With the gradual deepening of electronic technology in various application fields, the highly integrated circuit board has become an inevitable trend. Under this situation, the disadvantage of traditional circuit board FR-4 and CIM-3 in TC (thermal conductivity) has become a drawback to delay the development of electronic technology. Though the metal core PCBs are known for their good thermal management, they hard to meet the fast heat dissipation and miniaturization of the devices at the same time. This is why ceramic PCB stands out.
What is Ceramic PCB?
A ceramic PCB is a type of PCB made from ceramic materials, such as alumina (Al2O3), ALN (aluminum nitride), or Beryllium Oxide (BeO). These materials are prepared by using thermal conductive ceramic powder and organic adhesive under the condition of below 250℃. Ceramic powders are not easy to made, especially for aluminum nitride powder, this is one of reasons that why ALN ceramic PCB is more expensive.
There are some different methods to make ceramic PCBs, commonly in the market are thick film, DBC, DPC and thin film technology. Different types of ceramic circuit boards have its unique characteristics. May you heard about HTCC, LTCC and AMB, they are also the ways to make ceramic PCBs, but there just a few manufacturers can make. Here is a HTCC ceramic PCB that we made.
Why Ceramic PCBs are popular used?
Different from the traditional FR-4 PCB (wave fiber), ceramic PCBs have good high-frequency properties, electrical properties that organic materials can’t achieved. It is a new generation of large-scale integrated circuits and power electronics module ideal packaging materials. The main advantages of ceramic circuit board including:
Higher thermal conductivity
More matched thermal expansion coefficient (CTE)
Lower resistance
Good weldability and can be used in high temperature
Good insulation
Lower high-frequency loss
High density assembly available
No organic ingredients, resistance to cosmic rays, high reliability in aerospace
No oxide layer in copper layer, so it can be used for a long time in a reducing atmosphere
Who is the Best Ceramic PCB Manufacturer?
There are so many PCB manufacturers in the domestic and aboard, but reliable ceramic PCB vendors with good quality and reasonable price are very few. If you are looking for an experienced one, then keep the change. We’re the best option! Best Technology offers ceramic PCBs for our customers more than 100k every year, and we are high mixed from thick film ceramic PCB, DPC ceramic PCB, DBC/DCB ceramic PCB to AMB. Your PCBs need to use in automotives? Don’t worry, we gained IATF16949 and ISO13485 certifications, and all the manufacturing processes are strictly followed by ISO9001 quality control system. We welcome all the questions and inquiries from everyone.
Here is our ceramic PCB manufacturing capability for your reference.
Ceramic PCB Manufacturing Capability
No.
Item
General Parameter
Special Process
1
Substrate
High insulation, chemical corrosion resistance, high-temperature resistance
Al2O3
Glass, quartz, sapphire, 99% , 92% Al2O3 (black)
2
Excellent thermal conductivity, low thermal expansion coefficient, and high-temperature resistance
AIN
3
Insulation performance and high-temperature stability
ZTA
4
High strength, high hardness, high thermal conductivity, and low dielectric loss
In our daily life, electronic devices are existing everywhere. And there are many people know the “PCB†nowadays, while very less people know the “PWBâ€. Unless you’ve been in the PCB business for more than 20 years.
Actually, PWB is another term of circuit board, and it was used commonly before the year 1999. But with the development of electronics, it was replaced by PCB gradually. You want to know more about it? In this article, we will answer it for you. Deeply explain their definitions, manufacturing process, applications and the key differences between PCB and PWB.
What is A Printed Circuit Board (PCB)?
A Printed Circuit Board is a fundamental component in modern electronics, providing the physical and electrical connections for various electronic components. It consists of multiple compositions, including a non-conductive substrate, conductive pathways, and insulating layers, which facilitate the complex circuitry required in contemporary devices. A PCB can be made into single sided PCB, double sided PCB and multilayer PCB.
PCBs are integral to the functionality of a wide range of electronic products, from consumer gadgets like smartphones and computers to industrial machinery, medical devices, and aerospace systems. The advanced design and manufacturing processes involved in PCB production ensure high reliability and performance, making them essential in virtually all electronic applications.
Basic manufacturing process of PCB
Design and Layout
PCBs are designed using sophisticated computer-aided design (CAD) software. Designers create detailed layouts, specifying the placement of components, conductive pathways, and vias (interlayer connections). The design is converted into Gerber files, a standard format for PCB fabrication that contains all the necessary information for manufacturing. These files are essential for ensuring precision and accuracy during the manufacturing process.
Material Preparation
The substrate, typically FR4 (fiberglass epoxy laminate), is prepared. FR4 is known for its excellent mechanical strength and thermal stability, making it an ideal base material for PCBs. Copper sheets are laminated onto the substrate, which will form the conductive pathways after the etching process. This preparation stage is crucial for creating a reliable foundation for the PCB.
Printing the Circuit Pattern
A photoresist, a light-sensitive material, is applied to the copper-clad substrate. The board is exposed to ultraviolet (UV) light through a mask that defines the circuit pattern. The UV light hardens the photoresist in the exposed areas. The board is then developed in a chemical solution that removes the unexposed photoresist, revealing the copper to be etched away. This step accurately transfers the circuit design onto the board.
Etching
The board is immersed in an etching solution, commonly ferric chloride or ammonium persulfate, which removes the unprotected copper, leaving only the desired circuit pattern. This etching process is crucial for defining the conductive pathways on the PCB, ensuring that the correct connections are made according to the design specifications.
Drilling
Precision drilling machines are used to create holes for through-hole components and vias. These holes are then cleaned to remove any debris that could affect electrical connectivity. Drilling is a critical step in the PCB manufacturing process as it ensures proper placement and connection of components across different layers of the board.
Plating
The drilled holes are plated with copper to create electrical connections between the layers, which is especially important for multilayer PCBs. Additional layers of plating, such as nickel or gold, may be applied to improve conductivity and protect against oxidation. This plating process enhances the durability and performance of the PCB.
Solder Mask Applying
A solder mask is applied to protect the copper traces from oxidation and prevent solder bridges between closely spaced solder pads. The solder mask is exposed to UV light and then developed to reveal the solder pads. This layer not only protects the PCB but also improves its appearance and reliability.
Silkscreen Printing
A silkscreen layer is printed on the board to add text, component labels, and other identifiers. This layer helps in the identification and assembly of components, making it easier for technicians to work with the PCB during the manufacturing and repair processes.
Surface Finishing
Generally, a layer of surface finishing is coated on the PCB to protect its surface, it also called surface treatment. The common surface treatments are HASL-LF, ENIG, ENEPIG, OSP, Immersion Silver/Tin. Of course, different treatment offers different function, like OSP is to protect surface from oxidation, HASL-LF provides a good solderability, ENEPIG make sure the chemistry corrosion. Choose a suitable one according to your specific demands.
Assembly and Testing
Components are placed on the board using automated pick-and-place machines, and soldered using techniques like reflow soldering for surface-mount devices (SMD) and wave soldering for through-hole components. The finished PCB undergoes various tests, such as automated optical inspection (AOI), electrical testing, and functional testing, to ensure quality and performance. Want see the whole manufacturing process of a multilayer PCB, click here: Manufacturing Process of Multi-layer PCB.
What is the definition of Printed Wiring Board (PWB)?
A Printed Wiring Board is a term historically used to describe a type of circuit board that focuses primarily on the layout and wiring of electronic connections rather than the overall circuit functionality. PWBs emphasize the physical arrangement of conductive paths to connect various components but do not necessarily include all the integrated features found in modern PCBs.
This term was more prevalent during the earlier stages of electronic development, where the primary concern was establishing reliable electrical connections. As technology advanced, the term PCB became more common, reflecting the expanded capabilities and comprehensive role of these boards in forming complete electronic circuits. Despite being less common today, understanding the term PWB is crucial for historical context and certain niche applications.
How to Manufacture A Printed Wiring Board (PWB)?
Design and Layout
PWBs typically have simpler designs focused on wiring patterns rather than complex circuitry. In some cases, the layout may be done manually or using basic design software.
Material Preparation
Simpler substrates such as phenolic or epoxy resins may be used for PWBs. Copper sheets are laminated onto the substrate to form the conductive pathways. These materials are cost-effective and suitable for applications where advanced performance characteristics are not required.
Printing the Wiring Pattern
Similar to PCBs, a photoresist is applied to the copper-clad substrate. The board is then exposed to UV light through a mask and developed to reveal the copper to be etched away. This process creates the wiring pattern necessary for connecting electronic components.
Etching
The board is immersed in an etching solution to create the wiring pattern. This step is straightforward compared to the more intricate etching processes used in PCB manufacturing, reflecting the simpler requirements of PWBs.
Drilling
Holes for through-hole components are drilled, but the process may not require the precision needed for complex PCBs. This basic drilling process is adequate for the less demanding applications of PWBs.
Plating (if necessary)
Plating is done to ensure electrical connectivity but may not involve advanced techniques like those used for multilayer PCBs. It suffices for the simpler construction of PWBs.
Solder Mask Application
A basic solder mask may be applied to protect the wiring pattern. This layer provides sufficient protection for the relatively simple designs of PWBs, preventing short circuits and oxidation.
Silkscreen Printing
A simple silkscreen layer may be added for component identification. This helps in the assembly process but does not require the detailed labeling often necessary for PCBs.
Assembly and Testing
Components are manually or semi-automatically placed on PWBs and soldered using standard techniques. Basic electrical testing is conducted to ensure functionality. This simpler assembly and testing process aligns with the less complex nature of PWBs.
Which Kind of Materials used in PCB and PWB?
Substrate Materials
FR4 (fiberglass epoxy laminate) is the most common substrate material for PCBs due to its excellent mechanical strength and thermal stability. Phenolic resin, used in PWBs for simpler applications, is less durable and has lower thermal stability compared to FR4, but it is cost-effective and suitable for basic electronic devices. Polyimide is used for flexible PCBs due to its high flexibility and thermal resistance, making it ideal for applications requiring bending and flexing, such as wearable electronics and flexible displays.
Conductive Materials
Copper is the primary conductive material for both PCBs and PWBs. It is used to create the conductive pathways and pads, providing excellent electrical conductivity and reliability. Gold, nickel, and silver are used for plating to enhance conductivity and protect against oxidation, primarily in PCBs. These materials improve the durability and performance of the PCB by providing a reliable contact surface for soldering and component connections.
Insulating Materials
Prepreg, a fiberglass cloth impregnated with resin, is used in multilayer PCBs to bond the layers together. Prepreg provides mechanical strength and electrical insulation between the layers. Dielectric materials are used between layers in multilayer PCBs to provide electrical insulation, maintaining signal integrity and preventing short circuits.
Solder Mask Materials
Liquid Photo Imageable (LPI) solder mask is the most common type used in PCBs, providing excellent protection and durability. LPI solder masks are applied using a photolithographic process, ensuring precise coverage and protection. Dry film solder mask is used for simpler applications and PWBs. This type of solder mask is less expensive and easier to apply but may not offer the same level of protection as LPI solder masks.
Key differences between PCB and PWB
Feature
PCB (Printed Circuit Board)
PWB (Printed Wiring Board)
Design and Layout
Designed using sophisticated CAD tools for complex circuitry, including detailed simulation and optimization.
Simpler designs focused on wiring patterns, often done manually or with basic software.
Layer Count
Can have multiple layers (e.g., double-sided, multilayer) to support intricate circuit designs.
Generally single or double-sided, less commonly multilayer.
Component Types
Supports surface-mount technology (SMT) and through-hole technology (THT) components.
Designed to maintain high signal integrity, minimizing electrical noise and interference.
Basic signal integrity management, sufficient for simple applications.
Flexibility and Rigidity
Includes both rigid and flexible PCBs, allowing for a wide range of applications.
Typically rigid, not commonly used in flexible applications.
Terminology and Usage
Universally used in the industry to refer to boards that integrate all necessary components to form complete circuits. Also called “bare boardâ€.
Universally used in the industry to refer to boards that integrate all necessary components to form complete circuits.
Industry Standards
Recognized by standards organizations like IPC, IEC, and ANSI with specific performance and quality criteria.
Covered under broader standards but with fewer specific guidelines due to limited modern use.
Cost and Efficiency
Higher cost due to advanced materials and processes, offering superior performance and reliability.
More cost-effective for simple applications, but with limited performance and reliability.
Applications
Used in consumer electronics, industrial equipment, medical devices, aerospace, and defense.
Historically used in simpler electronic devices and early computers, still relevant in niche applications.
(Summary Differences: PCB VS PWB)
Other Terms Related to PWB and PCB
Based on the PCB and PWB, you may still hear about CCA, PCA, PWA during the PCB working. These terms are also related to printed circuit board. Here is a detailed explanation of each:
Printed Wiring Assembly (PWA)
PWA is the abbreviation for printed wiring assembly. This is an archaic term that was once used to describe what we now refer to as PCB assembly or PCBA. Although it is less common today, understanding this term is useful for historical context and when dealing with older documentation.
Circuit Card Assembly (CCA)
CCA stands for circuit card assembly. It is essentially the same thing as PCBA, where the PCB is assembled with all necessary components to create a functional unit. CCA is a less frequently used term compared to PCBA but is still recognized in certain industries and contexts.
Printed Circuit Board Assembly (PCBA)
PCBA is the abbreviation for printed circuit board assembly. When the PCB is assembled with all its electronic components by SMT technology, it is called PCBA or PCB assembly. Since a change in terminology in 1999, PCBA has become the standard term used for all assembled circuit boards. From users to technical committees, PCBA is the preferred term for referring to assembled boards. The assembly process involves placing and soldering components onto the PCB, making it a functional electronic circuit.
Printed Circuit Assembly (PCA)
PCA stands for printed circuit assembly, which is another term for PCBA. Like CCA, PCA is not commonly used in modern terminology but refers to the same concept of an assembled printed circuit board.
In a word, whatever for PWB, PCB, or circuit cards, they are refer to bare printed circuit boards (bare boards). While PCA, CCA, PWA, and PCBA refer to assembled circuit boards. Among these terms, PCB and PCBA are the most widely used in both industry and technical documentation.
This is the end of this introduction of PWB and PCB, welcome to contact us if you want more about PCB knowledge.
In today’s tech-driven world, creating efficient high speed PCB (Printed Circuit Board) is critical for ensuring devices can handle rapid data transfer without issues. These high speed PCBs are popular in the wireless devices which needs high signal transfer. Crafting high-speed circuits requires careful planning and precise execution to maintain signal quality and overall performance. In this blog, we introduced the basics of high-speed PCB design, offering practical tips and insights into the best materials and techniques for high-frequency applications.
What is a High Speed Circuit PCB?
High-speed PCB is a circuit board that can support signal transmission. High-speed signals usually refer to signals with frequencies higher than 50MHz, such as high-speed digital signals, high-speed analog signals, etc. These fast transitions can introduce challenges like signal reflections, electromagnetic interference (EMI), and crosstalk, which can disrupt performance if not properly managed.
Additionally, these signals will be affected by board materials, layout, wiring and other factors during transmission. Therefore, a specially designed circuit board is required to ensure the integrity and reliability of the signal. Here is a 4 layers high speed PCB for Iradar device with 50ohm single-ended impedance control.
Features of High-Speed PCB
High frequency
Low permittivity and low loss factor
Multilayer design
Strict impedance control
High-precision manufacturing
Low noise characteristic
High density circuit layout (micro-vias)
High performance
What is Considered High-Speed PCB Design?
High-speed PCB design focuses on managing the complexities that come with high-frequency signals and fast switching. Key considerations include:
– Signal Integrity: Ensuring signals travel without distortion or loss.
– Power Management: Distributing power effectively to minimize noise and voltage drops.
– Heat Handling: Managing heat from high-speed components to prevent overheating.
– Impedance Matching: Keeping impedance consistent to reduce signal reflections and loss.
– Differential Pair Routing: Reducing EMI and crosstalk by routing complementary signal pairs together.
This type of high speed pcb design requires a solid understanding of electromagnetic principles, advanced simulation tools, and precise manufacturing techniques. For those new to high-speed PCB design, Best Technology offers expert guidance and solutions.
What’s the Best Material for High-Speed PCB Design?
Choosing the right material for high speed pcb is vital for maintaining signal integrity and achieving optimal performance. The material impacts the board’s dielectric constant (Dk), loss tangent, and overall signal quality. Common materials include:
– FR4: Widely used but not ideal for very high frequencies due to higher loss tangent.
– Rogers (RO4000 series): Preferred for high-speed designs thanks to its low dielectric constant and loss tangent.
– Teflon: Excellent for high-frequency applications but more expensive and harder to process.
Selecting the appropriate material ensures the PCB can handle high-speed signals without compromising performance.
Where is the High-Speed PCB Commonly Used in?
High-speed circuit boards are widely used in signal transmission applications, the typical fields are including:
1. Communication equipment – such as 5G base stations, optical fiber communication equipment, etc.
2. Data center – like high-performance computing, storage servers, etc.
3. Consumer electronics in our daily life – high-end smartphones, tablets, gaming devices, etc.
4. Aerospace and military – high speed are always used in high-end devices. For example, radar, navigation systems and other equipment with high reliability requirements.
What is the 3H Rule in High Speed PCB Design?
The 3H rule is a guideline suggesting that signal traces should be spaced at least three times the height of the dielectric (3H) between the signal layer and the adjacent ground or reference layer. This helps minimize crosstalk and maintain signal integrity, particularly for high-speed digital signals with rise times of 1 ns or less. Key aspects include:
– Trace Spacing: Keeping traces apart by at least 3H reduces electromagnetic coupling and interference.
– Signal Integrity: Adequate spacing helps maintain clear signals in high-speed circuits.
– Effectiveness: This rule is especially beneficial for fast digital signals, reducing the risk of crosstalk and interference.
For instance, if the dielectric height between the signal layer and the reference layer is 0.2 mm, traces should be at least 0.6 mm apart to follow the 3H rule.
How to Design a High-Speed Board?
Designing a high-speed PCB involves several strategies to ensure effective signal transmission, power distribution, and minimal EMI. Here’s a step-by-step approach:
Component Placement and Layer Stack-Up
Place high-speed components to minimize signal paths and interference. Group related components to simplify routing. In addition, create a layer stack-up that supports controlled impedance and reduces signal loss. Use ground planes between layers for a return path for high-frequency currents.
Trace Routing and Impedance Control
Keep high-speed traces short and direct, avoiding right-angle bends. Use microstrip or stripline configurations for controlled impedance and minimal noise. For impedance control, calculate and ensure consistent impedance for traces. Use differential pair routing for high-speed signals to reduce EMI and crosstalk.
Power Distribution and EMI Mitigation
Use decoupling capacitors near high-speed components to filter noise and stabilize the power supply. Design a robust power distribution network to minimize impedance and ensure stable voltage. And employ proper grounding and shielding techniques. Route high-speed signals on inner layers between ground planes to reduce EMI and provide a consistent return path.
Simulation and Testing
Use signal integrity analysis tools like SI or PI to simulate the PCB layout, predicting signal behavior and identifying potential issues. Analyze aspects like eye diagrams to assess signal quality.
High-speed PCB design is a complex but rewarding endeavor that ensures your electronics perform efficiently in high-frequency environments. By understanding the fundamentals and applying the right techniques and materials, you can create robust, high-speed boards. Best Technology is here to assist you with expert advice and solutions for your high-speed PCB needs.
Best Technology has been a leader in PCB manufacturing and design for over 17 years. Our R&D team allows us to offer customers quick and valuable PCB design solutions. Here, we share one of our industrial motherboard design for PICE card for your reference.
PICE card
[1]: Main chip: XCKU11P
[2]: 30A maximum current
[3]: Single pair differential line, 10G optical network
[4]: 14 layers PCB
If you need a custom industrial PCB design, please feel free to contact us.
A video decoder PCB design comprises several critical components that ensure efficient video signal processing. It includes the video decoder IC, memory modules (such as DDR RAM), power management units, and connectors for video input and output. You can see a video decoder pcb design example as following:
Video decoder
[1]: Xlinx: XC7K325T, Hisilicon: HI3521DV100_VI
[2]: Single pair differential line, 10G optical network, memory of DDR4
[3]: 12 layers PCB
Why choose us?
We are a China based fabricator with over 17 years experience, what we provide not only including PCB design service, but also PCB fabricating, PCB duplicating and component sourcing and so on. Choose Best Technology you can enjoy:
When designing high-speed PCBs, several critical factors must be considered to ensure optimal performance. These include signal integrity, impedance control, and minimizing electromagnetic interference (EMI). Below is an ultra high speed camera PCB solution made by Best Technology:
An ultra-high-speed camera rigid-flex circuit board
[1]: XCKU060 chip
[2]: 20A maximum current
[3]: Four DDR4 channels
[4]: 20 layers PCB
Camera PCB design considerations:
1. When the Camera adopts a connector: when the MIPI differential signal passes through the connector, the adjacent differential signal pairs must be isolated using GND pins; If it is not convenient to punch holes, the spacing between the difference pairs is at least 15mil.
2. If there is a reserved test point for the Camera connection seat, it should be close to the connection seat, and the Stub on the cable should be as short as possible.
3. Decoupling capacitors of AVDD/DOVDD/DVDD power supply need to be placed as close as possible to the Camera connection base.
4. The Camera layout needs to be far away from high-power radiation devices, such as GSM antennas.
5. CIF/MIPI and other signals, if there is a board to board connection through the connector, it is recommended that all signals be connected with a certain resistance value (between 2.2ohm and 10ohm, depending on the SI test), and reserve TVS devices.
Best Technology offers one-stop solutions for our values customers. And we provide free technical support for our customers. If you have similiar requirements, welcome to contact us at any time!
PCB design is one of an important process before the PCB manufacturing, it determines the overall performance of the whole product. We are an experienced PCB design and manufacturing vendor, with our professional technical team and advanced evaluated tools, we can make sure the PCB design one-time success. Today, we shared a example of fiber optical SFP modules design:
32X100G(QSFP28) large capacity convergence shunt
[1]: Marvell: 98CX8522
[2]: Single pair differential line, 25G optical network
[3]: 16 layers PCB
How to design a SFP optical module PCB?
SFP optical module interface PCB design depends on many aspects, including interface signal processing, timing control, power management and so on.
1. Determine the interface standard: SFP optical module interface standards, such as SFP, SFP+, QSFP and so on, you need to choose the appropriate interface standard according to the specific needs.
2. Choose the chip solution: According to the interface standard, choose the appropriate chip solution, usually including constant voltage source, amplifier, comparator, clock generator, EEPROM, etc.
3. Signal processing: For receiving and sending signals, filtering, amplification and comparison are required to ensure signal quality and stability.
4. Timing control: The timing and frequency of the clock signal need to be accurately controlled to ensure the correctness and stability of data transmission.
5. Power management: SFP optical module interface requires multiple power supplies, including Vcc, VCC-TX, VCC-RX, etc. Reasonable power management is required to ensure the stability and reliability of the power supply.
6. PCB design: According to the above requirements, PCB design is carried out, considering signal isolation, layering layout, status separation, signal integrity and other factors.
Feel freely to send message us if you are interested in PCB design.
A motherboard network adapter PCB comprises several key components, each playing a vital role in ensuring effective network connectivity. And between them, the PCB is the most important. Now, best technology is sharing an example about motherboard network PCB design.
10G/100G large capacity convergence shunt
[1]: Marvell: 98DX8548
[2]: 21A maximum current
[3]: Single pair differential line, 10G and 25G optical networks
[4]: 10 layers PCB
What are the considerations before PCB design?
PCB design involves several steps and some considerations need to be noticed. If you are a designer, think about these points before starting the design.
Manufacturing: prototyping study or mass production.
What it will be used in?
What kind of production technology it will used?
Material?
How many layers you want?
Whether need to do impedance control?
Best Technology has more than 17 years in this industry, we have served for over 1200 customer all around the world. Our goal is to provide customer with best solutions and top notch quality products, and it is luckily that we did a good job. If you want to work with us or need a PCB manufacturer in Asia, contact us right now!
A high-speed circuit handles signals that switch quickly or operate at high frequencies, typically above 50 MHz, though some advanced systems may go into the GHz range. Best Technology is a one-stop PCB manufacturer that covers pcb design, pcb layout, pcb diagram, DFM, SI, PI analysis, PCB manufacturing and so on. In the following, you can see a high speed pcb design solution for industrial switch that we cooperated with our customer.
32 x 400GE industrial switch
[1]: Marvell-400G chip
[2]: 200A maximum current
[3]: Single pair differential line 56G optical network
[4]: 24 layers high power PCB
What’s the Best Material for High-Speed PCB Design?
Choosing the right material is vital for maintaining signal integrity and achieving optimal performance. The material impacts the board’s dielectric constant (Dk), loss tangent, and overall signal quality. Common materials include:
FR4: Widely used but not ideal for very high frequencies due to higher loss tangent.
Rogers (RO4000 series): Preferred for high-speed designs thanks to its low dielectric constant and loss tangent.
Teflon: Excellent for high-frequency applications but more expensive and harder to process.
Selecting the appropriate material ensures the PCB can handle high-speed signals without compromising performance.
For the PCB design service, we can make sure the one-time success to save much time and money for customers. Our goal is to work with customers together and win more market with our clients. Just feel free to contact our technical team if you have similiar designs.
Best technology engaging in the PCB manufacturing and PCB design for more than 17 years. With a strong R&D team, we can provide customers with fast and valued PCB design solutions. Here is one of our industrial motherboard design & industrial PCB case sharing for your reference. If you want to get your own industrial PCB design, welcome to contact us.
A mITX architecture industrial control motherboard
[5]：2x USB 3.0 (Internal) + 1x USB 3.0 (Client) + 2x USB 3.0 (Rear I/O) + 2x USB 2.0 (Rear I/O) +
2x USB 2.0 (Front Header) + 1x USB 2.0 (mPCIe)
Industrial PCB Design Considerations
Control the length of the circuit: Minimize the length of the circuit, especially the key signal lines, to reduce signal attenuation and delay.
Avoid sharp angles and right angles: Right angles and sharp angles should be avoided when wiring, and rounded or 45 degree angles should be used as far as possible to reduce signal reflection and impedance discontinuity.
Line width: Determine the line width according to the current size and thermal requirements to ensure the reliability and stability of the circuit.
Inter-layer wiring: Rational use of multi-layer PCB inter-layer wiring, such as the signal line on the inner layer, power and ground wire on the outer layer.
Impedance control: For high-speed signals, it is necessary to control the line impedance to ensure signal integrity, and carry out impedance matching design if necessary.
Avoid cross and parallel wiring: Try to avoid cross and parallel wiring of signal lines to reduce crosstalk and electromagnetic interference.
Contact us if you have any questions and inquiry about industrial PCB design projects.
