Archive for the ‘Ceramic PCB’ Category

Thursday, November 21st, 2024

What is Ceramic DIP Package?

The Ceramic Dual-In-Line Package (CDIP or CerDIP) is a sealed enclosure composed of two dry-pressed ceramic parts, encased by a dual-in-line pin frame. This package design effectively prevents the entry of moisture and contaminants once sealed. The CerDIP consists of two main components: the upper section, known as the cap, and the lower section, referred to as the base. It features gold-plated leads attached to the brazed sides and a metal cover that is securely bonded to the chip using a metal seal. The base also includes a cavity designed to house the microchip.

What is the Ceramic DIP Package Made of?

A ceramic DIP package part is usually made of ceramic body, metal leads, sealing materials and internal bonding wires.

Ceramic Body

The core structure of a CerDIP package is its ceramic body. This part provides mechanical strength, thermal stability, and electrical insulation. Alumina is the most commonly used ceramic due to its excellent dielectric properties, high-temperature resistance, and cost-effectiveness. For applications demanding higher thermal conductivity, beryllium oxide or silicon nitride may be used.

Metal Leads

CerDIPs feature metal leads that extend from the ceramic body to connect the internal IC to external circuits. These leads are typically made of nickel, gold-plated copper, or tin-coated steel.

Sealing Materials

To protect the IC from environmental factors, CerDIPs are often hermetically sealed. This involves the use of materials such as glass or metal seals to create an airtight enclosure.

Internal Bonding Wires

Inside the package, fine bonding wires made of gold or aluminum are used to connect the IC chip to the external leads. These wires ensure electrical continuity and maintain the integrity of the circuit.

Why Are CerDIPs Important in Electronics?

CerDIPs act as a protective casing for ICs, safeguarding delicate components from environmental hazards and operational stress. They are particularly valued in industries where temperature fluctuations, mechanical stress, or moisture exposure can compromise performance.

The ceramic material used in CerDIP packages offers superior thermal conductivity and electrical insulation compared to other materials like plastic. This allows circuits to operate at peak performance even in extreme conditions, such as high altitudes, deep-sea environments, or industrial facilities with fluctuating temperatures. Additionally, CerDIP packages are highly resistant to contamination, providing a long-term reliability and stability. That’s why the ceramic DIP package part so important.

What Sets CerDIP Apart from Other Packaging Formats?

The main differences between CerDIP packages and other packaging formats are their materials, applications and characteristics. ‌

CerDIP is mainly used In ECL RAM, DSP (digital signal processor) and other circuits. The pin center distance is 2.54mm, and the number of pins ranges from 8 to 42. The CerDIP package has a glass window and is suitable for UV-erasing EPROMs and microcomputer circuits with EPROMs inside ‌.

The main differences between CerDIP and other packaging formats are:

Materials: CerDIP uses ceramic materials, while other package formats may use plastic or other materials.
Application field: CerDIP is mainly used for ECL RAM, DSP and other circuits, while other packaging formats are suitable for different circuits and application scenarios.
Features: CerDIP is glass sealed and is suitable for circuits that require sealed protection.
Heat dissipation: Ceramics efficiently dissipate heat, preventing ICs from overheating.

In addition, CerDIP differs from other package formats in pin center distance and pin count. For example, DIP (Dual In-line Package) has a pin center distance of 2.54mm and the number of pins from 6 to 64; The Ball Grid Array (BGA) is surface-mount, the number of pins can exceed 200, and the package body is smaller ‌

What Applications Rely on CerDIP Technology?

CerDIP packages are found in a wide range of applications, particularly in industries where performance and reliability cannot be compromised.

Aerospace and Defense

In satellites, aircraft, and military systems, CerDIP packages are critical for electronic modules that operate in extreme conditions.

Medical Devices

Advanced medical technologies like imaging equipment, pacemakers, and laboratory instruments rely on CerDIPs for their precise and reliable performance. These devices often operate in sterile or temperature-sensitive environments, where CerDIP packages thrive.

Automotive Electronics

As vehicles become more advanced, electronic systems play a larger role in ensuring safety and efficiency. CerDIPs are used in engine control units, advanced driver-assistance systems (ADAS), and other critical components that demand reliability.

Industrial Equipment

In manufacturing and automation, CerDIPs are part of control systems that manage processes with high precision.

High-Performance Computing

CerDIPs are used in high-speed computing and telecommunications devices, where heat management and signal integrity are critical.

Key Features of CerDIP Packages

CerDIPs operate reliably over a wide temperature range, from sub-zero conditions to high-heat industrial settings.
The ceramic material is an excellent insulator, reducing the risk of electrical interference or short circuits.
CerDIPs can be hermetically sealed, preventing moisture, dust, and contaminants from affecting the ICs inside.
The rigid structure of the ceramic provides protection against mechanical shocks and vibrations.
CerDIP packages can be designed to support compact circuit assemblies, making them suitable for space-constrained applications.

How Are CerDIPs Manufactured?

The production of CerDIP packages involves complex and meticulous processes to ensure high quality, here are some basic process that manufacture a ceramic DIP package part:

Material Preparation: Ceramic powders are mixed with binders and compressed into the desired shape.
Sintering: The compressed ceramic is baked at high temperatures, a process that enhances its density and strength.
Machining: The sintered ceramic is machined to precise dimensions, ensuring compatibility with circuit designs.
Metal Pin Attachment: Pins are attached to the ceramic body to facilitate electrical connections. These pins are typically made of a conductive metal like gold or nickel.
Sealing: Hermetic sealing ensures that the package is airtight, protecting the IC from environmental factors.

As a ceramic PCB manufacturer, Best Technology not only focus on the manufacturing of ceramic circuit board, but also in ceramic package shell fabrication. We have strong R&D team and most of our engineers are engaging in ceramic PCB manufacturing for over 10 years. They can provide professional technical support for your PCB project. In addition to this, we offer one-stop service from the ceramic PCB design, PCB copy, component sourcing, PCB fabrication, PCB assembly, box building assembly and arrange the shipment. Choose us, we can be your most reliable ceramic package supplier.

Understanding Ceramic Heat Sinks

Ceramic heat sinks are thermal management devices designed to absorb and dissipate heat generated by electronic components. They are primarily made from materials such as aluminum oxide (Al2O3), silicon carbide (SiC), and other advanced ceramics. These materials exhibit excellent thermal conductivity and stability at high temperatures, making them suitable for various electronic applications.

Applications of Ceramic Heat Sinks

1. Power Electronics

Ceramic heat sinks are widely used in power electronics, such as inverters and converters. These devices generate significant amounts of heat during operation, and ceramic heat sinks play a crucial role in dissipating this heat to maintain optimal performance and reliability. Their ability to withstand high temperatures makes them ideal for high-power applications, including electric vehicles and renewable energy systems.

2. LED Technology

The use of LED lighting has surged in recent years, and efficient thermal management is essential to maintain brightness and extend the lifespan of LED components. Ceramic heat sinks are increasingly employed in LED applications due to their high thermal conductivity and ability to manage heat effectively. By dissipating heat efficiently, ceramic heat sinks help maintain stable light output and prolong the operational life of LED lighting systems.

3. Telecommunications

In telecommunications, devices such as base stations and routers often operate under heavy loads, generating substantial heat. Ceramic heat sinks are commonly used in these applications to manage thermal loads effectively, ensuring that devices operate within specified temperature ranges. This thermal management is critical for maintaining signal integrity and overall system performance.

4. Aerospace and Defense

The aerospace and defense industries require components that can perform reliably under extreme conditions. Ceramic heat sinks are utilized in various applications, including avionics and satellite systems, where high temperatures and harsh environments are common. Their lightweight and high-temperature resistance make them suitable for applications in aircraft electronics and military equipment, ensuring reliability and safety.

5. Medical Devices

Medical equipment, particularly imaging systems and laser devices, require effective thermal management to ensure safe and reliable operation. Ceramic heat sinks are employed in these applications to dissipate heat generated during operation, preventing overheating and ensuring consistent performance. By maintaining optimal temperatures, ceramic heat sinks contribute to the safety and effectiveness of medical devices.

Advantages of Ceramic Heat Sinks

1. Excellent Thermal Conductivity

Ceramic materials such as aluminum oxide and silicon carbide exhibit high thermal conductivity, allowing ceramic heat sinks to absorb and dissipate heat efficiently. This property is crucial for maintaining optimal operating temperatures in electronic components.

2. High-Temperature Resistance

Ceramics can withstand high temperatures without degrading, making them suitable for high-power and high-frequency applications. This capability ensures that ceramic heat sinks can operate effectively even in extreme conditions.

3. Electrical Insulation

Ceramic heat sinks provide excellent electrical insulation, preventing unwanted current flow between electronic components. This characteristic is essential for applications where electrical isolation is critical to avoid short circuits and enhance safety.

4. Lightweight and Compact Design

Ceramic materials can be engineered to be lightweight, which is beneficial in applications where weight is a concern, such as aerospace and portable electronics. Their compact design also allows for flexible integration into various systems, accommodating space constraints.

5. Corrosion Resistance

Ceramic materials are inherently resistant to corrosion and chemical damage, making them suitable for harsh environments. This property ensures longevity and reliability in applications exposed to corrosive substances.

Challenges of Ceramic Heat Sinks

Despite their advantages, the implementation of ceramic heat sinks comes with challenges.

1. Brittleness

One of the primary challenges of ceramic materials is their brittleness. While they offer excellent thermal performance, they can be susceptible to cracking or breaking under mechanical stress. This brittleness necessitates careful handling during manufacturing and installation.

2. Manufacturing Complexity

The production of ceramic heat sinks can be more complex than that of traditional metal heat sinks. The processes involved, such as sintering and shaping, may require specialized equipment and techniques, increasing manufacturing costs.

3. Cost Considerations

Ceramic materials can be more expensive than metals like aluminum or copper. The higher initial costs may deter some manufacturers, especially in cost-sensitive applications. This financial consideration can limit the broader adoption of ceramic heat sinks in certain markets.

4. Thermal Interface Materials (TIM)

The performance of ceramic heat sinks heavily relies on the quality of thermal interface materials (TIMs) used between the heat sink and electronic components. Selecting the right TIM is crucial for optimizing thermal conductivity, but it can also add to the overall cost and complexity of the assembly process.

Future Trends in Ceramic Heat Sink Technology

The future of ceramic heat sinks looks promising, driven by ongoing research and technological advancements. Several trends are shaping their development.

1. Advanced Material Development

Research into new ceramic materials with enhanced thermal and mechanical properties is ongoing. Innovations in material science could lead to the development of ceramics that combine high thermal conductivity with improved strength and ductility, addressing some of the current limitations.

2. Integration with Active Cooling Solutions

While ceramic heat sinks are predominantly passive cooling solutions, integrating them with active cooling systems—such as fans or liquid cooling—could enhance thermal management capabilities. This hybrid approach may provide greater efficiency in high-performance applications where heat generation is significant.

3. Sustainability and Eco-Friendly Practices

As environmental concerns grow, the development of eco-friendly materials and sustainable manufacturing practices for ceramic heat sinks is becoming increasingly important. This trend will likely influence future designs and production processes.

4. Miniaturization

The continued trend toward miniaturization in electronics demands compact and efficient thermal management solutions. Ceramic heat sinks can be designed to fit into smaller spaces while maintaining effective heat dissipation, meeting the needs of next-generation portable devices.

Conclusion

Ceramic heat sinks play a vital role in the thermal management of modern electronic devices. Their unique properties—such as high thermal conductivity, temperature resistance, and electrical insulation—make them ideal for a wide range of applications, from power electronics to medical devices. While challenges such as brittleness and manufacturing complexity exist, ongoing advancements in materials and techniques are likely to enhance their performance and applicability.

As the demand for high-performance electronics continues to grow, the importance of ceramic heat sinks in effective thermal management will only increase. By leveraging innovative designs and materials, manufacturers can ensure that ceramic heat sinks meet the thermal management challenges of tomorrow, contributing to the reliability and efficiency of modern technology.

What is Active Metal Brazing (AMB) Technology?

AMB technology is developed on the basis of DBC technology, at a high temperature of about 800 ° C, AgCu solder containing active elements Ti and Zr is wetted and reacted at the interface of ceramics and metals, so as to achieve heterogeneous bonding between ceramics and metals.

Compared with traditional products, AMB ceramic PCB relies on the chemical reaction of ceramic and active metal solder paste at high temperature to achieve the combination, so its combination strength is higher, better reliability, extremely suitable for connectors or scenarios with large current load and high heat dissipation requirements. In particular, new energy vehicles, rail transit, wind power generation, photovoltaic, 5G communication and other power electronics and high-power electronic modules with demanding performance requirements have a huge demand for AMB ceramic copper clad plates. At present, this kind of product is becoming one of the mainstream products in the market.

AMB Ceramic PCB | Ceramic PCB Prototype & Design

Why use AMB Ceramic PCB?

The main benefits of AMB ceramic substrates include excellent thermal conductivity, copper layer bonding, reliability and suitability for high power and current applications. ‌ AMB ceramic substrate compared with the traditional DBC ceramic substrate, in the thermal conductivity, copper layer bonding force, reliability and other aspects of better performance, especially suitable for high temperature, high power, high heat, high reliability package requirements.

Specifically, the AMB ceramic substrate is welded between the copper foil and the ceramic substrate using a metal solder containing a small amount of active elements. This process improves the wettability of the solder to the ceramic after melting, so that the ceramic surface can be welded with the metal without metallization, thereby improving the thermal conductivity and copper layer bonding force.

In addition, the characteristics of AMB ceramic substrate with high current carrying capacity and low thermal expansion coefficient make it excellent in IGBT module, vehicle gauge main inverter, photovoltaic transformer, rail transit high voltage and other application.

What is the difference between DBC and AMB ceramic PCB?

Both DBC and AMB technologies use ceramic as the base material, but their bonding processes are different, leading to distinct performance characteristics.

Bonding Process: DBC relies on a high-temperature process to bond copper directly onto a ceramic substrate. AMB, on the other hand, uses active metal brazing, where metals like titanium and zirconium are added to form a strong bond between the copper and ceramic.

Thermal Conductivity: AMB ceramic PCBs are known for better thermal conductivity compared to DBC.

Mechanical Strength: AMB ceramic PCBs typically offer superior mechanical strength due to the brazing process. The bond is more durable and reliable under extreme conditions.

Flexibility in Design: AMB technology allows for more flexibility in terms of the shapes and sizes of copper patterns, which can be a big advantage in custom designs. DBC, while effective, can sometimes be limited in this regard.

AMB Ceramic PCB Manufacturing Process

The process of creating AMB ceramic PCBs is intricate and requires precision at every step. Here’s an overview of the key stages involved:

1. Ceramic Substrate Preparation: The first step is choosing the right ceramic substrate. Common materials include aluminum nitride and alumina, both known for their excellent thermal properties.

2. Metal Deposition: Copper is the most common metal used for AMB ceramic PCBs. However, unlike traditional methods, an active metal like titanium or zirconium is added to the copper to form a strong bond with the ceramic substrate.

3. Active Metal Brazing: The ceramic and metal are heated to a high temperature, allowing the active metals to react with both the copper and ceramic. This process forms a bond that is stronger than conventional methods like soldering or adhesion.

4. Etching and Circuit Formation: Once the copper has bonded with the ceramic, the next step is to etch the copper to create the desired circuit patterns. This is done using precise laser technology to ensure high accuracy.

5. Inspection and Testing: Quality control is vital in AMB ceramic PCB manufacturing. Each PCB is carefully inspected for defects and tested to ensure it meets the necessary performance criteria.

Types of Ceramic Substrate

Nowadays, there are four common types of ceramic substrates used in the ceramic PCB manufacturing – Al2O3, AlN, BeO and Si3N4. Let me introduce them firstly:

1. Al2O3

Al2O3 (Alumina) substrate is the most commonly used substrate material in the electronics industry. Compared with most other oxide ceramics, alumina ceramics have high strength and chemical stability, rich raw material sources, cheap prices, and are suitable for a variety of manufacturing technologies and different shape requirements.

2. BeO

BeO has a higher thermal conductivity than metal aluminum, applied to the need for high thermal conductivity, but the temperature exceeds 300°C rapidly decreases, but also due to its toxicity, greatly limiting the application of BeO ceramics.

3. Si3N4

The thermal conductivity of silicon nitride ceramic substrate 75-80W/(m·K), the thermal conductivity is indeed less than that of aluminum nitride ceramic substrate, but the bending strength of silicon nitride ceramic substrate is 2-3 times that of aluminum nitride ceramic substrate, which can improve the strength and impact resistance of silicon nitride ceramic copper-clad plate, welding thicker oxygen free copper without porcelain cracking phenomenon, and improve the reliability of the substrate.

4. AlN

AlN has several very important performance advantages: it is non-toxic; High insulation performance and high breakdown field strength (1.4×107V/cm); Low dielectric constant (~ 8.8); Very high thermal conductivity (comparable to good thermal conductivity of aluminum, theoretical thermal conductivity 280W/m/K); There is an expansion coefficient matching Si (293K-773K, 4.8×10-6K-1). Only the mechanical strength of AlN ceramic material itself is slightly worse; Compared with Al2O3, the price of AlN is relatively high. However, in terms of cost performance, AlN is still much higher, because the thermal conductivity of Al2O3 (96%) is only 29W/M*K (25°C), and the thermal conductivity of AlN is as high as 180W/M*K (25°C). Therefore, for the emerging and rapidly developing high-power electronic devices required by the Internet of Things, artificial intelligence, 5G, power electronics, rail transit, new energy vehicles and other industries, especially high-power IGBT modules, aluminum nitride ceramic substrates with high thermal conductivity and high reliability will become the preferred material.

Among them, only Al2O3, AlN and Si3N4 can be MADE by AMB technology. Below is a performance table of AMB ceramic PCB made with different materials:

How Much Does an AMB PCB Cost?

The cost of an AMB ceramic PCB depends on several factors, each influencing the overall price.

Material Choice

The type of ceramic used plays a significant role in the cost. Aluminum nitride is more expensive than alumina but offers superior thermal properties. Depending on the application, choosing the right material is key to balancing cost and performance.

Copper Thickness

Thicker copper layers increase the price due to the additional material required. However, they also improve the current-carrying capacity, which might be necessary for high-power devices.

Design Complexity

More intricate designs, especially those with custom shapes or numerous layers, will naturally cost more due to the precision required during manufacturing.

Batch Size

Ordering AMB ceramic PCBs in bulk can reduce the cost per unit. This is particularly beneficial for larger companies that require high-volume production.

Testing and Quality Assurance

Rigorous testing and quality checks are essential for AMB ceramic PCBs, especially in industries where failure is not an option. Higher standards of quality control can drive up costs but ensure greater reliability.

Challenges Facing AMB Technology

While AMB technology offers numerous advantages, it is not without its challenges. Understanding these challenges is crucial for its successful implementation in ceramic circuit boards.

1. Cost Considerations

One significant hurdle to the widespread adoption of AMB technology is cost. The materials involved in AMB, particularly the reactive filler metals, can be more expensive than traditional bonding methods. Additionally, the equipment and processes required for AMB may involve higher initial investments.

2. Process Complexity

The AMB process demands a high degree of precision and control. Factors such as temperature, environment, and timing must be meticulously managed to ensure optimal bonding quality.

3. Limited Availability of Filler Materials

The selection of suitable filler materials for AMB can be restrictive. Finding a filler that effectively bonds with various ceramics and metals while maintaining desirable mechanical and thermal properties can be a daunting task.

4. Risk of Thermal Shock

The high temperatures associated with the AMB process pose a risk of thermal shock to the ceramic substrates. If not properly managed, rapid temperature changes can lead to cracking or other failures in the ceramic material. Careful consideration of thermal profiles during the brazing process is essential to mitigate this risk.

Best Technology is a reliable Ceramic PCB manufacturer in China. We specialize in small to medium-volume PCB Manufacture, PCB Assembly and Electronic Manufacturing Services. Our product ranges from thick film ceramic PCB, thin film ceramic PCB, DPC ceramic PCB, DBC ceramic PCB, AMB ceramic PCB, HTCC ceramic PCB and LTCC ceramic PCB. Choose us, you can enjoy:

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1. Introduction

With the continuous progress of electronic technology, the performance and reliability of electronic components have been put forward higher requirements. Ceramic substrate technology, as one of the key materials for integrated circuits (ICs) and microwave assemblies, provides excellent electrical properties and mechanical strength. Low temperature co-fired ceramics (LTCC) and high temperature co-fired ceramics (HTCC) technologies are the two main ceramic substrate technologies, and this paper will provide an in-depth comparison of these two technologies to clarify their advantages and disadvantages as well as the applicable scenarios.

2. LTCC Technology Overview

2.1 Process

LTCC technology uses low-temperature co-fired ceramic materials, which are typically sintered at temperatures ranging from 850°C to 900°C. The process includes material preparation, printed circuitry, and a high level of sintering. The process consists of material preparation, printed circuits, lamination and co-firing. LTCC materials are usually composed of a mixture of glass and ceramic powders, which melt and fuse well at low temperatures.

2.2 Material Characterization

Low temperature co-fired ceramics (LTCC) materials have a low dielectric constant and low dielectric loss, making them suitable for high frequency applications. The conductive layer can be fabricated by screen printing technology and can support multi-layer integration, which makes LTCC perform well in space-constrained applications.

2.3 Advantages and Disadvantages Analysis

Advantages:

Multi-layer integration capability: Low temperature co-fired ceramics (LTCC) supports complex multi-layer structures, making it suitable for highly integrated circuit designs.

Cost Effectiveness: Lower sintering temperatures reduce production costs.

High-frequency performance: Excellent high-frequency characteristics for wireless communications and microwave applications.

Disadvantages:

Weak High Temperature Resistance: Not suitable for applications in high temperature environments.

Limited material selection: Compared to HTCC, LTCC has a smaller variety of materials, limiting the design for certain applications.

3. HTCC Technology Overview

3.1 Process

High temperature co-fired ceramics (HTCC) uses high-temperature co-fired ceramic materials, which are typically sintered at temperatures between 1500°C and 1600°C. HTCC materials mainly include alumina (Al₂O₃), which is capable of achieving high densities and excellent mechanical properties at high temperatures. The HTCC process involves powder preparation, molding, and sintering steps.

3.2 Material Characterization

High temperature co-fired ceramics (HTCC) materials have very high temperature resistance and chemical stability. The high temperature sintering process gives these materials excellent mechanical strength and wear resistance, making them suitable for use at high temperatures and in harsh environments. Their electrical properties are stable and suitable for high power and high frequency applications.

3.3 Analysis of Advantages and Disadvantages

Advantages:

High temperature resistance: able to withstand extremely high operating temperatures, suitable for high-temperature environments.

High mechanical strength: high strength and wear resistance, making it suitable for harsh application conditions.

Wide range of materials: support a variety of high-temperature ceramic materials to meet different application requirements.

Disadvantages:

High cost: High temperature sintering equipment and process requirements result in high production costs.

Process complexity: the need for high-temperature sintering equipment, the process is more complex.

4. Comparative analysis of LTCC and HTCC

4.1 process complexity

Low temperature co-fired ceramics (LTCC) process is relatively simple, low-temperature sintering reduces the cost of equipment and process difficulties, while HTCC requires the use of high-temperature sintering equipment, process complexity and high cost.

4.2 Material Performance

Low temperature co-fired ceramics (LTCC) materials are suitable for high-frequency and multi-layer integration applications and offer low dielectric loss, while HTCC materials offer higher mechanical strength and temperature resistance for high-temperature and high-power applications.

4.3 Comparison of Application Scenarios

LTCC (Low Temperature Co-fired Ceramics) Application Areas

1. Wireless communications:

Reason: LTCC technology has excellent high-frequency performance and low dielectric loss, which makes it suitable for radio frequency circuit (RF circuit) and microwave applications in wireless communication equipment. Its multi-layer integration capability allows the realization of complex RF circuits on a small substrate to meet the demand for high frequency and miniaturization of modern communication systems.

Application examples: mobile communication base stations, satellite communication systems, wireless sensor networks.

2. Automotive electronics:

Reason: In automotive electronic systems, LTCC can provide stable electrical performance and reliable multi-layer integration, which is suitable for in-vehicle communication modules and sensors that require high-frequency characteristics.

Application examples: automotive radar systems, in-vehicle wireless communications, automotive sensors and control units.

3. Medical devices:

Reason: LTCC technology enables highly integrated and miniaturized designs with good high-frequency performance, making it suitable for electronic components in medical instruments.

Application examples: Medical monitoring devices, medical imaging systems, implantable medical devices.

4. Consumer electronics:

Reason: LTCC’s low cost and high integration capability make it suitable for mass-produced consumer electronics such as smartphones and portable electronic devices.

Application examples: Smartphones, tablets, Bluetooth devices.

HTCC (High Temperature Co-fired Ceramics) Application Areas

1. Aerospace:

Reason: HTCC technology can withstand extremely high temperatures and harsh environmental conditions, making it ideal for high-temperature components and electronics in spacecraft and aircraft.

Application examples: High temperature sensors in spacecraft, electronic control systems in airplanes, rocket engine components.

2. Military equipment:

Reason: Military applications require high-strength, high-temperature-stable materials. HTCC’s excellent mechanical strength and high-temperature resistance make it suitable for use in key components in military equipment.

Application examples: missile systems, military communications equipment, radar systems.

3. High power electronic equipment:

Reason: HTCC is able to maintain stable performance in high power and high temperature environments, making it suitable for electronic components with high power density and high temperature operation.

Examples of applications: high power supply modules, high power amplifiers, lasers.

4. Sensors and devices for extreme environments:

Reason: HTCC materials’ excellent resistance to high temperatures and chemical stability make them suitable for sensors and other electronic devices in extreme environments.

Application examples: deep-sea exploration equipment, geological exploration instruments, sensors in extreme climatic conditions.

5. Conclusion

Low temperature co-fired ceramics (LTCC) and High temperature co-fired ceramics (HTCC) technologies have their own advantages and disadvantages, and the selection of the right technology depends on the specific application requirements. Low temperature co-fired ceramics (LTCC) is suitable for multilayer integrated circuits that require high-frequency characteristics and low cost, while High temperature co-fired ceramics (HTCC) is suitable for applications in high-temperature and high-power environments. Understanding the characteristics of both technologies can help engineers and designers make better choices in their projects, optimizing performance and cost effectiveness.

What is Thermal Conductivity?

Thermal conductivity refers to a material’s ability to conduct heat. It’s a physical property that indicates how easily heat can pass through a substance when there is a temperature difference. In scientific terms, thermal conductivity is measured in watts per meter-kelvin (W/m·K), describing how much heat (in watts) is transferred through a material for every meter of thickness when there’s a one-degree temperature difference across it.

For ceramic materials, thermal conductivity plays a pivotal role in determining their usability in various industrial and electronic applications. Materials with high thermal conductivity can transfer heat quickly, so it is important in situations where heat must be dissipated rapidly to avoid damage to components, like in electronics or aerospace industries. On the other hand, materials with low thermal conductivity are used for thermal insulation, preventing unwanted heat transfer in applications like kiln linings or fireproofing.

Do Ceramic Materials Have High Thermal Conductivity?

Ceramic materials are generally known for their thermal insulation properties, meaning they typically have low thermal conductivity. However, not all ceramics are insulators. There are a few exceptions with significantly higher thermal conductivity, making them valuable for heat-dissipating applications.

Traditional ceramics such as alumina and zirconia are typically poor conductors of heat due to their atomic structure, which restricts the movement of heat. However, advanced ceramics like aluminum nitride (AlN) and silicon carbide (SiC) exhibit impressive levels of thermal conductivity. These materials are increasingly being used in industries like electronics, aerospace, and automotive manufacturing, where managing heat efficiently is critical to the performance and safety of equipment.

High thermal conductivity ceramics, though less common, have opened new avenues for using ceramic materials in areas where heat transfer was traditionally a limiting factor. So, while most ceramics are not known for high thermal conductivity, advancements in ceramic technology have led to the development of high-performance materials that challenge this generalization.

Why is Thermal Conductivity Important for Ceramic Materials?

Thermal conductivity in ceramics is a key factor that dictates where and how these materials can be used. There are several reasons why thermal conductivity matters for ceramic materials:

Heat Management in Electronics

In electronics, high thermal conductivity ceramics are crucial to ensure that components do not overheat during operation. Many electronic devices produce heat as a byproduct, and if this heat is not managed properly, it can lead to equipment failures. Ceramic materials like AlN and BeO are widely used in applications such as LED packaging, power electronics, and semiconductor manufacturing due to their ability to transfer heat away from sensitive components quickly and efficiently.

Thermal Insulation

On the flip side, some ceramic materials with low thermal conductivity are perfect for insulation. In industries like metallurgy or construction, materials like silicon oxide or zirconia are used to keep heat in or out, making them excellent choices for furnace linings, kilns, and thermal barrier coatings.

Thermal Shock Resistance

Many ceramics with low thermal conductivity also possess high thermal shock resistance, meaning they can withstand rapid temperature changes without cracking or breaking. This is important in applications such as aerospace, where materials are often exposed to extreme temperature variations.

Energy Efficiency

Thermal conductivity affects the energy efficiency of systems. In applications like heating elements, components with good thermal conductivity allow heat to be transferred more effectively, leading to better energy efficiency and lower operational costs. Ceramics that balance both thermal insulation and conductivity provide optimized energy management, crucial for industrial processes.

5 Typical High Thermal Conductivity Ceramic Materials

Aluminum Nitride (AlN)

Thermal Conductivity: ~170-230 W/m·K

Aluminum nitride is one of the most well-known ceramics for high thermal conductivity. It is electrically insulating, which makes it an ideal material for electronic substrates and heat sinks in devices like LEDs and power modules. Its ability to rapidly dissipate heat while maintaining electrical isolation makes it a popular choice in electronics where heat management is critical.

Silicon Carbide (SiC)

Thermal Conductivity: ~120-270 W/m·K

Silicon carbide is not only known for its excellent thermal conductivity but also its incredible hardness and mechanical strength. It is used in high-temperature applications, such as in gas turbines and heat exchangers. Its ability to withstand harsh conditions while transferring heat efficiently makes it invaluable in aerospace and automotive industries.

Beryllium Oxide (BeO)

Thermal Conductivity: ~200-330 W/m·K

Beryllium oxide offers one of the highest thermal conductivities among ceramics, rivaling some metals. Its superior ability to conduct heat while remaining electrically insulating makes it ideal for high-performance electronic devices. However, its use is limited due to the toxic nature of beryllium, requiring careful handling during manufacturing.

Alumina (Al2O3)

Thermal Conductivity: ~20-35 W/m·K

Alumina is a widely used ceramic due to its good combination of thermal conductivity, mechanical strength, and electrical insulation. Though not as high in thermal conductivity as AlN or SiC, alumina’s affordability and versatility make it a common choice in many industrial applications, including substrates for electronics and thermal barriers.

Silicon Nitride (Si3N4)

Thermal Conductivity: ~20-30 W/m·K

Silicon nitride is a material prized for its thermal shock resistance and mechanical strength. Though it does not have the highest thermal conductivity, its ability to withstand extreme temperatures and thermal cycling makes it valuable in engines and high-performance bearings.

What Ceramic Materials Are Best for Thermal Conductivity?

Aluminum nitride is one of the most suitable ceramic materials for conducting heat. ‌ aluminum nitride (AlN) has a thermal conductivity of 170-230 W/mK, is one of the best thermal conductivity ceramic substrate materials, especially suitable for high power density and high-frequency electronic devices heat. Aluminum nitride is suitable for heat conduction, mainly for the following reasons:

1. High thermal conductivity: aluminum nitride has extremely high thermal conductivity and can effectively transfer heat from one area to another.

‌2. Excellent mechanical properties: aluminum nitride not only has good thermal conductivity, but also has high mechanical strength and chemical stability, can maintain the stability of its structure and properties in a variety of environments.

‌3. Wide application: aluminum nitride is widely used in the heat dissipation of high power density electronic devices and high-frequency electronic devices to meet the needs of modern electronic equipment for efficient heat dissipation.

What are the Thermal Properties of Ceramic Materials?

The thermal properties of ceramic materials mainly include melting point, heat capacity, thermal expansion and thermal conductivity. ‌ The melting point of ceramic materials is generally higher than that of metals, up to 3000℃ or more, and has excellent chemical stability at high temperatures‌.

The heat capacity of ceramic materials refers to the heat required to increase the temperature of ceramic materials by 1℃ per unit mass. Ceramic has a lower heat capacity, which means that it is less able to absorb heat when heated‌.

The coefficient of thermal expansion of ceramic materials is small, much lower than that of metal. This means that when the temperature changes, the size of the ceramic changes less and has good dimensional stability.

The thermal conductivity of ceramic materials is lower than that of metal materials, but its thermal conductivity depends on the specific type of ceramic. Some ceramics are good thermal insulation materials, while some ceramics are good thermal conductivity materials, such as boron nitride and silicon carbide ceramics.

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What is Aluminum Nitride PCB?

Aluminum nitride PCB also known as Aluminum nitride ceramic PCB or short for AlN PCB. It is a high-performance circuit board made from aluminum nitride ceramic, a material known for its exceptional thermal conductivity and electrical insulation properties. These boards are commonly used in industries where efficient heat dissipation is crucial, such as in power electronics, LED applications, and high-frequency devices. AlN PCBs are gaining popularity due to their ability to withstand extreme temperatures.

Aluminum Nitride PCB | Aluminum Nitride Ceramic PCB

Benefits of AlN PCBs

One of the key advantages of AlN PCBs is their excellent thermal conductivity, which helps prevent overheating in electronic components. With exceptional thermal conductivity of 170 W/mK, strong dielectric strength, and a low thermal expansion coefficient (CTE <4 ppm/°C), AlN is widely used in applications like high-power LEDs, lasers, high-current switches, and even ultra-low temperature vacuum electronics such as those in quantum computing. In addition to these features, AlN offers the same benefits as other ceramic materials, including rigidity, environmental and chemical resistance, and 0% water absorption.

Key reasons for choosing Aluminum Nitride over other PCB materials include:

Outstanding thermal conductivity of 170 W/mK

Excellent dielectric properties

High operating temperatures exceeding 350°C

Low thermal expansion coefficient (<4 ppm/°C)

Compact designs due to better integration

Hermetically sealed packages with 0% water absorption

Minimal to no outgassing

What is the Thermal Conductivity of Aluminum Nitride PCB?

‌The thermal conductivity of aluminum nitride PCB ranges from 170-230W/(m·K).

The high thermal conductivity of aluminum nitride PCB is due to its unique structure and chemical composition. The thermal conductivity of aluminum nitride ceramic substrate is 2-3 times higher than that of traditional alumina ceramics and silicon-based ceramics, and 10-20 times higher than that of titanium substrate. This high thermal conductivity allows them to effectively dissipate heat from high-power electronic components, preventing overheating and ensuring stable performance. The ability to manage heat efficiently makes AlN PCBs an ideal choice for applications that generate a significant amount of heat, such as power modules, LEDs, and RF components. In comparison to other materials like aluminum oxide, which has lower thermal conductivity (around 20-30 W/mK), aluminum nitride stands out as a top choice for heat-sensitive applications.

Factors affect thermal conductivity of AlN PCB

Although the theoretical thermal conductivity of AlN is extremely high, its performance in practical applications is limited by a number of factors, mainly including:

Microstructure

Phonon scattering is a key mechanism for heat conduction. Grain boundaries, interfaces, second phases, and defects can all affect the mean free path of phonons, thereby influencing thermal conductivity. High-purity, low-defect single-crystal AlN has a longer phonon mean free path and higher thermal conductivity.

Oxygen Impurity Content

AlN’s strong affinity with oxygen leads to the easy introduction of oxygen impurities, which form alumina films and lattice defects, such as aluminum vacancies. These significantly reduce the phonon mean free path, lowering thermal conductivity. When the oxygen concentration is below 0.75%, oxygen atoms primarily replace nitrogen atoms in the lattice; however, exceeding this concentration causes aluminum vacancies to disappear and results in the formation of extended defects, further affecting thermal conductivity.

Sintering Process and Additives

By selecting appropriate sintering additives (such as Y₂O₃-Li₂O, Y₂O₃-CaC₂ composite systems), densification can be achieved at lower temperatures, while reducing the formation of oxygen impurities and second phases, effectively improving the thermal conductivity of AlN ceramics. These additives help purify grain boundaries and optimize the microstructure, facilitating more efficient phonon transmission.

What is Aluminum Nitride PCB Used For?

Aluminum nitride as a stable hexagonal wurtzite covalent bond compound, has shown extensive application potential in the field of electronics and optoelectronics due to its unique physical and chemical properties. Its crystal structure takes AlN4 tetrahedron as the basic unit, space group P63mc, belongs to the hexagonal crystal system, which gives AlN a series of excellent properties and use in advanced applications.

Some common applications include:

Optical Communication

Integrated Circuits and High-Power Electronic Devices

Power Electronics

Wafer chips

Epoxy Resin Packaging

Optical Devices and Piezoelectric Devices

Industrial Materials

Acoustic Devices

Aerospace

Military

Why is Aluminum Nitride Expensive?

The high cost of aluminum nitride PCBs stems from several factors.

First of all, the raw material cost of aluminum nitride PCB is higher. The preparation of aluminum nitride powder requires high purity raw materials, synthesis methods include direct nitriding method, carbothermal reduction method, self-propagating high temperature synthesis and chemical vapor deposition method, etc. These methods have high requirements on equipment and technology, resulting in higher costs.

Secondly, the production process is complicated. The preparation process of aluminum nitride PCB is complex, including multiple steps such as molding and sintering, which has high requirements for equipment and technology and a high production threshold.

Finally, the market demand is large. Aluminum nitride PCB in power electronics, communication equipment, automotive electronics and other fields have a wide range of applications, especially in high power, high frequency and other occasions, its excellent heat dissipation and insulation performance can not be replaced, resulting in short supply in the market, the price of natural rising.

Aluminum Nitride PCB vs. Alumina Oxide PCB

Both aluminum nitride (AlN) and alumina oxide (Al2O3) are ceramic materials used in PCB manufacturing, but they differ significantly in terms of performance. AlN offers superior thermal conductivity, typically 170-230 W/mK, compared to aluminum oxide’s lower range of 20-30 W/mK. This makes AlN the better option for applications requiring efficient heat dissipation, such as high-power electronics and LED lighting.

However, aluminum oxide is more cost-effective and is often used in applications where high thermal conductivity is not as crucial. While Al2O3 provides good electrical insulation and is easier to produce, it may not perform as well in heat-sensitive environments as AlN. Therefore, the choice between AlN and Al2O3 depends on the specific thermal and budgetary requirements of the application. Here are the parameters of AlN and Al2O3 materials:

Parameter	Aluminum Nitride (AlN)	Alumina Oxide (Al2O3)
Thermal conductivity	170-230 W/m.k	24-30 W/m.k
Dielectric constant	8.8	9.2-10
Dielectric strength	15-25kV/mm	10-15kV/mm
Temperature resistance	1000-1500C	1000-1200C
CTE	4.0 ppm/K	6.5-7 ppm/K
Flexural strength	450MPa	320MPa
Dielectric breakdown voltage	14 V/m	10 V/m

AlN Ceramic PCB Design Considerations

When designing an aluminum nitride PCB, several factors need to be considered to optimize performance:

1. Trace Width

The trace width on AlN PCBs should be a minimum of 10 mils. This ensures that the conductor cross-section is sufficient to handle the current and heat dissipation needs. Given the thermal advantages of AlN, wider traces help in spreading heat more efficiently, minimizing the risk of overheating in power-dense applications.

2. Trace Clearance

Clearances between adjacent traces should be at least 8 to 10 mils. AlN PCBs often work with higher voltage levels, making spacing critical to prevent arcing or dielectric breakdown. In high-power designs, careful spacing between traces reduces the likelihood of signal interference and maintains the board’s insulation integrity.

3. Via Pads

For via pads, a minimum diameter of 16 mils is recommended. This provides sufficient area for stable soldering and ensures proper electrical connection through the via. Depending on the board’s application, larger via pads may be necessary to accommodate higher currents or thermal dissipation needs. Via sizing should also account for assembly techniques, such as reflow soldering or thermal management features, like thermal vias, which enhance heat transfer away from components.

4. Pad Geometry Adjustments

Unlike FR-4 designs, AlN PCBs often require specific adjustments in pad geometries. The mechanical and thermal properties of AlN are quite different from those of traditional PCBs. The expansion rate, hardness, and substrate fragility mean that pad designs should allow for thermal expansion and contraction without causing stress fractures. Proper pad design also ensures better solder joint reliability, particularly for components exposed to continuous thermal cycling.

5. Gold Plating for Wire Bonding Pads

In high-performance applications, wire bonding is often used, and gold plating is a preferred surface finish for wire bonding pads. The use of gold provides a stable, corrosion-resistant surface that improves bond integrity and longevity. Wire bonding is especially critical in high-frequency, high-reliability devices, where the connections must maintain integrity under thermal stress or in harsh environments.

6. Component and Solder Matching

All components and solder materials must match the electrical and mechanical properties of the AlN substrate. Mismatches in thermal expansion between the PCB material and components can lead to stress, causing cracking or delamination. It’s important to select components and solder that can withstand high temperatures and thermal cycles while maintaining compatibility with AlN’s characteristics, especially in applications like power electronics and RF circuits.

7. Hermetic Sealing and Height Restrictions

For applications requiring hermetic sealing, such as aerospace or medical devices, height restrictions may apply to the components on the PCB. Hermetic seals protect against moisture and environmental contaminants, ensuring long-term reliability in sensitive applications. The overall component height should be kept in line with the sealing requirements, and compact designs are often necessary to meet stringent packaging constraints.

8. Thermal Expansion Management

When attaching large dies or high-power devices, it’s crucial to model and account for thermal expansion. Even though AlN has a low thermal expansion coefficient (<4 ppm/°C), the difference in expansion rates between components and the substrate can create mechanical stress, especially during thermal cycling. Careful design, including flexible connections or underfill materials, can help mitigate these effects.

9. Thermal Vias

Thermal vias are essential for managing heat in high-power applications. By placing thermal vias directly underneath hot components, heat can be efficiently transferred away from sensitive areas, extending the lifespan of both the components and the PCB itself. In many designs, a network of thermal vias is integrated with heat sinks or spreaders to further improve heat dissipation.

10. Surface Finishes and Coatings

Aluminum nitride PCBs can benefit from surface finishes such as electroless nickel immersion gold (ENIG) or immersion silver, which protect the copper traces from oxidation and provide excellent solderability. The choice of surface finish may also depend on the specific application environment and the reliability requirements, especially in high-power or high-frequency circuits.

FAQs About AlN PCBs

1. How durable are aluminum nitride PCBs?

AlN PCBs are highly durable and can withstand extreme temperatures and harsh environments.

2. Can AlN PCBs be used in high-frequency applications?

Yes, aluminum nitride PCBs are well-suited for high-frequency and high-speed applications due to their excellent electrical insulation and low signal loss.

3. Are aluminum nitride PCBs environmentally friendly?

While the production process can be resource-intensive, AlN PCBs offer longer lifespans and higher efficiency, which can reduce the environmental impact over time.

4. How do AlN PCBs compare with metal-core PCBs?

Metal-core PCBs, such as those with an aluminum core, provide good thermal management but lack the superior electrical insulation of AlN PCBs. AlN PCBs are preferred for applications requiring both high thermal conductivity and insulation.

5. What industries typically use aluminum nitride PCBs?

Industries like power electronics, aerospace, automotive, and telecommunications commonly use AlN PCBs for their high-performance needs.

Is ceramic a good thermal conductor?

Ceramic PCB is a good thermal conductor. ‌

What is the thermal conductivity of ceramic?

The thermal conductivity of ceramic PCBs is due to the materials used, such as aluminum oxide (Al2O3) and aluminum nitride (AlN). These materials have high thermal conductivity and can effectively dissipate heat, prevent overheating, and ensure that electronic components can still work stably in high temperature environments.

The thermal conductivity of aluminum nitride reaches 170W/(mK)~220W/(mK). Such high thermal conductivity enables ceramic PCBs to effectively dissipate heat when the chip is working, ensuring that the sensor signal will not be distorted, especially in high temperature, high vibration, and corrosion environments. The signal of ceramic PCBs is still efficient, sensitive, and accurate. ‌

In addition, the manufacturing process of ceramic PCB adopts LAM technology, which is a laser rapid activation metallization technology, making ceramic PCB highly versatile and can replace the entire traditional printed circuit board with a simpler structure and enhanced performance.

In summary, ceramic PCB not only has good thermal conductivity, but also can maintain stability and reliability in harsh environments such as high temperature, high vibration, corrosion, etc., which is an ideal choice for high-performance electronic components.

What are the thermal properties of ceramics?

The thermal performance of ceramic PCB is significantly better than that of traditional printed circuit boards (PCBs).

The thermal performance of ceramic PCB is mainly reflected in the following aspects:

High thermal conductivity: The thermal conductivity of ceramic PCB is usually above 18W/mK, which is much higher than that of traditional ceramic materials and organic substrates. It can effectively transfer heat from the heating element to the heat sink and improve the heat dissipation efficiency.

Good insulation performance: The ceramic substrate has good insulation performance and can withstand high voltage and high current, ensuring the safety and stability of the circuit.

High mechanical strength: The ceramic substrate has high mechanical strength, can withstand large pressure and impact, and is not easy to break and deform.

‌Good chemical stability‌: Ceramic substrates have good chemical stability and can withstand corrosion from chemicals such as acids, alkalis, and salts, and are not prone to aging and deterioration‌.

‌Thin and lightweight‌: High thermal conductivity ceramic substrates can be made into thin and lightweight products to meet the needs of miniaturization and lightweight electronic devices‌.

These characteristics make ceramic PCBs the first choice for applications that generate a lot of heat and require efficient thermal management, especially in radio frequency (RF) and microwave applications, which can maintain signal integrity and minimize signal loss, making them indispensable in industries such as telecommunications, aerospace, and satellite communications‌.

In addition, ceramic PCBs’ chemical resistance and ability to withstand harsh environments make them ideal for applications that require contact with corrosive substances‌.

What material has the highest thermal conductivity?

Aluminum nitride (AlN) has the highest thermal conductivity. ‌

Aluminum nitride (AlN) is an excellent ceramic material with extremely high thermal conductivity and low expansion coefficient. Its thermal conductivity is as high as 170-230 W/mK, making it one of the ceramic substrate materials with the best thermal conductivity.

The effective heat dissipation performance of aluminum nitride makes it particularly suitable for the heat dissipation needs of high-power density electronic devices and high-frequency electronic devices. In addition, aluminum nitride also has the characteristics of high hardness, high mechanical strength, strong corrosion resistance, high biocompatibility, and a thermal expansion coefficient close to silicon, so it performs well in applications such as high-power LEDs, power modules, and laser fields.

In contrast, other common ceramic PCB materials such as aluminum oxide (Al2O3) have low thermal conductivity, generally between 18-35 W/mK. Although they have good insulation properties and mechanical strength, their thermal conductivity is not as good as aluminum nitride and cannot meet the heat dissipation needs of high-power devices. Therefore, aluminum nitride is the preferred material in applications that require efficient heat dissipation.

What is the thermal conductivity of ceramic in W mK?

Ceramic PCB, as a high thermal conductivity material, its thermal conductivity depends on the type of ceramic substrate used. The thermal conductivity of ‌alumina ceramic‌ is between 18-35 W/mK, while the thermal conductivity of ‌aluminum nitride ceramic‌ is as high as 170-230 W/mK, which shows that aluminum nitride ceramic has higher thermal conductivity than alumina ceramic.

In addition, the thermal conductivity of ceramic PCB is better than that of traditional ‌FR4 PCB‌ or ‌metal substrate‌, the latter of which usually has a thermal conductivity of less than 3W/mK. Especially in the field of products that require high heat dissipation performance, ceramic PCB is favored for its excellent thermal conductivity.

Do ceramics have good conductivity?

The conductivity of ceramic PCB (printed circuit board) is due to the ceramic substrate it uses. This substrate material has good thermal and electrical conductivity and can withstand high power density.

Ceramic substrates are usually made of materials such as alumina, aluminum oxide and silicon nitride, which give ceramic substrates excellent electrical properties and mechanical strength, making them widely used in high-frequency communications.

The thermal conductivity of ceramic PCB is between 25~230w, with very good insulation and thermal conductivity. At the same time, its dielectric constant is low, dielectric loss is small, and it has excellent high-frequency performance. These characteristics make ceramic PCB perform well in applications that require efficient thermal management and maintain signal integrity.

How good of an insulator is ceramic?

Ceramic PCB has excellent insulation performance. ‌

The insulation performance of ceramic PCB is due to its material characteristics. It is based on ceramic materials and has extremely high hardness and wear resistance. It also has good insulation performance and thermal stability. Ceramic materials themselves have excellent electrical insulation properties and can effectively prevent short circuits and current leakage.

Does ceramic have electrical resistance?

‌Ceramic PCB has resistance. ‌

Ceramic PCB, as a high-performance electronic substrate material, has excellent physical and electrical properties. In ceramic PCB, resistors are part of electronic components, used to limit current and reduce voltage, and are an indispensable component in the circuit. The resistors of ceramic PCBs are usually installed on the circuit board together with other electronic components to complete the function of the circuit together.

The thermal conductivity of ceramic is one of its important properties. Different types of ceramic materials have different thermal conductivities. In the future, with the continuous development and progress of electronic devices, the performance requirements for PCBs will become higher and higher, and ceramic PCBs will continue to develop and innovate to meet market demand.

What are the holes in a PCB called?

What are the holes on PCB called? What are the holes in the circuit? The holes on PCB can be roughly divided into 3 types, screw holes (mounting holes), conductive holes (vias), and plug-in holes.

Screw holes: Screw holes are used for fixing.

Conductive holes: Conductive holes (also called vias) are used for conducting electricity just like circuits.

Plug-in holes: Plug-in holes are of course used to plug in various parts, such as diodes, transistors, capacitors, inductors, etc.

What is a through hole

What is a through hole? Through holes, also known as perforations, are holes in a PCB that go all the way through the board. Their main purpose is to provide electrical connections for component pins while allowing soldering on both sides of the board.

1.A via is a special through hole whose wall is metallized to achieve electrical connection between different layers on a circuit board. This type of hole is usually used to connect component pins to internal circuits, or to achieve electrical connection between different layers in a multi-layer PCB. Vias need to be metallized during the PCB manufacturing process, which usually includes drilling, desmearing, chemical copper plating, and electroplating.

2.Non-conducting holes are the opposite of through holes. Their hole walls are not metallized, so they do not have electrical connection functions. These holes are mainly used for mechanical fixation, heat dissipation or identification purposes. Non-conducting holes are relatively simple in the PCB manufacturing process, and only drilling operations are required.

What is a blind via?

A blind via is a hole that extends from one side of a PCB to a certain internal layer without penetrating the entire board. The emergence of blind vias is mainly due to the development of HDI technology, which provides circuit designers with greater flexibility and more compact layout. Blind vias are usually used to connect surface mount components (SMD) to internal circuit layers, or to connect circuits between different internal layers.

What are buried vias?

Buried vias are holes located inside the PCB that do not penetrate any side of the board. They are completely hidden inside the board and are used to connect circuits between different internal layers. Buried vias are especially useful in HDI boards because they can reduce the overall thickness of the board while maintaining electrical connections between internal circuits.

What is a microvia?

Microvia refers to a hole with a smaller diameter, usually at the micron level. The emergence of microvia technology enables PCB designers to achieve more complex circuit layouts in a smaller space. Microvias are often used in high-density, high-reliability electronic devices such as mobile phones and tablets. The manufacture of microvias requires high-precision drilling equipment and technology to ensure the accuracy and reliability of the holes.

What are Mounting holes？

What are Mounting holes?Locking holes are auxiliary holes used in the PCB manufacturing and assembly process to accurately locate and fix the circuit board. They are usually located at the edge or specific position of the PCB to ensure that the circuit board can be accurately aligned and fixed during manufacturing, testing and assembly. The locating holes do not participate in the connection of the circuit, but are essential to ensure the quality and performance of the circuit board.

What are Mounting holes？

What are thermal vias?

Thermal vias are holes designed specifically for heat dissipation, usually large and can run through the entire PCB or multiple layers. Their role is to reduce heat buildup on the circuit board by increasing surface area and air flow, thereby improving the stability and reliability of the device. Thermal vias are particularly important in high-performance, high-power electronic devices.

FAQ About board electronics with holes

How to solve the contradiction between manual routing and automatic routing of high-speed signals?

Most of the current powerful routing software’s automatic routing tools have set constraints to control the routing method and the number of vias. The routing engine capabilities and constraint setting items of various EDA companies are sometimes very different. For example, whether there are enough constraints to control the winding method of the serpentine, whether the routing spacing of the differential pair can be controlled, etc. This will affect whether the routing method generated by automatic routing can meet the designer’s ideas. In addition, the difficulty of manually adjusting the routing is also related to the capabilities of the routing engine. For example, the pushing ability of the routing, the pushing ability of the via, and even the pushing ability of the routing pair copper. Therefore, choosing a routing tool with strong routing engine capabilities is the solution.

Will adding test points affect the quality of high-speed signals?

As for whether it will affect the signal quality, it depends on the method of adding test points and how fast the signal is. Basically, the additional test points (not using the existing vias (via or DIP pins) as test points) may be added to the line or a small section of wire may be pulled out from the line. The former is equivalent to adding a very small capacitor to the line, while the latter is an additional branch. Both of these situations will have some impact on high-speed signals, and the extent of the impact is related to the frequency speed of the signal and the edge rate of the signal. The magnitude of the impact can be learned through simulation. In principle, the smaller the test point, the better (of course, it must meet the requirements of the test equipment) and the shorter the branch, the better.

Can you introduce some foreign technical books and data on high-speed PCB design?

Now the application of high-speed digital circuits includes communication networks and calculators and other related fields. In the communication network, the operating frequency of PCB boards has reached around GHz, and the number of layers is as many as 40 layers as far as I know. Due to the advancement of chips, the operating frequency of calculator-related applications, whether it is a general PC or server, has reached 400MHz (such as Rambus) or above. In response to the demand for high-speed and high-density routing, the demand for blind/buried vias, mircrovias and build-up process technology is gradually increasing. These design requirements can be mass-produced by manufacturers.

Does the design of rigid-flexible boards require special design software and specifications? Where can I undertake the processing of such circuit boards in China?

Can I use general PCB design software to design flexible printed circuits (Flexible Printed Circuit). The Gerber format is also used for FPC manufacturers to produce. Since the manufacturing process is different from that of general PCBs, each manufacturer will have its own restrictions on line width, line spacing, and aperture (via) based on their manufacturing capabilities. In addition, some copper foil can be laid at the turning point of the flexible circuit board for reinforcement. As for the manufacturer, you can search for “FPC” as a keyword on the Internet and you should be able to find it.

If the size of the circuit board is fixed, if the design needs to accommodate more functions, it is often necessary to increase the routing density of the PCB, but this may lead to increased mutual interference between the routings, and at the same time, the impedance cannot be reduced if the routing is too thin. Please introduce the techniques in the design of high-speed (>100MHz) high-density PCBs?

When designing high-speed and high-density PCBs, crosstalk interference does need to be paid special attention to because it has a great impact on timing and signal integrity. Here are a few things to note:

Control the continuity and matching of the characteristic impedance of the trace.

The size of the trace spacing. The spacing commonly seen is twice the line width. Through simulation, you can know the impact of trace spacing on timing and signal integrity and find the tolerable spacing. The results of different chip signals may be different.

Choose an appropriate termination method.

Avoid the same routing direction of the upper and lower adjacent layers, or even have traces overlapped up and down, because this kind of crosstalk is greater than the case of adjacent traces on the same layer.

Use blind/buried vias to increase the trace area. However, the production cost of the PCB board will increase. It is indeed difficult to achieve complete parallelism and equal length in actual implementation, but it should be done as much as possible.

In addition, differential termination and common mode termination can be reserved to mitigate the impact on timing and signal integrity.

The RF part, IF part, and even the low-frequency circuit part of the outdoor unit are often deployed on the same PCB. What are the material requirements for such PCB? How to prevent interference between RF, IF, and even low-frequency circuits?

Hybrid circuit design is a big problem. It is difficult to have a perfect solution.

Generally, RF circuits are laid out and wired as an independent single board in the system, and there will even be a special shielding cavity. Moreover, RF circuits are generally single-sided or double-sided boards, and the circuits are relatively simple. All of these are to reduce the impact on the distributed parameters of RF circuits and improve the consistency of RF systems. Compared with general FR4 materials, RF circuit boards tend to use high-Q substrates. The dielectric constant of this material is relatively small, the distributed capacitance of the transmission line is small, the impedance is high, and the signal transmission delay is small. In hybrid circuit design, although RF and digital circuits are made on the same PCB, they are generally divided into RF circuit area and digital circuit area, and laid out and wired separately. Shielding is used between ground vias and shielding boxes.

What is an alumina circuit board?

Alumina circuit board is a circuit board that uses alumina ceramic as a substrate. This circuit board has excellent electrical insulation properties, high thermal conductivity, excellent soft solderability and high adhesion strength. It can be etched with various graphics like a PCB board and has a large current carrying capacity.

Alumina ceramic circuit board is an ultra-thin composite substrate made by bonding copper foil directly to the surface (single or double sides) of an alumina (Al2O3) ceramic substrate at high temperature through a special process.

Alumina ceramic circuit boards are widely used in electronic devices that require high performance and high reliability, such as solar applications, voltage regulators, amplifier circuits, and memory modules.

Alumina ceramic substrates are mainly composed of white amorphous powder, commonly known as alumina or simply Al2O3. It has excellent properties, such as high wear resistance, acid and alkali corrosion resistance, excellent performance at high temperatures (1600-1700 degrees Celsius), etc.

What types of alumina circuit boards are there?

Ordinary alumina ceramics are classified according to their Al2O3 content, including 99%, 96%, etc. 99% alumina has high purity, white or ivory color, and is widely used in various applications, including lamps, electronic devices, and wear-resistant components. 96% alumina is widely used in various electronic applications while providing good thermal conductivity and insulation properties.

‌96% alumina‌:

Suitable for thick film circuit substrates, with excellent electrical insulation properties, mechanical strength, good thermal conductivity, chemical durability and dimensional stability.

Its surface roughness is generally 0.2~0.6μm, and the maximum operating temperature of the substrate can reach 1600℃.

96% alumina has become an economical choice for manufacturing hybrid microelectronic circuits due to its availability, low cost and technical quality.

‌99% Alumina‌:

Commonly used for most thin-film electronic substrate applications such as sputtering, evaporation, and chemical vapor deposition of metals for circuit generation.

99% Alumina has higher purity, smaller grain size, and the prepared substrate has excellent surface smoothness (surface roughness is generally 0.08~0.1μm), and the maximum use temperature of the substrate can reach 1700℃.

It has high mechanical strength, low thermal conductivity, excellent electrical insulation, good dielectric properties, and good corrosion resistance and wear resistance.

What are the advantages of alumina circuit boards?

The advantages of alumina circuit boards are mainly reflected in their physical and chemical properties, which make them widely used in many fields.

‌High hardness‌: The hardness of alumina ceramic plates is very high, second only to diamond and sapphire, and has excellent wear resistance and corrosion resistance.

‌High melting point‌: The melting point of alumina is as high as 2072℃, which means that alumina circuit boards can work for a long time in high temperature environments without being affected and maintain stable performance.

‌Good insulation performance‌: Alumina ceramic boards have good insulation performance and can effectively isolate the conduction of current and heat.

‌Excellent heat dissipation performance‌: In LED lighting and high-power electronic devices, alumina circuit boards are widely used due to their excellent heat dissipation performance.

‌Lightweight‌: Compared with other materials, alumina ceramic boards have a lower density and lighter weight, which can greatly reduce the load of the equipment‌.

‌Chemical stability‌: Alumina is an electrical insulating material with high resistivity, good chemical stability and good corrosion resistance.

What are the disadvantages of alumina circuit boards?

The disadvantages of alumina ceramic PCBs mainly include high cost, fragility, inferior thermal conductivity to other materials, complex manufacturing process and high price. ‌

‌High cost‌: Compared with plastic packaging, alumina ceramic PCBs have higher process temperature requirements, which leads to relatively high costs.

‌Fragile‌: Alumina ceramics are relatively fragile, and compared with aluminum nitride ceramic substrates, alumina ceramics are more fragile.

‌Thermal conductivity is not as good as other materials‌: Although alumina ceramics have certain thermal conductivity, their thermal conductivity is usually between 25W and 50W, while the thermal conductivity of aluminum nitride ceramic substrates can reach 190~260W. In comparison, the thermal conductivity of alumina ceramics is poor‌.

‌Complicated manufacturing process‌: Due to the high hardness of alumina ceramics, mechanical processing is more difficult, which increases the cost of its precision machined parts.

‌Higher price‌: Due to the above factors, the price of alumina ceramic PCBs is usually higher, about 3~10 times that of resin PCB boards‌.

What are the uses of alumina circuit boards?

Alumina circuit boards are widely used and are mainly used in the following aspects:

‌Electronic industry‌: Alumina ceramic circuit boards have become the preferred material in the manufacture of electronic components such as semiconductor devices and integrated circuits due to their excellent insulation properties and high temperature resistance.

‌Optoelectronic industry‌: In the field of optoelectronics, alumina ceramic circuit boards also perform well. Due to their high optical transparency and chemical stability, they are widely used in the manufacture of optoelectronic devices such as lasers and LEDs.

‌Automobile Industry‌: In terms of automobile headlights, the popularity of high-power LED headlights has put forward higher requirements for heat dissipation performance. Alumina ceramic substrates, with their good thermal conductivity, ensure the stable operation of LED light sources and improve lighting effects and service life. ‌

‌Aerospace‌: Alumina ceramic substrates have been widely used in key components such as aerospace devices and satellite communication equipment due to their comprehensive performance advantages. ‌

‌Medical Devices‌: Due to their excellent physical, chemical and mechanical properties, alumina ceramic circuit boards can meet the high requirements of medical devices for materials and ensure the performance and safety of medical devices.

In summary, alumina circuit boards have been widely used in many fields due to their unique physical, chemical and mechanical properties, providing solid support for technological progress and industrial upgrading in all walks of life. ‌

Is alumina a good electrical insulator? ‌

Alumina PCB is a good electrical insulator. ‌

Alumina (Al₂O₃), as a common ceramic material, has good electrical insulation, high temperature resistance and mechanical strength. Its color is usually white or light yellow, its volume density is between 3.7-3.9 g/cm³, its thermal conductivity is as high as 24 W/(m·K) or more, and its bending strength is usually between 300-400 MPa.

In addition, alumina also has a low dielectric constant and breakdown voltage, which makes it particularly suitable for high-frequency circuits and high-voltage circuits.

Therefore, alumina PCB is not only one of the most commonly used ceramic PCBs on the market because of its low price and excellent performance, but also when using alumina PCB, there is no need to add an insulating layer, which further proves its good electrical insulation.

What other ceramic PCB materials are there?

In addition to alumina ceramic PCB materials, it also includes alumina, aluminum nitride, silicon carbide, silicon nitride, zirconium oxide, etc. These materials each have unique properties and are suitable for different application scenarios.

Aluminum nitride (AlN): Aluminum nitride is also an excellent ceramic material with extremely high thermal conductivity and low expansion coefficient. It is gray in color and has a volume density between 3.33-3.35 g/cm³. The thermal conductivity of aluminum nitride is as high as 170 W/(m·K), which is several times that of traditional organic materials. The flexural strength can reach about 400-500 MPa, and it also has a low dielectric constant, which is suitable for high-power electronic devices and high-speed digital circuits.

‌Silicon Carbide (SiC): Silicon carbide is a hard material with excellent wear resistance and corrosion resistance. It is gray in color and has a volume density of 3.1-3.15 g/cm³. Silicon carbide has a high thermal conductivity of up to 100 W/(m·K), a flexural strength of more than 450 MPa, and a low dielectric constant and breakdown voltage, which is suitable for power electronic devices in high temperature environments.

‌Silicon Nitride (Si3N4): Silicon nitride is a high-strength, high-toughness ceramic material widely used in the aerospace field. It is gray in color and has a volume density of about 3.22 g/cm³. Silicon nitride has a high thermal conductivity of up to 20 W/(m·K), a flexural strength of generally between 700-1200 MPa, and a low dielectric constant and breakdown voltage, which makes it suitable for electronic components in high temperature and high pressure environments.

Zirconium oxide (ZrO2): Zirconium oxide is a high-toughness, high-hardness ceramic material with good chemical stability. It is gray in color and has a volume density of about 6.0 g/cm³. Zirconium oxide has a high thermal conductivity of up to 3 W/(m·K), a flexural strength of about 100-400 MPa, and a low dielectric constant and breakdown voltage, which makes it suitable for electronic components in high temperature and high pressure environments.

In short, alumina ceramic PCBs are increasingly used in the electronic field. It not only provides a solid foundation for the innovative development of electronic equipment, but also opens up a new path for the advancement of future electronic technology. BEST Technology is a professional ceramic circuit board manufacturer with rich manufacturing experience in various ceramic materials, and its product quality has passed relevant quality inspections. Choosing us will get the best quality products!

What is a ceramic pcb board?

ceramic pcb board, also known as ceramic printed circuit board, is a printed circuit board that uses ceramic as a substrate instead of traditional fiberglass or epoxy resin. Compared with traditional substrates, ceramic materials have a variety of advantages, making them ideal for high-performance electronic applications.

Ceramic PCB board, Low Volume&Customization

What are the different types of ceramic PCB?

There are several types of ceramic materials commonly used in PCB boards, including aluminum oxide (Al₂O₃), aluminum nitride (AlN), and beryllium oxide (BeO). Each material has its own unique properties and advantages.

1. Alumina ceramic pcb board

Alumina is the most widely used ceramic material in PCB boards. It has excellent electrical insulation, high thermal conductivity and good mechanical strength. Alumina ceramic pcb boards are suitable for a wide range of applications, including power electronics, LED lighting and automotive electronics.

2. Aluminum Nitride ceramic pcb board

Aluminum nitride is a high-performance ceramic material with extremely high thermal conductivity. This makes it ideal for applications where heat dissipation is a key factor, such as high-power LEDs, power modules, and RF/microwave equipment.

3. Beryllium Oxide ceramic pcb board

Beryllium oxide is a highly toxic material, but it has excellent thermal conductivity and electrical insulation. Due to its toxicity, beryllium oxide ceramic pcb boards are only used in special applications where other materials cannot meet the performance requirements.

What is the high temperature ceramic PCB?

High temperature ceramic PCB‌ is a special ceramic circuit board designed for high temperature environments, commonly known as high temperature co-fired ceramic (HTCC) circuits. This circuit board is made by mixing adhesives, lubricants, solvents, plasticizers, and aluminum oxide to make raw ceramics, and then forming circuits.

The main feature of high temperature ceramic PCBs is their high temperature resistance, which allows them to work stably under extreme temperature conditions, making them ideal for applications that require high reliability and long-term stability.

In addition, during the manufacturing process of high-temperature ceramic PCB, the copper foil and the ceramic substrate are bonded together. This bonding method not only has strong bonding strength, but also the copper foil will not fall off, thus ensuring the performance stability in harsh environments such as high temperature and high humidity.

The materials of high-temperature ceramic PCB usually include ceramic materials such as aluminum oxide (Al2O3), beryllium oxide (BeO), aluminum nitride (AlN), silicon carbide (SiC) and boron nitride (BN). These materials are not only very effective in conducting heat, but also good electrical insulators, making high-temperature ceramic PCBs perform well in applications that require high thermal conductivity and excellent electrical properties.

In general, high-temperature ceramic PCB is a high-performance, high-reliability circuit board, especially suitable for applications that require high thermal conductivity, excellent electrical properties, and stable operation in harsh environments, such as aerospace, military electronics, etc.

What are the manufacturing processes involved in ceramic pcb boards?

The manufacturing process of ceramic pcb boards is more complicated than that of traditional PCB boards. It generally involves the following steps:

1. Substrate preparation

Ceramic substrates are prepared by sintering ceramic powder at high temperatures. The sintered substrate is then polished and cleaned to ensure a smooth surface for subsequent steps.

2. Circuit pattern formation

Circuit patterns are formed on ceramic substrates using various methods, such as screen printing, photolithography, or laser ablation. In screen printing, a conductive paste is printed onto the substrate to form a circuit pattern. Photolithography involves the use of a photomask and photoresist to create a circuit pattern. Laser ablation uses a laser to remove unwanted ceramic material to form a circuit pattern.

3. Metallization

After the circuit pattern is formed, the substrate is metallized to provide conductivity. This is usually done by sputtering or electroplating a thin layer of metal, such as copper or gold, onto the substrate.

4. Component mounting

Electronic components are then mounted onto the ceramic pcb board using surface mount technology (SMT) or through-hole technology (THT). SMT involves soldering components directly onto the surface of the PCB board, while THT involves inserting components into holes in the PCB board and soldering them to the bottom surface.

What are the advantages of ceramic pcb boards?

ceramic pcb boards have several advantages over traditional PCB boards, making them ideal for high-performance electronic applications. Some of the main advantages include:

1. High thermal conductivity: Ceramic materials have excellent thermal conductivity, which allows for efficient heat dissipation.

2. High electrical insulation: Ceramic materials have high electrical insulation, which reduces the risk of electrical short circuits and improves the reliability of electronic devices.

3. Good mechanical strength: Ceramic materials have good mechanical strength, making them resistant to vibration and shock.

4. Small size and light weight: ceramic pcb boards can be made very thin and lightweight, making them ideal for portable electronic devices.

5. High-frequency performance: Ceramic materials have low dielectric losses and high frequency stability, making them suitable for high-frequency applications such as RF/microwave equipment.

What is a ceramic PCB used for?

Ceramic PCBs have a wide range of applications, including:

1. Power Electronics: Ceramic PCBs are widely used in power electronics applications such as power modules, inverters, and converters. The high thermal conductivity and electrical insulation of ceramic materials make them ideal for handling high power levels.

2. LED Lighting: Ceramic PCBs are used in LED lighting applications due to their excellent heat dissipation properties. The high thermal conductivity of ceramic materials helps to extend the life of LEDs by reducing operating temperatures.

3. Automotive Electronics: Ceramic PCBs are used in automotive electronics applications such as engine control units, power steering systems, and airbag controllers. The high mechanical strength and reliability of ceramic materials make them suitable for use in harsh automotive environments.

4. Aerospace and Defense: Ceramic PCBs are used in aerospace and defense applications due to their high performance and reliability. The small size and light weight of ceramic PCBs make them ideal for satellite and missile systems.

5. Medical Devices: Ceramic PCBs are used in medical devices such as pacemakers, defibrillators, and hearing aids. The high electrical insulation and biocompatibility of ceramic materials make them suitable for use in medical applications.

How is ceramic pcb board developing?

As the electronics industry continues to develop, there is a growing demand for high-performance PCB boards that can meet the growing requirements of advanced electronic devices. ceramic pcb boards are expected to play an important role in meeting this demand. Some future trends in ceramic pcb board technology include:

1. Increased use of high-performance ceramic materials

As the performance requirements of electronic devices continue to increase, there is a growing demand for high-performance ceramic materials such as aluminum nitride and silicon carbide. These materials have higher thermal conductivity and electrical insulation than traditional ceramic materials, making them ideal for next-generation electronic devices.

2. Passive component integration

In order to reduce the size and weight of electronic devices, there is a growing trend to integrate passive components such as resistors, capacitors, and inductors onto PCB boards.

3. 3D printing of ceramic pcb boards

3D printing technology is emerging as a promising method for manufacturing ceramic pcb boards. 3D printing can create complex geometries and structures that are difficult to achieve using traditional manufacturing methods.

4. Development of hybrid PCBs

Hybrid PCBs that combine ceramic and traditional substrates are being developed. Hybrid PCBs can use ceramic substrates for the power section and traditional fiberglass substrates for the signal section.

Ceramic PCBs are a revolutionary technology that offers several advantages over traditional PCBs. As the electronics industry continues to grow, ceramic PCBs are expected to play an increasingly important role in meeting the growing demand for advanced electronic devices.

Archive for the ‘Ceramic PCB’ Category

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What is the Ceramic DIP Package Made of?

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What Sets CerDIP Apart from Other Packaging Formats?

What Applications Rely on CerDIP Technology?

Key Features of CerDIP Packages

How Are CerDIPs Manufactured?

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1. Introduction

2. LTCC Technology Overview

3. HTCC Technology Overview

3.3 Analysis of Advantages and Disadvantages

4. Comparative analysis of LTCC and HTCC

5. Conclusion

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What is Thermal Conductivity?

Do Ceramic Materials Have High Thermal Conductivity?

Why is Thermal Conductivity Important for Ceramic Materials?

5 Typical High Thermal Conductivity Ceramic Materials

What Ceramic Materials Are Best for Thermal Conductivity?

What are the Thermal Properties of Ceramic Materials?

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What is Aluminum Nitride PCB?

Benefits of AlN PCBs

What is the Thermal Conductivity of Aluminum Nitride PCB?

Factors affect thermal conductivity of AlN PCB

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AlN Ceramic PCB Design Considerations

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Is ceramic a good thermal conductor?

What are the thermal properties of ceramics?

What material has the highest thermal conductivity?

What is the thermal conductivity of ceramic in W mK?

Do ceramics have good conductivity?

How good of an insulator is ceramic?

Does ceramic have electrical resistance?

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What are the holes in a PCB called?

What is a through hole

What is a blind via?

What are buried vias?

What is a microvia?

What are Mounting holes？

What are thermal vias?

FAQ About board electronics with holes

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What is an alumina circuit board?

What types of alumina circuit boards are there?

What are the advantages of alumina circuit boards?

What are the disadvantages of alumina circuit boards?

What are the uses of alumina circuit boards?

Is alumina a good electrical insulator? ‌

What other ceramic PCB materials are there?

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What is a ceramic pcb board?

What are the different types of ceramic PCB?

What is the high temperature ceramic PCB?

What are the manufacturing processes involved in ceramic pcb boards?

What are the advantages of ceramic pcb boards?

What is a ceramic PCB used for?

How is ceramic pcb board developing?