The first purpose of coverlay is that cover and protect the FPC circuit, enhance the rupture resistance of FPC.
Secondly, keep the circuit away from the injury by temperature, humidity, pollution and Corrosive material.
Thirdly, to cover the follow-up surface finishing of the FPC.
What’s more, it has the effect of soldermask in FPC SMT.
And the first characteristics of coverlay, it is suitable for the traditional way and rapid pressing on the same time.
Secondly, the heat resisting property and peel strength can keep a long time.
Thirdly, it can control the glue squeeze-out.
The coverlay still has the excellent bending resistance, it is suitable for the high flexible FPC.
And it meet the requirement of RoHS, the coverlay does not contain lead, mercury, cadmium,Polybrominated biphenyls,polybrominated diphenyl ether and red phosphorus.
