Archive for the ‘Ceramic PCB’ Category

What Are the Benefits of Using Ceramic PCB?

Tuesday, August 13th, 2024

With the continuous improvement of the performance requirements of electronic equipment, such as high current, fast heat dissipation, high frequency, long life and a series of other requirements, the requirements for the circuit board carrying the functions of the equipment have become particularly harsh. The traditional FR4 pcb circuit board in the past has completely failed to meet the current use scenarios. It is found that the circuit board produced by adding the corresponding ceramic materials can meet the corresponding requirements when making the circuit board substrate. Since then, ceramic PCB came into being and quickly gained a decisive position in the market.

Why Use Ceramic PCB?

Ceramic PCB shows remarkable advantages in many application fields because of its unique physical and chemical properties. ‌

First of all, ceramic PCBs have excellent heat dissipation performance and low thermal expansion coefficient, which enables them to maintain stable performance in high temperature environment and effectively avoid equipment damage or performance degradation caused by temperature changes. Secondly, ceramic PCB has excellent insulation performance and high voltage resistance, which can guarantee personal safety and stable operation of equipment. In addition, the ceramic PCB has strong adhesion, and the bonding technology is adopted to ensure that the copper foil will not fall off, which improves the reliability of the product, especially in the application of high-frequency circuits. ‌

Ceramic PCB: What is it & Why should we use it?

The manufacturing process of ceramic PCB also has its own uniqueness. Usually, the bottom plate is formed by pressing ceramic powder, which ensures the flatness and surface smoothness of PCB, thus improving the quality of circuit board. Although the cost of ceramic PCB is usually higher than that of traditional materials such as FR-4, it is undoubtedly a better choice in applications requiring high performance and high reliability. ‌

To sum up, ceramic PCB is widely used in high-power power electronic modules, solar panel components, high-frequency switching power supplies, solid-state relays, automotive electronics, aerospace, military electronic products, high-power LED lighting products, communication antennas and other fields because of its excellent physical and chemical properties and high stability in high-frequency circuit applications.

What Are the Basic Components of Ceramic PCB?

The first is highly integrated circuit board, which has become an inevitable trend with the progress of electronic technology. Modern technology and electronic products integrate hundreds, thousands or even millions of transistors and resistors on a small silicon chip or integrated circuit (commonly known as IC) to form complex components.

These integrated circuits need a foundation for building tiny electronic materials and connections, usually called substrates. It also needs a structure to isolate the circuit from the external environment and turn it into a compact and solid unit, which is called packaging.

Integrated circuits need substrates and packages to maintain their reliability. Integrated circuits need insulating materials, and these two materials are born for this purpose. These packages will then be mounted on the printed circuit board.

Ceramics are famous for their insulating properties. The protective performance of this advanced ceramic material is an important factor for its use as substrate and packaging. This is why ceramic printed circuit boards or PCBs stand out from other similar products.

What are the Materials Used in Ceramic Circuit Board?

There are many kinds of materials for making ceramic PCB. When choosing ceramic materials, two basic characteristics that should be paid attention to are thermal conductivity and thermal expansion coefficient (CTE) of PCB.

Alumina (Al2O3), aluminum nitride (AlN), beryllium oxide (BeO), silicon carbide (SiC) and boron nitride (BN) are commonly used materials in ceramic PCB.

Alumina (Al2O3)

Alumina is an inorganic compound, also known as bauxite. It is an advanced material made of aluminum and oxygen. It is usually white, but it varies according to purity. The color can be pink to almost brown. This compound is tasteless and crystalline powder, but it is insoluble in water.

Among all oxide ceramics, alumina is the hardest and strongest. Because the content of alumina is higher than 95%, it is an excellent electrical insulator with a resistivity as high as about 1× 1014 Ω cm. Common purity ranges from 94% to 99%. The required color, hardness, size and shape should be easy to achieve. Because the composition can be changed, it is considered to be beneficial to engineering production.

This industrial oxide ceramic has excellent thermal stability and corrosion stability, excellent mechanical strength and dielectric strength, and can even form an airtight seal. The common 96% alumina has a thermal conductivity of 25.0 W/(m k) and a CTE of 4.5 to 10.9 x 10-6/k.. Besides being affordable and cost-effective, it has all these advantages.

It is the most commonly used substance in ceramics because it has many applications in the electronic field, including substrates and packaging. This is the preferred material when the application does not require the highest level of thermal performance. It is one of the most advanced ceramic materials with the most in-depth research and comprehensive characteristics.

Aluminum nitride (AIN)

Aluminum nitride (AIN) is a non-oxide semiconductor technology-grade ceramic material. The structure of this compound is hexagonal crystal, which is blue and white in pure state. Aluminum nitride is a synthetic ceramic compound, which is usually white or gray.

One of the best ceramic substrate materials at present is aluminum nitride (AlN). Its resistivity ranges from 10 to 1210ω-m, and its thermal conductivity is 80 to 200W/(m k), even as high as 300W/(m k). Based on these characteristics, it is undoubtedly one of the most attractive PCB substrate materials and one of the best choices.

It has electrical insulation and a low coefficient of thermal expansion (CTE) of 4 to 6× 10-6k1 (between 20 and 1000°C), which is very close to the silicon wafer. The value of this compound is much higher than that of alumina, but the cost is also higher. It is most suitable for use in high current and high temperature environment.

Beryllium oxide (BeO)

Beryllium oxide (BeO) or Beryllium oxide is also called dextran or glucose oxide in history. As the name implies, it comes from beryl or mineral beryl. It is a solid crystalline inorganic compound with white color.

In addition to good electrical insulation, its thermal conductivity is higher than that of any other nonmetal [(209 to 330 W/(m k)], and even exceeds that of some metals except diamond. There are rigid bonds between the atoms of beryllium oxide, just like diamonds. It transfers heat in the form of vibration through these strong bonds, so the energy loss is minimal.

This refractory compound has a melting point of 2506.85 °C to 2575 °C, a boiling point of 3905 °C and a CTE of 7.4 to 8.9 x 10-6/k. Beryllium oxide has these excellent characteristics, so it is widely used in electronic industry and is a valuable resource. Because of its high melting point, excellent thermal conductivity and good resistance, other industries also benefit from it.

Beryllium oxide has shown excellent chemical and thermal stability in challenging conditions and harsh environments for more than 60 years. BeO can be used to provide air or liquid cooling in applications where PCB is exposed to high temperature or high-density PCB with limited space. ‌

What are the Advantages of Ceramic PCB over Traditional PCB?

The use of ceramic printed circuit boards has several advantages, which help to significantly reduce the size and weight of the final product while improving energy efficiency. High quality surface smoothness (due to its flatness), high temperature resistance and low dielectric constant are their other significant advantages. In addition, ceramic plates are durable and wear-resistant, which means that they can be used in areas with high mechanical stress.

Because ceramic substrates are cleaner than FR-4 boards, ceramic PCBs can accommodate high component density on a single circuit board, which means that they can accommodate smaller components while still maintaining the same mass and occupying space.

The high temperature resistance of ceramic board is several times higher than that of FR4, and the thermal deformation temperature of ceramic board is much higher than that of traditional FR4, which makes the circuit board have better performance under extreme temperature conditions, thus prolonging the service life of the circuit board.

Ceramic PCB is more resistant to moisture in the air than FR4 board.

Ceramic PCB is made of ceramics, which is more durable and stronger than traditional FR4.

Ceramic board has higher density than traditional PCB, which can ensure high signal integrity. In addition, these boards are faster and more reliable than traditional boards.

Ceramic boards have high thermal resistance due to low thermal conductivity, so ceramic PCB has another advantage of fire prevention, which can make them a good choice for products that need to meet certain flammability and heat resistance criteria. Because a thin layer of ceramic fiber on the surface of PCBA can prevent heat from flowing into the circuit board, and at the same time, it can protect the conductive traces from cracking when exposed to excessive heat.

What are the Application of Ceramic PCB?

1. High power device

2. On-board chip module

3. Proximity sensor

4. Solid State Relay (SSR)

5. Solar panel array

6. Transmission/reception module

7. Multilayer Interconnect Board

8. Solar cells

9. Light emitting diodes

10. Automobile lighting system

As a high-performance electronic component, ceramic PCB‌ is playing a vital role in many fields because of its unique characteristics. This kind of printed circuit board is becoming more and more popular for various reasons. The most important factor to consider when choosing a PCB manufacturer is quality and experience. Through meticulous manufacturing technology and firm commitment to quality, BEST Technology strives to provide ceramic PCBs that can stand the test of time and meet the needs of the continuous development of modern technology. Contact us for more information!

What is a Ceramic PCB?

Ceramic PCB or ceramic circuit board is a kind of printed circuit board using ceramic material as substrate. Different from the traditional PCB which often uses FR4 and other materials, ceramic PCB has better heat dissipation and electrical insulation. These characteristics make ceramic PCB an ideal choice for high-power applications such as LED lighting, power electronics and automotive electronics.

Commonly used ceramic materials for ceramic PCB generally include alumina (Al2O3), aluminum nitride (AlN) and silicon carbide (SiC). These materials can provide the necessary thermal conductivity and mechanical strength for ceramic PCB applications, and ensure that the circuit board can withstand high temperature and harsh working conditions.

One of the main advantages of ceramic circuit boards is that they can handle higher power load without overheating risk, which significantly improves the service life of ceramic PCB. At the same time, the low coefficient of thermal expansion (CTE) in ceramic materials also reduces the risk of thermal stress and further improves the durability of ceramic PCB.

How to Make Ceramic PCB?

Due to the unique properties of ceramic materials, the process of manufacturing ceramic PCB is more complicated than traditional PCB. The manufacturing process usually involves several key steps:

Firstly, the first step is to select the appropriate ceramic materials according to the specific requirements of the circuit board.

The second step is to press and sinter the ceramic powder into the required shape and thickness after selecting the material. The sintering process involves heating the material to a high temperature to fuse the particles together, thus forming a dense and solid substrate.

The third step is to deposit a layer of metal (usually copper or gold) on the surface after the substrate is formed, then apply photoresist material to the metal layer, and use ultraviolet rays to expose the required circuit pattern, and then etch away the exposed area, leaving the circuit pattern.

Finally, after the circuit is formed, the circuit board should go through a finishing process to improve its performance and durability. Finally, the quality of the finished circuit board should be checked to ensure that it meets all the required specifications.

What is Ceramic PCB? Its Types and Manufacturing Process

This process can make ceramic PCB highly reliable and can work normally under extreme conditions.

How Many Layers in Ceramic PCB?

Ceramic PCB can be made of multiple layers like traditional PCB, and its number of layers depends on the complexity of the circuit and the application requirements.

Single-layer ceramic PCB is composed of a single-layer ceramic material and a metal circuit at the top, which is usually used for heat dissipation applications.

Multilayer ceramic PCB is more complex, consisting of multilayer ceramic materials and metal circuits, which are stacked together and interconnected by vias. The extra layer allows more complex circuit design, enabling the circuit board to handle more signals and power for applications requiring higher functions.

The number of layers in ceramic PCB can range from one to several. Each additional layer will increase the complexity and cost of the circuit board, but it will also increase its function and performance, depending on its application scenario.

How Thick is Gold Conductor Printed on the Ceramic PCB?

The thickness of gold conductor on ceramic PCB is an important factor affecting the performance and durability of circuit board. The thickness of gold conductor depends on the application and required performance characteristics, and is usually in the range of 0.5 micron to 10 micron. Of course, a thicker gold layer can also be provided, which also brings better conductivity and more stable performance, especially in high-power applications, which also brings higher costs.

In high frequency applications, the thicker gold layer can reduce the signal loss, improve the overall performance of the circuit, and also better prevent wear and prolong the service life of PCB.

Considering the specific requirements of the application, the exact thickness of the gold conductor has been determined in the design stage. Our advanced manufacturing technology enables us to accurately control the thickness of the gold conductor and ensure that each circuit board meets the required specifications.

What is the Ceramic insulator on the Circuit Board Used For?

Ceramic insulators are generally used to electrically insulate different components and conductive paths on a circuit board, prevent short circuits and ensure that the circuit operates as expected. It plays a vital role in the performance and reliability of ceramic circuit boards.

Even a small amount of current leakage will cause serious problems. Ceramic materials of insulators provide excellent electrical insulation performance, which means that they can withstand high voltage without allowing current to pass through. In addition to electrical insulation, ceramic insulators also have thermal insulation properties, which can help control the heat generated by components on the circuit board.

Ceramic insulators are usually placed between metal conductors on the circuit board, which allows multiple conductive paths to be placed closely together without the risk of short circuit because they are electrically insulated from each other.

Generally speaking, ceramic insulator is a key component of ceramic PCB, which helps to improve its performance and reliability.

What equipment does BEST Technology have?

We use advanced machines at every step of the production process, from substrate molding to circuit molding and surface treatment, to ensure the highest quality ceramic PCB.

For substrate forming, we have high-precision press and sintering furnace, which can produce dense and uniform ceramic substrates.

Our metallization process is also supported by advanced sputtering and chemical vapor deposition equipment to ensure that a consistent high-quality metal layer can be formed on the substrate.

At the same time, we also have cutting-edge lithography equipment for circuit formation, which enables us to create complex and accurate circuit patterns on the circuit board.

In addition to our advanced equipment, our team of technicians and engineers have rich experience in the production of ceramic printed circuit boards. Combined with our most advanced equipment, we can provide high-quality products that meet the most demanding requirements.

Ceramic PCB has a series of advantages, from materials to technology, each of which provides corresponding advantages, including excellent thermal management, electrical insulation and durability, making them an ideal choice for high power and high temperature applications. BEST Technology has advanced manufacturing technology, first-class equipment and commitment to quality, which can ensure that our ceramic PCB achieves the highest performance and the best quality. Whether you need a single-layer board or a complex multi-layer design, we have the expertise and equipment to provide products that meet your needs.

How is the ceramic pcb made by HTCC process? ‌

First of all, the starting material of HTCC (high temperature co-fired ceramics) process is ceramic powder (such as Al2O3 or AlN), and these materials need to be mixed with organic binder to form paste ceramic slurry. Then, the ceramic slurry is scraped into a sheet by using a scraper, and a green embryo is formed through a drying process. After the green embryo is formed, through holes are drilled according to the circuit layer design, and then the wiring and hole filling are carried out by screen printing metal paste. Finally, the germ layers are stacked and sintered in a high temperature furnace (about 1600 C). ‌

Specifically, the ‌HTCC process flow includes the following key steps:

Casting molding method: the ceramic slurry is scraped into a thin strip with uniform thickness, and dried by blowing filtered hot air opposite to the moving direction of the conveyor belt to form a green sheet.

Punching: Through mechanical drilling, mechanical punching or laser drilling, through holes are punched in the green blank. The size, position and accuracy of these holes directly affect the on-off and wiring density in the substrate.

Through-hole filling: the filling slurry is extruded into the through-hole of the green porcelain by mask printing method to complete the metallization process of the green porcelain.

Lamination, slicing and co-firing: the printed germ layers are laminated, then sliced and finally co-fired at high temperature. ‌

After the completion of this series of steps, a high-temperature co-fired ceramic (HTCC) substrate is obtained, which has excellent electrical and mechanical properties and is widely used in the manufacture of electronic products requiring high performance. ‌

How is the ceramic pcb made by LTCC process?

The first step is to prepare raw materials. The raw materials of ‌LTCC are mainly composed of ceramic powder and organic additives. Ceramic powders, such as alumina and zirconia, are used to improve the insulation and mechanical strength of ceramic materials. Organic additives are used to increase viscosity and improve plasticity, which is convenient for the subsequent molding process. ‌

Then there is circuit printing, the purpose of which is to print circuit patterns on ceramic substrates, usually using shielding printing technology. Firstly, the ceramic substrate is cleaned and coated with conductive metal ink. Then, the circuit pattern is transferred to the substrate by stamping with a printing die. Then, through the baking process, the conductive ink is solidified on the substrate to form a conductive circuit. ‌

The third step is a sintering process, in which ceramic materials are chemically reacted at high temperature to combine their particles to form a compact ceramic body. In the process of sintering, the control of temperature gradient and atmosphere is very important to reduce the stress of materials and prevent them from oxidation.

In the final step of finished product inspection and subsequent treatment, the sintered ceramic substrate needs to be inspected first, including appearance quality inspection, size measurement, electrical performance test and other items. Qualified products can be subjected to subsequent electronic component packaging processes, such as welding, film covering, gas packaging, etc., to realize the protection and connection of electronic components. ‌

To sum up, the manufacturing process of ceramic PCB by ‌LTCC process involves many steps, such as precise material selection, processing, circuit printing, sintering, finished product inspection and subsequent treatment, to ensure the quality and performance of the final product.

How is the ceramic pcb made by DBC process?

The first step is the preparation of raw materials. First, it is necessary to select suitable ceramic substrate materials. Common materials include alumina (Al2O3) and aluminum nitride (AlN), which have high insulation, high thermal conductivity and good mechanical strength. The surface of the substrate should be cleaned and treated first to ensure the bonding with the subsequent copper foil. ‌‌

Then the bonding between copper foil and ceramic substrate is the core step of DBC manufacturing process. At a certain temperature and pressure, the copper foil is closely attached to the ceramic substrate to form a firm bonding interface. It is necessary to control the parameters such as temperature, pressure and time in the bonding process to ensure the bonding quality and performance. ‌

Secondly, after the bonding is completed, the copper foil needs to be etched to form the required circuit pattern. Chemical etching or laser etching can be used in the etching process. By precisely controlling the etching depth and width, high-precision and high-resolution circuit patterns can be obtained. ‌

Finally, the DBC structure is cleaned, dried and tested. The purpose of this is to remove residues and improve the reliability and stability of products. ‌

Through the above steps, high-performance DBC ceramic substrates can be prepared, which are widely used in the packaging of intelligent power modules and electric vehicle power modules. ‌

How is the ceramic pcb made by DPC process?

Firstly, the ceramic substrate is pretreated and cleaned to ensure the cleanliness of the substrate surface and prepare for the subsequent deposition and copper plating process. ‌

Then the key step is to deposit a Ti/Cu layer on the surface of the substrate as a seed layer by vacuum sputtering technology. This step is the most important in DPC process.

Followed by photolithography, development and etching processes, the circuit is completed.

Finally, the thickness of the circuit is increased by electroplating or electroless plating to enhance the conductivity and durability of the circuit. After the metallized circuit is manufactured, the photoresist is removed, and finally the substrate is manufactured. ‌

The manufacturing process of ceramic PCB by DPC process involves vacuum sputtering, photolithography, development, etching and electroplating, which makes the ceramic PCB by DPC process have good conductivity and durability, and is suitable for various electronic application scenarios. ‌

With the increasing use of ceramic PCB, in order to adapt to some application fields, many different process technologies have emerged, and each process technology has its own unique technology. For example, HTCC process needs to be sintered at high temperature to achieve its goal. According to the different environment used and the production cost, the appropriate ceramic PCB production technology is selected. BEST Technology has rich experience in manufacturing ceramic circuit boards. For different kinds of ceramic PCBs, there are different production lines and professionals. If you choose the right manufacturer, you will get the best quality ceramic circuit boards.

What is a printed circuit board?

Before knowing the methods of testing circuit board, let’s understand the definition of PCB. A PCB is a flat board made from insulating materials like fiber glasses with conductive pathways etched onto its surface. The pathways we called circuit or traces. These pathways connect different electronic components, so that they can communicate and function together. PCBs come in various materials, shapes and sizes, which always is customized to meet specific applications and performance requirements.

PCBs can be divided into different types according to substrate material used. They are – normal FR4 PCB, polyimide flexible PCB, metal core PCB, ceramic PCB, rogers PCB. Different has its own properties and advantages. The choice of materials and the design of the PCB significantly impact the performance and reliability of the final product. Understanding the materials used in PCBs is crucial for anyone involved in electronics, from hobbyists to professional engineers/designers.

Common PCB Circuit Board Issues

Though PCB has a strong construction, they are easy to be broken or failure since they always encounter a range of issues. These problems can stem from manufacturing defects, wear and tear, or improper handling. Identifying and diagnosing these issues promptly is crucial for maintaining the reliability and performance of electronic devices. Common issues we faced are including:

Open Circuits: These occur when a break in the circuits prevents current flow normally. Open circuits can result from physical damage or manufacturing errors.

Short Circuits: Due to improper soldering, unreasonable circuit design and other reasons, resulting in a short circuit between two or more points in the circuit that should not be connected. This can cause excessive current flow, potentially damaging components.

Grounding: The unreasonable design of ground area leads to interference signals on the grounding, which affects the normal operation of the circuit.

Signal: The signal circuit design is not reasonable, resulting in interference signals on the signal.

Component Failures: Individual components on a PCB can fail due to aging, overheating, or electrical stress breakdown. And incorrect orientation will lead to the failure of PCB.

Soldering Issues: Poor soldering can lead to weak connections, causing intermittent faults or complete circuit failure. This including the dents in the solder joints, this also can make the PCB failure.

Corrosion: PCB exposure to moisture and contaminants for a long time can cause corrosion, degrading the conductive pathways and component leads.

How to check a PCB?

In generally, there are four common ways to check whether if your PCB are good or failure.

1. Visual inspection

The easiest way is visual inspection. Through naked eye observation, check whether the solder joint on the PCB circuit board is firm, whether there is short circuit, open circuit and other phenomena. And look for burnt components, discolored areas, or broken traces, such as somewhere became black or be burned obviously. These are clear indicators of damage.

2. Use a multimeter

Multimeter is a common tool used for measuring PCB. Multimeter is versatility and it has multiplied modes. Select the appropriate mode on the multimeter, such as continuity, voltage, or resistance mode, depending on what you are testing. Before testing, make sure probes are in good condition and properly connected to the multimeter, with the red probe typically being positive and the black probe negative or ground. Click here to read What is the PCB flying probe test?

3. E-tester

E-tester is a good way to test short or open circuit when it is a mass production. If you just want to test one piece PCB, multimeter is much better.

4. Use oscilloscope

An oscilloscope is a powerful diagnostic tool used to observe the waveform of electrical signals in a circuit. Connect the oscilloscope probes to the test points on the PCB, it can capture the waveform. By observing the waveform, determine whether the circuit is working normally.

5. Use a thermal imager

A thermal imager also is a effective way to check the condition of PCB. It can capture the temperature distribution on the PCB. It helps identify areas with excessive heat, which can indicate potential issues.

How to Test a Circuit Board with a Multimeter Effectively?

Testing a circuit board with a multimeter is essential for diagnosing and fixing electronic issues. A multimeter can measure voltage, current, and resistance, helping you identify problems with the PCB. The main way to test a PCB with a multimeter is to measure voltage, ‌ resistance, and ground. ‌

Measuring voltage

By measuring the voltage on the circuit board, ‌ can quickly test whether the circuit is working properly. Use the voltage gear of the multimeter, ‌ select the appropriate range, ‌ then measure the input and output of the power supply on the circuit board respectively, ‌ to check whether the voltage is within the normal range. If the voltage is abnormal, ‌ may indicate that the circuit is open or short. ‌

Measuring resistance value

By measuring the resistance value on the circuit board, can detect whether the circuit is smooth. Use the resistance level of the multimeter, select the appropriate range, then measure the key nodes on the circuit board, check whether the resistance value is within the normal range. If the resistance value is abnormal, may indicate that the circuit is open or short. ‌

Check the grounding

Grounding is critical to the proper operation of the circuit board. Use the multimeter’s ground test function, to check that key points on the board are properly grounded, ‌ this helps to spot potential electrical connection problems. ‌

In addition, for industrial-grade PCB measurement, the use of higher-precision multimeters and special pens can improve the accuracy and efficiency of the measurement. ‌ For example, the ‌ Fluke 17B Max multimeter is equipped with an extra-pointed stylus, enables more accurate measurement of patch components and pins, and ‌ improves measurement fineness and accuracy.

Generally speaking, using a multimeter to test the PCB board needs to master the correct measurement methods and skills. At the same time according to the complexity of the circuit board to choose the appropriate measurement tools, to ensure the accuracy and efficiency of the test.

How to Tell if a Circuit Board is Bad?

Identifying a bad circuit board requires a combination of visual inspection and multimeter testing. Here are some signs and methods to determine if a PCB is faulty:

Visual Signs

Look for burnt components, discolored areas, or broken traces, such as somewhere became black or be burned obviously. These are clear indicators of damage.

Component Testing

Use the multimeter to test individual components. A component that doesn’t show the expected resistance or voltage is likely faulty.

Continuity Testin

Check for open circuits. Lack of continuity in a path indicates a broken trace or solder joint.

Short Circuit Detection

Identify any unintended connections between different paths. This can be done by checking for continuity where there should be none.

Functionality Testing

Test the circuit board in its intended application. If the device does not function correctly, there may be an issue with the PCB.

Why Choose Best Technology?

By reading this post, you may know how to test a PCB by multimeter already and other methods to identify them. Best Technology has engaging in the PCB manufacturing for more than 18 years, we have served over 2000+ customers all around the world. We have strong R&D team and equipped with advanced equipment to improve the yield and product quality.

At Best Technology, we provide various PCB manufacturing, including metal core PCBs, ceramic PCBs, rigid-flex PCBs and some other special PCBs like HDI PCB, busbar PCB, heavy copper PCB. If you have similiar projects, you are welcome to contact us.

What is a thick film ceramic circuit board used for?

Thick film ceramic circuit board is a kind of circuit board made by thick film technology, which is widely used, mainly for electrical connection, component mounting and surface modification.

What are thick and thin film ceramic circuit boards used for?

Electrical connection

Thick film circuit board can effectively connect all parts of the circuit to ensure the smooth transmission of current.

Component mounting

It can bear and fix electronic components, and ensure the correct position and stable operation of components in the circuit.

Surface modification

Through thick film technology, the surface of the circuit board can be modified to improve its electrical performance and durability. ‌

In addition, the thick film ceramic circuit board has some specific advantages, such as its manufacturing method allows it to be manufactured independently without using a substrate, and its thickness is usually between 10 and 25 μ m. This technology can be manufactured independently without using a substrate, which provides greater design flexibility. However, there may be some limitations in the accuracy of thick-film ceramic circuit boards. For example, in the process of using screen printing technology, the line width and accuracy may be insufficient due to the problems of screen printing, which may gradually lose the accuracy advantage for heat sinks with smaller and smaller size requirements in the future.

What is a thin film ceramic circuit board used for?

Thin film ceramic circuit boards are mainly used in module components of microwave circuits, including thin film load, thin film equalizer, thin film power divider, thin film attenuator, thin film coupler and thin film bridge. ‌

1. Thin film load is often used to match the terminals of module components of microwave circuits to absorb redundant incident power. It is designed with alumina ceramic substrate, which has the advantage of high precision machining.

2. Thin-film equalizer is used to adjust the broadband power flatness of microwave circuits. By changing the square resistance of the integrated tantalum nitride film and designing different resistance values, the output waveform of the device is adjusted to achieve the balance of power signals.

3. Thin film power divider is used in multi-channel communication network system, which distributes power according to a certain proportion, and one input can be multi-output, thus avoiding the problem of unstable patch resistance welding of microstrip power divider.

4. Thin film attenuator is used for large signal attenuation or multi-gear adjustment attenuation value in microwave RF module, which realizes high attenuation value flatness of ultra-wideband and stable performance.

5. Thin-film couplers are used for power detection or signal separation, and can be designed as couplers with any weak coupling degree. tantalum nitride design is used to integrate isolated loads, which is suitable for broadband applications.

6. As a part of microwave module, thin film bridge is used for specific circuit connection and signal processing. ‌

According to these applications, we can better understand the wide application and advantages of thin-film ceramic circuit boards in the fields of high frequency, high power and high integration.

What are the advantages of thick film over thin film ceramic PCB?

Thick film ceramic circuit boards have higher mechanical strength and thermal conductivity than thin film ceramic circuit boards, and are more suitable for power electronics, automotive electronics and other occasions that require higher thermal management and mechanical strength. ‌

The main difference between thick-film ceramic circuit board and thin-film ceramic circuit board lies in their film thickness and manufacturing process. The thickness of thick film circuit board is generally greater than 10μm, while that of thin film circuit board is mostly less than 1μ m.. Thick film circuit board usually adopts screen printing process, while thin film circuit board adopts vacuum evaporation, magnetron sputtering and other process methods.

This difference in technology leads to their differences in performance and application fields. Specifically, the advantages of thick film ceramic circuit boards are mainly reflected in the following aspects:

Reliable performance

Thick film circuits are flexible in design, low in investment and cost, and are mostly used in high voltage, high current and high power occasions.

High mechanical strength

Due to the use of thick film materials, thick film ceramic circuit boards have high mechanical strength and can withstand greater physical pressure and impact.

Good thermal conductivity

Thick-film ceramic circuit boards have good thermal conductivity, which is conducive to rapid heat dissipation, and is particularly important for electronic equipment that needs good thermal management. ‌

Therefore, thick film ceramic circuit boards are more suitable for applications that require high mechanical strength and good thermal conductivity, such as power electronics, automotive electronics and other fields.

What is the difference between thick film and ceramic resistors?

There are some differences between film resistance and ceramic resistance in materials, manufacturing technology, size and shape, electrical properties and application scenarios. ‌

1. Materials and manufacturing process: Thick film resistors are usually made by screen printing process and spraying or sputtering on the circuit substrate. The commonly used substrate materials are ceramics, glass and so on. The ceramic resistor is a resistance device made of ceramic material, which is fired in a ceramic kiln. ‌

2. Size and shape: Thick film resistors are usually flat, can be made into various sizes and shapes, and are suitable for assembly on circuit boards. Ceramic resistors are usually cylindrical and have a fixed size and shape. ‌

3. Electrical performance: Thick film resistor has high resistance accuracy and stability, and small temperature coefficient. Ceramic resistors have larger power carrying capacity and higher withstand voltage. ‌

4. Application scenario: Thick film resistor is suitable for high-precision circuits because of its large resistance range and good temperature stability. Ceramic resistors are suitable for general circuits and small electronic devices because of their small size and general electrical properties. ‌

From this, we can know that thick film resistors and ceramic resistors are different in materials, manufacturing processes, sizes and shapes, electrical properties and application scenarios, which make them suitable for different electronic equipment and circuit design requirements.

‌‌Thick film technology and thin film technology have certain substitutability in some fields, but thick film technology has irreplaceable role in the manufacturing and related processes of many products due to its advantages in cost, reliability, high temperature performance, etc., especially in multi-layer co-sintering processes such as LTCC and HTCC, where thin film technology cannot be applied. As a professional ceramic substrate manufacturer, Best Technology is committed to providing customers with high-quality thick film and thin film ceramic substrates to meet the needs of different applications.‌‌

Material Selection of DPC Ceramic PCB

It is very important to select ceramic substrate with good high temperature stability and high thermal conductivity. Commonly used ceramic materials are Al2O3, AlN, Si3N4 and so on. Taking Al2O3 as an example, its thermal conductivity is as high as 24~30W/(m·K), and the coefficient of thermal expansion is about 8.2×10^-6/℃, which is similar to the coefficient of thermal expansion of most chips. The ceramic layer on the surface of the substrate should be smooth and uniform, and have good adhesion, oxidation resistance, wear resistance and corrosion resistance.

Design and Application of PVD in DPC Manufacturing Process

The heat dissipation performance of DPC ceramic substrate is one of the key factors affecting its work in high temperature environment. In order to test the heat dissipation performance of DPC ceramic substrate, thermocouple temperature measurement, infrared temperature measurement, thermal imager and other testing methods can be used. The experimental results show that the DPC ceramic substrate has good heat dissipation performance and can effectively heat dissipation and reduce the influence of temperature on electronic devices.

DPC Ceramic PCB Structure Design

The structure design of DPC ceramic substrate includes the thickness of copper foil, the size of aperture, the layout of copper foil and the thickness of ceramic substrate. The choice of copper foil thickness should be determined according to heat dissipation requirements and chip power density and other parameters.

There are two layout methods of copper foil, one is fully plated surface; The other is local copper, that is, only the copper foil is laid in the area around the chip. The local copper laying method can reduce the copper foil area and reduce the cost, but the adhesion between the copper foil and the substrate needs to be higher. The thickness of the ceramic substrate also needs to be selected according to the specific application requirements.

PVD Process of DPC Ceramic PCB

Direct Plating Copper (DPC) is a ceramic circuit processing technology developed on the basis of ceramic film processing. In this process, the copper metal composite layer is sputtered on the ceramic substrate by vacuum coating, and then the circuit is made by re-exposure, development, etching and film removal with the photoresistance of yellow light microshadow. Finally, the thickness of the circuit is increased by electroplating/electroless deposition, and the metallized circuit is made after the photoresistance is removed.

The process is the process of vaporizing metal materials (titanium and copper) into molecules and then forming a metal film on the surface of a ceramic substrate. The main process includes cleaning the surface of the substrate, heat treatment of the ceramic substrate, preparation of the target of metal materials, DPC of the target, measurement of film thickness and surface treatment. Among them, heat treatment can improve the thermal stability and adhesion of the ceramic substrate, and ensure that the covered copper foil will not peel off in high temperature environment.

DPC ceramic substrate small size, precision structure, high reliability requirements, complex process flow, fine production process, belongs to technology-intensive industries, with high technical barriers. Its production process mainly involves drilling, magnetron sputtering, chemical copper deposition, copper plating, solder resistance printing, chemical silver/chemical gold deposition and other main processes

Application of DPC Ceramic PCB

a. VCSEL package

The power density of VCSEL is very high, and the DPC ceramic circuit board has a high thermal expansion coefficient matching with VCSEL, so as to solve the stress problem caused by the mismatch of thermal expansion between chip and substrate. The DPC ceramic circuit board makes the metal edge closely combined with the ceramic substrate, avoiding the additional paste process, coordination accuracy and other problems in the later assembly process, as well as the reliability problems caused by the aging of the glue. The ceramic circuit board of DPC film technology almost meets the packaging requirements of VCSEL.

b. IGBT package

The insulated gate bipolar transistor has become the mainstream of the development of power semiconductor devices due to its high input impedance, fast switching speed, low on-state current and high blocking voltage. Its applications are as small as frequency conversion air conditioning, silent refrigerator, washing machine, induction cooker, microwave oven and other household appliances, and as large as electric locomotive traction system. Due to the high output power and high heat output of IGBT, heat dissipation is the key for IGBT packaging. At present, the DPC ceramic substrate is mainly used for IGBT packaging, because the DPC ceramic substrate has the characteristics of large metal layer thickness, high bonding strength (good thermal impact) and so on.

c. LED package

Throughout the development of LED technology, the power density continues to improve, and the requirements for bracket heat dissipation are becoming higher and higher. DPC ceramic substrate has high insulation, high thermal conductivity and heat resistance, low expansion and other characteristics, especially the use of through hole interconnection technology, well meet the LED flip, eutectic, COB (chip on board), CSP (chip scale package), WLP (wafer package) packaging needs, suitable for medium and high power LED packaging.

In conclusion, the design and application of DPC copper-coated ceramic substrate need to consider many factors, and a lot of experiments and data analysis are required. The performance and reliability of DPC ceramic substrate at high temperature can be improved by selecting suitable materials and designing reasonable structure and process, and the high temperature application of microelectronic devices can be guaranteed.

The advent of DPC ceramic substrate products opens the development of heat dissipation application industry. Due to the heat dissipation characteristics of the ceramic substrate, it has the advantages of high heat dissipation, low thermal resistance, long life and voltage resistance. With the improvement of production technology and equipment, the rationalization of product prices is accelerated, and the application field of LED industry is expanded.

What is a PCB Board?

A printed circuit board (PCB) is an electronic that uses metal conductors to create electrical connections between components. Generally, a PCB is a flat, laminated composite made of non-conductive substrate materials with conductive pathways etched or printed onto it. These pathways, also known as traces, enable the electronic components mounted on the board to communicate with each other.

PCBs are designed to support and electrically connect various components such as resistors, capacitors, diodes, and integrated circuits. The intricate network of copper tracks forms circuits that dictate the device’s functionality. PCBs can range from simple single-sided boards used in basic electronics to complex multi-layered structures found in advanced applications.

Common PCB Structure

A PCB’s structure is composed of several key layers, each serving a distinct purpose. Here is a detailed breakdown of these layers:

Substrate (Base Material)

The substrate, usually made of fiberglass (FR4), provides the board with its rigidity and thickness. It is the foundational layer upon which all other materials are built.

Copper Layer

This conductive layer is typically made of copper foil. For single-sided PCBs, the copper layer is only on one side of the substrate, whereas double-sided and multi-layer PCBs have copper layers on both sides or between multiple layers of substrate.

Solder Mask

The solder mask is a protective layer applied over the copper traces to prevent oxidation and accidental short-circuiting. It insulates the copper traces and leaves the component pads exposed for soldering. The green color commonly associated with PCBs comes from this layer, though it can also be found in other colors like red, blue, black, and white.

Silkscreen

The silkscreen layer is used to add labels, symbols, logos, and other markings to the PCB. This layer helps in identifying component locations and orientations during assembly and troubleshooting.

Components and Connectors (PCBA)

Components such as resistors, capacitors, diodes, and integrated circuits are soldered onto the PCB. Connectors allow the PCB to interface with other boards, power supplies, and external devices.

How Many Types of PCB?

Single-Sided PCBs

These are the simplest types of PCBs, with copper on only one side of the board. You’ll find them in basic, low-cost electronics like calculators, radios, and power supplies. They’re easy to design and manufacture, which keeps costs down and makes them great for straightforward applications.

Double-Sided PCBs

These boards have copper layers on both sides, allowing for more complex circuits. They’re common in more sophisticated electronics like amplifiers, power monitoring systems, and HVAC systems. With increased circuit density and flexible design options, they can handle more complex tasks.

Multi-Layer PCBs

When you need to pack in a lot of circuits, multi-layer PCBs are the way to go. They consist of three or more layers of copper, separated by insulating layers. You’ll see these in high-tech devices like computers, servers, medical equipment, and aerospace electronics. They offer high circuit density, reduced size and weight, and better signal integrity.

Rigid PCBs

Made from solid, inflexible materials like fiberglass, rigid PCBs keep their shape and provide strong support for components. They’re durable and used in everything from simple toys to complex industrial equipment.

Flexible PCBs

These are made from flexible plastic materials like polyimide, allowing them to bend and flex. Perfect for wearable electronics, flexible displays, and compact devices where space is tight. They’re lightweight, can fit into small, irregular spaces, and can handle being bent repeatedly.

Rigid-Flex PCBs

Combining the best of both rigid and flexible PCBs, these are great for devices that need both stability and flexibility, like smartphones, cameras, and medical devices. They save space, reduce the need for connectors and interconnections, and improve reliability.

High-Frequency PCBs

Designed to operate at frequencies above 1 GHz, these are used in communication systems, microwave technology, and high-speed devices. They provide low signal loss and high performance, making them crucial for advanced communication technologies.

Ceramic PCBs

Using ceramic as the substrate material, these PCBs offer excellent thermal conductivity and stability. They’re perfect for high-power applications and environments with extreme temperatures, like LED lighting, power electronics, and aerospace systems. Ceramic PCBs ensure reliable performance in harsh conditions.

Metal Core PCBs

Featuring a metal core, usually aluminum or copper, these PCBs improve heat dissipation. They’re used in high-power applications where efficient thermal management is crucial, such as LED lighting, power supplies, and automotive electronics.

Special PCBs

Bus Bar PCBs

These integrate bus bars for high-current applications, ensuring efficient power distribution and minimal voltage drop. They’re used in heavy-duty power supplies, electric vehicles, and industrial machinery. Bus bar PCBs provide robust and reliable connections for high-power systems.

Heavy Copper PCBs

With thicker copper layers, typically 3 ounces per square foot or more, these PCBs can handle higher currents and enhance thermal management. They’re used in power distribution, automotive, and industrial applications where durability and performance are critical. Heavy copper PCBs ensure reliable operation under high-stress conditions.

HDI (High-Density Interconnect) PCBs

These feature finer lines and spaces, smaller vias, and higher connection pad density. They’re used in advanced electronics like smartphones, tablets, and medical devices where space and performance are paramount. HDI PCBs enable miniaturization and improved electrical performance.

Extra Thin PCBs

Designed with minimal thickness, these PCBs are perfect for fitting into compact and lightweight devices. You’ll find them in flexible displays, wearables, and miniaturized electronic gadgets. Extra thin PCBs allow for innovative design solutions and space-saving configurations.

RF (Radio Frequency) PCBs

Optimized for high-frequency signals, these are used in communication devices, antennas, and microwave applications. They’re designed to minimize signal loss and interference, ensuring optimal performance in wireless communication systems.

High Tg PCBs

These have a high glass transition temperature, making them suitable for high-temperature environments. Used in automotive, aerospace, and industrial applications, high Tg PCBs maintain structural integrity and performance at elevated temperatures.

Impedance Control PCBs

These are designed to maintain consistent impedance for high-speed signal transmission. They’re used in communication devices, high-speed digital circuits, and advanced computing systems. Impedance control PCBs ensure signal integrity and reduce signal loss and reflection.

Why Are PCB Boards So Expensive?

Material Quality

High-grade materials like FR4 (fiberglass), ceramics, and high-quality copper foil are used to ensure durability and performance. These materials are essential for withstanding environmental stress and ensuring reliable operation, but they are expensive. For example, ceramic substrates can cost up to 10 times more than standard FR4 materials due to their superior thermal conductivity and electrical properties.

Complexity of Design

Multi-layer PCBs and advanced designs such as HDI (High-Density Interconnect) boards require complex manufacturing processes. The process involves precise alignment of layers and sophisticated techniques like laser drilling for micro-vias. The added complexity increases the production costs significantly. For instance, a standard 4-layer PCB might cost $50 per square meter, while a 12-layer HDI PCB could cost over $200 per square meter.

Precision and Technology

Manufacturing high-precision PCBs involves advanced machinery for etching, drilling, and plating. This machinery requires significant investment, and the skilled labor needed to operate it adds to the cost. The precision required in the production process ensures that the PCBs meet exacting standards, crucial for high-performance applications. A single advanced PCB drilling machine can cost upwards of $500,000.

Volume of Production

Smaller production runs generally have higher costs per unit because the setup and tooling expenses are spread over fewer units. For example, a low-volume production run of 10 PCBs might cost $100 per board, whereas a high-volume run of 10,000 boards might reduce the cost to $10 per board due to economies of scale.

Testing and Quality Assurance

Rigorous testing, including electrical, thermal, and functional tests, ensures that the PCBs meet strict performance standards. This testing process is vital to ensure reliability, especially in critical applications like medical devices and aerospace. Quality assurance processes can add 20-30% to the overall production cost, but they are essential for maintaining high standards.

What is the Difference Between PCBA and PCB Board?

The terms PCB and PCBA are often used interchangeably, but they refer to different stages of the board’s life cycle. The PCB is the bare board itself, with no electronic components attached. It consists of a non-conductive substrate, copper traces, solder mask, and silkscreen. A PCB serves as the foundation for assembling electronic components.

On the other hand, a PCBA (Printed Circuit Board Assembly) is a PCB that has undergone the assembly process, where all necessary electronic components like resistors, capacitors, diodes, and integrated circuits are soldered onto the board. Essentially, a PCBA is a functional circuit board ready for use in electronic devices. The transition from a PCB to a PCBA involves component placement, soldering, and quality testing, transforming the bare board into an operational assembly. Below is a typical PCBA product for your reference.

What is PCB Board Common Use?

PCB boards are existing in everywhere what we live, for example, the global smartphone market, which relies heavily on PCBs, was valued at approximately $520 billion in 2020. Here are some common applications that PCB used in:

Automotive Industry

In the automotive sector, PCBs are used in engine control units, infotainment systems, and advanced driver-assistance systems (ADAS). These applications enhance vehicle performance, safety, and connectivity.

Medical Devices

PCBs are integral to medical devices such as diagnostic equipment, patient monitoring systems, and implantable devices. They ensure precise and reliable operation, which is critical for patient safety and effective treatment.

Industrial Applications

PCBs are used in control systems, machinery, and power distribution units in industrial settings. They provide robust and durable solutions capable of withstanding harsh conditions and continuous operation.

Telecommunications

In telecommunications, PCBs are essential in routers, switches, and communication devices, ensuring efficient and reliable data transmission. As the demand for faster and more reliable communication networks grows, so does the need for high-quality PCBs.

Why Are Circuit Boards Green?

The characteristic green color of most PCBs comes from the solder mask, a protective layer applied over the copper traces to prevent oxidation, short-circuiting, and to protect the board during soldering.

The green color is traditional, largely due to historical reasons and practical benefits. Green solder mask provides a good contrast against the white silkscreen and the shiny copper traces, making it easier for technicians to inspect and identify components during assembly and troubleshooting. Additionally, green solder mask was one of the first colors to be developed and standardized in the industry, leading to its widespread adoption. However, PCBs are not limited to green; they can also be found in other colors such as red, blue, black, and white, depending on the specific requirements and aesthetic preferences of the project. The choice of solder mask color does not affect the performance of the PCB, but green remains popular due to its well-established manufacturing process and visual advantages.

How to Get Started with Best Technology?

Here at Best Technology, we are experienced in designing all types of PCBs, including standard rigid PCBs, special PCBs, and irregular PCBs. We can design and develop PCBs according to customer specification and offer suggestions on the right materials for your project.

We provide the full series of PCB manufacturing, from the initial PCB design, PCB layout, to custom PCB fabricate, PCB assembly, box building and so forth. By the way, we have our own factory in Vietnam, that means we can ship out the PCBs directly from Vietnam.

Welcome to contact us when you want to get a quote!

1. High thermal conductivity

The core metal content of ceramic circuit boards is as high as 96-98%, which makes them have extremely high thermal conductivity. Compared with ordinary FR4 circuit boards, the thermal conductivity of ceramic circuit boards can reach 170-230 W/mK, while the thermal conductivity of FR4 boards is usually only 0.3-0.4 W/mK. Higher thermal conductivity allows for more efficient heat dissipation, avoiding the problem of damage to electronic components due to overheating. This is particularly important in high-power applications, such as LEDs and power semiconductors.

2. Low thermal expansion coefficient

Ceramic materials have a very low coefficient of thermal expansion (CTE), usually between 6-8 ppm/°C. In contrast, FR4 material has around 14-16 ppm/°C CTE. This means that ceramic materials hardly expand or contract when temperature changes. The low thermal expansion coefficient improves the reliability of the circuit board, reduces the influence of the thermal cycle on the circuit board structure and the connection of electronic components. Especially suitable for use in the environment with frequent temperature changes.

3. High surface hardness

The surface hardness of ceramic materials is up to 9 Mohs, which is harder than aluminum oxide and silicon. It means ceramic PCB has more wear-resistant, scratch resistant, and not easy to damage. It enables to run stably for a long time even in harsh physical environments, extending the service life of the board. That is why ceramic PCB is always recommended to use in military.

4. High compressive strength

The compressive strength of the ceramic circuit board can reach 450-500 MPa, which can withstand large mechanical pressure without deformation or rupture. This characteristic makes them excellent in applications that require them to withstand mechanical stress, such as industrial automation and aerospace.

5. High dielectric strength

Ceramic PCB has very high dielectric strength, usually between 15-25 kV/mm. And it can withstand higher electric fields without electrical breakdown.

6. Ability to withstand higher temperatures

Ceramic circuit boards can operate at temperatures up to 1000°C without degradation or damage. While FR4 circuit boards typically operate at an upper limit of 140-170°C. Ceramic circuit boards are suitable for electronic devices in high temperature environments, such as electric vehicles and high-power lasers.

7. High breakdown voltage

The high breakdown voltage of the ceramic circuit board can reach 20-35 kV, ensuring reliable operation under high voltage conditions. It is well suitable for use in high-voltage power supplies and power electronic equipment, providing higher safety.

8. Does not absorb water

The water absorption of ceramic materials is usually less than 0.1%, while the water absorption of FR4 materials is 0.1-0.2%. The non-water absorbing feature prevents performance degradation and damage caused by water absorption in a humid environment. It is ideal for Marine, medical, and other applications that require moisture resistance.

9. Low loss at high frequency

In high-frequency applications, the dielectric loss Angle tangent (Df) of ceramic circuit boards is usually between 0.0001-0.001, while the loss Angle tangent of FR4 materials is 0.02-0.03. Low loss ensures signal integrity and transmission efficiency, which is suitable for communication equipment and high-frequency electronic equipment.

10. Resistance to cosmic rays

Ceramic materials can resist the impact of cosmic rays, will not be degraded or damaged by rays. They are suitable for satellite electronic equipment, ensuring the stability and reliability of the circuit board in a high radiation environment.

11. No organic ingredients

Ceramic circuit boards do not contain organic components, so they have high chemical stability, are not susceptible to chemical corrosion and decomposition. They are good choice to use in harsh chemical environments.

12. High-density assembly

Ceramic circuit boards support high-density assembly with line/pitch resolution of 20 microns. This allows them to be adapted to more complex and refined circuit designs, suitable for microelectronics and high-precision applications.

Best Technology provides professional one-stop ceramic PCB design and manufacturing service all around the world. We welcome all the friends and partners from domestic and abroad to visit our ceramic circuit board workshop.

Archive for the ‘Ceramic PCB’ Category

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Material Selection of DPC Ceramic PCB

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What is a PCB Board?

Common PCB Structure

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Special PCBs

Why Are PCB Boards So Expensive?

What is the Difference Between PCBA and PCB Board?

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How to Get Started with Best Technology?

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1. High thermal conductivity

2. Low thermal expansion coefficient

3. High surface hardness

4. High compressive strength

5. High dielectric strength

6. Ability to withstand higher temperatures

7. High breakdown voltage

8. Does not absorb water

9. Low loss at high frequency

10. Resistance to cosmic rays

11. No organic ingredients

12. High-density assembly

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