Archive for the ‘FR4 PCB’ Category

Monday, October 7th, 2024

Can you use AC in PCB?AC can be used in PCB boards. PCB boards are designed to support the use of AC, and the functions of AC can be realized through proper circuit design and component selection.

Can you use AC in PCB?

The use of AC in PCB boards requires consideration of the characteristics of AC. The current magnitude and direction of AC change continuously over time, which requires the components and layout on the PCB to adapt to such changes. For example, components such as inductors and capacitors play an important role in AC circuits, and their parameters and layout need to be carefully designed to achieve the desired circuit performance.

Specifically, AC circuit design on PCB boards includes selecting appropriate components, layout, and routing. For example, using test instruments such as LCR digital bridges can measure the parameters of components in AC circuits to ensure that the performance of the circuit meets the design requirements. In addition, reasonable ground routing and layout can reduce signal interference and ensure the stable transmission of AC.

Is the circuit board DC or AC?

Circuit boards can transmit both direct current and alternating current. In modern electronic products, we use alternating current for power supply, so most circuit boards are also designed to transmit alternating current. Of course, in some special application scenarios, some circuit boards also need to transmit direct current. Whether transmitting direct current or alternating current, the circuit board needs to meet the requirements of the transmitted current.

What is the PCB in AC?

The alternating current in PCB refers to the current whose direction changes periodically, that is, alternating current (AC). The application of alternating current in PCB is mainly reflected in power conversion and power transmission. PCB power supply usually converts AC into stable direct current (DC) output to meet the demand of electronic equipment for stable power supply. PCB power supply converts AC into the required DC through components such as transformers, rectifiers, filters and voltage regulators, and provides stable power output.

How to calculate the bandwidth of AC in PCB traces

The calculation of AC PCB trace width can be performed by the following formula: W = (I / J) * K, where W represents the trace width, I represents the current, J represents the current density, and K represents a coefficient related to materials and processes. ‌This formula shows that the trace width is related to the current, current density, and material properties‌.

AC in PCB Design Guide

Current Carrying Capacity: The width of a trace directly affects its ability to handle current without exceeding temperature limits or causing excessive voltage drop.
‌Impedance Control: In high-frequency applications, maintaining controlled impedance is critical for signal integrity. Trace width, trace spacing, and dielectric properties affect the characteristic impedance of the transmission line.
‌Heat Dissipation: Adequate trace width helps to effectively dissipate heat, preventing thermal issues such as trace delamination or solder joint failure.
‌Voltage Drop: Narrower traces exhibit higher resistance, resulting in increased voltage drop along the length of the trace. By adjusting the trace width, the voltage drop can be minimized.
‌Manufacturability: The PCB manufacturing process imposes restrictions on the minimum trace width, and designers must balance performance requirements with manufacturability constraints. ‌2.
‌Minimum Trace Width: Most manufacturers have a minimum trace width of 6mil or 0.152mm, and typically use traces of 0.254-0.3mm.
‌Material and Process Deviations: Due to the possibility of material and process deviations in the actual PCB manufacturing process, a certain margin needs to be left when calculating the line width.
‌Signal Integrity Simulation‌: Perform signal integrity simulations to ensure impedance is controlled and signal degradation due to reflections, crosstalk, or transmission line effects is minimized‌

AC in PCB wiring

The current trend is that the power supply voltage is getting lower and lower (especially for highly integrated digital devices), the space occupied is getting smaller and smaller, the weight is getting lighter and lighter, and the efficiency is getting higher and higher, which requires the precise design of the power supply circuit starting from the PCB.

Safety distance includes electrical clearance (spatial distance), creepage distance (surface distance) and insulation penetration distance…

Electrical clearance: the shortest distance between two adjacent conductors or one conductor and the adjacent motor housing surface measured along the air.
Creepage distance: the shortest distance between two adjacent conductors or one conductor and the adjacent motor housing surface measured along the insulation surface.

Determination of electrical clearance:

The distance can be determined according to the measured working voltage and insulation level

The electrical clearance size requirements of the primary side line are shown in Table 3 and Table 4

The electrical clearance size requirements of the secondary side line are shown in Table 5

But usually: Primary side AC part: L-N ≥ 2.5mm before the fuse, L.N PE (earth) ≥ 2.5mm, no requirements are made after the fuse is installed, but a certain distance should be maintained as much as possible to avoid short circuit damage to the power supply.

Primary side AC to DC part ≥2.0mm

Primary side DC ground to earth ≥2.5mm (primary side floating ground to earth)

Primary side to secondary side ≥4.0mm, components connected between primary and secondary sides

Secondary side gap ≥0.5mm

Secondary side ground to earth ≥1.0mm

Note: Before determining whether it meets the requirements, the internal parts should be applied with a force of 10N and the outer shell with a force of 30N to reduce the distance so that the space distance still meets the requirements under the worst case.

Determination of creepage distance:

Based on the working voltage and insulation level, the creepage distance can be determined by looking up Table 6

But usually: (1), primary side AC part: L-N ≥2.5mm before the fuse, L.N earth ≥2.5mm, no requirement is required after the fuse, but try to keep a certain distance to avoid short circuit damage to the power supply.

(2) Primary side AC to DC part ≥2.0mm

(3) Primary side DC ground to ground ≥4.0mm such as primary side ground to earth

(4) Primary side to secondary side ≥6.4mm, such as optocoupler, Y capacitor and other components, the foot spacing ≤6.4mm needs to be slotted.

(5) Secondary side parts ≥0.5mm

(6) Secondary side ground to earth ≥2.0mm or more

(7) Transformer two-stage ≥8.0mm or more

Insulation penetration distance:

It should meet the following requirements according to the working voltage and insulation application:

For working voltage not exceeding 50V (71V AC peak or DC value), there is no thickness requirement;
The minimum thickness of additional insulation should be 0.4mm;
When the reinforced insulation is not subjected to any mechanical stress that may cause deformation or performance degradation of the insulating material at normal temperature, the minimum thickness of the reinforced insulation should be 0.4mm. If the insulation provided is used in the protective casing of the equipment and will not be bumped or scratched during maintenance by the operator, and any of the following conditions apply, the above requirements do not apply to thin insulating materials regardless of their thickness;
For additional insulation, at least two layers of material are used, each of which can pass the dielectric strength test for additional insulation; or:
For additional insulation composed of three layers of material, any combination of two layers of material can pass the dielectric strength test for additional insulation; or:
For reinforced insulation, at least two layers of material are used, each of which can pass the dielectric strength test for reinforced insulation; or:
For reinforced insulation composed of three layers of insulating material, any combination of two layers of material can pass the dielectric strength test for reinforced insulation.

Points to note about wiring process:

Flat components such as capacitors must be flat without glue.

If the distance between two conductors can be shortened by applying a force of 10N, which is less than the safety distance requirement, glue can be used to fix the part to ensure its electrical clearance.

When laying PVC film inside some shell equipment, attention should be paid to ensuring the safety distance (pay attention to the processing technology).

When fixing the parts with glue, be careful not to leave foreign matter such as glue wire on the PCB board.

When processing parts, insulation damage should not be caused.

Requirements for flame-proof materials:

Heat shrink tubing V-1 or VTM-2 or above; PVC tubing V-1 or VTM-2 or above

Teflon tubing V-1 or VTM-2 or above; plastic materials such as silicone sheets, insulating tape V-1 or VTM-2 or above

PCB board 94V-1 or above

Regarding insulation level

(1) Working insulation: insulation required for normal operation of equipment

(2) Basic insulation: insulation that provides basic protection against electric shock

(3) Supplementary insulation: independent insulation applied in addition to basic insulation to protect against electric shock in case of basic insulation failure

(4) Double insulation: insulation consisting of basic insulation plus supplementary insulation

(5) Reinforced insulation: a single insulation structure that provides the same level of protection against electric shock as double insulation under the conditions specified in this standard

The applicable situations of various insulation are as follows:

A. Operational insulation

a. Between parts with different voltages

b. Between ELV circuits (or SELV circuits) and grounded conductive parts.

B. Basic insulation

a. Between parts with dangerous voltages and grounded conductive parts;

b. Between SELV circuits with dangerous voltages and grounding-dependent;

c. Between the primary power conductor and the grounded shield or the core of the main power transformer;

d. As part of double insulation.

C. Supplementary insulation.

a. Generally speaking, between accessible conductive parts and parts that may carry dangerous voltages after basic insulation is damaged, such as:

Ⅰ. Between the surface of handles, knobs, handles or similar objects and their ungrounded axis.

Ⅱ. Between the metal casing of the second category equipment and the outer skin of the power cord passing through this casing.

Ⅲ. Between the ELV circuit and the ungrounded metal casing.

b. As part of double insulation

D. Double insulation

Double insulation Reinforced insulation

Generally speaking, between the primary circuit and

a. between accessible ungrounded conductive parts, or

b. between floating SELV circuits, or

c. between TNV circuits

Double insulation = basic insulation + supplementary insulation

Note: ELV circuit: extra low voltage circuit

Under normal working conditions, the AC peak value between conductors or between any conductors does not exceed 42.4V or the DC value does not exceed 60V.

SELV circuit: safety extra low voltage circuit.

A properly designed and protected secondary circuit so that under normal conditions or single fault conditions, the voltage between any two accessible parts, and between any accessible parts and the protective grounding terminal of the equipment (only for Class I equipment) will not exceed the safety value.

TNV: communication network voltage circuit

Under normal working conditions, the circuit carrying communication signals

Difference between direct current and alternating current

‌The main differences between DC and AC include direction and polarity, voltage change, current loss, transformer use, and application scenarios.

‌Direction and polarity:

DC: The direction of the current remains unchanged, and the electrons flow from the positive electrode to the negative electrode.

AC: The direction of the current changes periodically, and the electrons flow back and forth between the positive and negative electrodes. ‌
‌Voltage change:

DC: The voltage remains constant and does not change over time.

AC: The voltage magnitude and direction change periodically over time. For example, the mains is an AC with a sine waveform.

‌Current loss:

DC: Fault losses are relatively small.

AC: There is capacitive current, and there is capacitive current in the transmission line. ‌
‌Transformer use:

DC: The voltage cannot be changed using a transformer.

AC: The voltage can be changed using a transformer, which is suitable for boosting voltage to reduce losses during long-distance transportation.

‌Application scenarios:

DC: Suitable for low-voltage electrical appliances and occasions that require stable current.
‌Alternating current‌: Suitable for household and industrial use, using transformers to change voltage to suit different needs.‌

FAQ About AC in PCB

FAQ About AC in PCB

Q: The relationship between PCB current and line width. Is the current divided into AC or DC?
A: The relationship between PCB current and line width is not divided into AC or DC. In terms of the nature of the lines on the PCB, the lines are all made of copper materials, and both AC and DC can pass. However, how much current can pass depends on the cross-sectional area of the line on your PCB. That is, line width x thickness of the copper foil of the line. If the cross-sectional area of the line is small, only small current signals can pass, and if the cross-sectional area is large, large current signals can pass. This signal can be AC or DC.
Not just 1mm, any line width can pass DC or AC signals.

Q: There is a packaged device, and there are 2 pins in the device that need to be connected to the live wire and neutral wire of 220V AC respectively. So how to deal with this power line when drawing the PCB? Are there any size requirements for pads, wires, etc.? Are there any protective measures required? Is it not possible to directly add pads to connect to the pin pads of the device?
A: It is best to mill a groove between the neutral wire and the live wire, and choose the thickness of the wire according to the current. When the current is large, you can put a tin layer on the wire, and the pad should be slightly larger.

Q: The grounding of the PCB circuit board design is also the negative pole. What is the difference between the grounding here and the AC grounding?

A: The concept of the circuit board ground is somewhat different from that of the power supply system. The power supply system refers to the earth, that is, the terminal with the same potential as the earth.

The ground in the circuit board is just a common terminal of a potential, which can be positive or negative, depending on the needs of the designer. It’s just that everyone is used to and assumes that the negative pole is the common terminal, that is, the ground. The circuit board ground is not necessarily connected to the earth.

But it must be connected to the earth when EMI filtering is required.

Q: Should all GNDs on the PCB board be connected? There is a terminal (screw type) with two terminals marked as V1+ and V1- on the PCB schematic. Should V1- be connected to the power supply ground? But I used a multimeter to measure why V3- is not connected to other GNDs on the board?

So how do you connect the ground and 10V of the power supply to the V1+ and V1- ends of the terminal?

A: Not all ground wires on the board are connected together. The ground wires are divided into analog ground and digital ground, just like the ground wire in DC and the ground wire in AC cannot be connected together. That is to say, there is a ground wire that is specifically used for power supply, and there is a ground wire that is specifically used for signals (shielding signal interference). These two ground wires cannot be connected together.
In addition, you mentioned V1+ and V1-, and V1- should not be considered a ground wire. Generally, the signal represented by this method is a differential signal, that is, the V1 signal is differentially divided into V1+ and V1-, which can reduce external interference and transmit farther. Finally, V1+ and V1- are integrated into the V1 signal.
You need to figure out whether the V1+ and V1- of the terminal are used for power supply. If they are used for power supply, then V1+ is the positive pole. V1- is the negative pole. Since you didn’t show us the picture, you can’t just connect it randomly. The circuit board needs to connect not only power but also signals, depending on how your board is made.

What are the holes in a PCB called?

What are the holes on PCB called? What are the holes in the circuit? The holes on PCB can be roughly divided into 3 types, screw holes (mounting holes), conductive holes (vias), and plug-in holes.

Screw holes: Screw holes are used for fixing.

Conductive holes: Conductive holes (also called vias) are used for conducting electricity just like circuits.

Plug-in holes: Plug-in holes are of course used to plug in various parts, such as diodes, transistors, capacitors, inductors, etc.

What is a through hole

What is a through hole? Through holes, also known as perforations, are holes in a PCB that go all the way through the board. Their main purpose is to provide electrical connections for component pins while allowing soldering on both sides of the board.

1.A via is a special through hole whose wall is metallized to achieve electrical connection between different layers on a circuit board. This type of hole is usually used to connect component pins to internal circuits, or to achieve electrical connection between different layers in a multi-layer PCB. Vias need to be metallized during the PCB manufacturing process, which usually includes drilling, desmearing, chemical copper plating, and electroplating.

2.Non-conducting holes are the opposite of through holes. Their hole walls are not metallized, so they do not have electrical connection functions. These holes are mainly used for mechanical fixation, heat dissipation or identification purposes. Non-conducting holes are relatively simple in the PCB manufacturing process, and only drilling operations are required.

What is a blind via?

A blind via is a hole that extends from one side of a PCB to a certain internal layer without penetrating the entire board. The emergence of blind vias is mainly due to the development of HDI technology, which provides circuit designers with greater flexibility and more compact layout. Blind vias are usually used to connect surface mount components (SMD) to internal circuit layers, or to connect circuits between different internal layers.

What are buried vias?

Buried vias are holes located inside the PCB that do not penetrate any side of the board. They are completely hidden inside the board and are used to connect circuits between different internal layers. Buried vias are especially useful in HDI boards because they can reduce the overall thickness of the board while maintaining electrical connections between internal circuits.

What is a microvia?

Microvia refers to a hole with a smaller diameter, usually at the micron level. The emergence of microvia technology enables PCB designers to achieve more complex circuit layouts in a smaller space. Microvias are often used in high-density, high-reliability electronic devices such as mobile phones and tablets. The manufacture of microvias requires high-precision drilling equipment and technology to ensure the accuracy and reliability of the holes.

What are Mounting holes？

What are Mounting holes?Locking holes are auxiliary holes used in the PCB manufacturing and assembly process to accurately locate and fix the circuit board. They are usually located at the edge or specific position of the PCB to ensure that the circuit board can be accurately aligned and fixed during manufacturing, testing and assembly. The locating holes do not participate in the connection of the circuit, but are essential to ensure the quality and performance of the circuit board.

What are Mounting holes？

What are thermal vias?

Thermal vias are holes designed specifically for heat dissipation, usually large and can run through the entire PCB or multiple layers. Their role is to reduce heat buildup on the circuit board by increasing surface area and air flow, thereby improving the stability and reliability of the device. Thermal vias are particularly important in high-performance, high-power electronic devices.

FAQ About board electronics with holes

How to solve the contradiction between manual routing and automatic routing of high-speed signals?

Most of the current powerful routing software’s automatic routing tools have set constraints to control the routing method and the number of vias. The routing engine capabilities and constraint setting items of various EDA companies are sometimes very different. For example, whether there are enough constraints to control the winding method of the serpentine, whether the routing spacing of the differential pair can be controlled, etc. This will affect whether the routing method generated by automatic routing can meet the designer’s ideas. In addition, the difficulty of manually adjusting the routing is also related to the capabilities of the routing engine. For example, the pushing ability of the routing, the pushing ability of the via, and even the pushing ability of the routing pair copper. Therefore, choosing a routing tool with strong routing engine capabilities is the solution.

Will adding test points affect the quality of high-speed signals?

As for whether it will affect the signal quality, it depends on the method of adding test points and how fast the signal is. Basically, the additional test points (not using the existing vias (via or DIP pins) as test points) may be added to the line or a small section of wire may be pulled out from the line. The former is equivalent to adding a very small capacitor to the line, while the latter is an additional branch. Both of these situations will have some impact on high-speed signals, and the extent of the impact is related to the frequency speed of the signal and the edge rate of the signal. The magnitude of the impact can be learned through simulation. In principle, the smaller the test point, the better (of course, it must meet the requirements of the test equipment) and the shorter the branch, the better.

Can you introduce some foreign technical books and data on high-speed PCB design?

Now the application of high-speed digital circuits includes communication networks and calculators and other related fields. In the communication network, the operating frequency of PCB boards has reached around GHz, and the number of layers is as many as 40 layers as far as I know. Due to the advancement of chips, the operating frequency of calculator-related applications, whether it is a general PC or server, has reached 400MHz (such as Rambus) or above. In response to the demand for high-speed and high-density routing, the demand for blind/buried vias, mircrovias and build-up process technology is gradually increasing. These design requirements can be mass-produced by manufacturers.

Does the design of rigid-flexible boards require special design software and specifications? Where can I undertake the processing of such circuit boards in China?

Can I use general PCB design software to design flexible printed circuits (Flexible Printed Circuit). The Gerber format is also used for FPC manufacturers to produce. Since the manufacturing process is different from that of general PCBs, each manufacturer will have its own restrictions on line width, line spacing, and aperture (via) based on their manufacturing capabilities. In addition, some copper foil can be laid at the turning point of the flexible circuit board for reinforcement. As for the manufacturer, you can search for “FPC” as a keyword on the Internet and you should be able to find it.

If the size of the circuit board is fixed, if the design needs to accommodate more functions, it is often necessary to increase the routing density of the PCB, but this may lead to increased mutual interference between the routings, and at the same time, the impedance cannot be reduced if the routing is too thin. Please introduce the techniques in the design of high-speed (>100MHz) high-density PCBs?

When designing high-speed and high-density PCBs, crosstalk interference does need to be paid special attention to because it has a great impact on timing and signal integrity. Here are a few things to note:

Control the continuity and matching of the characteristic impedance of the trace.

The size of the trace spacing. The spacing commonly seen is twice the line width. Through simulation, you can know the impact of trace spacing on timing and signal integrity and find the tolerable spacing. The results of different chip signals may be different.

Choose an appropriate termination method.

Avoid the same routing direction of the upper and lower adjacent layers, or even have traces overlapped up and down, because this kind of crosstalk is greater than the case of adjacent traces on the same layer.

Use blind/buried vias to increase the trace area. However, the production cost of the PCB board will increase. It is indeed difficult to achieve complete parallelism and equal length in actual implementation, but it should be done as much as possible.

In addition, differential termination and common mode termination can be reserved to mitigate the impact on timing and signal integrity.

The RF part, IF part, and even the low-frequency circuit part of the outdoor unit are often deployed on the same PCB. What are the material requirements for such PCB? How to prevent interference between RF, IF, and even low-frequency circuits?

Hybrid circuit design is a big problem. It is difficult to have a perfect solution.

Generally, RF circuits are laid out and wired as an independent single board in the system, and there will even be a special shielding cavity. Moreover, RF circuits are generally single-sided or double-sided boards, and the circuits are relatively simple. All of these are to reduce the impact on the distributed parameters of RF circuits and improve the consistency of RF systems. Compared with general FR4 materials, RF circuit boards tend to use high-Q substrates. The dielectric constant of this material is relatively small, the distributed capacitance of the transmission line is small, the impedance is high, and the signal transmission delay is small. In hybrid circuit design, although RF and digital circuits are made on the same PCB, they are generally divided into RF circuit area and digital circuit area, and laid out and wired separately. Shielding is used between ground vias and shielding boxes.

‌What is a high frequency pcb communication circuits

High frequency pcb communication circuits to a circuit board with an operating frequency in the high frequency band (usually greater than 300MHz or a wavelength less than 1 meter), which is mainly used to transmit high-frequency signals and data. ‌ This type of circuit board is widely used in radio frequency (RF) and microwave fields, such as communication equipment, radar systems, satellite communications, and high-speed data transmission systems.

What is a high frequency pcb communication circuits

The characteristics of high-frequency circuits include challenges such as transmission line effects, signal integrity issues, and electromagnetic interference (EMI). Due to the short wavelength of high-frequency signals, traditional low-frequency circuit design methods are no longer applicable, and special design and processing methods are required to ensure the performance and stability of the circuit.

High-frequency circuit boards are produced on microwave substrate copper-clad boards using ordinary rigid circuit board manufacturing methods or special processing methods. They need to have high-quality electrical properties and chemical stability to meet the requirements of high-frequency signal transmission.

Definition of high frequency pcb communication circuits

High-frequency circuit board, as a special circuit board, is mainly suitable for occasions with high electromagnetic frequency, especially in the fields of high frequency (frequency greater than 300MHz or wavelength less than 1 meter) and microwave (frequency greater than 3GHz or wavelength less than 0.1 meter).

It is a circuit board made on a microwave substrate copper-clad board by adopting some manufacturing processes or special processing methods of ordinary rigid circuit boards. Generally speaking, when the frequency of the circuit board reaches above 1GHz, it can be defined as a high-frequency board.

With the rapid development of science and technology, more and more equipment designs have begun to involve microwave frequency bands (>1GHz) and even expanded to the millimeter wave field (such as 77GHz), especially in popular applications such as 77GHz millimeter wave antennas on vehicles.

This trend not only promotes the continuous increase in frequency, but also puts higher requirements on the substrate of the circuit board.

For example, the substrate material needs to have excellent electrical properties, stable chemical properties, and as the frequency of the power signal increases, the loss on the substrate must be extremely small. Therefore, the importance of high-frequency boards is becoming more and more prominent.

Advantages of high frequency pcb communication circuits

The main advantages of high frequency pcb communication circuits include efficient data transmission, strong anti-interference ability, high-frequency bandwidth and high reliability. ‌

high frequency pcb communication circuits can achieve efficient data transmission. High-frequency signals have a short cycle and can transmit more information per unit time, so they have the advantage of large-capacity transmission. In addition, high-frequency signals can achieve fast signal processing and are suitable for application scenarios that require high-speed data transmission and high real-time requirements.
high frequency pcb communication circuits have strong anti-interference capabilities. Due to the short wavelength of high-frequency signals, they can better avoid external interference and attenuation and have strong anti-interference capabilities. This makes high-frequency signals have advantages in fields such as wireless communications and radar systems, and can achieve stable signal transmission and reception. ‌
high frequency pcb communication circuits also have the advantage of high-frequency bandwidth. High-frequency signals correspond to a larger frequency range and can provide higher bandwidth than low-frequency signals. This means that more data can be transmitted, thereby supporting higher data rates and richer media content. ‌
High reliability of high frequency pcb communication circuits is also one of its advantages. The use of high-quality materials and manufacturing processes can effectively resist external interference and oxidation corrosion, ensure stable performance in high temperature environments, and thus extend the service life of the circuit board.

Classification of high frequency pcb communication circuits

Classification by material:

Organic materials: including phenolic resin, glass fiber/epoxy resin, Polyimide, BT/Epoxy (bismaleimide triazine/epoxy resin), etc.
Inorganic materials: mainly including aluminum, copper-invar-copper, ceramic, etc. These materials are mainly selected for their excellent heat dissipation function.

Classification by the hardness of the finished product:

Rigid PCB: has a solid structure and stable performance.
Flexible PCB: has flexibility and bendability, suitable for occasions requiring flexible wiring.
Rigid-Flex PCB: It combines the characteristics of rigid and flexible boards, and has higher design flexibility and wide application.

Classification by structure:

Single-sided board: A circuit board with a conductive layer on only one side.
Double-sided board: Both sides are coated with conductive layers, separated by insulating materials in the middle.
Multilayer board: It is composed of multiple conductive layers and insulating layers, and has higher circuit integration and reliability.

Classification by use:

Communication board: It is used in various communication equipment and systems.
Consumable electronic board: It is commonly found in consumer electronic products.
Military board: A circuit board that meets special requirements in the military field.
Computer board: A circuit board used in computer hardware.
Semiconductor board: A circuit board used in the manufacturing and testing process of semiconductors.
Electrical test board: A circuit board used in electronic testing and measurement equipment.

How to choose high-frequency circuit board high-speed board

When choosing PCB board, you must find a balance between meeting design requirements, mass production and cost. In short, the design requirements cover two aspects: electrical performance and structural reliability. Especially when designing ultra-high-speed PCB (frequency greater than GHz), the choice of board is particularly important. For example, the commonly used FR-4 material will have a significantly increased dielectric loss (Df, i.e., Dielectric Loss) at a frequency of several GHz, and may no longer be applicable.

Taking the 10Gb/S high-speed digital signal as an example, this signal can be regarded as the superposition of multiple sinusoidal wave signals of different frequencies. Therefore, the 10Gb/S signal contains multiple components of different frequencies: such as a 5GHz fundamental signal, a 3rd-order 15GHz signal, a 5th-order 25GHz signal, and a 7th-order 35GHz signal. In order to ensure the integrity of digital signals, maintain the steepness of the upper and lower edges of the signals, and be compatible with the low-loss, low-distortion transmission of RF microwaves (the high-frequency harmonic part of the digital signal reaches the microwave frequency band), the selection of materials for high-speed digital circuit PCBs has many similarities with the needs of RF microwave circuits.

In actual engineering operations, the selection of high-frequency boards seems simple, but the factors that need to be considered are quite complex. Through the introduction of this article, PCB design engineers or high-speed project leaders can have a deeper understanding of the characteristics and selection of boards. Understand the electrical properties, thermal properties, reliability and other characteristics of the board, and use the stacking design reasonably to create products with high reliability and excellent processability, and achieve the best balance of various factors.

Composition and key components of high frequency pcb communication circuits

High frequency pcb communication circuits are basically composed of passive components, active devices and passive networks. Passive components include resistors, capacitors and inductors, which mainly exhibit resistance characteristics at low frequencies, but also exhibit reactance characteristics at high frequencies. Active devices such as high-frequency triodes have the characteristics of high gain, high frequency response and low noise, and are widely used in television, radio communication, radar and other fields.

Application of high frequency pcb communication circuits

High frequency pcb communication circuits are widely used in long-distance communication systems, with a communication distance of up to thousands of kilometers, and are often used to maintain communication between aircraft and bases. It occupies a high-frequency band of 2~30MHz, uses skywave propagation, and can propagate over long distances. Modern airborne high-frequency communication systems usually use single-sideband communication systems, which can greatly compress the occupied frequency band and save transmission power. However, high-frequency communication is also susceptible to electrical interference such as ionospheric disturbances and lightning, generating radio background noise, and there is fading, and the signal is sometimes strong and sometimes weak.

Design Guidelines for High Frequency PCB Communication Circuits

Design Guidelines

High Frequency PCB Communication Circuits

How to avoid high-frequency interference?

The basic idea of avoiding high-frequency interference is to minimize the interference of the electromagnetic field of high-frequency signals, which is the so-called crosstalk. You can increase the distance between high-speed signals and analog signals, or add ground guard/shunt traces next to analog signals. Also pay attention to the noise interference of digital ground to analog ground.

How to solve the signal integrity problem in high-frequency communication PCB design?

Signal integrity is basically an impedance matching problem. The factors that affect impedance matching include the architecture and output impedance of the signal source, the characteristic impedance of the trace, the characteristics of the load end, and the topology of the trace. The solution is to rely on termination and adjust the topology of the trace.

How is the differential wiring method implemented?

There are two points to note when wiring differential pairs. One is that the length of the two lines should be as equal as possible, and the other is that the spacing between the two lines (this spacing is determined by the differential impedance) should remain unchanged, that is, they should be kept parallel. There are two parallel methods, one is that two lines run on the same routing layer (side-by-side), and the other is that two lines run on two adjacent layers (over-under). Generally, the former side-by-side (side by side, shoulder to shoulder) is more commonly used.

How to implement differential routing for clock signal lines with only one output end?

To use differential routing, it must be meaningful if both the signal source and the receiving end are differential signals. Therefore, differential routing cannot be used for clock signals with only one output end.

Can a matching resistor be added between the differential line pairs at the receiving end?

The matching resistor between the differential line pairs at the receiving end is usually added, and its value should be equal to the value of the differential impedance. This will improve the signal quality.

Why should the routing of differential pairs be close and parallel?

The routing method of differential pairs should be appropriately close and parallel. The so-called appropriate proximity is because this spacing will affect the value of differential impedance, which is an important parameter for designing differential pairs. Parallelism is also required because the consistency of differential impedance must be maintained. If the two lines are sometimes far away and sometimes close, the differential impedance will be inconsistent, which will affect the signal integrity and timing delay.

How to deal with some theoretical conflicts in actual wiring?

Basically, it is right to separate the analog/digital ground. It should be noted that the signal routing should try not to cross the split place (moat), and the return current path of the power supply and signal should not be too large.

The crystal oscillator is an analog positive feedback oscillation circuit. To have a stable oscillation signal, the loop gain and phase specifications must be met. The oscillation specification of this analog signal is easily interfered. Even if ground guard traces are added, it may not be possible to completely isolate the interference. Moreover, if it is too far away, the noise on the ground plane will also affect the positive feedback oscillation circuit. Therefore, the distance between the crystal oscillator and the chip must be as close as possible.

It is true that there are many conflicts between high-speed wiring and EMI requirements. But the basic principle is that the resistors, capacitors or ferrite beads added due to EMI cannot cause some electrical characteristics of the signal to not meet the specifications. Therefore, first use the techniques of arranging routing and PCB stacking to solve or reduce EMI problems, such as routing high-speed signals on the inner layer. Only then use resistors, capacitors or ferrite beads to reduce damage to the signal.

How to solve the contradiction between manual routing and automatic routing of high-speed signals?

Most of the current powerful routing software’s automatic routing tools have set constraints to control the winding method and the number of vias. The winding engine capabilities and constraint setting items of various EDA companies are sometimes very different. For example, whether there are enough constraints to control the winding method of the serpentine, whether the routing spacing of the differential pair can be controlled, etc. This will affect whether the routing method generated by automatic routing can meet the designer’s ideas. In addition, the difficulty of manually adjusting the routing is also related to the ability of the winding engine. For example, the pushing ability of the routing, the pushing ability of the via, and even the pushing ability of the routing to the copper plating, etc. Therefore, choosing a routing tool with a strong winding engine capability is the solution.

About test coupon.

The test coupon is used to measure the characteristic impedance of the produced PCB board with TDR (Time Domain Reflectometer) to see if it meets the design requirements. Generally, the impedance to be controlled is single line and differential pair. Therefore, the trace width and line spacing (when there is a differential pair) on the test coupon should be the same as the line to be controlled. The location of the ground point during measurement is important. In order to reduce the inductance of the ground lead, the grounding point of the TDR probe is usually very close to the probe tip, so the distance and method between the point where the signal is measured on the test coupon and the ground point should be consistent with the probe used.

In high-speed PCB design, the blank area of the signal layer can be copper-plated, and how should the copper of multiple signal layers be distributed in grounding and power supply?

Generally, the copper plating in the blank area is mostly grounded. However, when plating copper next to high-speed signal lines, pay attention to the distance between the copper plating and the signal line, because the copper plating will reduce the characteristic impedance of the trace a little. Also be careful not to affect the characteristic impedance of other layers, such as in the dual strip line structure.

Can the signal line on the power plane be calculated using the microstrip line model? Can the signal between the power and ground planes be calculated using the stripline model?

Yes, both the power plane and the ground plane must be considered as reference planes when calculating the characteristic impedance. For example, a four-layer board: top layer-power layer-ground layer-bottom layer. At this time, the model of the characteristic impedance of the top layer routing is a microstrip line model with the power plane as the reference plane.

Can the automatic generation of test points on high-density printed circuit boards by software generally meet the test requirements of mass production?

Whether the test points automatically generated by general software meet the test requirements depends on whether the specifications for adding test points meet the requirements of the test equipment. In addition, if the routing is too dense and the specifications for adding test points are strict, it may not be possible to automatically add test points to each line. Of course, the places to be tested need to be filled manually.

Will adding test points affect the quality of high-speed signals?

As for whether it will affect the signal quality, it depends on the way of adding test points and how fast the signal is. Basically, the additional test point (without using the existing via or DIP pin as the test point) may be added to the line or a short line may be pulled out from the line. The former is equivalent to adding a very small capacitor to the line, and the latter is an additional branch. Both situations will have some impact on the high-speed signal, and the degree of impact is related to the frequency speed of the signal and the edge rate of the signal. The magnitude of the impact can be known through simulation. In principle, the smaller the test point, the better (of course, it must meet the requirements of the test equipment) and the shorter the branch, the better.

How should the ground wires between the boards of a system be connected when several PCBs are connected to each other?

When the signals or power supplies between the PCB boards are in operation, for example, when the power supply or signal from board A is sent to board B, there will be an equal amount of current flowing back from the ground layer to board A (this is Kirchoff current law). The current on the ground layer will flow back to the impedance. Therefore, at each interface where the power supply or signal is connected to each other, the number of pins allocated to the ground layer should not be too small to reduce the impedance, so as to reduce the noise on the ground layer. In addition, the entire current loop can be analyzed, especially the part with larger current, and the connection method of the ground layer or ground wire can be adjusted to control the flow of current (for example, create low impedance at a certain place to let most of the current flow through this place) to reduce the impact on other more sensitive signals.

What is a single-sided PCB circuit board

Single-sided PCB circuit board is a type of printed circuit board. Only one side of the PCB board has circuits (it can have holes or not), and the other side is a substrate or directly covered with insulating ink. There is no circuit and the whole board is transparent under strong light (except for individual boards and special process requirements). The cross section only contains copper foil on the side with circuits.
Single-sided PCB circuit board is obtained by etching copper-clad board. Copper-clad board consists of board base and copper foil. The board base is usually made of insulating materials such as glass fiber, and is covered with a layer of copper foil (usually oxygen-free copper).

Single layer PCB manufacturer

Single layer PCB manufacturer Best Technology has offered high-quality PCBs and the best PCB assembly & box building service all over the world since 2006. We are professional fabricator on PCB prototype, IPC Class III standard are available. You can get high-quality PCB board and PCBA at a very reasonable price.

Single layer PCB design
Best Technology excels in PCB design, perform PI analysis, SI analysis, EMC test and DFM tests to ensure one-time successed PCB design. Over 20 professional engineers, all of them has more than 15+ years experience in PCB, we make sure every design is optimized for performance and manufacturability.

Single layer PCB prototype
As an industry-leading PCB prototype manufacturer, Best Technology offers 24 hours quick turn PCB prototype, PCB assembly and reliable small-batch PCB production. Free technical support and VIP one-to-one service.

Single layer PCB production
With over 18 years PCB manufacture experience, we dedicated to provide highest quality PCB for customers. We offer turnkey service from PCB design, PCB layout, PCB prototype, mass production and PCB assembly. Contact us to get an instant quote.

Single layer PCB assembly
Professional PCB assembly service, includes DFM/DFA checks, function/ICT testing, X-RAY, Online dual AOI, nitrogen reflow oven. 10+ SMT lines, free passive parts and Thorough Inspections! SMT, Thru-hole, BGA, QFN Assembly at Low Prices! No MOQ, complex and difficulty designs welcome!

Single-sided PCB production process

Cutting
Drilling or punching
Screen printing circuit anti-etching pattern or using dry film
Curing inspection and board repair
Screen printing solder mask pattern (commonly used green oil)
Screen printing character mark pattern, UV curing
Preheating, punching and appearance
Electrical open and short circuit test
Pre-coating flux anti-oxidant (drying) or tin spraying hot air leveling
Packaging and delivery

Single-sided PCB production capacity

Item	Content
Material type :	XPC FR-1 FR-4 CEM-1
Surface finish :	ENIG gold, HASL Immersion Tin, Chemical Silver OSP
Layer No :	Single side, Multilayer PCB
Max PCB size:	1500mm*600mm
Min PCB size:	5mm*5mm
Min space/width:	0.1mm
Warp and Twist:	≤0.5%(board thickness：1.6mm，PCB size ： 300mm*300mm)
Board thickness:	0.3-5.0mm
Copper thickness:	35um-240um
Outline Tolerance:	±0.15mm
V-CUT Precision:	±0.1mm
Capacity:	80000㎡/Month
PTH Dia tolerance:	±0.076mm
Outline tolerance:	CNC ：±0.1mm punch：±0.15mm

What are the single-sided PCB materials?

What are the single-sided PCB materials

Phenolic paper substrate
Phenolic paper substrate (commonly known as cardboard, plastic board, V0 board, flame retardant board, red-letter copper clad board, 94V0). The most commonly used product models of phenolic paper-based copper clad boards are FR-1 (flame retardant) and XPC (non-flame retardant). Single-sided copper clad boards can be easily judged from the color of the characters on the back of the board. Generally, red characters are FR-1 (flame retardant) and blue characters are XPC (non-flame retardant). This type of board is the cheapest compared to other types of boards.

Epoxy fiberglass cloth substrate
Epoxy fiberglass cloth substrate (commonly known as: epoxy board, fiberglass board, fiberboard, FR4), epoxy fiberglass cloth substrate is a type of substrate with epoxy resin as adhesive and electronic grade glass fiber cloth as reinforcing material. Its bonding sheet and inner core thin copper clad board are important substrates for making multi-layer printed circuit boards. The working temperature is high and its own performance is less affected by the environment. In terms of processing technology, it has great advantages over other resin fiberglass cloth substrates. This type of product is mainly used for double-sided PCBs. It is also about twice as expensive as phenolic paper substrates, and the commonly used thickness is 1.5MM.

Composite substrates
Composite substrates (commonly known as powder boards, etc., cem-1 boards are also called 22F in some places in China) mainly refer to CEM-1 and CEM-3 composite-based copper-clad boards. Copper-clad boards made of wood pulp fiber paper or cotton pulp fiber paper as core reinforcement materials and glass fiber cloth as surface reinforcement materials, both of which are impregnated with flame-retardant epoxy resin, are called CEM-1. Copper-clad boards made of glass fiber paper as core reinforcement materials and glass fiber cloth as surface reinforcement materials, both of which are impregnated with flame-retardant epoxy resin, are called CEM-3. These two types of copper-clad boards are the most common composite-based copper-clad boards. This type of board is cheaper than FR4 type boards.

Single-sided PCB circuit board price

Since the cost of single-sided PCB circuit boards is affected by many factors, including the cost of raw materials, production cost, production process, special requirements, etc., its exact pricing needs to be negotiated with its single-sided PCB circuit board supplier. The general unit price calculation formula is: (length MM) × (width MM) × 0.01 × unit price (yuan/square meter) ÷ 10000 (rounded to 3 decimal places)
For specific single-sided PCB quotes, please consult bestpcbs．

Single-sided PCB circuit board price

Single-sided PCB applications and features

Single-sided PCBs are increasingly widely used due to their many unique advantages;
High density: For decades, high-density printed boards have developed with the improvement of integrated circuit integration and the advancement of installation technology.
High reliability: Through a series of inspections, tests and aging tests, PCBs can work reliably for a long time (usually 20 years).
Designability: According to the requirements of various performances (electrical, physical, chemical, mechanical, etc.) of single-sided boards, printed boards can be designed in a short time and efficiently through design standardization.
Manufacturability: Through modern production management, standardization, scale (quantification), automation, etc. can be achieved to ensure the consistency of product quality.
Testability: Complete test methods, standards and various test equipment and instruments have been established to detect and evaluate the qualification and service life of a single PCB.
Assembly: Circuit boards facilitate standardized assembly of various components to achieve automated, large-scale mass production. At the same time, circuit boards and various component assemblies can be assembled into larger components and systems, and even complete machines.

Maintainability: Circuit boards and various component parts are manufactured with standardized designs and scales. If a system fails, components can be replaced quickly and conveniently. The system can recover quickly due to this flexibility. More examples include system miniaturization, lightweight, high-speed signal transmission, etc.

FAQ About single sided pcb

FAQ About single sided pcb

Q: When laying out the board, if the lines are dense, there may be more vias, which will of course affect the electrical performance of the board. How can I improve the electrical performance of the board?
A: For low-frequency signals, vias are not a big deal, but for high-frequency signals, try to reduce vias. If there are many lines, you can consider multi-layer boards;

Q: Is it better to add more decoupling capacitors on the board?
A: Decoupling capacitors need to be added with appropriate values at appropriate locations. For example, add them to the power supply port of your analog device, and use different capacitance values to filter out stray signals of different frequencies;

Q: What are the standards for a good board?
A: Reasonable layout, sufficient power redundancy of power lines, high-frequency impedance, and simple low-frequency routing.

Q: How much difference do through holes and blind holes have on signals? What are the application principles?
A: Using blind or buried holes is an effective way to increase the density of multi-layer boards, reduce the number of layers and board size, and greatly reduce the number of plated through holes. But in comparison, through holes are easy to implement in terms of process and have lower costs, so through holes are generally used in designs.

Q: What kind of layout can achieve the best heat dissipation effect?
A: There are three main sources of heat in PCB: (1) heat generated by electronic components; (2) heat generated by the PCB itself; (3) heat transmitted from other parts. Among these three heat sources, the heat generated by components is the largest and is the main heat source, followed by the heat generated by the PCB board. The heat transmitted from the outside depends on the overall thermal design of the system and is not considered for the time being. The purpose of thermal design is to take appropriate measures and methods to reduce the temperature of components and PCB boards so that the system can work normally at a suitable temperature. This is mainly achieved by reducing heat generation and accelerating heat dissipation.

Q: Can you explain the proportional relationship between the line width and the size of the matching via?
A: This is a good question. It is difficult to say that there is a simple proportional relationship because the two simulations are different. One is surface transmission and the other is ring transmission. You can find a via impedance calculation software on the Internet, and then keep the impedance of the via consistent with the impedance of the transmission line.

Q: In an ordinary PCB circuit board with an MCU control, but without high current and high-speed signal requirements, is it better to lay a layer of ground wire around the outermost edge of the PCB to wrap the entire circuit board?
A: Generally speaking, just lay a complete ground.

Q: How to deal with the avoidance of vias during the wiring process of high-speed PCB, what good suggestions are there?
A: For high-speed PCB, it is best to make fewer vias and solve the need to increase vias by adding signal layers.

Q: How to select the thickness of the power trace in PCB board design? Are there any rules?
A: You can refer to: 0.15×line width (mm)=A, and copper thickness also needs to be considered.

Q: When digital circuits and analog circuits are on the same multi-layer board, should analog ground and digital ground be arranged on different layers?
A: This is not necessary, but analog circuits and digital circuits should be placed separately.

Q: How many vias are generally suitable for digital signal transmission? (Signals below 120Mhz)
A: It is best not to exceed two vias.

What Is DB Technology Hoot Circuit Board?

The DB Technology Hoot Circuit Board is an advanced control board used in hot tubs to manage and automate various functions, making your spa experience efficient and enjoyable. This circuit board is central to the hot tub’s operation, overseeing everything from heating the water to powering the jets. It communicates with the control panel, relays commands, and adjusts settings based on user inputs. Essentially, the Hoot Circuit Board is the brain of the hot tub, coordinating multiple components to maintain a smooth, safe, and personalized experience for the user. It is known for its durability and reliability, this board can, however, develop faults over time due to age, moisture, or electrical issues, necessitating a replacement.

DB Technology Hoot Circuit Board Replacement

Components and Functions of the Hoot Circuit Board

The DB Technology Hoot Circuit Board consists of several key components, each serving an essential role in the functioning of your hot tub:

Microcontroller Unit (MCU): The MCU is the core of the circuit board, processing commands from the control panel. It manages tasks like temperature adjustments, pump speed, and safety protocols.

Relay Switches: These switches control the power flow to various parts of the hot tub, such as heaters and pumps. They act as the gatekeepers, opening and closing circuits based on commands from the MCU.

Sensors and Thermistors: These components monitor temperature and water flow. They ensure the hot tub operates within safe limits, preventing overheating and other potential hazards.

Power Supply Components: The power components, including capacitors and resistors, regulate voltage and current, ensuring stable power delivery to the entire system.

Communication Ports: These ports allow the circuit board to communicate with the control panel and other connected devices, facilitating real-time adjustments and error reporting.

Each part of the Hoot Circuit Board works together to provide a safe and enjoyable hot tub experience. However, when one component fails, it can affect the entire system.

How Much Does It Cost to Replace a Circuit Board on a Hot Tub?

Replacing a circuit board on a hot tub can vary in cost, depending on the model and brand. For a DB Technology Hoot Circuit Board, replacement prices typically range between $200 and $600. Factors influencing the cost include the availability of the board, whether it’s purchased directly from the manufacturer or a third-party supplier, and any additional installation fees.

If you opt to replace the board yourself, you may only need to pay for the board and any tools required. However, this approach demands basic knowledge of electronics and safety precautions.

Or you can hirea professional can add to the cost, with service fees ranging from $100 to $200. Though more expensive, a professional installation ensures the board is installed correctly, minimizing risks of further issues.

While the initial cost may seem high, replacing a faulty circuit board can extend the life of your hot tub and improve its performance, making it a worthwhile investment.

How Long Do Hot Tub Circuit Boards Last?

The life of the circuit board of the hot tub is affected by many factors, and a fixed number of years cannot be given. ‌

The life of hot tub circuit board is affected by many factors such as raw material quality, production process, environmental factors and so on. High-quality substrates and copper foils effectively reduce the risk of aging and failure, while high-precision production processes and strict quality control reduce defects and improve long-term stability. In addition, environmental factors such as humidity, temperature, and the presence of contaminants can also cause the board to age. Therefore, maintaining appropriate environmental conditions, such as controlling humidity and temperature, is an effective measure to extend the shelf life of the circuit board.

For electric water heaters, their service life is between 5-15 years, which indicates that the life of the circuit board will also be affected by the overall use of the electric water heater. Therefore, the life of the hot tub circuit board not only depends on the quality and maintenance of the circuit board itself, but also is affected by the frequency of use of the water heater, maintenance and other factors. In order to ensure the safety and effectiveness of use, it is recommended to regularly inspect and maintain the hot tub and its circuit board, follow the manufacturer’s recommendations for maintenance and replacement to ensure the best performance and safety.

How Do I Know If My Circuit Board Is Bad?

Recognizing the signs of a failing circuit board early can help prevent further damage and costly repairs. Here are common indicators to be done if your DB Technology Hoot Circuit Board might be malfunctioning:

1. Visual inspection

Carefully observe whether the surface of the circuit board has obvious physical damage, such as burning, cracking, corrosion, etc. If an anomaly is found, it is likely a sign of damage to the circuit board.

2. Test voltage

Use a digital multimeter or multifunction tester to measure the voltage between each key point on the circuit board. If there is an abnormal voltage value (such as short circuit, open circuit, or abnormal high and low), it indicates that there may be a problem with the board.

3. Tracking signals

When some functions on the circuit board do not work properly, devices such as oscilloscopes or logic analyzers can be used to track the signal path and determine whether there is interruption or interference.

4. Component testing

If there are removable components on the circuit board, such as integrated circuit chips, electrolytic capacitors or diodes, you can use test instruments to test these components to confirm whether their performance is normal.

5. Thermal imaging

Use an infrared thermal imaging camera to scan the surface of the circuit board to detect whether there are hot spots or abnormal temperature areas. This can help detect possible faults or overload conditions in the board.

Please note that if you do not have the relevant expertise and skills, it may be risky to determine whether the board is damaged. It is recommended to consult a professional or seek the help of professional repair services like Best Technology when it is necessary to judge or repair the circuit board.

Alternatives to the Hoot Circuit Board

If a replacement Hoot Circuit Board is not readily available or doesn’t fit your budget, consider alternative options that offer comparable performance:

Generic Replacement Boards

Some manufacturers produce universal circuit boards compatible with multiple hot tub brands. These boards can serve as a suitable alternative but may require additional wiring adjustments.

Upgraded Boards

You can upgrade your circuit boards with enhanced features, like advanced control settings or energy efficiency improvements, are available. Though slightly more expensive, these boards can enhance your hot tub experience.

Used or Refurbished Boards

Pre-owned or refurbished circuit boards can be a cost-effective solution. Ensure that these boards are tested and come with a warranty to avoid future issues.

Choosing the right alternative depends on your hot tub’s compatibility and your specific needs. Always verify compatibility before purchasing a replacement.

Step-by-Step Guide to Replacing Your Hoot Circuit Board

Replacing your DB Technology Hoot Circuit Board can be a manageable task with the right tools and guidance. Here’s a simple step-by-step guide:

1. Before starting, turn off the power supply to your hot tub at the breaker box to avoid electrical shock.

2. Locate the control box that houses the circuit board. Remove the cover using a screwdriver.

3. Before disconnecting anything, take detailed photos of the circuit board and wiring connections. This will help you reconnect everything correctly.

4. Carefully remove the connectors and wiring attached to the circuit board. Unscrew any mounting screws holding the board in place.

5. Position the new Hoot Circuit Board in place and secure it with screws. Reconnect all wires and connectors as per your reference photos.

6. Turn the power back on and test all functions of the hot tub to ensure the new board is working correctly. Check for any error messages or irregular operation.

7. Once everything is functioning as expected, replace the control box cover securely.

Replacing a circuit board can be a straightforward process, but if you’re unsure, consulting Best Technology is always a good idea to ensure safety and proper installation.

Why Choose Best Technology for Hoot Circuit Board?

Selecting the right supplier for your DB Technology Hoot Circuit Board replacement or upgrade can greatly impact the performance and longevity of your hot tub. Choosing Best Technology as your go-to provider for Hoot Circuit Boards because:

No stencil, setup fee
Free capacitors and resistors for prototype customers
Rapid prototyping: 24-hour delivery, 8-hour rush service
Dust-free workshop for PCB and PCBA assembly
Over 2000+ customers all around the world
Dedicated one-on-one service with WIP production updates
ISO9001, ISO13485, IATF16949 certificated
Factory in Vietnam, US, China

You are welcome to contact us any time for PCB projects!!

What is a Pinner in PCB?

What is a Pinner in PCB? A Pinner in PCB manufacturing is a specialized tool or mechanism used to align and secure various components or layers during the assembly process of printed circuit boards (PCBs). It ensures that all elements, whether they are individual electronic components or stacked layers in multilayer boards, remain accurately positioned until the final bonding or soldering process is completed. In simple terms, it acts as a “placeholder,” holding everything firmly in place to avoid any shifts or misalignments that could compromise the performance or quality of the PCB.

Pinners can be manual, semi-automatic, or fully automated, depending on the scale and precision requirements of the production line. While manual pinners are often used for small-scale production or prototypes, automatic pinners are prevalent in large-scale manufacturing due to their high efficiency and accuracy.

Function of PCB Pinner

The function of a PCB pinner is primarily to align and secure PCB layers or components during the assembly process, ensuring that everything is held in place precisely before final soldering or bonding. Here’s a breakdown of its essential functions:

1. Component Placement Stability

One of the key functions of a PCB pinner is to provide stability to the components placed on the PCB. Whether it is a surface-mounted component, a through-hole part, or different layers in a multilayer PCB, the pinner holds these elements firmly in place to prevent any shifting during further processes such as soldering, wave soldering, or selective soldering.

2. Accurate Layer Alignment

In multilayer PCB manufacturing, aligning the various layers accurately is a complicated but crucial task. A pinner ensures that each layer is positioned perfectly over the others, preventing any misalignment that could result in short circuits, poor signal transmission, or weak connections between layers. In multilayer PCBs, where hundreds of traces may overlap in different layers, alignment is critical to ensure the board functions correctly.

3. Minimization of Errors

Errors such as misaligned components or layers can lead to significant issues like short circuits or signal interference in PCBs. By keeping everything in place with high precision, the PCB pinner reduces the chances of human or machine errors during assembly.

4. Support During Automated Processes

In automated assembly lines, the PCB pinner often works in coordination with other machines such as pick-and-place machines and soldering stations. While components are being positioned by a robotic arm or soldering is taking place, the pinner ensures that none of the components shift out of alignment.

5. Enabling High-Density PCB Designs

As PCB designs become more complex and denser with miniaturized components, the risk of misalignment increases. A pinner helps overcome this challenge by holding even the smallest components in the exact position, preventing misplacement in densely packed circuits.

6. Enhancing Overall Manufacturing Efficiency

Using a pinner enhances the overall efficiency of the manufacturing process. It allows other automated systems to perform their functions more swiftly because there’s less risk of a production halt due to misaligned components.

7. Reducing Rework and Scrap

The precision offered by PCB pinners means there are fewer instances of defective boards, which in turn means less rework and lower scrap rates. By ensuring proper alignment, pinners contribute to a higher yield of functional PCBs, reducing the amount of waste produced during manufacturing.

Types of PCB Pinner

The selection of a PCB pinner depends on the specific requirements of the assembly process, the type of components being used, and the complexity of the PCB design. Below are some common types of PCB pinners:

Through-Hole Pinners

These are designed for use in through-hole PCB assembly, where components have leads that pass through holes in the board. Through-hole pinners secure these leads in place, ensuring they remain stable during the soldering process. They are especially useful for components with multiple leads, such as integrated circuits.

Surface Mount Pinners

Surface mount technology (SMT) is a widely used method for mounting components directly onto the surface of a PCB without the need for leads to pass through the board. Surface mount pinners are specifically designed to hold these components in place on the board’s surface, preventing movement during reflow soldering.

High-Precision Pinners

Certain PCB assemblies require extremely high precision, especially in fields like aerospace or medical devices. High-precision pinners are engineered to hold components with micron-level accuracy, ensuring even the slightest misalignment is avoided. These pinners are often used alongside advanced placement machines that demand exact component positioning.

Custom Pinners

In some cases, standard pinners may not meet the unique needs of a specific PCB assembly process. Custom pinners can be designed and manufactured to accommodate specialized component shapes, board layouts, or particular assembly requirements. These pinners are typically developed through collaboration between PCB designers and pinner manufacturers to meet the exact specifications of the production line.

How Does a PCB Pinner Work?

A PCB pinner works by using pins or clamps to hold the PCB layers or components in place during the assembly process. When layers of a PCB are stacked or when components need to be placed with high precision, the pinner ensures they remain aligned. The pins are positioned strategically to avoid any areas where components will be placed or where soldering will occur. Once the components are secure, the pins can be removed without disturbing the alignment, leaving the PCB ready for soldering or bonding.

In automated systems, the pinner operates in sync with other assembly tools, such as pick-and-place machines or soldering stations, making the entire process seamless and highly efficient.

Advantages of Using PCB Pinner

There are several key advantages to using a PCB pinner in the manufacturing process:

1. PCB pinners ensure that all components and layers are perfectly aligned, reducing errors that could lead to faulty boards.

2. By securing the components, the pinner allows other machines to work faster without the risk of misalignment, speeding up the overall assembly process.

3. A well-aligned PCB means fewer errors and less rework. This not only saves time but also reduces material waste and associated costs.

4. Consistently aligned components lead to more reliable PCBs, which translates into higher product quality and fewer defects.

5. PCB pinners can be used with various PCB types, including single-layer, multilayer, and flexible PCBs.

What is Pinner in PCB Factory?

In a factory setting, where large volumes of PCBs are produced, PCB pinners are often integrated into the assembly line as part of a highly automated process. These pinners work in conjunction with other assembly machines, such as pick-and-place machines and soldering stations, to create a streamlined manufacturing process. By securing the PCB layers or components in place, pinners prevent shifts that can occur due to vibration, movement, or machine interaction, ensuring that the assembly process proceeds without errors.

In sectors where precision is vital, such as aerospace, automotive, medical devices, and telecommunications, even the slightest misalignment can lead to failure or reduced performance. PCB factories that operate in these high-precision fields rely heavily on pinners to ensure that all components are perfectly placed and secured before final assembly. The reliability and quality of the final PCB often depend on how well the pinner performs its job in maintaining alignment throughout the process.

MCPCB production process

Substrate preparation: Select appropriate metal substrates, such as aluminum, iron, copper, indium copper, tungsten-molybdenum alloy, etc., as the base of MCPCB. These metal substrates have good thermal conductivity and are the core components of MCPCB.

Insulating dielectric layer coverage: Cover the metal substrate with an insulating dielectric layer. Common insulating dielectrics include modified epoxy resin, polyphenylene ether, polyimide, etc. This layer not only provides the insulation performance required by the circuit, but also enhances the mechanical strength and durability of the MCPCB.

Copper layer laying: Lay the copper layer on the insulating dielectric layer to form the conductive part of the circuit. The copper layer is made through the production process of printed circuit boards, and the corresponding circuits are laid according to the needs of electronic circuits.

Thermocompression bonding process: The metal substrate, insulating dielectric layer and copper layer are combined together through the thermocompression bonding process to form the basic structure of the MCPCB. This step ensures the close bonding between the layers and improves the stability and reliability of the MCPCB.

Circuit production: According to the design requirements, circuit lines are made on the copper layer. This includes drilling, dry film covering, exposure, development and other steps to ensure the accuracy and conductivity of the circuit line.

‌Inspection and testing‌: Inspect and test the completed MCPCB to ensure that its performance meets the design requirements. This includes inspection of the circuit surface and aluminum base surface, as well as testing of conductivity and insulation performance.

What are the advantages of mcpcb

Excellent heat dissipation performance: MCPCB usually adopts aluminum substrate or copper substrate, which has good thermal conductivity, can effectively dissipate the heat generated by electronic components, and improve the stability and reliability of the circuit board. This excellent heat dissipation performance makes MCPCB particularly suitable for high switching power applications, such as LED lighting, power modules, automotive electronics and power electronics, among which LED lighting is one of the most widely used fields of MCPCB.

‌High mechanical strength: The base material of metal core PCB is thicker, with high mechanical strength and bending and torsion resistance, which is conducive to the assembly and transportation of electronic products. This feature makes MCPCB perform well in environments that need to withstand greater physical pressure or frequent movement.

‌Reliable welding performance: After the surface of metal core PCB is coated with solder paste, it has good welding performance and is suitable for surface mount technology (SMT) and plug-in welding technology. This feature improves the applicability of MCPCB in PCBA processing, making it a preferred material in the manufacture of modern electronic products.

‌Corrosion and wear resistance: Metal core PCB has strong corrosion resistance and wear resistance, which is suitable for electronic products in harsh environments. This feature enables MCPCB to work stably for a long time under high temperature, humidity or other extreme conditions, improving the durability and reliability of the product.

‌Space saving‌: Compared with traditional FR-4 substrates, MCPCB has higher heat dissipation performance, which can design smaller electronic products and save space. This advantage is particularly important in devices with limited space, such as portable electronic devices such as smartphones and tablets.

‌Improve reliability‌: Good welding performance and corrosion resistance can improve the reliability and stability of the circuit board and reduce the failure rate. This is especially important in critical systems and equipment, such as medical equipment, industrial control systems, etc., where reliability and stability are crucial factors.

What accessories does a street lamp have?

Lamp holder. The lamp holder of a street lamp is usually an LED lamp, which is the core part of the street lamp. It is responsible for converting electrical energy into light energy to provide lighting services for people. The quality of the lamp holder directly affects the lighting effect and life of the street lamp.
Lamp pole. The lamp pole is the part that supports the lamp holder. It is usually made of metal and has various shapes such as conical poles and prismatic poles. Street lamps in different scenes may require lamp poles of different heights and shapes to meet lighting needs. In addition, safety issues should also be considered, such as anti-theft design and prevention of excessive wind force. In addition, installation accessories such as clamps are also used to fix the lamp pole.
Light source. The light source is an important part of the street lamp, including LED lamp beads, bulbs, etc. The choice of light source is related to key indicators such as brightness, energy consumption and life of the street lamp. At present, LED light sources are widely used in street lamps due to their high efficiency, energy saving and long life.
Electrical control device. The electrical control device includes components such as ballast, trigger, light control switch, etc., which are used to control the working state of the street lamp and protect the circuit safety. For example, light-operated switches can automatically turn streetlights on and off according to ambient light, saving energy. In addition, some advanced streetlights may also be equipped with intelligent control systems to achieve remote monitoring and management.
Installation accessories. These include small parts such as clamps and screws. Although these parts are not conspicuous, they are very important for the installation and maintenance of streetlights. For example, clamps are used to fix the connection between the top of the lamp pole and the lamp head, and screws are used to fix various parts to ensure the stability and safety of the streetlight.

What are the street lights?

Ordinary street lights
Ordinary street lights are the most common lighting facilities on the streets. They usually use light bulbs or LED lamp heads and are installed on light poles to provide basic lighting for pedestrians at night.

Solar street lights
Solar street lights are an environmentally friendly street light that uses solar panels to absorb solar energy, converts energy into electrical energy, stores it in batteries, and lights up the street lights at night through control devices. Solar street lights do not need to be connected to an external power supply, have low maintenance costs, and are widely used in parks, suburban roads and other places.

LED street lights
LED street lights use light-emitting diodes as light sources, which have the advantages of high efficiency, energy saving, long life, safety and reliability. LED street lights have good lighting effects and can be intelligently adjusted according to different environments. They are the first choice for modern urban street light renovation.

Landscape street lights
In addition to the basic lighting function, landscape street lights also emphasize artistic decorative effects. It is usually integrated with the surrounding environment, with unique design and diverse shapes, and is used to increase the beauty and cultural atmosphere of street landscapes.

Multifunctional street lights
Multifunctional street lights integrate multiple functions such as lighting, monitoring, and communication. In addition to providing lighting, this type of street lamp is also equipped with cameras, display screens and other devices for urban management and security monitoring.

What is Copper Clad Laminate?

Copper clad laminate short for CCL, it is a foundational material in the electronics industry. It consists of a thin copper foil bonded to one or both sides of a non-conductive substrate like fiberglass or resin. This combination creates a durable and conductive material that serves as the base for creating printed circuit boards (PCBs). The copper layer facilitates the transmission of electrical signals, while the insulating substrate supports the board’s structural integrity.

CCL comes in various thicknesses and types, depending on the application. It’s a critical part of most electronic devices, from smartphones to industrial machines. Its main role is to support the etching of circuit patterns, where unnecessary copper is removed, leaving conductive paths that enable electrical connections. Below is a structure of a double sided copper clad laminate:

What is Copper Clad Board Used For?

Copper clad boards are widely used in PCB manufacturing. Their role is to provide a surface for electrical components to connect through conductive copper traces. CCLs are widely used in applications including, but not limited to:

Electronic products: Copper clad board is the basic material of electronic products, used to manufacture various electronic equipment circuit board, such as TV, radio, computer, computer and so on.

Communication equipment: Mobile phones, tablet computers, routers and other communication equipment a large number of copper clad laminate.

Computers and peripherals: Computer motherboards, graphics cards, hard disks, etc., need a large number of copper-clad boards.

Automotive electronics: Electronic equipment in modern automobiles, such as ABS, air conditioning, navigation, etc., need to use copper clad board.

Military: Electronic components in military equipment also need to use a large number of copper-clad boards.

In addition, copper clad boards are also used in industrial control, medical instruments, national defense, aerospace and other fields. With the development of technology and the increase of application demand, the use of copper clad plate in electronic products is more and more extensive, which plays an important role in promoting the renewal of social production and living tools. For example, the development of the Internet of Things and artificial intelligence, as well as the application of 5G communication technology, have greatly increased the demand for copper clad sheets. ‌

What is the Market Report for Copper Clad Laminate?

The market for copper clad laminate has grown steadily due to the increasing demand for consumer electronics, automotive advancements, and telecommunication developments. The global CCL market is expected to expand significantly over the next few years, driven by technological advancements in 5G, renewable energy systems, and electric vehicles.

Key players in this market are working to develop lighter, thinner, and more efficient CCLs to keep pace with the growing need for high-performance electronics. Manufacturers exploring new materials and production methods to reduce costs while enhancing performance. The future looks promising, with a forecast of rapid growth driven by the electronics industry’s evolution.

Is Copper Clad Better Than Copper?

Copper clad laminate is a more practical option for PCBs than solid copper because it provides the required conductive properties at a lower cost. While copper is an excellent conductor, using copper as metal core PCBs would be expensive and impractical. CCL offers the same conductivity benefits but adds a lightweight, non-conductive layer that provides structural support.

Electrical Conductivity and Cost Efficiency

While pure copper has excellent electrical conductivity, copper clad laminates (CCLs) provide a balance between cost and performance. In a copper clad board, only a thin copper layer is used, which significantly reduces the amount of copper needed compared to using solid copper. For applications like PCBs, where large surfaces need copper conductivity but do not require the full thickness of copper, copper clad is more efficient and economical.

Thermal Management

Copper clad materials often have better thermal management properties due to the substrate’s ability to dissipate heat while maintaining the copper layer’s high conductivity. Pure copper, while an excellent heat conductor, may not offer the same level of thermal dissipation when used alone in complex electronic assemblies. For instance, in multi-layer PCBs, copper clad boards help balance the need for heat management and conductivity by using the copper layer efficiently while the base material manages thermal stress.

Structural Support and Durability

Copper clad laminates provide added structural support compared to pure copper sheets. The non-conductive substrate, often made of fiberglass, resin, or other materials, adds durability and rigidity to the thin copper layer. By contrast, is soft and flexible, making it unsuitable for structural applications without some form of backing material.

Corrosion Resistance

Copper, though highly conductive, is prone to oxidation and corrosion over time, which can affect its performance in certain environments. Copper clad laminates, however, are often treated with protective coatings or layered with other materials to enhance their resistance to corrosion.

Weight Considerations

Another important factor is weight. Copper is a dense metal, and using thick copper layers can significantly increase the weight of a product. In contrast, copper clad laminates achieve high conductivity with only a fraction of the copper’s weight.

How Thick is Copper Clad Board?

The thickness of a copper clad board depends on its intended application. Standard copper thicknesses for CCL are measured in ounces per square foot, typically ranging from 0.5 oz to 2 oz per square foot. This translates to about 17 to 70 microns. For high-power applications, thicker copper, such as 3 oz or more, may be used.

On the other hand, the thickness of the laminate itself can also vary, depending on whether it’s a single-layer, double-layer, or multilayer board. The insulating substrate can range from 0.2 mm to several millimeters, depending on the application. The total thickness of the copper clad board is a combination of the copper foil and the insulating material.

How Much Does Copper Cladding Weigh?

The weight of copper cladding is typically expressed in ounces per square foot. A common weight is 1 oz of copper, which means that a square foot of copper clad board has a 1-ounce copper layer. This is approximately 35 microns thick. Heavier copper cladding, such as 2 oz or 3 oz, is also used for applications that require higher current-carrying capacity or greater durability.

It’s important to balance the weight with the application needs. Higher copper weight provides better conductivity and durability but adds cost and weight to the final product. Therefore, the choice of copper weight in CCL depends largely on the required performance and cost considerations.

Copper Clad Laminate Price

The price of copper clad laminate varies based on several factors such as copper thickness, substrate material, board size, and production volume. Standard-grade CCL is more affordable, while high-end options with specialty substrates like Teflon or ceramic tend to be more expensive.

On average, copper clad laminate costs range from $5 to $15 per square meter for common types. However, high-performance laminates designed for demanding environments, such as those used in aerospace or military applications, can be significantly more expensive.

Global market trends, material shortages, and the demand for electronics heavily influence pricing. Recently, fluctuations in copper prices and supply chain disruptions have impacted the cost of CCL. Still, bulk orders or long-term contracts with suppliers can help reduce costs for large manufacturers.

How to Cut Copper Clad Laminate?

CCL requires careful handling to ensure precise cuts without damaging the copper layer or the substrate. The cutting method will vary depending on the thickness and material, but overall, clean and accurate techniques are key.

1. Choose the Right Tools

The tools you use depend on the thickness of the copper clad laminate. Thin CCL can be cut with a utility knife, while thicker boards require specialized tools like a PCB shear or laser cutter.

2. Prepare the Work Area

Before cutting, ensure that your workspace is clean and stable. Use a flat surface to keep the laminate steady during cutting. For larger boards, use clamps to secure them in place. Always wear protective gear like goggles and a mask, especially when working with power tools to avoid dust and debris.

3. Measure and Mark the Cutting Line

Accurate measurements are crucial for a clean cut. Use a ruler or measuring tape to mark the cutting line and draw it clearly with a permanent marker. Double-check your measurements to avoid mistakes before cutting.

4. Score the Copper Clad Laminate

For thin laminates, use a utility knife to score along the marked line. Score the copper side first, then flip it over and score the substrate. Once both sides are scored, gently bend the laminate along the line until it snaps cleanly.

5. Cut Thick Copper Clad Laminate

For thicker CCL, use a guillotine PCB shear or a Dremel tool. A PCB shear provides a clean, straight cut, while a Dremel is useful for cutting complex shapes. For high precision, a laser cutter is the best choice, especially for intricate designs.

6. Deburr and Smooth the Edges

After cutting, the edges may be rough. Use a file to smooth out any jagged areas, then finish with fine-grit sandpaper.

Safety is important when cutting CCL. Fiberglass and other substrate materials can produce harmful dust. Always wear a dust mask and safety goggles, and work in a well-ventilated area to minimize exposure to particles. In addition to this, avoid over-scoring the laminate, which can damage the substrate or cause copper peeling. Make sure to apply consistent pressure while cutting to prevent uneven edges. Always prioritize safety by using proper protective gear to avoid injuries.

Copper Clad Laminate Suppliers

Numerous suppliers provide copper clad laminate globally. The selection of a supplier depends on factors like the type of laminate, application requirements, and volume needed. Some well-known suppliers include:

Kingboard Laminates
Panasonic
Isola Group
Nan Ya Plastics
Shengyi Technology
Rogers Corporation
Ventec International Group
Doosan Corporation
Iteq Corporation
Mitsubishi Gas Chemical

With over a decade of effort and experience, Best Technology has been actively contributing to the growth of this business. Certified with ISO9001, ISO13485, IATF16949, UL, and RoHS, the company is fully capable of delivering high-quality, eco-friendly PCBs and various types of copper clad laminates at competitive prices.

What is Resistance in a Circuit Board?

Resistance in a circuit board determines how easily electric current flows through the board. Every component and trace on the board offers some resistance, but the goal is to minimize it. Resistance happens when the flow of electrons is blocked or slowed down by the material they travel through. This blockage causes energy loss, often as heat.

In printed circuit boards (PCBs), low resistance is preferred in traces and paths to ensure smooth current flow. However, resistors are intentionally added in circuits to control and manage current flow, protecting sensitive components.

Does A Circuit Board Base Have Low Resistance?

What is the Base of a Circuit Board?

The base of a circuit board is the foundation on which components are mounted and connected. The copper layers, laminated onto the base, provide the conductive pathways that allow current to flow between components. It usually consists of layers of different materials, including a non-conductive substrate like fiberglass, often referred to as FR4. Some other materials also can be used as the base of circuit board, like:

Glass fiber cloth substrate: commonly used in the production of double panels and multi-layer boards, with good mechanical properties and cost effectiveness.

Paper substrate: lower cost suitable for cost-sensitive applications.

Epoxy resin substrate: it has good mechanical properties and thermal stability, widely used in electronic products

Polyimide substrate: it has excellent high temperature resistance, suitable for high performance electronic products.

Polytetrafluoroethylene (PTFE) substrate: very high temperature resistance and low dielectric constant, suitable for high frequency and high temperature environments.

Ceramic substrates: such as alumina, aluminum nitride, etc., with high thermal stability and low dielectric constant, suitable for extreme environments.

Teflon (ETFE) substrate, it has good corrosion resistance, high frequency properties and low dielectric constant.

Metal substrates: metal materials like aluminum or copper are always serve as the base of metal core PCBs, they have very good thermal conductivity, and suitable for high power applications where need good heat dissipation.

How Does a Basic Circuit Board Work?

The basic circuit board connects various electronic components through conductive paths called traces, and performs specific functions through the interaction of electronic components. These tracks are made of copper and are designed to create specific circuits that control the flow of electricity. The circuit board uses insulating materials to isolate the conductive layer of copper foil on the surface, so that the current flows in each component along the pre-designed path to complete the functions of work, amplification, attenuation, modulation, demodulation, coding and so on.

Components such as capacitors, resistors, transistors, and diodes are soldered onto the board. The current flows through the components, following the paths designed in the layout, executing the required tasks, such as powering an LED or processing signals.

For the circuit to work, all components must be properly connected and powered. Any break in these connections can disrupt the flow of current, leading to malfunctions.

The main components and functions of the circuit board:

Pad – metal holes for welding the pins of components.

Through hole – there are metal through holes and non-metal through holes, used to connect the component pins between each layer.

Conductor – the conductive path connecting electronic components.

Components – such as resistors, capacitors, inductors, etc., are connected to each other by conducting lines.

Connector – used to connect external devices.

Electrical boundary – defines the electrical characteristics of the board.

Does an Open Circuit Have Low Resistance?

No, an open circuit has high resistance, often considered infinite.

Open circuit refers to the circuit state when no current passes between two points in the circuit or is connected by a conductor with a very large impedance value (or resistance value). When the branch between two points in the circuit is open, the potential difference between the two points is called “open voltage” and can be measured by a voltmeter. In the open state, because there is no current flow, the resistance is very high, this is because the current path in the open circuit is interrupted, resulting in the current cannot flow, so that the resistance in the open state is extremely high ‌

In contrast, a short circuit refers to the situation where the current does not pass through the electrical appliance and directly constitutes a path. In a short circuit, the resistance in the circuit is small, because the current flows directly through the wire, rather than through the load, resulting in a large current. In this state, the fuse may automatically blow due to excessive current, to prevent the wire from causing a fire due to heat ‌

How to Tell If a Circuit Board is Shorted?

Identifying a shorted circuit board involves looking for signs like:

Burn marks or discoloration on the board.

Swollen or damaged components.

Overheating, causing the board to feel hot to the touch.

The device or board not powering on or malfunctioning.

To confirm a short, a multimeter can be used. By measuring the resistance between points where there should be separation, a very low resistance could indicate a short. This can help pinpoint faulty components or traces.

How to Check Resistors on a Circuit Board?

To check resistors on a circuit board, you can use a multimeter in resistance mode.

Turn off the power to the board and discharge capacitors to avoid any residual current.

Set the multimeter to the appropriate resistance range.

Place the probes across the resistor’s terminals and read the value displayed on the meter.

Compare this value with the expected resistance value, usually printed on the resistor or found in the circuit’s schematic. A large discrepancy could indicate a faulty resistor.

How Are Circuit Boards Grounded?

Circuit boards are grounded by connecting the ground plane, often a large layer of copper, to a grounding point. The grounding modes of the circuit board mainly include single point grounding, multi-point grounding, floating ground and virtual ground. ‌

Single-point grounding

Single-point grounding ‌ is suitable for low-frequency circuits where only one physical point in the entire circuit system is defined as the grounding reference point and all other points that need to be grounded are directly connected to this point. This approach can reduce common ground impedance coupling and low-frequency ground loop interference, and is usually used for circuits with frequencies less than 1MHz.

Multi-point grounding

Multipoint grounding ‌ is suitable for high-frequency circuits, where each ground point of the electronic device is directly connected to the nearest ground plane (that is, the metal base plate of the device). This method can reduce the interference generated by the common ground impedance, and also reduce the parasitic capacitance and inductance, which is usually used for circuits with frequencies greater than 10MHz.

Floating ground

‌Floating ‌ that is, the ground of the circuit is connected to the ground without a conductor, but at a higher potential. The advantage of floating ground is that the circuit is not affected by geoelectrical properties, and can prevent electromagnetic interference caused by the coupling of common ground impedance circuits. However, the disadvantage of this method is that it is affected by the parasitic capacitance, which leads to the change of ground potential and increases the inductive interference to the analog circuit.

Virtual ground

Virtual ground ‌ is similar to floating ground and can be understood as the “floating ground” when the operational amplifier is short and broken.

What is the Rule for Resistance in a Circuit?

The fundamental rule of resistance is governed by Ohm’s Law: V=IR, where voltage (V) is equal to the current (I) multiplied by resistance (R). This shows that the resistance directly affects how much current flows for a given voltage.

In circuits, resistors are used to control current, and their value determines how much current is allowed through. For example, higher resistance lowers the current flow, while lower resistance allows more current to pass.

With over 18 years as an industry leader, Best Technology is one of the most experienced PCB and PCB assembly manufacturer in Asia. We are highly specialized not only in quick-turn PCB prototype and PCB assembly, but also medium and small volume PCB fabrication. In Best Technology, you can enjoy a full-comprehensive one-stop service from PCB design, layout, PCB fabricate, PCB assembly, function testing and delivery. We always try our best to fabricate your PCB with copper clad laminate with the highest quality to meet your demands.

If you have any questions, please feel free to contact us with sales@bestpcbs.com, we will be happy to help you.

PCB Full Form

PCB stands for Printed Circuit Board, a key component in almost all electronic devices. It connects and supports electronic components using conductive tracks, pads, and other features. The design and production of PCBs require precise engineering, as they are crucial for the functionality of the final product.

What is PCB Quote Packaging?

PCB quote packaging refers to the process of gathering and organizing all the details needed to estimate the cost of producing a PCB. This includes not only the design specifications but also the materials, manufacturing processes, and other engineering considerations. It’s not just a financial calculation but a complete engineering analysis that ensures the quote is accurate, feasible, and optimized for production.

The quote must consider every detail that affects production—like material types, size, complexity, and production volume. The aim is to package all these details into a clear, comprehensive quote, ensuring the client understands what they are paying for and why.

Why is Engineering Important in PCB Quote Packaging?

Engineering plays a vital role in the PCB quoting process because it’s not just about estimating costs. It’s about understanding the technical requirements and ensuring that every aspect of the design and production is accounted for. Engineers analyze the design, materials, and manufacturing methods to ensure the quote reflects the real cost of production.

Without engineering insight, a quote could be inaccurate, leading to cost overruns or production delays. Engineers make sure that all technical details, such as layer count, trace width, and component placement, are properly considered.

What Are the Key Factors in a PCB Quote?

Several factors come into play when preparing a PCB quote:

PCB Quote Packaging is What Type of Engineering?

1. Type of manufacturing process

The technical type of PCB determines its complexity and cost. For example, simple single panels cost much less than multi-layer panels, while flexible circuits (FPC) or rigid and flexible panels require more complex manufacturing processes and naturally cost more. In addition, whether advanced technologies such as microvias, laser drilling, blind holes or buried holes are required can also have a significant impact on the quotation.

2. Material type

Materials are an important part of PCB costs. Common materials include FR4, ceramics, metal substrates, etc. FR4 is the most common base material and is suitable for most conventional applications, but for high-frequency, high-temperature environments, ceramic or metal-based materials may be more suitable, but their price is relatively high. Choosing the right material not only affects the performance, but also directly affects the cost.

3. IPC level

IPC grades reflect the quality standards of PCB manufacturing, commonly used are IPC-A-600 grades 1, 2 and 3. The higher the grade, the more stringent the manufacturing requirements, and the corresponding increase in cost. For example, grade 3 PCBS are usually used in high-demand fields such as aerospace and medical equipment, which require higher accuracy and quality control, so the price is higher.

4. Circuit design

PCB circuit design complexity directly affects manufacturing costs. Including wire width, spacing, hole size and so on, the production process has put forward different requirements. High density interconnect (HDI) boards typically require more elaborate wiring techniques and may involve the use of microvias, which will increase the difficulty and cost of manufacturing.

5. PCB size and yield

The size of the PCB directly affects the amount of material used, and the larger the board, the more material is needed. In addition, the yield is also an important factor affecting the quotation. PCB manufacturing with complex design or high density lines is prone to defects, resulting in decreased yield. That means manufacturers may need to produce more boards to meet orders, increasing costs.

6. Material thickness

Different applications require different thicknesses of PCB materials. The standard FR4 thickness is usually 1.6mm, but thinner or thicker boards are sometimes used. Changes in material thickness can affect the overall cost, especially if thicker sheets require special processing or higher strength, and manufacturing expenses will increase accordingly.

7. Copper thickness

The copper thickness in the PCB usually has a standard choice, such as 1oz, 2oz or even thicker copper layers. The higher the copper thickness, the better the conductivity of the PCB, suitable for high-current applications, but the increase in copper thickness will significantly increase the manufacturing cost, especially in the plating and etching process requires additional materials and processes.

8. Stack-up method

The stacking mode determines the number of layers and the interlayer structure of the PCB. Complex multilayer boards or HDI boards require more complex lamination processes. For example, the lamination method may involve multiple pressing, the use of prepregs or special insulation materials. Each additional layer requires more manufacturing steps, resulting in increased costs.

9. Quantity

The quantity of the order has a direct impact on the PCB quotation. High-volume production can reduce unit prices by spreading tooling and setup costs, while small-batch orders are typically more expensive due to relatively high production preparation and start-up costs.

10. Delivery date

The shorter the delivery time, the higher the quotation. Rush orders require prioritizing production, which can disrupt the plant’s production schedule and require additional resource deployment. To meet urgent delivery deadlines, manufacturers may need to work overtime or speed up production, increasing overall production costs.

These are just a few examples, but they show how engineering considerations are woven into every part of the quoting process.

PCB Manufacturing Process

How Do Engineers Calculate PCB Manufacturing Costs?

Engineers calculate PCB manufacturing costs by considering the design specifications and the production methods needed to meet those requirements. They start by analyzing the PCB’s layout and design, which determines factors like layer count, trace width, and hole size. Each of these elements has a direct impact on the materials used and the manufacturing process.

They also consider the assembly process—whether it’s surface-mount or through-hole—and what testing will be required. After evaluating these details, they calculate the costs associated with each step of the manufacturing process. This ensures the final quote is both accurate and comprehensive.

What Type of Engineer Designs PCBs?

Engineers who design PCBs typically have a bachelor’s degree or above in electrical engineering, automation, computer science, or a related field ‌ and understand the basics of electronic design, printed circuit board (PCB), and electronics manufacturing in the PCB industry. These engineers need to master PCB design software such as Altium Designer, Eagle PCB, PADS, or CAD, etc., as well as the use of related manufacturing and testing tools. At the same time, they need to have a knowledge of the PCB industry, a certain circuit design and electronic components knowledge, including digital and analog circuits, signal processing, power electronics, embedded systems, communication technology, etc. In addition, holding certificates such as IPC-2221/2222, IPC-A-600/610, and CID (Certified Interconnect Designer) can prove that they have relevant professional knowledge and skills, which can help improve their career competitiveness.

These engineers also need to have a strong sense of responsibility and team spirit, have good communication and coordination skills, and be able to work effectively with customers, manufacturers, and other team members. For junior engineers, it is recommended to study in a single point of depth, such as PCB design, SI simulation, thermal design, EMC design, product testing, etc., and then start from this advantage point to expand the scope of knowledge

What Materials Are Considered During PCB Quote Packaging?

The type of material used for a PCB is a major cost driver. Common materials include:

This is the most common material used in PCBs due to its balance of cost and performance. It’s versatile and reliable for most standard applications.

Metal Core

Metal core PCBs are used in applications where heat dissipation is a concern, such as LED lighting. These boards are more expensive due to the metal layer.

Ceramic

Ceramic materials are used for high-frequency or high-temperature applications. They are more costly but offer better performance in extreme conditions.

Each material has its own manufacturing process, which also affects the cost. For instance, metal core boards may require different drilling techniques compared to standard FR4 boards. Engineers must consider these details when preparing a quote.

How Does the Choice of PCB Manufacturing Methods Impact the Quote?

The method used to manufacture the PCB can greatly impact the final cost. Common methods include:

Surface-Mount Technology (SMT): This is the most common method for modern PCB assembly. It’s efficient and cost-effective for most applications.

Through-Hole Technology (THT): This method is used for components that require a stronger mechanical bond. It’s more labor-intensive and, therefore, more expensive.

Flexible and Rigid-Flex Manufacturing: These types of PCBs require specialized processes and materials, which can increase the cost.

Additionally, advanced techniques like laser drilling for microvias or selective soldering for complex assemblies may be necessary for high-precision designs. Each of these methods requires careful consideration, and engineers must choose the best process for both the design and the budget.

Who Designs PCB?

Since 2006, Best Technology has been the leading PCB quick turn manufacturer specializing in both PCB prototype and production quantities, initially produced single-sided and double-sided printed circuit boards for the consumer electronics market. Now, we provide not only FR4 PCB, but also some special PCB like flex circuit, metal core PCB, ceramic PCB, extra thin PCB, HDI PCB, IC substrate, busbar PCB, heavy copper PCB and so on. We can make 50 layers PCB, and it is not our limit.

Nowadays, Best Technology has grown to become a major PCB manufacturer in Asia to serve in diverse customers base such as electronics appliance, communication, educational electronics, power supplies, automations.

For more information about PCB, or to learn more about the online quote and ordering process, please visit www.bestpcbs.com

Archive for the ‘FR4 PCB’ Category

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What is Copper Clad Laminate?

What is Copper Clad Board Used For?

What is the Market Report for Copper Clad Laminate?

Is Copper Clad Better Than Copper?

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How Much Does Copper Cladding Weigh?

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How Are Circuit Boards Grounded?

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PCB Full Form

What is PCB Quote Packaging?

Why is Engineering Important in PCB Quote Packaging?

What Are the Key Factors in a PCB Quote?