Some customers may get PCB that includes blister on the solder mask layer, even the solder mask layer fall off. As PCB manufacturer, we will let you know what cause it and how to prevent on PCB manufacturing process. Please read the following information but don’t hesitate to contact us if you need more help.
- The surface of copper is not clean and oxidation in previous processing. It need to strength the surface finishing of the boards and ensure to dry off the boards in previous processing.
- The film was underexposed. It need to determinate and adjust the exposure energy of the boards.
- The insufficient curing. It need to to check the heat uniformity of the dryer oven and control the curing temperature and time of boards.
- Improper proportion of boards’ink. Pay more attention to the ink’s proportion when mixed.
