Archive for the ‘FAQ’ Category

What temp does pc board solder melt? Desoldering temperature

Tuesday, December 31st, 2024

What temp does pc board solder melt? Solder melting points vary depending on the type. Traditional tin-lead solder, the common 63/37 tin-lead alloy melts at about 183°C. Today’s widely used lead-free solder, for example, tin-silver-copper alloy, melts at about 217°C – 227°C. When soldering SMD components, the temperature is set at around 240°C – 260°C to ensure that the tin-silver-copper solder is fully melted.

What temperature do PCBs melt?

The melting point of the PCB substrate itself is usually between 130°C and 140°C. This means that above this temperature range, the FR-4 substrate may begin to soften and melt.

What temp does pc board solder melt? Desoldering temperature

In electronics manufacturing, components on PCB substrates are usually connected by soldering technology. The solder used in the soldering process has a lower melting point, generally between 183°C and 215°C. This ensures that during the soldering process, the solder can melt and form a reliable connection with the PCB substrate and components.

What is the best solder for circuit boards?

The best solder selection for circuit boards depends on the specific application requirements and environmental conditions.

Tin-lead solder wire: Tin-lead solder wire is one of the most commonly used solders in circuit board soldering. It is usually made of 63/37 tin-lead alloy, which has the advantages of low melting point, good fluidity and easy operation.

Lead-free solder wire: With the improvement of environmental awareness, lead-free solder wire has gradually become the mainstream. Lead-free solder wire is mainly composed of tin, silver, copper and other elements, and has the characteristics of high melting point, high hardness and wear resistance.

Silver paste: Silver paste is a packaging material widely used in high-frequency circuits, microwave circuits, power devices and printed circuit boards. It is applied to the surface of the circuit board by spraying or printing, and is baked and cured at high temperature.

What is the melting point of circuit board solder?

The melting point of circuit board solder is usually between 183℃ and 214℃. Commonly used solder is tin-copper alloy, which has good plasticity, conductivity and corrosion resistance, making it the most commonly used soldering material. In addition, the melting point of lead solder is 183℃, while the melting point of lead-free solder is 217℃.

In the actual soldering process, the soldering temperature is usually about 50℃ higher than the melting point of the solder, so the actual soldering temperature is generally between 220℃ and 250℃.

For manual soldering, the soldering temperature is generally between 300℃ and 350℃ to ensure that the solder wire melts quickly and ensures good wettability. For wave soldering, the optimal temperature is 280℃, and the tin furnace temperature can be set to 288±5℃.

What temperature does 50/50 solder melt at?

The melting temperature range of 50/50 solder is 190℃ to 216℃. This solder is an alloy composed of 50% tin and 50% lead, and its melting temperature is approximately in this range.

In addition, the melting point of solder varies depending on the composition. For example, the melting points of lead solder wire are as follows:

63/37 melting point is 183℃
60/40 melting point is 185℃ to 190℃
55/45 melting point is 187℃ to 202℃
50/50 melting point is 190℃ to 216℃
45/55 melting point is 192℃ to 227℃
40/60 melting point is 194℃ to 238℃
35/65 melting point is 198℃ to 247℃
30/70 melting point is 202℃ to 256℃.

Can you burn a PCB while soldering?

The PCB may be burned during soldering, which mainly depends on the control of soldering methods and parameters.

The main reasons for burning PCB during laser welding include:

Excessive laser power: Laser power is a key factor in determining the heat input of welding. If the power is set too high, the laser energy will be concentrated in the solder joint in a short time, and the heat generated will far exceed the heat required for the solder to melt, causing PCB burns.

Improper pulse width and frequency: The laser pulse width and frequency will also affect the welding effect. A pulse width that is too long or a frequency that is too high will cause excessive heat accumulation, and the heat transferred to the PCB board will increase, which may cause burns.

Poor thermal performance of materials: PCB materials have low thermal conductivity or small specific heat capacity, and the heat conduction speed inside the material is slow, which is easy to concentrate near the solder joint, causing local overheating and burns.

Surface treatment and quality problems: When a PCB board with oil, oxide layer or impurities on the surface is irradiated by laser, the contaminants will absorb part of the laser energy, generate additional heat, and increase the risk of burns.

The reasons for burning PCBs during traditional welding include:

Excessive welding temperature and excessive welding time: The temperature generated during welding is indeed very high, but if the welding temperature is too high or the welding time is too long, it may cause damage to the components on the circuit board or thermal cracks in the circuit board itself.

Measures to avoid burning PCB

Choose appropriate welding tools and methods: Choose welding tools that suit your needs and control welding temperature and time. For laser welding, reasonably set the laser power, pulse width and frequency to ensure that the heat input is within a safe range.

Control welding temperature and time: Set the appropriate welding temperature according to the material of the circuit board and the heat resistance of the components, and try to shorten the welding time.

Optimize welding skills: Master welding skills to avoid the problems of thermal expansion deformation of copper foil and separation of copper foil from the substrate caused by high-energy local rapid heating.

Check the quality of PCB boards: Ensure that the surface treatment of PCB boards is clean, without oil, oxide layer or impurities, and avoid contaminants absorbing laser energy to generate additional heat.

What temperature does PCB solder reflow at?

The temperature range of PCB solder during reflow soldering is usually 220℃ to 249℃. During the reflow soldering process, the solder paste needs to undergo processes such as solvent volatilization, flux removal of oxides on the surface of the weldment, solder paste melting, reflow, and solder paste cooling and solidification. The specific temperature zones are as follows:

Preheating zone: The temperature gradually rises from room temperature to about 150℃. At this stage, the solvent and gas in the solder paste begin to evaporate, the flux wets the pads and component pins, and the softened solder paste covers the pads, isolating oxygen and preparing for the next welding.

Constant temperature zone: The temperature is between 150℃ and 200℃, ensuring that the PCB and components are fully preheated to avoid damage to the PCB and components due to a sudden temperature rise.

Reflow zone: The temperature rises rapidly to 220℃, up to 249℃. In this area, the solder paste reaches a molten state, the liquid solder wets and diffuses, and forms solder joints between the pads, component ends and pins.

Cooling zone: The solder joints gradually solidify, completing the entire reflow process.

Temperature control during reflow is extremely important because it directly affects the welding quality and product reliability. Too high or too low temperature may cause welding defects such as solder balls, cold soldering, bridging and other problems.

What temperature should pcb be desoldered at?

The temperature range of PCB during desoldering is generally between 250℃ and 350℃. The specific temperature should be adjusted according to the size and type of components on the circuit board. For smaller components and thin lines, the temperature should be set at around 250℃; for larger components and thicker solder joints, the temperature can be set at around 350℃.

Specific temperature requirements for different welding methods

Manual welding: usually set between 300℃ and 350℃. For precision components such as IC and SMD, it is recommended to control between 260℃ and 300℃; for welding of large-area heat sinks or power lines, the temperature may need to be increased to around 380℃.

Wave soldering: The temperature of the preheating zone is usually 90℃ to 140℃, and the temperature of the solder tank is 240℃ to 260℃.

Reflow soldering: The temperature of the preheating zone is 150℃ to 200℃, the wetting zone is maintained at 150℃ to 200℃, the temperature of the reflow zone is 230℃ to 260℃, and the temperature of the cooling zone drops rapidly to below 100℃.

Laser welding: The local temperature is usually 250℃ to 300℃, and the exposure time is usually 0.1 to 2 seconds.

In short, the melting point of printed circuit board solder varies depending on the type and application scenario. Among traditional tin-lead solders, the melting point of 63/37 tin-lead alloy is about 183℃, which was widely used in PCB welding. With the demand for environmental protection, lead-free solder has emerged, and the melting point of common tin-silver-copper alloy is 217℃ – 227℃.

What Is Ceramic Base PCB?

A ceramic base PCB uses ceramic materials as its substrate instead of traditional options like FR4. These PCBs are renowned for their excellent thermal conductivity, electrical insulation, and mechanical stability. Designed for high-performance applications, they excel in environments requiring durability and precision.

Ceramic base PCB is often chosen for industries like aerospace, automotive, and medical devices, where reliability and efficiency are paramount. Its unique properties make them indispensable for cutting-edge technologies.

What Are The Benefits of Ceramic Base PCB?

Ceramic base PCBs offer several advantages that set them apart from conventional options. Their high thermal conductivity ensures efficient heat dissipation, making them ideal for power-intensive devices. Their low coefficient of thermal expansion minimizes the risk of mechanical stress, ensuring long-lasting performance.

These PCBs are also highly resistant to chemical and environmental damage. Their excellent electrical insulation supports stable and reliable operations, even under challenging conditions. Combined with their compact size and lightweight nature, ceramic base PCBs are a top choice for innovative and efficient electronic designs.

What Are The Applications of Ceramic Base PCBs?

Ceramic base PCBs find applications across various industries due to their superior properties. In the automotive sector, they are used in engine control systems and LED lighting. Aerospace applications include navigation systems and avionics, where reliability is critical.

In the medical field, ceramic base PCBs are essential for diagnostic devices, imaging systems, and surgical instruments. They are also widely employed in telecommunications for RF and microwave components. Consumer electronics, including LED displays and sensors, further benefit from their durability and efficiency.

What Are The Different Types of Ceramic Base PCB?

Ceramic base PCBs are available in several types, each designed to meet specific requirements:

Aluminum Nitride (AlN) PCBs: Known for high thermal conductivity and excellent electrical insulation.

Alumina (Al2O3) PCBs: Cost-effective and suitable for a wide range of applications.

Beryllium Oxide (BeO) PCBs: Exceptional thermal performance, though less commonly used due to safety concerns.

Silicon Nitride (Si3N4) PCBs: High strength and thermal shock resistance, ideal for demanding environments.

Each type offers unique features to suit different industries and applications.

Why Turn To Best Technology For Ceramic Base PCB?

Best Technology is a trusted name in the PCB manufacturing industry, offering unmatched expertise in ceramic base PCBs. We cater to diverse customer needs with our wide product range, including various types of ceramic PCBs. Whether you require small quantities or bulk orders, our flexible production capabilities ensure your demands are met efficiently.

Our focus on quality is unwavering. Every product undergoes stringent testing to meet the highest standards. We prioritize fast delivery, ensuring your projects stay on schedule. With our customization services, you can rely on us for tailored solutions that fit your specific requirements. Our commitment to exceptional service makes us the preferred choice for customers worldwide.

What Is the Material of Ceramic Base PCB?

The materials used in ceramic base PCBs are critical to their performance. Common materials include:

Aluminum Nitride (AlN): Offers outstanding thermal conductivity and is ideal for high-power applications.

Alumina (Al2O3): Provides a balance of performance and cost-effectiveness, making it widely popular.

Beryllium Oxide (BeO): Delivers superior thermal performance but requires careful handling.

Silicon Nitride (Si3N4): Combines strength, thermal resistance, and reliability.

These materials are chosen based on application requirements, ensuring optimal performance and durability.

How To Design Ceramic Base PCB?

Designing ceramic base PCBs requires careful consideration of material properties, thermal management, and circuit layout. The substrate’s thermal conductivity must align with the application’s heat dissipation needs. Selecting appropriate components and ensuring proper spacing is essential for reliable operation.

Advanced fabrication techniques, such as laser drilling and metallization, are used to achieve precision and quality. Working with experienced manufacturers like Best Technology ensures that every aspect of your design is optimized for performance and longevity.

FAQs About Ceramic Base PCB

1. What industries use ceramic base PCBs?

Industries like automotive, aerospace, medical devices, telecommunications, and consumer electronics widely use ceramic base PCBs.

2. How does ceramic base PCB compare to traditional PCBs?

Ceramic base PCBs offer superior thermal conductivity, mechanical strength, and environmental resistance compared to traditional PCBs.

3. Can ceramic base PCBs be customized?

Yes, Best Technology provides fully customized ceramic base PCBs to meet unique application requirements.

4. What is the lead time for ceramic base PCBs?

With our fast delivery services, lead times are minimized, ensuring your projects stay on track. Normally, The fastest lead time is about 2 weeks.

5. Why is thermal conductivity important in ceramic base PCBs?

High thermal conductivity ensures efficient heat dissipation, critical for maintaining performance in high-power applications.

In short, ceramic base PCBs are indispensable for industries requiring high performance and reliability. Best Technology excels in delivering top-notch ceramic base PCBs tailored to your needs. With our diverse product range, exceptional quality, and fast delivery, we are your trusted partner for ceramic base PCB solutions. If you have any questions or any inquiry about ceramic base PCB products, warm welcome to consult us via sales@bestpcbs.com. Thank you.

What is the best temperature to solder at?

The optimal temperature range for PCB soldering varies depending on the soldering method.

Surface mount technology: For surface mount technology (SMT), the soldering temperature is generally between 200-240 degrees Celsius. This soldering method includes hot air ovens and reflow soldering, which is mainly used in modern electronic equipment manufacturing.

Wave soldering: The soldering temperature of wave soldering is generally between 230-260 degrees Celsius. The preheating zone temperature of the wave soldering machine is usually 90-130℃, the solder temperature is 275℃～300℃, the immersion speed is 20mm/s～25mm/s, and the immersion time is 1s～3s.

Manual soldering: The temperature requirements for manual soldering are relatively high, usually set between 300℃ – 350℃. For precision components such as IC and SMD, it is recommended to control it at 260℃ – 300℃.

Reflow soldering: The preheating zone temperature of reflow soldering is heated from room temperature to 150℃ – 200℃, the wetting zone is maintained at 150℃ – 200℃, and the peak temperature of the reflow zone is 230℃ – 260℃. The entire reflow soldering process is usually controlled within 4-7 minutes.

Lead-free solder: For lead-free solder, due to its high melting point, the soldering temperature usually needs to be higher, generally between 250℃ – 280℃.

What temperature is 60 40 soldering?

The optimal soldering temperature range of 60/40 solder wire is 220℃-240℃. Within this temperature range, the fluidity and wettability of the solder wire are good, which can ensure the quality and effect of soldering components.

In addition, different types of solder wire have different optimal temperature ranges:

63/37 alloy: high melting point, suitable for soldering circuits and PCB boards, the optimal temperature range is 260℃-280℃.

55/45 alloy: melting point is 187℃-202℃, suitable for specific application scenarios.

50/50 alloy: melting point is 190℃-216℃, suitable for soldering tasks requiring higher melting points.

45/55 alloy: melting point is 192℃-227℃, suitable for soldering tasks requiring higher melting points.

40/60 alloy: melting point is 194℃-238℃, suitable for specific high melting point soldering needs.

35/65 alloy: melting point is 198℃-247℃, suitable for high melting point welding tasks.

30/70 alloy: melting point is 202℃-256℃, suitable for extremely high melting point welding tasks.

What is too much heat on solder?

Overheating of PCB solder can lead to a variety of problems, including reduced soldering quality, component damage and safety hazards. Specifically:

Degraded soldering quality: Overheating can lead to increased solder fluidity, which may cause excessive solder joints or solder accumulation, affecting soldering quality. In addition, overheating may also cause solder joints to turn white, have no metallic luster, have a rough surface, easily peel off, and reduce strength.

Component damage: High temperature accelerates the aging process of electronic components and shortens their life. Long-term overheating may cause damage, burning or failure of electronic components, requiring more frequent component replacement, and increasing repair and maintenance costs.

Safety hazards: Overheating may cause fire risks. In extreme cases, overheated PCB boards may cause wires, cables and other materials to melt, causing fires.

Do and don’ts of soldering?

The precautions for PCB soldering include the following aspects:

1. Selection of soldering materials and flux:

Soldering materials: Commonly used soldering materials include tin-lead solder, which is suitable for general electronic product assembly due to its low melting point, high mechanical strength, low surface tension, and good oxidation resistance.

Flux: Flux is divided into solder resist and soldering flux. The soldering flux is mainly used to remove oxide film, prevent oxidation, reduce surface tension, and increase solder fluidity. Commonly used soldering fluxes include rosin series, which are non-corrosive and suitable for electronic assembly soldering.

2. Key points of welding technology:

Surface treatment of weldment: Remove rust, oil, dust and other impurities on the welding surface.

Pre-soldering: Pre-moisten the welding parts of component leads or wires with solder to reduce welding errors.

Appropriate amount of flux: Rosin water should only wet the solder joints to be formed to avoid excessive use resulting in excessive solder joints or cold solder joints.

Keep the soldering tip clean: The soldering tip needs to be cleaned regularly to prevent oxidation from affecting the heating effect.

3. Control of welding temperature and time:

Temperature control: Too high or too low temperature of the soldering iron will affect the welding quality. It is recommended to use a white light adjustable soldering iron, the temperature is about 350°C for lead soldering, and the temperature is about 380°C for lead-free soldering.

Time control: Select the appropriate heat and time according to the size and shape of the solder joint to ensure the full melting of the solder and the activation of the active flux.

4. Soldering sequence and component placement:

Soldering sequence: Prioritize soldering of smaller components, such as resistors and capacitors, and finally solder larger components and connectors.

Component placement: Components should be neatly, centered, and placed on the board surface, and pay attention to the polarity of the components.

5. Ventilation and safety measures:

Ventilation: Harmful gases will be generated during welding, and exhaust fans or other ventilation equipment must be equipped.

Safe operation: Ensure the safety of the operating process, circuit boards and welding tools, and use anti-static tools and protective measures.

What temperature does solder reflow at?

The reflow temperature range of solder during reflow soldering is usually between 220-260℃. Specifically, the four key temperature zones of reflow soldering and their temperatures and times are as follows:

Preheating zone: The temperature is usually set at 150-200℃ for 60-120 seconds. The purpose of this stage is to preheat the circuit board and components to reduce thermal stress and avoid thermal shock.

Wetting zone: The temperature range is 180-230℃ for 30-90 seconds. At this stage, the solder paste begins to melt and penetrate into the solder joints, preparing for the next reflow stage.

Reflow zone: The temperature is usually 220-260℃ for 30-60 seconds. At this stage, the solder paste is completely melted to form a stable solder joint. Too high a temperature or too long a time may cause the solder joint to overheat, while too low or too short a time may cause the solder joint to be loose.

Cooling zone: The temperature drops below 70℃ for 60-120 seconds. The rapid cooling process helps to reduce the thermal stress of the solder joints and improve the reliability and stability of the product.

In addition, the solder paste will go through four stages during the reflow process: solvent volatilization, oxide removal, melting and reflow, and cooling and solidification. The temperature and time settings of these stages are crucial to ensure the quality of welding and product reliability.

How to remove old solder?

There are mainly the following ways to remove old solder:

Use a solder sucker: The solder sucker is a commonly used tool, especially suitable for soldering work on precision circuits. When using a solder sucker, first heat the soldering iron to melt the solder joint, then gently place the solder sucker on the solder joint, and the molten solder will be absorbed by the solder sucker.

Use anhydrous ethanol or alcohol above 95%: Dip anhydrous ethanol or high-concentration alcohol on a soft brush, brush the solder joint, and then dry it with absorbent cotton.

Ultrasonic cleaning: Ultrasonic cleaning uses the high-frequency oscillation of ultrasound to produce a cavitation effect, which removes the dirt on the solder joint and accelerates the dissolution process of the cleaning fluid.

Manual cleaning: Use manual tools such as tweezers, scrapers, etc. to directly clean the residual solder on the solder joint. This method is simple but inefficient, and it is easy to damage solder joints and components.

Use special tools: such as desoldering mesh wire, desoldering braided belt, etc. Desoldering mesh wire is made of alloy copper wire and is suitable for removing excess solder on SMT parts solder joints and electronic components of PCB.

In short, the PCB welding temperature is determined by many factors. The melting point of tin-lead solder is 183℃ – 327℃, and the lead-free solder is 217℃ – 227℃; the tools are different, the electric soldering iron solders fine boards at 20 – 30W, 280℃ – 320℃, the hot air gun removes lead chips at 300℃ – 350℃, and the lead-free chips at 380℃ – 420℃. Special scenes are adjusted as needed, and instrument monitoring and calibration are required to ensure the quality of solder joints and products.

How do you melt stubborn solder?

Methods for melting stubborn solder include using appropriate solvents, heating methods and special solvents or cleaning agents.

How to melt strong solder joints? Types of soldering joints

Use solvent: According to the composition of the solder, choose a suitable solvent for dissolving. Common solvents include acetone, alcohol, acetic acid, toluene, etc. Pour the solvent on the solder, let it soak for a while, and then gently wipe it with a soft cloth to dissolve the solder.

Heating method: For hot-melt solder, heating can be used to dissolve it. Use a hot air gun or a special hot melt device to heat the solder to a molten state.

Use special solvents or cleaners: You can try to use special solvents or cleaners. Some solvents or cleaners have strong dissolving power and are suitable for specific types of solder.

How do you remove excess solder from PCB?

During the production or repair process, some solder residues left by solder will easily remain on the PCB. If you want to avoid affecting the normal use of the circuit board, you must remove these solder residues. The following are common cleaning methods:

The first method:

1. Soak the circuit board in acetone solution for about 10 minutes;

2. Clean with more than 95% alcohol. If it is difficult to remove, you can use a soft brush to gently sweep;

3. After cleaning, use cotton and other absorbent items to dry;

4. Use a tin sucker, a needle for the welding hole, insert and rotate after the soldering iron is heated. Or you can quickly shake the printed plate after heating to shake off the tin residue. Be careful not to move too much to avoid damaging the circuit board.

The second method:

1. First shake off the solder on the soldering iron and melt the solder joint again. Repeat several times.

2. Find a small section of multi-strand wire, dip it in rosin, melt it together with the solder joint, and remove the wire while it is hot to remove the excess solder.

3. If the solder is on a large area, a special hot air gun or tin furnace can be used.

The third method:

Ultrasonic cleaning method, also soak the circuit board in acetone solution for about 10 minutes, then take out the PCB circuit board and immerse it in a container filled with anhydrous ethanol, and then put the container into the ultrasonic cleaning tank, and continue to clean for about 5 minutes. After completion, take it out and dry it.

What temperature does PCB solder melt?

The melting temperature of PCB solder depends on its composition. The melting temperatures of common solders such as tin-lead alloys (such as 60/40 and 63/37) are as follows:

60/40 solder: melting temperature is about 188°C (370°F).

63/37 solder: melting temperature is about 183°C (361°F).

Temperature requirements for different welding methods

1. Manual welding:

Temperature range: generally between 300°C and 350°C. This temperature range can make the solder wire melt quickly and ensure good wettability.

Time requirement: The welding time for small components is about 2 to 3 seconds, and large components may take 3 to 5 seconds.

2. Wave soldering:

Temperature range: usually between 245°C and 265°C. This temperature can ensure that the solder fully wets the pads and component pins on the PCB board under the push of the wave crest.

Time requirement: depends on the speed of the conveyor belt and the height of the wave crest, generally around 3 to 5 seconds.

3. Reflow soldering:

Temperature curve: divided into preheating zone (100°C to 150°C), insulation zone (150°C to 180°C), reflow zone (210°C to 240°C) and cooling zone.

Time requirement: The entire reflow soldering process is generally between 3 and 6 minutes.

What are the types of PCB solder joints?

The types of PCB solder joints mainly include the following:

Surface mount solder joints (SMT): This type of solder joint is suitable for surface mount components. The solder paste is melted by hot air furnace and other equipment to fix the components on the PCB surface.

Plug-in solder joints: Suitable for plug-in components. The component pins need to be soldered on the PCB by wave soldering or manual soldering.

Through-hole solder joints: Used for component soldering on double-sided or multi-layer PCB boards. The component pins need to be passed through the PCB board and fixed by wave soldering or other technologies.

What temperature is needed to Desolder a PCB?

The optimal temperature range for desoldering a PCB is 250℃-350℃. This temperature range is adjusted according to factors such as component packaging form, volume, and board thickness. Too high a temperature can easily damage the circuit board, while too low a temperature can make it impossible to remove the components or easily cause component damage.

Specific temperature setting suggestions

Preheating table desoldering temperature: When desoldering on the preheating table, the preset temperature is 400 degrees. In actual operation, the temperature under the circuit board is about 170-200 degrees Celsius, and the temperature above the circuit board is about 130-140 degrees Celsius, which can effectively desolder without overheating the PCB.

Large component welding temperature: When handling large-size components, the soldering iron temperature should be set at 350 to 370 degrees Celsius, and the maximum temperature should not exceed 390 degrees Celsius. The welding time should be kept within a few seconds to prevent damage to the pads of the PCB board.

What happens if you overheat a solder joint?

Impact on PCB performance

Degradation of performance: Electronic components on PCBs are sensitive to temperature, and overheating may cause degradation of component performance.

Shortened lifespan: High temperatures accelerate the aging process of electronic components, resulting in a shortened lifespan of components.

Thermal expansion and thermal stress: PCBs and components on them will experience thermal expansion when the temperature changes, and overheating may cause deformation, cracking, or solder joints to fall off.

What temperature will damage a PCB?

When melting solder, the maximum temperature a PCB can withstand is 280 degrees Celsius. At this temperature, the solder will melt but will not cause permanent damage to the PCB. However, if the temperature exceeds this range, it may cause damage to the PCB.

Temperature control of PCBs during soldering

Preheating temperature: Before soldering, the preheating temperature of the PCB is generally controlled between 80°C and 120°C to reduce the impact of thermal stress on components.

Soldering temperature: During soldering, the temperature of the solder needs to reach above its melting point to ensure that the solder can fully melt and wet the soldering surface.

Peak temperature: During the soldering process, some hot spots on the PCB may reach a peak temperature higher than the soldering temperature.

Does flux help melt solder?

Flux helps melt solder during the soldering process, mainly through the following aspects:

Reduce surface tension: Flux can reduce the surface tension of solder, allowing the molten solder to spread better on the soldering surface, and prevent the solder from forming a ball due to surface tension and not being able to fully contact the soldering part.

Remove oxides: Flux has reducing properties and can react with oxides to remove oxide film, so that the solder can be melted smoothly and form a reliable solder joint, and it is also conducive to heat transfer.

Promote heat transfer: Flux can make the soldering iron tip contact with the soldering surface more closely. As a heat conduction medium, it accelerates the solder to absorb heat, thereby melting faster, improving soldering efficiency and solder joint quality.

In short, melting a solid solder joint requires attention in many aspects. Traditional tools such as electric soldering irons and hot air guns should select parameters and operate accurately according to the characteristics of the solder joint and PCB; materials such as flux and tin-absorbing tape should be used skillfully as needed. As a professional PCB manufacturer, BTST Technology has rich experience in the field of PCB welding and is very skilled in the use of tools such as soldering irons and heat guns. Whether it is delicate motherboard solder joints or connection points of large industrial PCBs, they can accurately control and ensure impeccable solder joint quality.

What is pcb nickel champagne effect?

PCB nickel champagne effect refers to a champagne-like appearance and corresponding performance characteristics obtained by a specific nickel plating process on a printed circuit board (PCB).

Color: It presents a light golden or light amber color similar to champagne. This unique color makes it stand out among many PCB surface treatment effects and has high recognition and decorativeness.

Glossiness: It has a soft gloss, which is neither too bright mirror effect nor completely matte without gloss, but a moderate gloss between the two, giving people an elegant and textured visual experience.

Why choose champagne effect for pcb finishes?

There are several reasons for choosing champagne effect as PCB finish:

Aesthetic advantage: Champagne color is elegant and noble, with unique color and soft gloss, which makes it stand out visually, and can meet the differentiated and exquisite needs of high-end electronic products for appearance design. It is suitable for equipment that is sensitive to light reflection, avoids reflection interference, and enhances the overall visual effect.

Corrosion resistance: The champagne effect layer formed by nickel plating can effectively protect the copper foil from oxidation and corrosion. Whether it is in a harsh environment such as humidity, chemical exposure or outdoor, it can ensure the stability of PCB electrical performance and extend the service life.

What is pcb finish nickel or électrolytique with champagne effect?

Electrical performance: The surface of the nickel layer is flat and smooth, which can reduce contact resistance and ensure the integrity and accuracy of high-frequency and high-speed signal transmission; good solderability helps to improve welding efficiency and quality and ensure stable electrical connection.

Mechanical properties: With a certain hardness and wear resistance, it can withstand mechanical wear during production, assembly, transportation and use, such as PCBs with frequent plug-in and unplug interfaces, which can protect the circuits and plating and maintain the integrity and functionality of the PCB.

Market demand: Meet consumers’ pursuit of personalized electronic products and help products stand out from the competition; fit the high-quality and high-end image of high-end products and enhance the market competitiveness of products.

Why nickel champagne finish is gaining popularity?

The increasing popularity of nickel champagne finish is mainly due to its advantages in both beauty and performance, and the production process is also improving.

From the aesthetic point of view, it meets the needs of personalized and high-end appearance of consumer electronic products. Its unique champagne color is exquisite and elegant, which can enhance product recognition and high-end image.

In terms of performance, good corrosion resistance can ensure the reliability of PCB in complex environments; excellent electrical performance adapts to high-end technical requirements such as high-frequency and high-speed signal transmission, and mechanical performance can also cope with various mechanical forces in practical applications.

At the same time, the mature production process reduces costs, and has strong compatibility with existing PCB manufacturing processes, which is convenient for promotion and application.

How does nickel champagne effect improve pcb quality?

Nickel champagne effect improves PCB quality in three aspects:

Protective performance: First, it enhances corrosion resistance. The nickel layer can prevent the copper foil from being corroded by humid environment and chemicals, and prolong the service life of PCB. Second, it improves wear resistance. Its certain hardness can withstand mechanical friction and protect the circuit and plating.

Electrical performance: Reduce contact resistance, and the flat and smooth surface reduces signal transmission loss and reflection. At the same time, it improves solderability, combines well with solder, improves welding quality and efficiency, and ensures reliable electrical connection.

Appearance quality: The unique light golden or light amber color and soft luster enhance the recognition and beauty of PCB and increase the added value of high-end electronic products.

What impact does champagne effect have on pcb durability?

The champagne effect (usually achieved through nickel plating) has many positive effects on the durability of PCB:

1. Corrosion resistance

Isolation protection: The copper foil of PCB is susceptible to oxidation and corrosion. The champagne effect nickel layer is like a solid shield, isolating the copper foil from corrosive substances in the outside world, thereby greatly reducing the possibility of corrosion of the copper foil.

Long-term stability: This anti-corrosion property can ensure the stability of the electrical performance of the PCB during the long-term use of electronic products. The corrosion resistance brought by the champagne effect can significantly extend the service life of the PCB and reduce the failure and maintenance costs caused by corrosion.

2. Wear resistance

Mechanical protection: During the production, assembly, transportation and daily use of PCBs, there will be various possible mechanical frictions. The champagne effect nickel layer has a certain hardness and can withstand these frictions and scratches, protecting the lines and plating on the surface of the PCB from damage.

Maintain integrity: For frequently used electronic products, this wear resistance can ensure the integrity of the PCB, help avoid repeated friction and breakage, resulting in interruption of electrical connections, thereby improving the durability of the PCB.

Is champagne effect the best choice for premium pcbs?

Champagne effect is a good choice for premium PCBs, but not the absolute best choice.

From the advantages, it has appearance advantages, and the color and gloss make the PCB more refined and high-end. In terms of performance, it has good corrosion resistance and can stabilize electrical performance; the flat and smooth surface can reduce contact resistance, ensure signal quality, and has good solderability; in terms of mechanical properties, hardness and wear resistance can protect the circuit and plating.

However, it also has limitations. In terms of application scenarios, it may not be the most suitable when there are special requirements for extreme environments or electromagnetic shielding, and other targeted surface treatments are required.

PCB nickel plating can enhance the circuit board’s corrosion resistance, welding and multi-layer board connection performance, making it more durable and stable. Champagne effect electroplating adds aesthetic elements on the basis of the practicality of nickel plating, making it continuously advanced in performance and appearance, making the appearance of high-end electronic product circuit boards more refined.

How many layers does a circuit board have?

The number of layers of a circuit board can range from single to multiple layers. Common layers include single, double, four, six, eight, ten and twelve layers.

Single-layer boards are the most basic type of circuit boards. All components and circuits are on the same layer. The manufacturing cost is low but suitable for simple circuit designs.

Double-layer boards connect the upper and lower layers through vias and are suitable for medium-complex circuit designs.

Four-layer boards have two layers of internal copper foil, which have higher noise suppression and anti-interference capabilities and are often used in industrial control and communication fields.

Six-layer boards can optimize electromagnetic interference and are suitable for circuit designs that need to transmit signals at different speeds.

Eight-layer boards usually contain four wiring layers and four reference planes, which are suitable for high-end electronic devices and aerospace fields.

Common circuit board layers on the market include 1 layer, 2 layers, 4 layers, 6 layers, 8 layers, 10 layers and 12 layers. High-end PCB boards can even reach 32 layers or 50 layers, but these are usually used for special needs and high-performance equipment.

The number of layers of a circuit board has a significant impact on performance and cost. Multi-layer circuit boards have higher performance and reliability and can adapt to complex circuit design requirements, but the cost also increases with the number of layers.

What are the layers of a PCB layout?

PCB design includes multiple layers, each with its specific function:

Signal layer: including Top Layer, Bottom Layer and Mid Layer, used to install components and routing.

Mechanical layer: defines the appearance and mechanical size of the PCB board, without electrical properties, used to outline the shape, place text, etc.

Silkscreen layer: including Top Overlay and Bottom Overlay, used to define silkscreen characters, such as component names, symbols, etc.

Solder paste layer: including Top Paste and Bottom Paste, used for surface mount pads.

Solder mask layer: including Top Solder and Bottom Solder, to prevent short circuit during soldering.

Drilling layer: provides drilling information during manufacturing.

Prohibited wiring layer: defines wiring boundaries to prevent wiring from exceeding the range.

Multilayer: used for electrical connection of pads and vias.

Can a PCB have 3 layers?

PCB can have 3 layers. Three-layer PCB board does exist, which has a design with three copper layers, including two outer copper layers and one inner copper layer, and the inner copper layer is located between the two outer copper layers.

However, although three-layer PCB board is technically feasible, it is not common in practical applications. The main reasons include:

The process cost difference is not big: the process cost of three-layer board and four-layer board is not much different, because the four-layer board has an extra layer of copper foil and adhesive layer, but this difference is not enough to significantly increase the cost.

Process stability issues: In the PCB manufacturing process, four-layer boards are easier to control than three-layer boards, especially in terms of symmetry and warpage. Three-layer boards are prone to exceed this standard when they are large in size, affecting the reliability of SMT patches and the entire product.

Design habits: Designers usually tend to design boards with even layers. Even if odd-numbered boards can achieve functions, they will be designed as even layers to avoid potential problems.

How do you tell how many layers a PCB is?

The methods for judging the number of PCB layers mainly include the following:

1. Appearance judgment method:

Observation of copper foil layer: A single-layer PCB board has only one copper foil layer, one side of the double-sided component has copper foil, and the other side is printed circuit. A double-layer PCB board has two copper foil layers, located on both sides of the board. Four-layer and six-layer PCB boards have more copper foil layers, and the thickness of the board increases accordingly.

Drilling position and number: The drill holes in a multi-layer PCB board are channels connecting different layers. The drilling holes of double-layer PCBs are mostly located in the four corners, while four-layer or six-layer PCBs will have more drilling holes in the middle, and the drilling positions and quantities are more complicated.

Board thickness: Generally, the thickness of single-sided copper PCBs is 1.6mm, the thickness of double-sided copper PCBs is 1.2-1.6mm, and the thickness of four-layer PCBs is 1.6~2.0mm. If the thickness of the PCB board exceeds 2mm, then the PCB board has at least 4 layers.

2. File viewing method:

Use PCB design software such as AD, PADS, Eagle, etc. to open the target PCB file. Select the “Board Layer Structure” or “Layer Settings” option in the software to view the number of layers of the PCB. Design engineers usually name different layers, such as TOP, BOTTOM, L1, L2, etc., to indicate different copper foil layers and internal interlayers.

3. Visual method:

Edge observation: Observe the edge of the PCB. If you can see multiple layers of copper foil lines or stacked boards, then this may be a multi-layer PCB. Each copper foil line represents an independent PCB layer.

Solder mask color: Different layers of multi-layer PCBs are usually distinguished by solder mask layers of different colors. Check the surface of the PCB to see if there are areas of different colors, which may indicate differences between the layers.

Printed markings: PCB manufacturers usually mark the number of layers on the PCB. Check if there are printed marks or labels on the PCB, which may show the number of layers of the PCB.

4. Other methods:

Guide hole and blind hole light method: Determine the number of layers of the PCB by observing the guide holes and blind holes. The circuit connections of multi-layer PCBs all use guide hole technology. By observing the position and number of guide holes, the number of layers of the PCB can be preliminarily determined.

Accumulation method: Determine the number of layers of the PCB by comparing the routing and component positions of some public board PCB boards. This method requires a certain amount of experience and accumulation.

What is the spacing for PCB layers?

The spacing of PCB layers is usually between 0.1mm and 0.3mm. Specifically, the recommended range of interlayer distance is 0.1-0.3mm to ensure sufficient spacing between layers to avoid signal interference and short circuits.

In addition, other spacing requirements need to be considered in PCB design:

Spacing between conductors: The minimum line spacing must not be less than 4MIL, and the conventional spacing is 10MIL.

Pad aperture and pad width: If mechanical drilling is used, the pad aperture must not be less than 0.2mm; if laser drilling is used, it must not be less than 4mil.

Spacing between pads: Not less than 0.2mm.

Spacing between copper and board edge: The spacing between live copper and PCB board edge is not less than 0.3mm. Large-area copper plating usually has an indentation distance from the board edge, which is generally set at 20mil.

These specifications and standards are designed to ensure the electrical performance, mechanical strength and manufacturing feasibility of PCBs.

How is a PCB board structured?

The basic structure of a PCB board includes four main layers: top layer, bottom layer, inner layer and pad layer.

The top layer is the topmost layer of the PCB board, which is full of electronic components such as resistors, capacitors and chips, and is responsible for connection and wiring to ensure the accurate transmission of current and signals. The bottom layer is located at the bottom of the PCB board, and is mainly responsible for the laying of ground wires and the connection of auxiliary signal lines, providing stable support.

The inner layer is located between the top layer and the bottom layer, and is composed of multiple layers of copper foil stacked to form a complex circuit network for signal transmission and power supply, reducing signal interference.

The pad layer covers the surface of the pad to prevent the solder from splashing into other areas during the welding process, protecting the welding quality and stability of the circuit board.

What are the small holes in printed circuit boards called?

There are many types of small holes on printed circuit boards, mainly including Via, Blind Via, Buried Via and Through Via.

1. Via: Vias are one of the most common types of holes in printed circuit boards, which are used for electrical connections between layers or for fixing and positioning devices. Vias can be divided into three types: blind holes, buried holes and through holes.

Blind hole: a hole that connects the surface layer and the inner layer but does not penetrate the entire circuit board. It is suitable for high-density interconnection design and saves space.

Buried hole: a hole located between the inner layers but does not extend to the outer layer. It is used for inner layer signal interconnection to reduce signal interference.

Through hole: a hole that runs through the entire circuit board, used for internal interconnection or as a component positioning hole, easy to use and low cost.

2. Non-plated hole (NPTH): There is no copper on the inner wall of this hole. It is mainly used for positioning when assembling electronic components or connecting the joints of the panel.

3. Plated hole (PTH): including vias and pads. Vias are used for electrical connections between two layers, and pads are used to install plug-in electronic components.

4. Micro-Via: used for high-density PCB design to achieve more sophisticated wiring.

These different types of holes play different roles in printed circuit boards. Choosing the right hole type according to design requirements can improve the performance and reliability of the circuit board.

Each layer of the circuit board is indispensable. They work closely together to create a high-performance PCB circuit board. The substrate layer provides stable support, the signal layer transmits signals, the power layer provides power, the ground layer resists interference, the middle layer expands or isolates the circuit, and the silk screen layer assists in assembly.

How to read PCB for beginners?

The steps and methods for beginners to read PCB are as follows:

Observe the overall structure: First, carefully observe the overall structure of the circuit board, pay attention to the shape, size and color of the circuit board, as well as the markings and labels on it.

Identify electronic components: Try to identify various electronic components on the circuit board, such as resistors, capacitors, inductors, diodes, transistors, integrated circuits, etc.

Trace the circuit path: Trace the wire path on the circuit board and understand how the circuit is connected. Pay attention to the direction and connection of the wires, and try to trace the circuit path from one component to another and the connections between them.

Analyze the circuit board hierarchy: A complex circuit board usually consists of multiple layers. By observing the structure and hierarchy of the circuit board, you can infer the function and design of the circuit board.

Read the circuit board markings: There are usually markings, labels, printed text or icons on the circuit board to indicate components, connections or other important information.

Reference circuit diagrams and documents: Get the circuit diagram or related documents of the circuit board. The circuit diagram is a graphical representation of the circuit on the circuit board, which can provide more detailed information.

Learn basic circuit knowledge: In order to better understand the circuit board, it is recommended to learn some basic circuit knowledge. Understand the basic concepts such as current, voltage, resistance, capacitance in the circuit, as well as common circuit topologies and circuit analysis methods.

How do you analyse a PCB board?

Analysis of PCB boards can be carried out from the following aspects:

Check the ink quality: high-quality PCB boards usually use well-known brands of ink, and the printing and baking process is exquisite. Excellent ink has better gloss and thickness.

Observe the silk-screen text: the silk-screen text of high-quality PCB boards is clear and three-dimensional, and it is difficult to find the roughness of the edges of the handwriting even under a magnifying glass.

Check the smoothness of the V-cut: high-quality PCB boards are more delicate in V-cut processing, and the edges are smooth and free of burrs.

Evaluate the color of the board: the color of the board is uniform and there is no obvious color difference, indicating that the production process is stable and the quality is more guaranteed.

Check the packaging material: high-quality packaging materials can usually better protect the PCB board and prevent damage during transportation.

How do I identify parts of a PCB?

Identifying the various parts of a PCB (printed circuit board) requires understanding its basic structure and common components.

1. Basic structure

Substrate: FR4 (mostly green or brown) is common, as well as ceramic and aluminum substrates. It mainly plays a supporting and insulating role.

Copper foil circuit: observe the direction of the circuit, the thicker one carries large current, and the thinner one carries signals; multilayer boards should distinguish between the power layer and the signal layer.

2. Common components

Resistors: small cylinders with two pins, you can see the markings to identify the resistance value. Used for current limiting and voltage division.

Capacitors: various shapes, electrolytic capacitors have polarity, and ceramic capacitors have no polarity. Used for storing charge, filtering, etc.

Integrated circuits (ICs): black rectangular chips, multiple pins, and model identification, which are the core of realizing complex functions.

Transistors: bipolar and field effect types, three pins, used to amplify signals or as switches.

3. Others

Solder points and vias: Solder points connect components and circuits, and should be full and smooth; vias are used to connect different layers of circuits.

Test points and logos: Test points are used for electrical testing, and logos contain information such as component numbers and values to help understand circuits.

How do you identify PCB material?

To identify PCB (printed circuit board) materials, you can start from the following aspects:

1. Observe the appearance

Color: green or brown may be FR4; white and hard and brittle may be a ceramic substrate; silver with a metallic texture may be an aluminum substrate. Color sometimes also implies performance, such as black PCB may have a special design to resist electromagnetic interference.

Texture and thickness: touch it with your hand, FR4 is harder and tougher, ceramic is hard and brittle, and aluminum substrate has a metallic texture. The thickness of PCBs for different devices is different, simple devices are thinner, and complex devices are thicker.

2. Reference environment and scenario

High temperature environment: Ceramic or metal substrates may be used in high temperature environments, such as automobile engines and industrial furnace control circuits, and aluminum substrates are often used in electric vehicle motor controllers.

High humidity environment: High humidity environment requires materials to be moisture-proof. FR4 has a certain moisture-proof ability. Some PCBs that have been specially treated or coated with moisture-proof paint can better resist moisture.

High-frequency circuit application: The key to high-frequency circuits is dielectric constant and loss factor. For example, 5G communication equipment and radar systems may use special materials such as polytetrafluoroethylene boards, such as 5G base station antenna boards.

3. Check markings and documents

PCB surface markings: Check whether there are manufacturer markings, material types, certification marks, etc. on the surface, such as UL and RoHS certification, to obtain material clues.

Product documents and specifications: Find keywords such as “Board Material” in product manuals, technical documents or PCB specifications to determine the material.

How do you find the number of layers in a PCB?

To determine the number of layers of a circuit board (PCB), you can use the following methods to identify it:

1. Check the edge: Observe the edge of the PCB. If you can see multiple layers of copper foil or laminated boards, then this may be a multi-layer PCB. Each copper foil represents a separate PCB layer.

2. Number of holes: Multi-layer PCBs usually have more connection holes. Observe the solder holes on the surface and bottom of the PCB. If there are many holes arranged at intervals, it is likely a multi-layer PCB.

3. Solder mask color: Different layers of a multi-layer PCB are usually distinguished by solder mask of different colors. Check the surface of the PCB to see if there are areas of different colors, which may indicate differences between the layers.

4. Printed markings: PCB manufacturers usually mark the number of layers on the PCB. Check if there are printed markings or labels on the PCB, which may show the number of layers of the PCB.

5. Through the light source: If you have a light source, you can try to illuminate the PCB in a transparent way. Through the PCB, you may be able to see the layout of the internal layers, which can be used to infer the number of layers of the PCB.

What do the numbers on a PCB mean?

The numbers on the PCB board are usually used to identify the category, function number and serial number of electronic components on the circuit board. Specifically, the letter before the number indicates the category of the component, such as R for resistors, C for capacitors, D for diodes, etc.

The number after the number indicates the serial number or function number of the component on the circuit board. For example, R107 means that the serial number of the first resistor is 107, and C118 means that the serial number of the first capacitor is 11812.

In addition, the number can also represent the functional area or module of the circuit. For example, “1” may represent the motherboard circuit, “2” may represent the power supply circuit, etc., which are determined by the circuit designer.

In some cases, the combination of letters and numbers before the number can also represent specific functions or interfaces, such as SW for switch, LED for light-emitting diode, etc.

What does f stand for on a circuit board?

The “F” on the circuit board usually stands for fuse. In the circuit diagram, the single letter “F” usually represents lightning arrester, while the combination of letters has different meanings, such as “FU” for fuse and “FR” for thermal relay. This is a common representation method in electronic components.

To read the PCB board, you must first identify the substrate material, and then identify various electronic components, such as resistors, capacitors, integrated circuits, transistors, etc., understand their appearance characteristics and functional roles, so as to clarify the circuit connection and signal direction, and thus understand the circuit logic of the PCB board.

What is PCB Oxidation?

PCB oxidation refers to the phenomenon that the metal wire or pad surface on the PCB board reacts chemically with oxygen to form an oxide layer. This oxide layer is usually formed by oxides on copper materials, mainly including copper oxide (CuO) or cuprous oxide (Cu2O).

The reasons for PCB oxidation are varied, mainly including the following points:

Environmental factors: high temperature and humidity, high pH or pollutant-containing environments will accelerate the oxidation process of PCB boards.

Manufacturing and storage conditions: During the manufacturing and storage process, if the appropriate temperature and humidity are not maintained, or if the packaging is improper, causing the PCB to be exposed to moisture and corrosive gases, oxidation is likely to occur.

Chemical reaction: The metal part on the PCB reacts with moisture and chemicals in the surrounding environment, which is also an important cause of oxidation.

What are the effects of PCB oxidation?

PCB oxidation will have many effects on the performance and reliability of electronic products. First, oxidation will lead to a decrease in conductivity, making the circuit board prone to poor contact, cross-connection and short circuit problems, thereby affecting the use effect and performance of electronic products.

Second, oxidation may cause short circuits and fires, because the oxide layer will form a conductive rust layer, which may cause safety accidents once a short circuit occurs. In addition, oxidation will also reduce the stability and reliability of the circuit board, because the oxide layer reduces the protective layer on the surface of the circuit board, making it more susceptible to interference and fluctuations during long-term operation.

To prevent PCB oxidation, the following measures can be taken:

Control humidity and temperature: Store the PCB in a dry and ventilated environment, avoiding humidity and high temperature environments.

Use high-quality materials: Choose a circuit board with a copper-plated protective layer, which can effectively reduce the degree of oxidation.

Moisture-proof treatment: Use a moisture-proof treatment agent to treat the PCB with moisture to enhance its stability.

Daily maintenance: Regularly inspect and maintain the PCB to detect and deal with surface corrosion in a timely manner.

What are the types of PCB corrosion?

The types of PCB corrosion mainly include the following:

Atmospheric corrosion: This is the most common type of corrosion, usually caused by a chemical reaction between oxygen and moisture in the air and copper, resulting in the formation of copper oxide on the copper surface, reducing the conductivity of the circuit board, but the mechanical properties remain unchanged.

Local corrosion: This type of corrosion mainly affects a limited or small area, usually due to exposure to an environment with excessive humidity. Local corrosion includes filiform corrosion, crevice corrosion, and pitting corrosion.

Galvanic corrosion: occurs when two different metals (such as copper and another metal) are coupled in a corrosive electrolyte. Galvanic corrosion causes one metal to corrode faster than the other, usually when one end of the wire/cable is connected to the positive electrode and the other end is connected to the negative electrode.

Electrolytic corrosion: occurs when an ionized substance (electrolyte) comes into contact with two electrodes and current passes through the PCB. The electrolyte speeds up the rate of electrochemical reactions, causing the corrosion process to accelerate.

Fretting corrosion: Electrochemical corrosion occurs when two metal surfaces come into contact with each other and one of the metals is in a corrosive environment. Fretting corrosion usually occurs between two different metals, such as copper and steel or copper and aluminum, causing current to flow from copper to steel or aluminum, forming copper oxide.

Electrolytic dendrite formation: When there is ion contamination in the moisture, dendrites are formed on the copper traces, causing short circuits between traces. This deformation causes metal strips to grow from adjacent copper traces with different voltages, ultimately leading to a short circuit.

How to remove oxidation from PCB?

The methods for removing oxides from PCBs mainly include physical removal, chemical reduction, surface treatment, and environmental control.

1. Physical removal method:

Fine sandpaper wiping: For mild oxidation, fine sandpaper (non-iron sandpaper) can be used to gently wipe the oxide layer until the metallic luster is restored.

Diluted acid soaking: For more serious oxidation, you can soak the circuit board in diluted sulfuric acid, hydrochloric acid or white vinegar (acetic acid). After the oxide layer is corroded, clean it with alcohol.

2. Chemical reduction method:

Dimethyl borane alkaline solution: Use alkaline solution mainly composed of dimethyl borane to reduce the oxidized surface of the inner layer copper foil to enhance acid resistance and adhesion.

Sodium thiosulfate reduction solution: Use sodium thiosulfate reduction solution with a pH value of 3-3.5 to treat copper surface whiskers to form a coating layer of copper and cuprous oxide mixture to improve antioxidant capacity.

3. Surface treatment method:

Tin plating: Tin plating on the surface of the PCB to form a protective layer, which effectively prevents oxidation and has a low cost.

Gold plating: Gold plating can provide higher corrosion resistance, but the cost is higher.

Coating anti-oxidation coating: Use anti-oxidation coating to form a strong, corrosion-resistant protective layer to isolate the PCB surface from contact with air.

4. Environmental control method:

Control the ambient temperature and humidity: During the manufacturing, storage and transportation of PCBs, strictly control the temperature and humidity of the environment to avoid exposing the PCB to high temperature, high humidity or pollutant-containing environments.

Choose appropriate packaging materials: such as moisture-proof bags, foam boxes, etc. to ensure the integrity and quality of the PCB.

How to protect PCB from oxidation?

The methods to protect PCBs from oxidation include the following aspects:

Choose high-quality substrates: Select substrates with strong antioxidant properties, such as FR-4, high TG boards or aluminum substrates.

Control the ambient humidity: During the manufacturing and storage process, maintain a low humidity environment to reduce the risk of oxidation, because high humidity will accelerate the occurrence of oxidation reactions.

Use antioxidants: During the manufacturing or assembly of PCBs, antioxidants are applied to protect the circuit layer from oxidation, which can be implemented during the packaging and coating process.

Surface treatment process: The use of metal plating with strong antioxidant properties, such as gold plating, silver plating, tin plating, etc., can form a protective film on the surface of the metal circuit to prevent the occurrence of oxidation reactions.

Regular cleaning and maintenance: Use appropriate cleaning agents and regular cleaning methods to remove possible dirt and oxides and keep the PCB surface clean.

Reasonable storage and use environment: Avoid exposure to humid, high temperature, and highly polluted environments. It is best to use sealed packaging and place it in a dry and cool place. During use, pay attention to keeping the electronic equipment clean and prevent dust, moisture and other pollutants from entering the PCB.

What chemical is used to clean PCB?

Common chemicals for cleaning PCBs include water-based cleaning agents, hydrocarbon cleaning agents, and organic solvents.

Water-based cleaning agents use water as the cleaning medium and improve the cleaning effect by adding a small amount of surfactants, detergent aids, and corrosion inhibitors. This cleaning agent has a good dissolving effect on water-soluble dirt and is suitable for batch cleaning.

Hydrocarbon cleaning agents are suitable for manual scrubbing and local surface treatment wiping, but the air in the working environment must be unobstructed. Hydrocarbon cleaning agents have weak cleaning power and are flammable and explosive safety risks.

The organic solvent cleaning process is relatively simple, and only the same solvent needs to be used for cleaning and rinsing. Common organic solvents include trichloroethylene, carbon tetrachloride, etc. These solvents have a good dissolving effect on dirt, but attention should be paid to their volatility and safety.

Copper oxidation PCB involves many links in electronic manufacturing, from design to manufacturing, from use to maintenance, and negligence at each stage may lead to this problem, thereby damaging the performance of the PCB. As a professional PCB manufacturer, BEST Technology blocks oxidation factors from cleaning to packaging. Once an oxidation problem occurs, special cleaning agents are used for minor treatments, and professional processes such as micro-etching and electroplating are used for repair.

What is a COB flip chip?

COB flip chip refers to a packaging technology, the full name of which is Chip on Board (chip directly on the board), where “flip” refers to the packaging method of the chip. Flip chip COB technology packages LED chips directly on the PCB substrate, covers the silicon wafer with thermally conductive epoxy resin, and performs heat treatment, and finally establishes an electrical connection between the chip and the substrate through wire bonding.

Its characteristics and applications:

Simple structure: Full Flipped chip COB technology has a simpler structure, reduces gold or copper wire connections, and simplifies the manufacturing process.

High temperature resistance: This packaging method has better high temperature resistance and improves the stability and reliability of the product.

Good heat dissipation performance: Due to the reduction of connecting parts, the heat dissipation performance is improved, reducing the risk of dead lights and falling lights.

Widely used: Flip-chip COB technology is widely used in indoor small-pitch LED displays.

Comparison with other packaging technologies

Formal COB: The formal chip packaging method is earlier, the process is mature but the stability is poor, it is easily affected by moisture, and it affects the light output efficiency and heat dissipation efficiency.

Mixed COB: Mixing formal and flip chips, taking into account cost and performance, is suitable for the transition stage.

What is a flip chip used for?

The main functions of flip chips include:

Reduce signal delay and parasitic inductance: Flip chips are directly electrically connected to the pads of the package substrate through bumps, without the need for long bonding wires, so the signal path is shorter, which can effectively reduce signal delay and parasitic inductance.

Improve heat dissipation performance: Since the chip is directly connected to the substrate through bumps, heat is more easily transferred to the substrate, thereby improving heat dissipation performance.

High I/O pin density: Flip chips have higher I/O pin density, save area, and are suitable for high-performance and high-integration applications.

Improve package reliability: Flip chips use metal ball connections, which are compact and reliable, so they are increasingly used in the packaging industry.

Reduce package size: Using metal ball connections can reduce package size, improve electrical performance, and solve the problem that traditional packaging methods need to expand volume due to increased pin counts.

How does a flip-chip work?

The working principle of flip chip technology is to form bumps on the active side of the chip, and then align and weld the active side of the chip with the pads on the substrate facing down, thereby achieving direct electrical connection between the chip and the substrate.

This connection method not only reduces the package volume, but also improves signal transmission speed and reliability because the signal path is shorter and the parasitic inductance and capacitance effects caused by wire bonding are avoided.

What are the disadvantages of flip chip?

The main disadvantages of flip chips include thermal stress problems and reliability problems. Due to the mismatch in the coefficient of thermal expansion (CTE) between the chip and the substrate, when the temperature changes, the solder joints will be subjected to large thermal stress, resulting in fatigue damage and failure. In order to solve these problems, the bottom filling process is usually adopted, that is, polymer materials are injected into the gap between the chip and the substrate to improve the stress distribution of the solder joint, reduce the strain amplitude, and extend the thermal fatigue life of the solder joint.

In addition, flip chip technology faces some challenges in practical applications, including:

Material selection and process optimization: As chips become increasingly miniaturized and thinner, the requirements for the performance of filling materials and packaging reliability continue to increase. Material design, process optimization and other measures are effective ways to deal with potential challenges.

Wide-scale use of lead-free solder: The use of lead-free solder has put forward new requirements for the bottom filling process, which requires further research and improvement.

What are the different types of flip chips?

There are mainly the following types of flip chips:

FCBGA (flip chip ball grid array package):

Process characteristics: FCBGA uses small balls instead of pins for welding, has high I/O density, can effectively solve electromagnetic compatibility and electromagnetic interference problems, and reduce the packaging area. In addition, its good heat dissipation performance enables the chip to work stably at higher power.

Application areas: Widely used in high-end microprocessor and graphics processing chip packaging, such as high-end CPU and GPU, to ensure the stability and performance of the chip when running at high frequency.

FCCSP (Flip Chip Size Package):

Process characteristics: FCCSP can achieve chip size and package size close to each other, suitable for portable electronic devices with strict space requirements. Its compact packaging form minimizes the space occupied by the package while ensuring chip performance.

Application areas: Suitable for devices with limited internal space such as smartphones and tablets, which can reduce the package space while ensuring performance, leaving more space for other components.

Cob flip chip vs smd

SMD and COB each have their own advantages and disadvantages. Which technology to choose depends on the specific application scenario and requirements.

Application scenarios and comparison of advantages and disadvantages

1. Packaging method:

SMD: SMD (Surface Mount Device) technology is to package LED chips into lamp beads and then solder them on the PCB board. This technology is mature and low-cost, and is suitable for LED displays with regular spacing.

COB: COB (Chip-on-Board) technology is to directly package the LED chip on the PCB board, with a smaller dot pitch, which is suitable for micro-pitch LED display screens. Although the cost is higher, the process is simpler and the dot pitch can be smaller.

2. Dot pitch:

SMD: The dot pitch is larger, usually reaching P20 to P1.25, but it is difficult to reduce further.

COB: The dot pitch is smaller, suitable for products of P1.25 and below, such as P0.93, P0.78, etc.

3. Cost:

SMD: Due to mature technology and low cost, it is suitable for large-scale production and conventional applications.

COB: Due to the high cost of technology and materials, it is suitable for the high-end, high-demand micro-pitch LED display market.

4. Stability and life:

SMD: Due to the protrusion of the lamp beads, it is easy to cause the problem of falling or dead lights during installation and removal.

COB: Directly encapsulated on the PCB board, the probability of falling and dead lights is reduced, and the stability is better.

5. Optical performance and heat dissipation performance:

SMD: The light spot may be uneven due to the independent light emission of multiple LED chips, and the color rendering performance is affected by the design and materials. Heat dissipation performance is affected by the packaging design of a single LED chip.

COB: Multiple LED chips are closely arranged, the light spot is uniform, the color rendering performance is good, and the heat dissipation area is large and uniform.

What is the difference between flip chip and BGA?

The main difference between flip chip (Flip Chip) and BGA (Ball Grid Array) lies in the packaging method and application scenario.

1. Packaging method

Flip chip (Flip Chip): Flip chip is a packaging technology that directly solders the contact points of the chip to the substrate. The contact points of the chip (usually metal balls) are directly connected to the contacts on the substrate to form an electrical connection.

BGA (Ball Grid Array): BGA is a surface mounting technology in which the chip is connected to the pads on the substrate through its contact points (usually ball pins). BGA packaging usually uses a solder ball array, and the solder balls are fixed to the substrate by reflow soldering.

2. Application scenarios and advantages and disadvantages

Flip chip:

Advantages: Reduced resistance and parasitic capacitance, increased signal transmission speed; small package size, suitable for high-density integration; high reliability because of reduced connection points.

Disadvantages: Complex manufacturing process and high cost; requires precise alignment and welding technology.

Application scenarios: Suitable for high-performance computing and high-speed signal transmission occasions, such as CPU, GPU, etc.

BGA:

Advantages: Increased I/O pin count and increased packaging density; increased assembly yield; improved electrothermal performance.

Disadvantages: Occupies a large substrate area; relatively complex manufacturing process and high cost.

Application scenarios: Suitable for high pin count and high performance requirements, such as high-end processors, graphics processing units, etc.

What is the difference between flip chip and COB?

Flip chip and COB (Chip on Board) have significant differences in definition and application.

1. Definition and basic concepts

Flip chip is a chip packaging technology in which the I/O end (pin) of the chip faces downward and is connected to the substrate through solder bumps. This technology can improve packaging density and electrical performance, and is often used in high-performance computing and communication equipment.

COB (Chip on Board) is a technology that directly packages chips on circuit boards, aiming to solve the shortcomings of traditional LED displays, such as dead lights and falling lights, and improve stability and resolution. COB technology is divided into two types: positive and flip.

2. Packaging method:

Flip chip: The I/O end of the chip faces down and is connected to the substrate through solder bumps.

COB: The chip is directly packaged on the PCB board, which is divided into positive and flip. The positive chip faces up and is connected through welding wires; the flip chip faces down and is directly connected to the PCB without welding wires.

3. Application field:

Flip chip: Widely used in high-performance computing, communication equipment and other fields, it is favored for its high-density installation and good electrical performance.

COB: Mainly used in LED displays, especially in the field of high-end displays. COB technology can solve the problems of high thermal resistance, high cost and smaller spacing in traditional SMD packaging.

4. Advantages and Disadvantages:

Flip chip: Advantages include high packaging density and good electrical performance; Disadvantages are complex production process and high cost.

COB: Formal COB has lower cost, but there are wire bonding problems that affect stability and heat dissipation efficiency; Flip chip COB has high process requirements, better stability, strong thermal conductivity, but higher cost.

Flip chip COB LED integrates the advantages of COB packaging and flip chip technology, achieving precise light color control and uniform light distribution in optical performance, excellent electrical performance, efficient heat dissipation, and strong stability. As a professional PCB manufacturer, BEST Technology is committed to creating high-quality PCBs for flip chip COB LEDs and providing stable and reliable solutions.

What is high-frequency vs low frequency?

Definition of high frequency and low frequency

Low-frequency circuit: mainly used to process signals with lower frequencies, usually in the range of tens of hertz to several thousand hertz. Common applications include audio circuits, etc.

Is rf assembly high frequency or low frequency？

High-frequency circuit: used to process signals with higher frequencies, usually in the range of several thousand hertz to several hundred megahertz. High-frequency circuits are very important in applications such as communications, radars, and satellites.

Differences between high frequency and low frequency in PCB design

Power supply design: In high-frequency PCB design, the power supply design is usually one layer, which can minimize signal loops and thus reduce noise.

Signal integrity: High-frequency PCB design requires special attention to signal integrity, including signal transmission delay, reflection and crosstalk.

Is RF high or low-frequency?

RF (radio frequency) is high frequency. It refers to the electromagnetic frequency that can be radiated into space. Its frequency range is from 300kHz to 30GHz, so it belongs to the high-frequency category. Alternating current that changes less than 1000 times per second is called low-frequency current, while alternating current that changes more than 10,000 times per second is called high-frequency current. RF is such a high-frequency current.

Basic characteristics of RF

Frequency and wavelength: The frequency of RF is between 300kHz and 30GHz. The wavelength is inversely proportional to the frequency, that is, the shorter the wavelength, the higher the frequency. The frequency of RF is higher, so the wavelength is shorter.

Amplitude and phase: The amplitude signal of RF represents the measure of the change of electric field oscillation, and the phase represents the position of a single time point in the wave cycle.

Modulation: In order to achieve communication, the RF signal needs to be modulated. Modulation includes analog modulation and digital modulation, which uses frequency, phase and amplitude to transmit data.

What is the highest RF frequency?

The highest frequency of RF (radio frequency) is 300GHz. Within this frequency range, RF is widely used in fields such as radar and wireless communication.

The basic characteristics of RF include frequency, wavelength, amplitude and phase. Frequency refers to the frequency of electromagnetic field oscillation, measured in Hertz (Hz). Wavelength is inversely proportional to frequency, that is, wavelength is equal to the speed of light divided by frequency. The amplitude of RF refers to the measure of the change in electric field oscillation, while the phase indicates the position of a single time point in the wave cycle.

How do you know if the frequency is high or low?

In PCB design, judging whether the frequency is high or low is mainly based on the frequency range of the signal.

Definition of frequency range

High frequency: usually refers to signals with frequencies between 3MHz and 300GHz. In PCB design, signals greater than 50MHz are generally considered high-speed signals, and signals with rising/falling edges less than 50ps are also considered high-speed signals.

Low frequency: usually refers to signals with frequencies between hundreds of Hz and hundreds of kHz.

Specific applications in PCB design

High-frequency PCB design: In high-frequency PCB design, the power supply design is usually one layer, which can minimize the signal loop and thus reduce noise. In addition, high-frequency signals are susceptible to interference, so special attention should be paid to noise issues in the design.

Low-frequency PCB design: Low-frequency circuit design usually does not need to consider signal loops and noise issues too much, but it is still necessary to pay attention to signal integrity and electromagnetic compatibility.

Measurement methods and tools

Oscilloscope: Oscilloscope is a common tool for measuring signal frequency. The frequency range of the signal can be judged by observing the waveform.

Spectrum analyzer: Spectrum analyzer can measure the frequency component of the signal more accurately and is suitable for occasions requiring high-precision measurement.

What is high-frequency PCB?

High-frequency PCB is a special type of circuit board designed specifically for processing high-frequency signals, and its operating frequency can reach hundreds of megahertz (MHz) to tens of gigahertz (GHz). High-frequency PCB occupies a key position in high-frequency application scenarios such as wireless communication, 5G, Wi-Fi, radar, and high-speed data transmission.

High-frequency PCB has a low dielectric constant, which leads to less signal loss during transmission. It is suitable for efficient transmission. It uses special materials to ensure a small dielectric constant, thereby ensuring transmission speed and meeting the needs of high-speed data transmission. In the field of precision metal material heating treatment, high-frequency PCB can achieve heating of components of different depths to meet various heating needs.

What is RF PCB?

RF PCB is a printed circuit board specially used for RF circuit design and manufacturing. It has unique characteristics and requirements in high-frequency signal transmission, impedance control, shielding and isolation, miniaturization and high-density wiring.

It is mainly used to process high-frequency signals, usually above 100MHz, and is widely used in wireless communications, radar systems and other application scenarios that need to receive and send wireless signals.

What is microwave PCB?

Microwave PCB (microwave printed circuit board) is a circuit board specially designed to process microwave frequency band signals. Microwave PCB usually works in microwave bands with a frequency greater than 2GHz. It uses a specific microwave substrate copper clad board and is produced through a special manufacturing process to meet the low-loss and low-delay transmission requirements of high-frequency signals. Its characteristics include:

Low loss: Microwave PCB uses materials with low dielectric constants to reduce energy loss during signal transmission.

High stability: stable performance in high temperature and high humidity environments, ensuring reliable signal transmission.

Low latency: suitable for high-speed data transmission needs, ensuring signal accuracy and stability.

The frequency range of RF components covers low frequency and high frequency, with unique characteristics and a wide range of application scenarios. As the key foundation for supporting the operation of high-frequency RF components, the characteristics and design of high-frequency PCB directly affect the performance of RF components. From signal integrity to system stability to miniaturization integration capabilities, they are inseparable from the careful design and optimization of high-frequency PCB.

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