Printed Circuit Boards (PCBs) are the backbone of modern electronics. To ensure optimal performance and durability, PCBs undergo various surface treatments. These treatments protect the copper traces from corrosion, enhance solderability, and improve the overall reliability of the circuit board. In this article, we’ll explore the most common PCB surface treatments and their applications.
1. HASL (Hot Air Solder Leveling)
Principle
HASL is a traditional surface treatment that involves immersing the PCB in a bath of molten solder. After the solder solidifies, hot air is used to level the surface and remove excess solder.
Features
â˘Material: Lead-tin alloy (for traditional HASL) or lead-free solder (for LF HASL).
â˘Process: Immersion in molten solder followed by hot air leveling.
Advantages
â˘Excellent solderability.
â˘Cost-effective for large volumes.
â˘Good mechanical strength.
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2. OSP (Organic Solderability Preservatives)
Principle
OSP involves applying a thin layer of organic material (usually a rosin-based compound) to the copper surface, which protects it from oxidation.
Features
â˘Material: Organic preservatives.
â˘Process: Application of organic film.
Advantages
â˘Environmentally friendly.
â˘Good solderability.
â˘Suitable for rework.
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3. ENIG (Electroless Nickel Immersion Gold)
Principle
ENIG involves depositing a layer of nickel followed by a thin layer of gold on the copper surface. This provides a robust barrier against corrosion and ensures good solderability.
Features
â˘Material: Nickel and gold.
â˘Process: Electroless nickel deposition followed by immersion gold plating.
ENEPIG is similar to ENIG but adds a palladium layer between the nickel and gold. This improves the resistance to wear and tear.
Features
â˘Material: Nickel, palladium, and gold.
â˘Process: Electroless nickel deposition, electroless palladium, and immersion gold plating.
Advantages
â˘Superior wear resistance.
â˘Excellent solderability.
â˘Long-term reliability.
Applications
â˘High-reliability military and aerospace applications.
â˘High-frequency applications.
â˘Wire bonding
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5. Gold Immersion (Direct Gold Plating)
Principle
Gold immersion directly deposits a layer of gold onto the copper surface without a nickel underlayer.
Features
â˘Material: Gold.
â˘Process: Direct gold plating.
Advantages
â˘High conductivity.
â˘Excellent solderability.
Silver Immersion
Principle
Silver immersion involves depositing a layer of silver onto the copper surface.
Features
â˘Material: Silver.
â˘Process: Immersion silver plating.
Advantages
â˘High conductivity.
â˘Low cost compared to gold.
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6. Hard Gold (Selective Gold Plating)
Principle
Hard gold is a thicker and harder layer of gold, typically applied selectively to contact areas.
Features
â˘Material: Gold.
â˘Process: Selective gold plating.
Advantages
â˘High wear resistance.
â˘Good electrical contact properties.
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7. Tin Immersion
Principle
Tin immersion deposits a layer of tin onto the copper surface.
Features
â˘Material: Tin.
â˘Process: Immersion tin plating.
Advantages
â˘Good solderability.
â˘Low cost.
Applications
â˘Cost-sensitive applications.
â˘General-purpose electronics.
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Choosing the right surface treatment for your PCB depends on several factors, including the application environment, cost considerations, and performance requirements. Each treatment has its own set of advantages and limitations. Understanding these treatments will help you make informed decisions that enhance the performance and longevity of your electronic devices.
I hope this guide helps you understand the different surface treatments used in PCB manufacturing and their applications. If you have any questions or need further clarification, feel free to reach out!
The full form of ICT is In-Circuit Testing. It is a method that always used to test assembled circuit board during manufacturing.
What is ICT in PCB?
In-circuit testing (ICT) is a method used to test assembled circuit boards during production. It ensures that every component on the PCB functions as expected. By applying electrical signals to the board, it checks for faults like open circuits, shorts, and wrong component values.
In PCB assembly, ICT is used for final testing after surface-mount components and through-hole components have been soldered onto the board. This test is highly effective in identifying assembly defects that might compromise the functionality of the final product.
ICT vs. FCT
Although ICT and FCT look similar, their purposes and focus are different.
In-Circuit Testing (ICT) is like a thorough quality check for individual components. It tests each resistor, capacitor, inductor, and IC on the board to make sure theyâre installed and working as expected. ICT does this without focusing on the PCB’s complete function as a whole; instead, it looks for manufacturing faults or placement errors on each part of the circuit. This is perfect for catching problems before the PCB reaches final assembly.
Functional Circuit Testing (FCT), on the other hand, looks at the bigger picture. FCT checks if the assembled board works as intended in a simulated working environment. It mimics the real-world conditions the PCB will face once in use, testing the board as a whole rather than individual components. FCT aims to ensure that all parts are correctly interacting and that the board behaves as it should under operating conditions.
Together, ICT and FCT form a powerful duo: ICT focuses on each componentâs accuracy, while FCT ensures that all the elements work smoothly as a cohesive unit. Using both tests provides a comprehensive check, enhancing the PCB’s overall quality and reliability before it reaches the end-user.
What Items Does ICT Test for on a PCBA?
When ICT tests a PCBA, itâs really looking for any faults or failures in the components and connections that could cause problems later on. Hereâs what ICT commonly checks:
Resistors â It verifies that each resistor has the right resistance value and is correctly placed. If a resistor value is wrong, it can disrupt the whole circuit.
Capacitors â ICT checks capacitance levels and polarity (in specific cases) to make sure each capacitor is installed properly. Incorrect capacitors can lead to unstable performance.
Inductors â The test examines if inductors have the correct inductance values. Faulty inductors can cause power issues or signal problems.
Integrated Circuits (ICs) â ICT verifies that ICs are in the right orientation and connected properly to avoid shorts or opens, both of which can make the board malfunction.
Transistors â By checking transistor functionality, ICT ensures they wonât cause signal or power issues within the PCB.
Diodes â ICT makes sure diodes have correct polarity and work properly. Misplaced or faulty diodes can impact the flow of current, leading to circuit failure.
Solder Joints â ICT evaluates each solder joint, checking for breaks or poor connections. Bad solder joints lead to unstable electrical contact, which could cause intermittent issues or complete failure.
What is an ICT Machine?
An ICT machine is a specialized piece of equipment designed to perform in-circuit tests on PCBs. You can see it from below picture. The ICT machine uses a test fixture, also called a “bed of nails,” containing numerous tiny probes or pins. Each probe aligns with a specific point on the PCB, making contact with various circuit points to evaluate the electrical connections.
Once a PCB is placed in the test fixture, the machine applies signals through the probes to test individual components. It checks electrical properties such as resistance, capacitance, and voltage at each node. If a component is misplaced, missing, or faulty, the machine flags it immediately.
With its speed and precision, an ICT machine is an invaluable tool in high-volume production lines. While setting up an ICT machine requires creating a test fixture for each PCB, they save much time and human during the manufacturing process, make sure a fast delivery.
What Are the 7 Types of PCB Testing Methods?
In addition to ICT testing, there are other 6 types of PCB testing methods that widely used. Letâs talk about them one by one.
1. Flying Probe Testing
A testing method mainly used for prototypes or small/low volume orders. In Flying Probe Testing, multiple movable probes make contact with test points on the board. Unlike ICT, it doesnât require a fixture, making it highly flexible and cost-effective for small production runs. However, compared with ICT testing, itâs relatively slower than ICT because it tests points sequentially.
2. Functional Circuit Testing (FCT)
FCT is a method that check whether PCBA works correctly. It is typically come after ICT, and in almost factory, it is the last process to confirm that every component works together correctly.
3. Burn-In Testing
Burn-in Testing (also called aging test) pushes the board to its limits by applying high temperatures, loads, or voltages for extended periods. It can spot failures in components that might not withstand the stress of real-world conditions. Burn-in testing is often used for products that need high reliability, such as aerospace and medical devices.
4. X-Ray Inspection
For multilayer or densely packed PCBs, X-ray inspection is must to do. It helps visualize hidden solder joints and component placements that inspectors canât found by naked eyes. X-ray inspection is invaluable for boards with fine-pitch components such as BGAs, QFNs, or those where hidden joints canât be inspected visually.
5. Automated Optical Inspection (AOI)
AOI uses cameras to visually inspect the board for common issues like misalignment, missing components, or faulty solder joints. This is a quick and effective way to catch visible defects. AOI is widely used in automated production lines, as it quickly flags any boards that require closer examination. To get highest quality and no-defect products, Best Technology equipped with online dual track AOI to inspect PCBA.
6. Boundary Scan Testing
Boundary Scan Testing is particularly useful for complex boards where physical probing is challenging. It involves using ICs that support scan testing, so that engineers to check connectivity between ICs and other critical points. Boundary scan is common in high-density boards like those found in telecommunications.
Each method brings a unique advantage to PCB testing. In-Circuit Testing (ICT) is highly effective for large-scale quality control, while Flying Probe Testing is better suited for prototypes and smaller batches. Together, these tests form a complete strategy for delivering reliable, high-quality PCBs across various production needs.
How does ICT Testing?
ICT works by using a bed-of-nails (BON) tester or test probes to connect to specific test points on a PCB. Electrical signals are then sent through the board, and the responses are analyzed. Here’s how it works in simple steps:
Connection: The PCB is placed on the ICT machine, where test pins contact the board at designated points.
Signal Application: The ICT machine applies electrical signals to test the components individually or in groups.
Data Collection: The responses from each component are recorded to determine if it matches the expected output.
Fault Identification: Any deviations from expected responses are flagged, identifying potential defects like soldering errors, component failures, or incorrect placements.
FAQs about ICT
Q: What is ICT?
A: ICT (In-Circuit Test System), commonly known as online tester In Chinese, is mainly used for the test of assembled Circuit boards (PCBA).
Q: Which components can ICT basic functions measure?
A: On, short circuit, resistance, capacitance, inductance, diode, IC protection diode test, etc.
Q: Why use ICT?
A: According to the statistical data of the circuit board assembly industry, assembly defects are mainly reflected in the welding open circuit, short circuit, offset, missing parts and other aspects, accounting for more than 90%, so the principle of online testing technology application is to quickly detect faulty components or assembly defects, and can accurately locate defects and defect classification.
Q: Can ICT be regarded as a universal meter?
A: ICT can be regarded as an automated high-level multipurpose meter, and because it has the function of circuit isolation, it can accurately measure the actual value of each component in the circuit.
Q: What is the relationship between ICT and AOI?
A: ICT is mainly carried out by electrical measurement methods, while AOI is carried out by optical image processing technology. Both have their own strengths and complement each other. In the process arrangement, AOI is generally the first, then ICT.
In the PCB design and testing, there is a common term be mentioned frequently, that is EMI and EMC. Some people may ask that âwhat is EMI/EMC, why is it be mentioned every time?â Today, BEST team will take you to understand what are they and how to test them. Letâs keep reading.
What are EMI and EMC in PCB?
Before diving into, we should know both EMI and EMC are important elements during the PCB design. Some new PCB projects are failed during testing, because EMI and EMC design is not reasonable.
EMC is short for electromagnetic compatibility. EMC in a PCB is the ability of the PCB to operate in its electromagnetic environment without creating unbearable electromagnetic interference to other devices around it. In general, to achieve an EMC compliant design, engineers need to consider three basic aspects:
Generating unwanted electromagnetic radiation and its propagation.
The vulnerability of designs or components to electromagnetic interference (EMI).
PCB design should not cause intolerable electromagnetic interference on its own.
EMI is short for electromagnetic interference. EMI is unwanted noise or signals generated by electronic devices, which can disrupt other nearby equipment. PCBs, being central to electronics, are often both sources and victims of EMI. Every engineer should follow EMC configuration standards to minimize the total amount of EMI and its impact.
In a word, EMI refers to the generation of electromagnetic interference, while EMC refers to electromagnetic compatibility, that is, how well a device blocks EMI. EMI originates from electromagnetic equipment, and EMC involves equipment that is both anti-interference and non-interference with other equipment.
What Is the Difference Between EMI and EMC Testing?
EMI testing focuses on measuring the interference a device generates. It aims to ensure that the PCB doesnât emit electromagnetic waves that can interfere with other devices. EMC testing, on the other hand, checks the deviceâs ability to withstand electromagnetic interference from its environment without losing functionality. Both tests are essential to make sure that your PCB not only works well but also doesnât cause problems for other systems.
The main difference between EMC tests and EMI is their purpose and method of testing. â
Test purpose
âEMC testing focus on the equipment or system will function properly in an electromagnetic environment and will not cause intolerable electromagnetic disturbance to other equipment. EMC testing includes two aspects: electromagnetic immunity (the ability to resist interference) and electromagnetic emission (not to interfere with other equipment).
âHowever, EMI testing focuses on unwanted electromagnetic energy emitted by a device or system that may interfere with the normal operation of other nearby equipment. The purpose of EMI testing is to identify and reduce these sources of interference to prevent interference with other equipment â
Testing method
âEMC test usually includes shielding, grounding, and filtering methods. Shielding is surrounding devices or systems by using conductive materials to reduce leakage of electromagnetic radiation. Grounding is connecting the metal housing and ground to provide a safe electrical circuit loop. Filtering is to reduce unnecessary electromagnetic signal transmission through PCB circuit design.
âEMI test mainly measuring by the conducted interference and radiation interference of the devices. Conducted interference is interference that travels through a conductive medium (such as a wire), while radiative interference refers to the interference that travels through space.
What Are the Testing Standards for EMI/EMC?
Several global standards guide the EMI/EMC testing process. These include:
IEC 61000 series: This is the most common EMC test standard, covering EMI and EMS (Electromagnetic sensitivity) test methods, limits and units of measure.
EN 55014 series: This is the EU EMC test standard, including:
EN 55014-1: Radiation from household appliances
âEN 55014-2â: Radiation immunity of household appliances
âEN 55032â : Interference emission test for multimedia electronic products
âEN 55035â : Immune immunity test for multimedia electronic products
âGB/T17625 series â : This is China’s EMC test standard, including:
GB/T17625.1-2012â : EMC limits Harmonic current emission limits (Input current per phase â¤16A)
âGB/T17625.2-2007â : Limits on voltage variation, voltage fluctuation, and flicker (rated current of equipment per phase â¤16A)
âGB/T17625.7-2013â : Harmonic current limit for conditionally connected devices with rated current â¤75A in a common low-voltage power supply system
âGB/T17625.8-2015â : Harmonic current limit for devices connected to a common low-voltage system with input current greater than 16A but less than 75A per phase
âGB/T17625.9-2016â : Signal transmission emission levels, frequency bands and electromagnetic disturbance levels on low-voltage electrical installations
âGBZ17625.3-2000â : Limits on voltage fluctuations and flickers in low-voltage supply systems for devices with rated current >16A
âGBZ17625.6-2003â : Limits on harmonic currents produced by devices with rated current >16A in low-voltage power supply systems
âGBZ17625.13-2020â : Evaluation of emission limits for unbalanced installations connected to medium voltage, high voltage, and ultra-high voltage power systems
âGBZ17625.14-2017â : Evaluation of emission limits for harmonics, interharmonics, voltage fluctuations and unbalance of nuisance devices connected to low voltage power systems
âGBZ17625.15-2017â : Evaluation of low frequency electromagnetic immunity and emission requirements for distributed generation systems in low voltage power grids
These standards cover a wide range from household appliances to industrial equipment, you can follow one of them according to your specific applications and countries.
How to Conduct an EMI Test?
Before conduct a test, letâs know the testing method. EMI test methods mainly include the following â :
1. Pre-test: EMI testing performed during the design phase to detect and resolve EMI problems early in product design and development. Pre-test can be conducted using computer simulation, or by using actual test equipment.
2. Emission test: It is a test to measure whether electromagnetic waves emitted by equipment meet EMI standards. The emission test can be carried out by field test, half-time test, full-field test and other methods. Commonly used test equipment includes spectrum analyzer, scanning receiver, antenna, etc.
3. Sensitivity test: Common sensitivity testing methods include radiation sensitivity testing and conduction sensitivity testing. radiation sensitivity testing uses a signal generator to generate an electromagnetic field of a specific frequency and intensity. And conduction sensitivity testing involves injecting simulated electromagnetic interference signals on the power or signal lines of the equipment under test.
4â. Spectrum analysis: By measuring the spectrum of electromagnetic wave to analyze the characteristics of electromagnetic interference.
âAbove are the testing methods of EMI, and here is the steps that how to test it.
Select the right test method
First of all, select a right test method according to the specific test purpose and object. For example, if the emission characteristics of the equipment need to be evaluated, an emission test can be selected; If you need to evaluate the anti-interference capability of the equipment, you can choose sensitivity test.
Use professional equipment
Use professional test equipment, such as spectrum analyzer, signal generator, digital storage oscilloscope, etc., to ensure the accuracy of the test results.
Environment control
When performing sensitivity test, control the test environment to avoid the influence of other electromagnetic interference sources. Tests can be conducted in a shielded room to reduce outside interference.
Data analysis
Detailed analysis of the test data, identify potential sources of electromagnetic interference, and propose improvement measures. Methods such as difference method and potential zeroing method can be used to reduce the influence of interfering magnetic field on measurement results.
EMI/EMC PCB Design Guidelines
1. Ground plane
Because all circuits need to be grounded, the ground plane is the first line of defense against EMI. The following measures can be taken to reduce EMI:
Increase the ground area
Set up the ground plane
Each component should be connected to the ground plane
Each component should be connected to the ground plane or a ground point.
Decoupling capacitor
The ground plane is placed directly below the plane with the signal trace
Digital ground and analog ground should be separated
The ground wire should be as thick as possible
The length of the ground system should be kept to a minimum
2. Power supply design
Improper power supply design will result in greater noise and ultimately reduce product performance. Two main factors that lead to power supply instability:
1) Excessive transient AC current under high-speed switching
2) Inductance exists in the current loop Therefore, the integrity of the power supply should be fully considered in PCB design.
3. PCB layout
a) PCB size
PCB size must be considered. When it comes to oversized boards, the traces must go a long way as the impedance increases, the noise immunity decreases, and the manufacturing cost increases. When the board size is particularly small, it will cause heat dissipation problems and crosstalk is prone to occur between adjacent traces. The recommended PCB size is a rectangle with an aspect ratio of 3:2 or 4:3. In addition, when the board size exceeds 200mm*150mm, the mechanical strength of the board retraction should be considered.
b) Avoid right angles
This has been said many times. Avoid 45° to 90° for vias, traces, etc. When the trace reaches more than 45°, the capacitance will increase.
c) Keep signals separated
Digital circuits, analog circuits, and noise sources should be placed independently on the board, and high-frequency circuits should be isolated from low-frequency circuits. In addition, attention should be paid to the component distribution of strong and weak signals and the direction of signal transmission.
d) Increase the trace width as much as possible
e) Wider trace sizes can effectively reduce radiated emissions.
f) Make the return current path as short as possible and route along the path with the least resistance. The length of the return path should be roughly the same as or shorter than the length of the transmission trace.
4. Component placement
In general, it is best to completely separate analog and digital signals. Being too close can easily lead to problems such as crosstalk. In addition, compatible components should be placed independently to ensure that components do not interfere with each other in space.
5. PCB layer design
In terms of the number of layers, choose the appropriate number of layers. Single-layer PCBs and double-layer PCBs are suitable for medium and low-density wiring or low-integrity circuits. Based on manufacturing cost considerations, most consumer electronic products rely on single-layer PCBs or double-layer PCBs. However, due to their structural defects, they both generate a lot of EMI, and they are also sensitive to external interference. Multi-layer PCBs tend to be more used in high-density wiring and high-integrity chip circuits. Therefore, when the signal frequency is high and the electronic components are densely distributed, a PCB with at least 4 layers should be selected. In multi-layer PCB design, the power layer and the ground layer should be specially arranged, and the distance between the signal line and the ground line should be reduced.
6. EMI shielding
Shielding and filtering can minimize the impact of EMI. Some shielding and filtering options include:
Component and PCB shielding
Low-pass filtering
Cable shielding
7. Trace routing
Put the current signals with the same output but opposite directions in parallel to eliminate magnetic interference. Discontinuities in printed leads should be minimized. For example, the lead width should not change abruptly and the lead angle should not exceed 90°.
8. Routing design
The power line, ground line, and traces on the circuit board should maintain low impedance to high-frequency signals. When the frequency remains so high, the power line, ground line, and circuit board traces all become small antennas responsible for receiving and transmitting interference. To overcome this interference, it is more important to reduce the high-frequency impedance of the power line, ground line, and circuit board traces than to increase the filter capacitor. Therefore, the traces on the circuit board should be short, thick, and evenly arranged.
9. Decoupling and grounding
The proper placement of decoupling capacitors and the application of the inductor capacitor energy storage function make it possible to provide current to the device at the moment of switching. In a DC loop, load changes can cause power supply noise. The decoupling capacitor configuration can block the noise generated by load changes. For electronic equipment, grounding is a key method to control interference. If grounding is properly combined with shielding measures, most interference problems will be solved.
Above all are the key points when design pcb, hope you can take them in mind and use in your actual design phase.
CEM1 PCB is a composite epoxy metal-based copper-clad laminate. It is made of flame-retardant epoxy resin impregnated paper or glass fiber cloth as the substrate, covered with copper foil on one side, and hot-pressed. CEM1 PCB has good mechanical strength, electrical properties and heat resistance, and is suitable for the manufacture of various electronic devices.
What is a CEM composite epoxy material?
CEM composite epoxy material is a material used for printed circuit boards (PCBs), mainly composed of epoxy resin, glass fiber cloth, wood pulp paper and copper foil. Its main features are excellent mechanical processing performance, lower cost than glass fiber cloth copper-clad laminate, and better performance than paper-based copper-clad laminate.
Types and applications of CEM composite epoxy materials:
CEM composite epoxy materials mainly include types such as CEM1 and CEM-3. CEM1 composite materials are made of glass fiber fabric surface and paper core combined with epoxy resin, and are mainly used in the printed circuit board industry.
CEM-3 is a composite copper-clad laminate that uses glass cloth and glass felt as a composite substrate. Unlike FR-4, its production process is similar to FR-4, but it uses a different substrate.
What type of PCB is FR4?
FR4 is a copper-clad laminate that is mainly used in printed circuit board (PCB) manufacturing.
FR4, which stands for Flame-Retardant 4, is a composite material made of glass fiber and flame-retardant epoxy resin. It has excellent flame retardant properties and stable electrical properties, so it is widely used in the electronics industry.
FR4 board is mainly made of quadrifunctional epoxy resin plus filler and glass fiber cloth. Epoxy resin has good adhesion and electrical insulation, while glass fiber cloth provides mechanical strength and dimensional stability.
The specification standard of FR4 board is formulated by NEMA (National Electrical Manufacturers Association), where FR represents the flame retardant grade.
FR4 copper clad laminate is divided into different grades according to performance and quality, mainly including:
FR-4 A1 grade copper clad laminate: mainly used in high-end electronic products such as military industry, communications, computers, digital circuits, industrial instruments and meters, and automotive circuits.
FR-4 A2 grade copper clad laminate: suitable for ordinary computers, instruments and meters, high-end home appliances and general electronic products, and its performance indicators meet the needs of general industrial electronic products.
FR-4 A3 grade copper clad laminate: mainly used in the home appliance industry, computer peripheral products and general electronic products. On the premise that the performance meets the requirements, the price has a competitive advantage.
FR-4 A4 grade copper clad laminate: It is a low-end material, but it can still meet the needs of ordinary home appliances, computers and general electronic products, and its price is the most competitive.
FR-4 B grade copper clad laminate: The quality stability is poor, suitable for smaller circuit board products, and the price is the lowest.
In summary, FR4 is a high-performance copper clad laminate material, which is widely used in various electronic products and is favored for its excellent flame retardant properties and stable electrical properties.
What is the difference between CEM1 and FR4?
The main differences between CEM1 and FR4 are in terms of material composition, mechanical properties, electrical properties, heat resistance and cost.
Material composition and manufacturing process:
FR4: It is composed of glass fiber and epoxy resin. Its manufacturing process is mature and the cost is relatively low, so it is widely used.
CEM1: It is a composite epoxy resin material with wood pulp fiber paper or cotton pulp fiber paper as the core material, covered with glass fiber cloth on the surface, and impregnated with flame-retardant epoxy resin. Compared with FR4, CEM1 has slightly inferior mechanical properties and heat resistance, but lower cost.
Mechanical properties and heat resistance:
FR4: It has high mechanical strength and rigidity, suitable for complex electronic equipment and structures. It has good heat resistance and can remain stable at higher temperatures.
CEM1: It has slightly lower mechanical strength and is suitable for electronic products with low performance requirements. Its heat resistance is also relatively poor.
Electrical properties:
FR4: has excellent electrical properties, including high insulation resistance and low dielectric constant, suitable for electronic devices with high frequency and high-speed transmission.
CEM1: The electrical properties are slightly inferior to FR4, and it is not suitable for high-frequency applications.
In summary, FR4 performs better in mechanical properties, electrical properties and heat resistance, and is suitable for electronic devices with high performance requirements; while CEM1 has more advantages in cost and is suitable for electronic products with low performance requirements.
What are the advantages of CEM1 PCB?
The main advantages of CEM1 PCB include the following aspects:
Excellent mechanical properties: CEM1 PCB has excellent mechanical properties, and its impact force can reach 0.093 inches. Compared with paper grades, CEM1 is easy to stamp and has higher bending strength.
High cost-effectiveness: The cost of CEM1 PCB is lower than that of glass fiber cloth copper clad laminate, so it has significant advantages in cost control.
Good electrical performance: The electrical performance of CEM1 PCB is also excellent, suitable for various electronic devices, especially in the LED lighting market, CEM1 is able to achieve the best balance between heat dissipation performance and PCB cost.
Wide range of applications: CEM1 PCB is widely used in the printed circuit board industry, especially in some low-end and mid-range products.
What are the disadvantages of CEM1 PCB?
Mechanical durability: CEM1 printed circuit board lacks good mechanical durability.
Production applicable type: CEM1 can be used to produce single-sided PCBs because its laminate is not compatible with through-holes.
Fragility: PCBs produced by CEM1 are very fragile and can easily break if not handled properly.
Substitutability and limitations: FR-4 can be used to replace CEM1. But in case FR-4 needs to be replaced, CEM1 can only replace single-layer FR-4 PCBs with limited functions.
Why is CEM1 PCB single-layer?
The main reason why CEM1 PCB is single-layer is due to its material properties and cost-effectiveness.
CEM1 PCB is a single-layer printed circuit board. Its material properties determine that it can only be made into a single-layer structure. CEM1 material is mainly composed of glass cloth and epoxy resin. This material structure makes the PCB board have only one conductive layer.
Although technological advances have made multi-layer PCBs possible, PCBs made of CEM1 materials still maintain a single-layer structure, mainly because of its cost-effectiveness and design complexity.
The design and manufacturing of single-sided PCBs are relatively simple and low-cost, suitable for low-density design requirements. Since there is only one conductive layer, more winding is required during wiring design, but this is acceptable in low-density designs.
In addition, the manufacturing process of single-sided PCBs is relatively fast and low-cost, which is one of the reasons why it is widely used.
What are the applications of CEM1 PCB?
Simple applications and LED lighting: It can be used to make simple applications such as toys, remote controls, calculators, and home appliances. At the same time, headlights, indicator lights, and brake lights in LED lighting can also be made of CEM1 PCBs.
Computer Components: Computers are sensitive to heat, and LED CEM1 PCBs can conduct heat effectively, so computer components such as CPUs, floppy disk drives, and power supply units are made of them.
Industrial and Electronic Equipment: Used in the production of industrial controls, converters, instrumentation, UPS systems, hard disks, and telephone systems.
Medical Field: Tools used to perform surgeries are made of CEM1 LED PCBs, and even medical scanning technology uses such PCBs to manufacture scanning equipment.
As a special type of PCB, CEM1 PCB is widely used in the electronics industry for its good mechanical strength, electrical properties, heat resistance, and low cost. As electronic equipment continues to develop, CEM1 PCBs will also continue to innovate and develop to meet the needs of electronic equipment.
Aerospace PCB assembly refers to the intricate process of manufacturing printed circuit boards (PCBs) specifically for aerospace systems, including aircraft, spacecraft, satellites, and other related avionics systems. These boards are vital for controlling critical systems in extreme environments, where traditional electronic components would fail. Aerospace PCBs are engineered with precise attention to durability, signal integrity, and longevity to ensure reliable operation over long periods, even in the most hostile conditions like extreme temperatures, vibrations, and radiation.
The assembly process includes component placement, soldering, testing, and verification to ensure the PCBs meet strict aerospace industry standards. Due to the high-stakes nature of aerospace applications, each PCB must be built with the highest degree of precision and undergo rigorous testing to ensure it can withstand the operational conditions of the specific aerospace application.
Why does Aerospace PCB Assembly Need High Reliability?
Aerospace PCB assembly requires exceptionally high reliability due to the mission-critical nature of the systems they support. Unlike consumer electronics, where failures might lead to inconvenience, failures in aerospace systems can be catastrophic, leading to loss of life, property, or the failure of multimillion-dollar space missions. Once a satellite, spacecraft, or aircraft is deployed, accessibility to repair faulty components is extremely limited. So that aerospace PCBs function flawlessly for years, or even decades, without failure.
In addition to inaccessibility, aerospace electronics face harsh environmental conditions such as extreme temperatures, radiation, shock, and vibration. These conditions demand that PCBs operate continuously under stress without compromising their performance. High-reliability standards ensure the PCBsâ long-term stability and functionality in these demanding environments. Aerospace components must be high quality, fail-safe, and undergo extensive testing for performance, durability, and resilience.
What Grade of IPC Standard Should Aerospace PCB Assembly Follow?
IPC standards are a widely used term in the electronics industry that covers all aspects of electronic product design, including the acceptability of printed circuit boards, material requirements, and more. IPC standards establish standards from all aspects, as long as manufacturers strictly implement the standards, product quality and reliability are naturally guaranteed.
Aerospace PCB assembly needs to meet the requirements of high reliability, high quality and high performance, so during the production process, it should comply with IPC-6012 Level 3 standards. IPC-6012 is a performance specification document that defines the default requirements and specifications for each class of PCB. Among them, Class 3 PCBs have tighter tolerances and are commonly used in military applications, medical devices, and the aerospace industry. The IPC-6012 Level 3 standard ensures that the PCB can also ensure the reliable start-up and operation of the equipment in harsh environments, such as high temperature, low temperature, vibration and other extreme conditions can still work.
In addition to IPC-6012, IPC-610 Class 3 is critical for ensuring the highest quality workmanship in aerospace electronics as well. In the IPC-610 standard, class 3 defines the acceptance criteria for high-reliability electronics, including tight tolerances, high-quality soldering, and thorough inspections.
Industry Standards for Aerospace PCB Manufacturing
Aerospace PCB manufacturing must adhere to several industry-specific standards to ensure reliability and safety.
ISO9001
It is an internationally recognized quality management system standards designed to help organizations continue to provide products or services that meet customer and applicable legal and regulatory requirements through a systematic approach. It is the code of conduct that governs our production process.
AS9100
Another essential standard is AS9100, which is a widely recognized quality management system tailored specifically for the aerospace industry. It covers every aspect of the aerospace PCB production process, from material selection to assembly, testing, and delivery.
MIL-PRF-31032
It is one of the most significant standards is MIL-PRF-31032, which governs the qualification of printed wiring boards used in military and aerospace applications.
RoHS
PCBs for aerospace applications must also comply with RoHS (Restriction of Hazardous Substances) regulations, particularly in Europe, to ensure the environmental safety of electronic components. Additionally, aerospace PCBs undergo specific testing procedures, such as thermal cycling, vibration testing, and humidity resistance, to ensure they meet operational standards.
Best Technology certificated by ISO9001, ISO13485, IATF16949, AS9001, RoHS and some other certifications about manufacture. We are dedicated to provide customers with “High mixed, low volume, fast delivery and high quality” PCB and PCBA products. At Best Technology, you get a sense of value for money!
Common PCBA Modules or Systems for Aerospace Electronics
Aerospace electronics rely on various specialized PCBA modules and systems to ensure efficient and reliable operation in mission-critical environments. These systems are essential in everything from flight control to communication, navigation, and power management in aircraft, satellites, and spacecraft. Below are some of the most common PCBA modules or systems used in aerospace electronics:
1. Avionics Control Systems
Avionics control systems are the backbone of modern aerospace technology, responsible for managing and controlling various systems in aircraft and spacecraft. They handle critical functions such as navigation, communication, and onboard sensors, providing real-time data to pilots and flight computers.
2. Power Management Systems
Power management systems in aerospace electronics regulate the distribution and control of electrical power across the aircraft or spacecraft. These PCBA modules are designed to manage the onboard electrical grid. In some subsystems, they provide a stable power supply, such as for communication equipment, control systems, and sensors.
3. Flight Control Systems
Flight control systems are responsible for managing an aircraftâs or spacecraft’s attitude, direction, and speed. The PCBA modules within these systems process data from various sensors (like gyroscopes and accelerometers) and use it to adjust control surfaces or thrusters.
4. Radio Communication Systems
It enables the communication between the aircraft and ground control. RF (Radio Frequency) modules, transceivers, and antenna control units are common PCBAs in communication systems. Aerospace communication systems are engineered to handle long-distance transmission and are resistant to environmental interference, such as radiation or electromagnetic noise.
5. Navigation Systems
Navigation systems in aerospace electronics guide aircraft and spacecraft to their destinations using data from GPS satellites, inertial navigation systems (INS), and other sources. The PCBAs in navigation systems are responsible for processing this data and providing accurate location, speed, and altitude information.
6. Radar and Sensor Systems
They are the most important parts in the aerospace applications, like collision avoidance, terrain mapping, and weather monitoring. They can process large amounts of data quickly and reliably, often using digital signal processors and field-programmable gate arrays (FPGAs) to handle real-time processing.
7. Environmental Control Systems (ECS)
Environmental control systems are responsible for maintaining optimal cabin and equipment conditions within an aircraft or spacecraft. These systems monitor and regulate air pressure, temperature, and humidity. The PCBAs used in ECS modules often featuring sensors that track environmental parameters and control systems that adjust them accordingly.
8. Data Acquisition Systems
Data acquisition systems collect and process data from various subsystems and sensors in aerospace applications. These PCBA modules are integral in spacecraft, aircraft, and satellites, enabling real-time data monitoring, analysis, and recording. Data acquisition PCBAs are designed to interface with different sensors, process data quickly, and transmit it to central control systems for further analysis. These systems must be reliable and capable of operating in high-altitude or space environments where temperatures and radiation levels can be extreme.
9. Power Distribution Units (PDUs)
Power Distribution Units (PDUs) manage the flow of electrical power to various subsystems within an aircraft or spacecraft. The PCBAs in PDUs ensure that power is efficiently distributed to essential systems, and they often include built-in protections against power surges, overloads, and short circuits.
Best materials for Aerospace PCB Assembly
Aerospace PCB mainly used high reliability and high temperature materials. Common material types are the following:
High temperature substrate
Because aerospace electronic equipment is often in a high temperature environment, it is necessary to use high temperature substrate, such as polyimide (PI) and polytetrafluoroethylene (PTFE).
Refractory materials
The aerospace field has strict fire safety requirements, so it is necessary to use good flame
retardant materials, such as polystyrene (PS) and Australian flame retardant epoxy resin.
Corrosion resistant materials
There are some corrosive substances in the aerospace environment, so it is necessary to use materials with good corrosion resistance, such as special polyamides and special coatings.
High electrical performance materials
In aerospace applications, circuit boards are required to have good electrical properties, including high impedance, low dielectric constant and low dissipation characteristics, so materials such as high frequency glass fiber cloth (FR4), polyimide (PI) and polytetraoxyethylene (PTFE) are often used.
Aerospace PCB Assembly design standards
Designing PCBs for aerospace applications requires adherence to strict design standards that ensure optimal performance under harsh conditions. These design standards focus on several critical factors:
Signal Integrity
Aerospace PCBs must be designed to minimize signal degradation, ensuring accurate data transmission. High-speed signal transmission lines must be optimized for impedance control and reduced electromagnetic interference (EMI).
Thermal Management
Effective heat dissipation is crucial to prevent overheating in aerospace PCBs. The design must incorporate features such as metal cores or heat sinks to manage thermal loads efficiently.
Vibration and Shock Resistance
Aerospace PCBs are subject to extreme vibration and shock during flight or launch. The design must include mechanical reinforcements and vibration-dampening measures to protect the integrity of components and solder joints.
EMI Shielding
Aerospace environments are susceptible to electromagnetic interference, which can disrupt signal integrity. Proper shielding techniques, such as ground planes and shielded traces, are essential to reduce EMI and ensure reliable signal performance.
Component Placement
Components must be strategically placed to ensure signal integrity, reduce noise, and improve overall PCB performance.
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Flexible PCB is a printed circuit board made of flexible substrate, which can be bent, folded or twisted to a certain extent to meet the needs of various complex electronic device structures.
What are flexible PCBs made of?
Flexible PCBs are mainly made of polyimide or polyester film. These materials have good flexibility and insulation properties, which enable flexible PCBs to maintain stable working conditions in various bending and twisting environments.
The manufacturing process of flexible PCBs includes the following main steps:
Design phase: Use design software to create a prototype of the circuit board, determine the required lines, circuits and components, and design the shape and size of the flexible PCB according to the shape and size of the product.
Board making phase: Print the required lines and patterns on the plastic substrate, usually using photolithography techniques such as coating photolithography and inkjet printing.
Surface treatment and coating: Clean the circuit board and apply a protective coating to prevent chemical and mechanical wear, moisture, corrosion, etc.
Electroplating copper: Apply electroplating copper to certain parts of the flexible PCB to thicken the line.
Pattern chemical etching: Etch away the unnecessary parts of the circuit board and retain the required lines and components.
Molding and perforation: Cut the flexible PCB into the desired shape.
What is the difference between FR4 and flex PCB?
Material composition and performance
FR4: FR4 is the most common PCB substrate, mainly composed of glass fiber and epoxy resin. It has good electrical, thermal and mechanical properties.
Flexible PCB: Flexible PCB (FPC) is mainly made of materials such as polyimide (PI) and is flexible and bendable. They are often used in application scenarios that require frequent bending or limited space.
Application scenarios
FR4: Due to its rigidity and stability, FR4 is often used in applications that require high mechanical strength and stability, such as computer motherboards, mobile phone motherboards, etc.
Flexible PCB: Flexible PCB is often used in applications in car curves and corners, display screens and reverse cam screens, etc. due to its flexibility and bendability.
Manufacturing process and cost
FR4: The manufacturing process includes drilling, etching, copper plating, etc., with moderate cost, suitable for most consumer electronic products.
Flexible PCB: The manufacturing process is relatively complex and the cost is high, but it can meet the needs of specific applications.
In summary, FR4 and flexible PCBs have significant differences in material composition, performance and application scenarios. Choosing the right material depends on the specific application requirements.
What is the difference between a rigid PCB and a flexible PCB?
The main differences between rigid PCBs and flexible PCBs include softness, load-bearing capacity, durability, heat resistance and other aspects.
Softness: Flexible PCBs (FPCs) have good flexibility and can be easily twisted, bent and even folded, and are suitable for application scenarios that require flexible wiring. Rigid PCBs, on the other hand, are harder and cannot be bent, and are usually used in devices that require stability and high load capacity.
Load-bearing capacity: Flexible PCBs have relatively weak current carrying capacity and are suitable for applications with smaller currents. Rigid PCBs have stronger current carrying capacity and are suitable for high-load electronic devices.
Durability and heat resistance: Flexible PCBs can better absorb vibration and shock, have high durability and heat resistance, and can be used in extreme environments. Although rigid PCBs are thicker, they are easily damaged under the influence of high temperatures and chemicals.
Manufacturing process and materials: Flexible PCBs use flexible materials such as polyimide, and a cover layer process is used during the manufacturing process to protect the circuit. Rigid PCBs use thicker materials, usually made of glass-like materials, and require reinforcement.
Application scenarios: Flexible PCBs are widely used in modern smart devices such as smartphones, tablets, and wearable devices due to their flexibility and thinness. Rigid PCBs are often used in devices that require stability and high load capacity, such as laptops and desktop computers.
In summary, there are significant differences between rigid PCBs and flexible PCBs in terms of softness, load-bearing capacity, durability, heat resistance, and application scenarios. The selection of the appropriate type of circuit board should be determined according to specific application requirements.
What is the advantage of flex PCB?
Flexible PCB (Flexible Printed Circuit, FPC for short) has the following main advantages:
Flexibility: The main advantage of flexible PCBs is their elasticity and bending ability. They can be easily twisted, bent, and even folded, suitable for design requirements of various complex shapes.
Reduce weight and space: Flexible PCBs not only provide greater design freedom, but also have better space utilization and weight efficiency. Due to their thin and light characteristics, flexible PCBs can greatly reduce weight and space, especially for small devices.
Suitable for harsh environments: Flexible PCBs can be made of various corrosion-resistant materials and can withstand harsh environmental conditions.
Better thermal management: Flexible PCBs are made of polyimide, which has excellent thermal stability and can withstand extremely high heat.
Reduce costs: Flexible PCBs reduce assembly costs by reducing space requirements and the number of components. Since the need for wiring and connectors is reduced, testing and rework time is also reduced, improving productivity and efficiency.
In summary, flexible PCBs have significant advantages in flexibility, weight, space utilization, environmental adaptability and cost-effectiveness, making them an ideal choice for many high-tech products and applications requiring high reliability.
What are the disadvantages of flexible PCB?
The main disadvantages of flexible PCBs (FPCs) include:
High one-time initial cost: Since flexible PCBs are designed and manufactured for special applications, the cost of circuit design, wiring and photographic plates is high.
Difficult to change and repair: Once a flexible PCB is made, changes must start from the base map or the compiled photolithography program, so it is not easy to change. Its surface is covered with a protective film, which needs to be removed before repair and restored after repair, which is a relatively difficult task.
Size is limited: Flexible PCB is usually manufactured by intermittent process when it is not yet popular. Therefore, it is limited by the size of production equipment and cannot be made very long or wide.
Improper operation can easily cause damage: Improper operation by the assembly personnel can easily cause damage to the flexible circuit. Its soldering and rework require trained personnel to operate.
How thick is a flex PCB board?
The common thickness of flexible PCB board is 0.2mm. The thickening layer will be added behind the parts to be soldered. The thickness of the thickening layer is generally 0.2mm or 0.4mm12.
In addition, the thickness of flexible PCB board usually ranges from 0.1mm to 0.4mm, of which the thickness of 0.1mm to 0.4mm is called ultra-thin PCB board.
Where are flexible PCBs used?
Flexible PCB (Flexible Printed Circuit Board, FPC) is widely used in many fields, mainly including the following aspects:
Consumer electronics: Flexible PCB is widely used in consumer electronics such as smartphones, tablets, smart watches, etc.
Medical equipment: In medical equipment, flexible PCB can bend and adapt to specific shapes, and is often used in electrocardiographs, blood pressure monitors, monitoring equipment and medical sensors, etc.
Automotive electronics: Flexible PCB plays an important role in automotive electronic systems, connecting in-vehicle entertainment systems, navigation systems, dashboards, body control modules and safety systems, etc.
Aerospace: Flexible PCB is also widely used in the aerospace field, such as satellite communications, spacecraft control, etc.
Industrial control and automation: In the field of industrial control and automation, flexible PCB is used to connect sensors, actuators, control modules and data acquisition equipment, etc.
LED lighting: Flexible PCB is also used in LED lighting products to provide connection and signal transmission functions.
In summary, the material combination of flexible PCBs gives them unique properties and a wide range of application prospects. The flexible substrate provides bendability and durability, the conductive layer ensures efficient transmission of electronic signals, and the cover layer provides protection for the entire structure. The continuous innovation and optimization of these materials will continue to promote the development of flexible PCBs.
The core thickness range of HDI PCB (High Density Interconnect Circuit Board) mainly depends on its design and application requirements. According to different processes and application scenarios, the core thickness of HDI PCB can vary from 0.6mm to 1.0mm.
What is the standard thickness of a PCB core?
The standard thickness of PCB core boards usually includes the following specifications: 0.5mm, 0.7mm, 0.8mm, 1.0mm, 1.2mm, 1.5mm, 1.6mm, 2.0mm, 2.4mm, 3.2mm, 6.4mm. These thickness specifications are widely used in different electronic products and circuit board designs.
The thickness of PCB includes not only the thickness of the core board, but also the total thickness of all layers such as copper layer, solder mask layer and silk screen. The standard thickness ranges widely, from thinner 0.5mm to thicker 6.4mm, suitable for different application requirements.
Choosing the right PCB thickness is essential to ensure the performance and reliability of the circuit board. Thicker PCBs have higher mechanical strength and load-bearing capacity, and are suitable for products with high power and large electronic components, such as industrial, automotive, aerospace and military applications.
Ultra-thin PCBs are suitable for small electronic products such as smartphones, smart wearable devices and laptops due to their lightweight characteristics.
What is the thickness tolerance of a PCB core?
The thickness tolerance of a PCB core varies according to different thickness ranges.
For PCBs with a thickness of less than or equal to 1mm, the board thickness tolerance is Âą10% of the board thickness. For example, a PCB with a thickness of 0.5mm has a tolerance of Âą0.05mm; a PCB with a thickness of 0.8mm has a tolerance of Âą0.08mm.
For PCBs with a thickness greater than 1mm and less than or equal to 1.6mm, the tolerance is Âą0.14mm.
For PCBs with a thickness greater than 1.6mm and less than or equal to 2.0mm, the tolerance is Âą0.18mm.
For PCBs with a thickness greater than 2.0mm and less than or equal to 2.4mm, the tolerance is Âą0.22mm.
For PCBs with a thickness greater than 2.4mm and less than or equal to 3.0mm, the tolerance is Âą0.25mm.
For PCBs with a thickness greater than 3.0mm, the tolerance is Âą10%.
These tolerance standards apply to most PCB manufacturing processes, ensuring the stability and reliability of the PCB.
What is the difference between HDI and non-HDI PCB?
The main differences between HDI PCB and non-HDI PCB are their line density, size, production process and electrical performance. HDI PCB (High Density Interconnect PCB) has higher line density, smaller size and better electrical performance, while ordinary PCBs are lacking in these aspects.
First of all, the design and structure of HDI PCB are significantly different from ordinary PCBs. HDI PCB adopts higher line density and more complex circuit layout, which enables smaller size and lighter design. In contrast, ordinary PCBs have lower line density and are suitable for some application scenarios that do not require high line density.
In terms of production process, the manufacturing process of HDI PCB is relatively complex, including laser drilling, stacked copper plates, etching technology, etc., to achieve high-density interconnection and complex circuit wiring. The manufacturing process of ordinary PCB is relatively simple, generally using photolithography, etching process, etc.
In terms of electrical performance, HDI PCB uses technologies such as blind holes and buried holes to reduce signal transmission paths and improve the transmission rate and stability of electrical signals. In addition, HDI PCB also has better radio frequency interference, electromagnetic wave interference, electrostatic discharge and thermal conductivity performance.
Finally, the cost of HDI PCB is relatively high, mainly due to its complex manufacturing process and high technical requirements. The manufacturing cost of ordinary PCB is low, which is suitable for some application scenarios with low requirements for line density and technology.
How thick is a 2 layer PCB core?
The thickness of a 2-layer PCB core is usually 0.4mm.
PCB core is a base material composed of copper foil, solid resin material and glass fiber, with a certain hardness and thickness. Common PCB core thickness specifications include 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 1.0mm, 1.2mm, 1.5mm, 1.6mm, 2.0mm, 2.4mm, etc.
Among the common specifications of Shengyi core boards, the thickness of 0.4mm is widely used. In addition, the performance of multi-layer PCBs does not directly depend on the number of layers, but more reflects the space requirements during design.
Are HDI PCB reliable?
HDI PCBs are reliable. HDI PCBs are manufactured using high-density and high-reliability interconnection technology, with higher line density and more complex circuit layout, which can achieve smaller and lighter electronic devices.
Compared with ordinary PCBs, HDI PCBs perform well in anti-interference ability and electromagnetic compatibility, and can effectively reduce the impact of external interference on signal transmission, while having higher reliability and longer service life.
The reliability of HDI PCBs is due to the high-quality substrates, solder mask and copper foil materials used, as well as strict manufacturing processes and quality control. These characteristics enable HDI PCBs to maintain stable performance and quality in various harsh environments.
In addition, the development trend of HDI PCBs is towards higher integration, higher signal transmission rate, better electromagnetic compatibility and optimized thermal management capabilities, which further enhances its application value in high-performance and high-density integration requirements.
What are the benefits of HDI PCB?
The main benefits of HDI PCB include high-density wiring, high-performance signal transmission, adaptability to high-frequency applications, miniaturization, and thinness. These characteristics make HDI PCB play a vital role in electronic devices, especially in high-end electronic products such as smartphones, tablets, and high-end computers.
First, HDI PCB has the characteristics of high-density wiring, which can achieve more circuit connections in a smaller space. This allows the design of electronic products to be more compact and meet application scenarios with extremely high space requirements.
Secondly, HDI PCB excels in high-performance signal transmission, can provide better signal transmission quality and electrical performance, and is particularly suitable for processing high-speed and high-frequency signals.
In addition, HDI PCB also has the advantages of miniaturization and thinness, which contributes to the thinness and miniaturization of electronic products, making the equipment more portable while maintaining high performance.
These benefits of HDI PCB are due to its advanced manufacturing process and technology. By adopting finer line widths and smaller apertures, HDI PCB achieves higher wiring density and signal transmission speed.
At the same time, by optimizing material selection and circuit design, HDI PCB can reduce the loss and reflection during signal transmission and improve the integrity and accuracy of the signal. In addition, HDI PCB also has better anti-interference ability and electromagnetic compatibility, which can effectively reduce the impact of external interference on signal transmission.
The application range of HDI PCB is very wide, including smart phones, tablets, laptops, medical equipment and communication equipment. Due to its high-density interconnection and excellent electrical performance, HDI PCB plays an important role in these fields, promoting the development of the PCB industry, so that more dense components can be arranged more closely on HDI boards.
What are the disadvantages of HDI PCB?
The main disadvantages of HDI PCB include high cost, complex production process, environmental sensitivity and possible quality problems.
First, the cost of HDI PCB is relatively high. This is because high-precision manufacturing technology and special materials are required in its manufacturing process, which all lead to its cost increase.
In addition, HDI PCB is usually used in high-performance equipment, and the value of these equipment itself is also high, which further pushes up the price of HDI PCB.
Second, the production process of HDI PCB is very complicated. Due to its high density of lines and components, the manufacturing of HDI PCB requires highly precise processes and equipment. This not only increases the difficulty of production, but may also lead to a longer production cycle, further increasing costs.
In addition, HDI PCB has certain requirements for the environment. Due to its delicate structure, HDI PCB is very sensitive to humidity and temperature changes in the environment. Improper storage or transportation conditions may cause the PCB to become damp or deformed, affecting its performance and reliability.
Finally, HDI PCB may have some quality problems. Due to the complexity of the production process, HDI PCB may have problems such as poor solderability, delamination, short circuit, open circuit, etc. These problems may need to be avoided through strict quality control and testing.
The core thickness of HDI PCB is an important parameter, which is directly related to the performance and application of PCB. When choosing the core thickness of HDI PCB, factors such as application requirements, design requirements and manufacturing process need to be considered comprehensively to select the appropriate core thickness.
An inverter circuit board is designed to manage the conversion process by controlling the flow of current, regulating voltage, and ensuring efficient energy transfer. It can control and regulate the conversion of direct current (DC) into alternating current (AC). In the application of renewable energy systems such as solar power generation and wind power generation, inverters play a crucial role. It efficiently converts the DC energy collected by solar panels or wind turbines into AC power supplies suitable for home and business use.
An inverter PCB typically includes components such as power semiconductors (IGBTs or MOSFETs), microcontrollers, and various passive elements that enable the inverter to function correctly.
Types of Inverter PCB
Inverter PCBs come from several types, mainly are single-sided PCB, double-sided PCB and multilayer PCB.
Single-Sided PCB
A single-sided PCB is the most basic type, with all the components and circuits mounted on one side. It is commonly used in low-cost inverters with relatively simple circuits. Due to the limited space and circuit paths, its performance and power handling capabilities are moderate. Therefore, it is suitable for small-scale inverter systems or low-power home appliances.
Double-Sided PCB
Double-sided PCBs feature components and copper circuitry on both sides of the board. Furthermore, plated through holes can be drilled on such board to improve the electricity. These PCBs are suitable for mid-range inverter designs that require a higher number of components and connections, as they provide better performance and power efficiency. In higher power applications like motor control systems and renewable energy inverters, double sided PCB are commonly used.
Multilayer PCB
Inverters designed for industrial applications or high-performance devices often require multilayer PCBs. These boards consist of three or more layers of circuitry sandwiched between layers of insulation. Multilayer PCBs can reduce electromagnetic interference (EMI) and improve signal integrity, they are excellent in complex inverter systems used in electric vehicles (EVs), large solar arrays, and industrial motor drives.
What Benefits Does an Inverter PCB Offer?
First of all, â high reliability â is an important advantage of inverter PCB. Through precise circuit design and high-quality assembly processes, inverter PCBs can significantly improve the stability and reliability of equipment. In addition, the modular design makes troubleshooting and maintenance more convenient.
Secondly, âenvironmental protection â is also an important feature of the inverter PCB. Conventional inverter PCBs may use halogen-containing chemical materials in the manufacturing process, which can pose potential threats to the environment and human health. The halogen-free inverter PCB adopts halogen-free substrate and lead-free welding technology, does not produce harmful environmental pollutants, and has less impact on the environment and human health.
In addition, â easy to upgrade and maintain âis another important advantage of inverter PCBs. When the inverter needs to be upgraded or repaired, it can be achieved by replacing or repairing specific PCB modules, without large-scale changes to the entire system, which greatly reduces the complexity and cost of upgrading and maintenance.
Finally, â highly integrated â is also a significant advantage of inverter PCBs. Through a highly integrated design, the size and weight of the inverter are reduced for easy installation and maintenance.
What is an Inverter Circuit Diagram?
An inverter circuit diagram is a schematic representation that illustrates how the components on the PCB are interconnected to convert DC power into AC power. It provides a detailed view of the flow of current and the role each component plays within the inverter system.
The diagram typically includes:
Power Input: Showing where the DC power is supplied, often from batteries, solar panels, or other DC sources.
Switching Devices: Components like Insulated Gate Bipolar Transistors (IGBTs) or Metal-Oxide-Semiconductor Field-Effect Transistors (MOSFETs), which are used to alternate the direction of current, producing AC power.
Control Circuit: A microcontroller or other control logic that regulates the switching timing and frequency to generate a stable AC output.
Filters: Inductors and capacitors used to smooth out the AC waveform and minimize harmonic distortion.
Protection Circuits: Components that safeguard against overcurrent, overvoltage, and short circuits, ensuring safe operation of the inverter.
Applications of Inverter PCBs
Inverter PCBs are found in various applications, including renewable energy systems like solar inverters, uninterruptible power supplies (UPS), electric vehicle systems, motor drive systems, and home appliances like air conditioners, refrigerators, and washing machines. Below are the typical applications of inverter PCBs:
Solar Inverters
In solar power systems, inverter PCBs are critical for converting the DC electricity generated by solar panels into usable AC electricity for homes and businesses. Solar inverters also use MPPT (Maximum Power Point Tracking) algorithms to optimize energy harvesting.
Uninterruptible Power Supplies (UPS)
In UPS systems, inverter PCBs ensure the reliable conversion of DC battery power into AC electricity during power outages. These systems are vital in data centers, hospitals, and other environments where uninterrupted power is essential.
Electric Vehicles (EVs)
EVs rely on inverter PCBs to convert the DC power stored in the battery into AC power to drive the motor. The performance and efficiency of the inverter PCB directly affect the vehicleâs range and driving experience.
Industrial Motor Drives
Many industrial applications use AC motors for machinery and equipment. Inverter PCBs regulate the speed and torque of these motors by converting DC power into controlled AC output, they are important for automation, robotics, and manufacturing processes.
Home Appliances
Many modern home appliances, such as air conditioners, refrigerators, and washing machines, use inverter technology for energy efficiency. Inverter PCBs in these devices help control motor speed and reduce energy consumption, contributing to more eco-friendly and cost-effective home systems.
What Causes an Inverter Board to Fail?
There are many factors that can cause inverter board to fail, and some of them we can recognize by visual, but sometimes we cannot. Here we listing some potential factors that make inverter PCB be damaged or fail.
Overheating
Excessive heat is a common cause of inverter PCB failure, particularly in high-power applications. Poor thermal management or inadequate cooling can cause components to overheat and degrade over time. For such conditions, aluminum PCBs has good thermal conductivity, this can help to heat dissipation and transfer heat out efficiently, but if the cooling system is not properly designed, even these boards can fail.
Poor insulation
This may be due to poor installation, improper location selection and poor quality of equipment of PCB board. We can check whether the DC connector has short-circuit supports or burns due to water immersion, and whether the edges of the component become blackened.
Low bus voltage
If this problem occurs in the morning and evening, then it is normal as the inverter tries to limit the generation conditions. If it occurs during normal daytime hours, it can be detected by above method.
Abnormal current leakage
These problems are often caused by poor installation quality, improper location selection and poor equipment quality. We can locate the fault area and make it insulated. If the failure is caused by the material, then replace the incorrect one.
No response
Ensure that the DC input is correctly connected and the inverter has built-in reverse short circuit protection. After the connection is restored, the inverter can start. If the inverter still does not work, it may be the fault of the inverter oscillation circuit or inverter itself has a problem. Try to troubleshooting and repair with new one.
Considerations When Choosing the Right Inverter PCB
Several factors should be considered when choose an inverter PCB for your device. Letâs talk about them.
1. Power Rating
Select a PCB that can handle the power levels required by the application. Overloading a PCB beyond its rated capacity can lead to overheating, component failure, or even dangerous situations like fire.
2. Thermal Management
In applications where heat generation is a concern, selecting a PCB with good heat dissipation is vital. Aluminum PCB or high-quality multilayer PCBs can help dissipate heat effectively. Consider heat sinks, design thermal vias, and adequate ventilation in your design to improve thermal performance.
3. Component Quality
From above, we know high quality components used in the PCB is important as well. High-quality capacitors, transistors, and diodes ensure reliable operation, even in harsh conditions. Always choose components rated for the expected load and environment, or get touch with Best Technology to enjoy a one-stop service from components sourcing and PCB assembly.
4. Environmental Resistance
If the inverter will be used in outdoor or industrial environments, choose a PCB with protective coatings, such as conformal coatings, to shield against moisture, dust, and corrosive elements. Solar power systems or outdoor motor control applications must take it in mind.
5. PCB Layout and Size
The physical size and layout of the PCB should align with the space available in the inverter system. A well-organized PCB layout helps reduce electromagnetic interference (EMI) and improves overall efficiency.
Above are all the information about inverter PCB that we can shared. If you have a question concerning the topics, please contact us.
Wireless technology has transformed the way devices communicate. At the heart of this transformation are Wi-Fi modules. These small components power a wide range of applications, from home automation to industrial systems. In this blog, weâll explore the functions of Wi-Fi modules, their uses, design considerations in PCB assembly and their differences from Bluetooth.
What is a Wi-Fi Module?
The Wi-Fi module, also known as the wireless module, belongs to the transmission layer of the Internet of Things (loT). It integrates a processor, memory, transceiver, and sometimes an antenna. A Wi-Fi module is to convert the serial port or TTL level into an embedded module that meets the Wi-Fi wireless network communication standards, with built-in wireless network protocol IEEE802.11b.g.n protocol stack and TCP/IP protocol stack.
The module handles the task of connecting a device to a wireless router, allowing it to send and receive data over the internet. If embedded a Wi-Fi module in traditional hardware devices, then we can directly use Wi-Fi to connect to the Internet. It can be said, it is an important part of wireless smart home, M2M and other IoT applications.
Types of Wi-Fi Module
According to the different functions, Wi-Fi modules can be divided into three categories:
1. General Wi-Fi modules
Such as USB or SDIO interface modules on our mobile phones, laptops and tablets. Wi-Fi protocol stack and driver are run in Android, Windows and IOS systems, which require a very powerful CPU to complete the application.
2. Router Wi-Fi module
The most typical one is our home router, its protocol and driver has powerful Flash and Ram resources chip plus Linux operating system.
3. Embedded Wi-Fi module
Such as 32-bit MCU, built-in Wi-Fi driver and protocol, interface for the general MCU interface such as UART. Suitable for all kinds of smart home or smart hardware items.
What is the Difference Between Wi-Fi and Bluetooth Modules?
While both Wi-Fi and Bluetooth modules enable wireless communication, their usage and performance differ significantly:
â1. Frequency
The frequency of Wi-Fi has 2.4G and 5G bands. Wi-Fi 2.4G band has 13 channels, 2401~2423MHz. Wi-Fi 5G frequency band is divided into 5.2G band and 5.8G band, and the 5.8G frequency band is: 149, 153, 157, 161, 165; The 5.2G band must support 11ac, and the available channels are 36, 40, 44, 48, 52, 56, 60, and 64. Under normal circumstances, it is recommended to avoid 52, 56, 60, 64 channels, because they conflict with radar channels;
Bluetooth only has 2.4G band: 2.402GHz ~ 2480GHz, a typical Bluetooth has 76 channels, each channel is 1MHz. And bluetooth BLE has 40 channels, each channel 2MHz, of which 37 channels belong to the data channel, 3 channels belong to the broadcast channel;
2. Application
Wi-Fi can directly access the network, and Bluetooth needs conversion processing. Therefore, WiFi is more suitable for 1-to-many local area networking, such as home and company Internet access environment. Compared with Wi-Fi module, bluetooth is more suitable for short-range and high-stability transmission, such as smart headphones. Additionally, bluetooth mesh networking is especially suitable for smart home wireless control and other applications.
3. Transmission Distance
The transmission distance of Wi-Fi is further than that of Bluetooth, which can reach several hundred meters, while the transmission distance of Bluetooth is generally within 100 meters;
4. Transmission Rate
Wi-Fi: 54Mbps; Bluetooth: 2Mbps;
Wi-Fi is more suitable for big data transmission.
5. Speed
Wi-Fi is generally faster than Bluetooth. It can handle large file transfers or streaming content without any issues. Bluetooth is slower but works well for smaller data transfers like audio streaming or simple file sharing.
What is the Range of a Wi-Fi Module?
âThe coverage range of the WiFi module usually depends on the specific application scenario and environmental conditions. According to the IEEE 802.11 standard, the maximum distance that wireless devices can cover is usually 300 meters, but this depends on the environment is open or not.
In the specific environment, the coverage of the WiFi module will be affected by a variety of factors. For example, in an ideal environment of accessibility and interference, the wireless transmission distance of a wireless router is 100 meters indoors and 300 meters at outdoors. In the actual home environment, the wireless signal will be attenuated when passing through obstacles such as walls, glass, doors, and furniture, affecting the transmission distance. If an external antenna is used, the transmission distance can reach 30 ~ 50 km or even more, depending on the gain of the antenna itself.
Advantages of Wi-Fi Module
1. Wide coverage
WiFi module supports âIEEE 802.11b/g/n and other standards to provide a wide range of wireless coverage, suitable for a variety of indoor and outdoor environments.
2. High-speed transmission
WiFi module supports a high data transmission rate, which can meet the requirements of high-speed data transmission, and is suitable for application scenarios with a large amount of data.
3. Compatibility and ecosystem
WiFi module supports a variety of communication protocols, such as âWi-Fi, âBluetooth, etc., has good compatibility and ecosystem, and can be integrated with a variety of devices and services.
4. Easy to install and use
WiFi modules are usually plug and play, easy to install and use, suitable for a variety of devices and system integration.
Disadvantages of a Wi-Fi Module
1. Power consumption
One downside of Wi-Fi modules is their higher power usage compared to other wireless technologies, such as Bluetooth. This can be a concern for devices running on battery power.
2. Interference
Wi-Fi operates on the same frequencies as other devices, such as microwaves and cordless phones.
3. Security
Since Wi-Fi networks are widespread, they can be vulnerable to hacking. Proper security measures, such as encryption, must be implemented to protect data.
What is a Wi-Fi Module Used For?
Wi-Fi modules have a wide range of applications across industries. Actually, it exist everywhere need networks. It can be said, it can be used in every fields. Here are some typical applications:
Smart Homes
Wi-Fi modules power smart devices like security cameras, thermostats, and lighting systems. They connect to a home Wi-Fi network, so users to control them remotely through apps.
Industrial Equipment
In manufacturing or logistics, Wi-Fi modules enable machines to communicate wirelessly.
Consumer Electronics
Devices like laptops, gaming consoles, and smart TVs rely on Wi-Fi modules for wireless internet access.
Healthcare Devices
Medical equipment, such as patient monitors or wearable devices, often use Wi-Fi modules to transmit data to a healthcare provider in real time.
IoT Devices
The IoT relies heavily on Wi-Fi modules. Devices ranging from smart refrigerators to connected doorbells use Wi-Fi to communicate with each other and with cloud-based systems.
Wi-Fi Module Price
Wi-Fi modules are available at various price points, depending on their features and intended use. For instance, the ESP8266 typically costs between $2 to $5. The ESP32, with its additional capabilities, is priced slightly higher, ranging from $5 to $10. High-end industrial Wi-Fi modules can be more expensive, ranging from $20 to $50.
The price may also vary depending on factors like antenna design, supported protocols, and whether the module is designed for mass production or individual projects.
What is the Most Common Wi-Fi Module?
The ESP8266 is one of the most popular and widely used Wi-Fi modules. It is favored in many IoT applications due to its low cost, ease of use, and compact size. Another frequently used module is the ESP32, which offers additional features such as dual-core processing, built-in Bluetooth. In addition to them, there are some other common Wi-Fi module that used in the electronics.
Wi-Fi Module
Description
Frequency Brand
Range
Price
Special Features
ESP8266
Popular for IoT applications due to low cost and ease of use.
When integrating a Wi-Fi module into PCBA design, several factors need to be considered to ensure optimal performance:
Antenna Design and Placement
A key factor in wireless performance is the placement of the antenna. Ensuring there are no obstructions near the antenna can significantly improve signal strength. The module should be positioned to minimize interference from nearby components.
Power Supply
Wi-Fi modules require a stable and sufficient power supply to function effectively. Voltage fluctuations or insufficient power can result in poor connectivity or even module failure.
Thermal Management
Wi-Fi modules can generate heat, especially during heavy use. Proper heat dissipation methods, such as using heat sinks or thermal vias, should be incorporated into the PCBA design to maintain optimal performance.
EMI and EMC Compliance
Wireless communication devices must adhere to electromagnetic interference (EMI) and electromagnetic compatibility (EMC) standards. Proper shielding and circuit design can help reduce interference and improve reliability.
Firmware Integration
Many Wi-Fi modules come with firmware that handles wireless communication tasks.
One-Stop Box-Build Assembly for Wireless Communication Devices
For companies looking to develop wireless communication devices, Best Technology is your go-to choice. We offer one-stop PCBA and box-build service that can handle everything from component sourcing and PCBA design to final product assembly. By partnering with us, you can reduce much development time, and get a high quality, fast delivery, low cost PCBA with Wi-Fi modules.
With over 18 years of experience in printed circuit boards and as one of the leading PCB manufacturers, we support over 2,000 customers in different industrial areas worldwide. You can count on a PCB board manufacturer like us to meet your one-stop electronics manufacturing demands. We have an experienced engineer, production and quality team to fully understand the unique requirements of your industry, such as the particular acceptance criteria in medical, automotive, communication and aerospace industries. Contact us right now to get your PCB quotation!
A high temperature resistant flexible PCB is a flexible printed circuit board that can maintain stable performance in a high temperature environment. It is usually composed of a flexible substrate, a conductive layer, and a cover layer. It has the characteristics of being bendable, foldable, and lightweight, and can withstand high temperatures without affecting its electrical and mechanical properties.
What is the maximum temperature for a flex PCB?
The high temperature resistance of a flexible PCB mainly depends on its substrate material. Generally speaking, the maximum temperature that a flexible PCB can withstand can reach 280 degrees in a short period of time, but the long-term temperature is generally between 120 degrees and 150 degrees. â
Different types of flexible PCB materials have different tolerances to temperature. PI is a commonly used flexible PCB substrate material that has excellent heat resistance and stability. It can maintain performance in the range of -200 degrees to 300 degrees, but the long-term use temperature is generally between 120 degrees and 150 degrees. â
In addition, the glass transition point of solder mask is about 110 degrees, so special attention should be paid to the temperature limit of these materials when designing flexible PCBs. â
What temperature should flexible PCB soldering be?
âThe optimal temperature range for flexible PCB soldering is 290-310 degrees Celsius. This temperature range is suitable for most flexible PCB soldering operations and can ensure soldering quality and component reliability.
In specific operations, the soldering time should be kept within a few seconds to prevent damage to the pads of the PCB board. Accurate temperature management is essential to ensure the solder joint quality and circuit performance of the PCB board. The soldering temperature may vary for different types of flexible PCBs.
What is high Tg PCB?
âHigh Tg PCB refers to PCB materials with higher glass transition temperature (Tg). â Tg is the temperature point at which the material changes from glass to rubber state. High Tg materials can still maintain good mechanical strength and dimensional stability at high temperatures. â
The main advantages of high Tg PCB include:
âHeat resistanceâ: High Tg materials can still maintain good mechanical strength and dimensional stability at higher temperatures and are suitable for high temperature environments. â
âMoisture resistanceâ: High Tg materials have low moisture absorption. Even after being heated after moisture absorption, they can maintain good mechanical strength and adhesion, reducing the risk of failure caused by moistureâ.
âChemical resistanceâ: High Tg materials have better chemical stability at high temperatures and are not easy to decomposeâ.
âDimensional stabilityâ: When the temperature changes, the dimensional changes of high Tg materials are small, ensuring the accuracy of PCBâ.
Application scenarios of high Tg PCB include:
Lead-free manufacturing processâ: In highly functional and multi-layered electronic products, high Tg materials can ensure the stability and reliability of PCB in lead-free processesâ.
âHigh temperature environmentâ: In applications that need to withstand high temperature environments, such as computers, mobile communication devices, etc., high Tg PCBs can ensure stable operation of the equipmentâ.
What are the disadvantages of flexible PCB?
The main disadvantages of flexible PCB include:
âHigh one-time initial costâ: Since flexible PCBs are designed and manufactured for special applications, the initial circuit design, wiring and photographic plate costs are high.
âDifficult to change and repairâ: Once a flexible PCB is made, it must be changed from the base map or the compiled photolithography program, so it is not easy to change. Its surface is covered with a protective film, which must be removed before repair and restored after repair, which is a more difficult taskâ.
How thick is the copper in a flex PCB?
The copper foil thickness in a flexible PCB is usually around 0.1mm. The copper foil thickness of a flexible PCB is generally 0.1mm, which is one of its common specificationsâ.
In addition, the copper foil thickness of a rigid PCB has a wide range, and common thicknesses include 0.2mm, 0.4mm, 0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.6mm, 2.0mm, etc.â. The copper foil thickness of a rigid PCB can be adjusted according to demand. For example, in an environment where high current and high power are required, the copper foil thickness may be higherâ.
Flexible PCB materials usually include polyester film, polyimide film, and fluorinated ethylene propylene film, etc. These materials are widely used in curved and flexible circuit designs in electronic devicesâ.
Why are Flex PCBs so expensive?
First, material cost is one of the main factors affecting the price of flexible PCBs. Flexible PCBs mainly use special materials such as polyimide (PI) and polyester film, which have excellent heat resistance and electrical properties, but are more expensive.
Second, manufacturing process is also an important reason for the high cost of flexible PCBs. The production process of flexible PCBs includes multiple complex links such as exposure, development, etching, lamination and testing. High-precision manufacturing processes, such as fine line etching and precise alignment, require advanced equipment and technology, which increases production costs.
Design complexity is also a key factor. The design and manufacture of flexible PCBs involve multiple processes, such as etching, copper plating, drilling, etc. The higher the complexity of the process, the higher the manufacturing cost.
Finally, market demand also affects the cost of flexible PCBs. Mass production can effectively reduce unit costs, while small batch or customized production may lead to higher costs.
What is rigid-flex PCB vs flex PCB?
The main difference between rigid-flex PCB and flexible PCB lies in their structure and application scenarios. Rigid-flex PCB combines the characteristics of rigid PCB and flexible PCB, while flexible PCB is made entirely of flexible materials.
Rigid-flex PCB is a circuit board that combines rigid board and flexible board, and is usually used in areas where both rigidity and flexibility are required. This type of circuit board uses flexible materials in specific areas and remains rigid in other areas to meet complex design requirements.
Flexible PCB is made entirely of flexible materials and is usually used in applications that require high flexibility and space saving. Flexible PCB uses flexible materials such as polyimide, allowing the circuit board to be easily bent and folded in a small space. This type of PCB is widely used in modern smart devices such as smartphones, tablets and wearable devices to achieve smaller size and more complex functions.
What is the difference between FR4 and flex PCB?
The main difference between FR4 and flexible PCB lies in their materials, structure and application scenarios. FR4 is a rigid PCB substrate, mainly composed of glass fiber and epoxy resin, with good electrical properties and mechanical strength, suitable for applications requiring high stability and reliability. Flexible PCBs are highly flexible and bendable, suitable for applications with limited space or frequent bending.
FR4 features and applications:
FR4 is currently the most common PCB substrate. FR4 has good electrical properties, with a dielectric constant between 4.5 and 4.8, suitable for medium and low frequency applications; in terms of thermal performance, its thermal expansion coefficient is about 14-17ppm/°C, and its heat resistance can reach 260°C; in terms of mechanical properties, FR4 has high bending strength and tensile strength, suitable for manufacturing processes such as drilling, etching, and copper plating.
Due to its stability and reliability, FR4 is often used in applications such as display screens and reverse cam screens that require high stability.
Flexible PCBs features and applications:
Flexible PCBs (FPCs) are mainly made of materials such as polyimide and are highly flexible and bendable. They are often used in applications with limited size or frequent bending.
The design of flexible PCB is relatively simple, but when rigidity needs to be increased for easy installation or assembly, reinforcement plates such as PI, FR-4 or steel sheets are used.
Due to the high flexibility of flexible PCBs, they are often used in devices that require frequent movement or deformation, such as touch sensors and automotive lighting systems.
As a new type of PCB in the electronics field, high-temperature resistant flexible PCBs have gradually become a popular choice in the electronics field with their excellent high-temperature resistance, bendability, foldability, light weight, stable electrical performance, and good mechanical properties. High-temperature resistant flexible PCBs play an important role in applications in high-temperature environments such as aerospace, automotive electronics, industrial control, and medical equipment.
