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Can I design microvias in multilayer MCPCB?

Saturday, October 12th, 2024

What is a Microvias?

A microvia is a small hole drilled into a PCB that connects different layers. They are essential for high-density interconnections and are commonly used in advanced electronic designs. Typically, microvias equal to or less than 150 microns drilled on the PCB board with a laser. In 2013, the IPC standard changed the definition of microvias to those with an aspect ratio of 1:1. Ratio of aperture to depth (not exceeding 0.25mm). Previously, micropores were less than or equal to 0.15 mm in diameter, so they typically spanned only one layer.

Can I design microvias in multilayer MCPCB?

Because the diameter is very small compared to mechanically drilled through holes (PTH), we define them as microvias, usually connecting only one layer of the board to its adjacent layers. These through holes reduce the possibility of any type of manufacturing defect because they are laser drilled, thus reducing the possibility of any residue remaining after the process. Because of their small size and ability to connect one layer to the next, they can make dense printed circuit boards with more complex designs.

Types of Microvias

There are two types of microvias in the PCB design – stacked microvias and staggered microvias.

Stacked Microvias

Stacked microvias are formed by stacking multiple layers on top of each other to provide a path through which current flows. Create a hole in one layer and drill into another layer below. The top layer is welded or welded to the bottom layer to form an interconnect between the two layers. This allows for fast, efficient routing without compromising performance or reliability.

Staggered Microvias

The interlaced microvias is aligned with the pad of the same layer, but is offset from its center by half of the pad diameter. The distance from its center to the edge of the board is also half the diameter of the pad. Staggered microvias allow you to place two through holes in a single pad without overlapping them or having to route wires on different layers together in this location. This type of microvias can be used for electrical connections to the surrounding brass pads and traces.

What is the Difference Between Vias and Microvias?

Vias and microvias serve similar purposes in connecting different layers of a PCB, but they differ significantly in size and application.

1. Size

One of the most significant differences between vias and microvias is their size. Standard vias typically have a diameter greater than 150 micrometers (μm), while microvias are defined as having a diameter of 150 μm or less.

2. Design Complexity

As technology advances, the demand for higher circuit densities and more complex designs has grown. Microvias enable designers to create intricate multilayer circuits that were not possible with standard vias.

3. Layer Connection

Standard vias can connect any number of layers in a PCB, typically running from the outer layer through to the inner layers. In contrast, microvias are usually used for connecting one or two layers. Microvias are commonly employed in multilayer PCBs, where they can connect the outer layer to one or more inner layers without passing through the entire board.

4. Aspect Ratio

The aspect ratio, which is the ratio of the depth of a via to its diameter, is another important difference. Standard vias generally have lower aspect ratios, making them easier to fabricate. Microvias, due to their smaller size, often have higher aspect ratios. A typical aspect ratio for microvias ranges from 1:1 to 2:1.

5. Applications

Standard vias are commonly used in traditional PCB designs for applications where space is not as critical. They are suitable for general-purpose circuits, power distribution, and less complex layouts. In contrast, microvias are essential in high-density applications, such as smartphones, tablets, and advanced computing devices, where compact designs are necessary.

Microvias vs. Blind Via

Blind vias connect the outer layer of the PCB to one or more inner layers without penetrating the entire board. As the name suggests, these through-holes are “blind holes” because they are not visible from the other side of the PCB. Blind holes have several advantages, such as saving space on the board, enabling a more compact design, and improving signal integrity by reducing the length of the signal path.

The blind via passes through the surface layer of the PCB, extending through only a portion of the board to connect the surface layer to one or more inner layers. They are a key component in current PCB designs, allowing surface components to connect to inner layers while minimizing the number of layers required for wiring. The advantages of using blind vias including:

Increased density

Reduce the number of layers

Improved signal performance

Good for heat dissipation

Improve mechanical strength

Can Microvias be Designed in Multilayer MCPCB?

Yes, microvias can indeed be designed in multilayer MCPCBs. In fact, their small size and efficient design make them ideal for these types of boards. Multilayer MCPCBs often require compact interconnections to accommodate various functionalities, and microvias facilitate this need. By enabling multiple layers to connect efficiently, microvias enhance the overall performance of the MCPCB. Additionally, they contribute to improved thermal management, a critical factor in high-power applications. Their integration in multilayer designs is a significant advantage for modern electronics.

The process for using microvias in multilayer metal-based circuit boards includes the following key steps:

1. Inner laser drilling and plating: This is the first step in the production of microvias, precisely drilled by laser technology, and electroplated.

2. Resin filled: The micro-vias after electroplating are filled with resin to enhance the stability of the structure.

3. Resin grinding: Grind the orifice after the jack hole to ensure a smooth surface.

4. Electroplating: Metallize the surface of the orifice resin to achieve electrical interconnection between layers.

5. Inner circuit etching and outer layer lamination: To complete the production of the inner circuit, and the outer layer of laser drilling and graphic plating, and finally realize the production of multi-layer circuit board.

MCPCB Material in Best Technology

MCPCB Prototype Lead Time (Vary Depends on the MCPCB Design)

What is the meaning of depaneling?

Aluminum PCB depaneling refers to cutting multiple circuit boards arranged in a row from a large board into separate small boards. This process is to divide a large aluminum printed circuit board (PCB) into multiple independent and fully functional circuit boards for subsequent assembly and use.

Aluminum PCB depaneling is an important link in the production process of electronic devices, which can improve production efficiency and circuit board flexibility.

What are the methods of PCB depaneling?

There are many ways to depanel aluminum PCBs. Common depaneling methods include:

1. ‌V-cut depaneling‌: Use a V-shaped blade to cut a V-shaped groove on the PCB board, and then separate the aluminum PCB along the groove by external force. This method is suitable for smaller aluminum PCB boards and fine dividing lines.

2. ‌Sawtooth depaneling‌: Cut the aluminum PCB board with a sawtooth cutting tool to form multiple small panels, and then separate the panels by pressure or vibration. This method is suitable for aluminum PCB boards with larger areas.

3. ‌Laser depaneling‌: Use a high-energy-density laser beam to accurately cut the aluminum PCB, which is suitable for production environments with high precision requirements and high efficiency.

4. ‌Chemical corrosion depaneling‌: Corrode the aluminum PCB with a chemical corrosive agent to form a dividing line, and then separate the panels by physical methods.

What is the process of depaneling PCB?

The aluminum PCB depaneling process varies depending on the depaneling method. The common aluminum PCB depaneling methods and processes are as follows:

Manual depaneling

Preparation: Check whether the aluminum PCB board meets the conditions for manual depaneling, such as confirming that there are no stress-sensitive components such as SMD (Surface Mounted Devices) on the board, and prepare suitable fixtures and operating space.

Positioning and fixing: Place the aluminum PCB concatenated or assembled boards that need to be separated on a stable workbench and fix them with fixtures to ensure that the boards do not move during the separation process. For aluminum PCB boards with V-grooves, align the V-grooves with the direction that is convenient for force application, and ensure that the board is placed in the correct direction and position to facilitate the separation operation.

Separation operation: The operator uses both hands or simple tools (such as tweezers, etc., and small cutting tools may be used in some special cases, but they must be operated with caution to avoid damaging the board) along the V-groove to break or separate the aluminum PCB board into individual small boards with appropriate force. During the operation, pay attention to controlling the force and direction to avoid damage to the board due to uneven force or wrong direction.

V-cut board separation machine separation

Equipment debugging: Turn on the power of the V-cut board separation machine, and adjust the upper guide knife position and lower knife height of the board separation machine according to the thickness of the aluminum PCB board, the depth and width of the V-groove and other parameters to ensure that the spacing between the upper and lower knives is appropriate and the aluminum PCB board can be accurately cut.

Upper board positioning: carefully place the aluminum PCB board with V groove on the workbench of the V-cut board splitter, ensure that the V groove of the aluminum PCB board fits tightly with the lower knife of the board splitter, and the position of the board is accurate to avoid deviation during the cutting process.

Board splitting operation: start the V-cut board splitter manually, electrically or pneumatically, so that the blade cuts along the V groove of the aluminum PCB board. During the cutting process, pay attention to the cutting situation to ensure that the cutting depth is moderate and will not cause over-cutting or incomplete cutting of the aluminum PCB board.

What is the manufacturing process of aluminum PCB?

The manufacturing process of aluminum substrate PCB mainly includes the following steps: cutting, drilling, dry and wet film imaging, etching, surface treatment and final inspection. ‌

1. Cutting: Cut the large-sized incoming materials into the size required for production, pay attention to the protection of the aluminum and copper surfaces, and avoid scratches and board edge delamination.

2. Drilling: Position the holes in the board to ensure the correct number and size, and avoid scratches on the board and deviation of the hole position.

3. Wet and dry film imaging: Present the parts required for making the circuit on the board, and pay attention to whether the circuit is open and whether the alignment is deviated after development.

4. Etching: Remove the uncovered parts to form the circuit pattern, and pay attention to the quality and stability of the circuit after etching.

5. Surface treatment: Perform necessary surface treatment on the circuit board, such as tin spraying, to improve the performance and appearance of the circuit board.

6. Final inspection: Perform a final inspection on the completed circuit board to ensure that the quality meets the requirements.

What are the advantages of aluminum PCB?

The main advantages of aluminum substrate PCB include:

Excellent heat dissipation performance: The aluminum substrate uses high thermal conductivity aluminum alloy as the core material, which can quickly conduct and dissipate heat, thereby effectively reducing the operating temperature of components.

‌Lightweight design‌: Compared with traditional FR4 substrates, aluminum substrates have lighter weight, which is particularly important in weight-sensitive fields such as aerospace and automobiles, helping to reduce the weight of the overall equipment and improve energy efficiency and operating performance‌.

‌Good mechanical properties‌: Aluminum substrates have high strength and hardness, providing good support and protection for electronic components. At the same time, its excellent impact resistance and vibration resistance enable it to adapt to various complex working environments and ensure the stable operation of the equipment‌.

‌Excellent electrical performance‌: Aluminum substrates have excellent insulation and voltage resistance, which can meet the electrical requirements of electronic equipment in various working environments and provide stable electrical support for the equipment‌.

‌Environmental protection‌: Aluminum substrates are made of environmentally friendly materials, there is no pollution in the production process, and waste is easy to recycle and dispose, which is fully in line with the current trend of green environmental protection‌.

‌Diverse application forms‌: There are many types of aluminum substrates, including flexible aluminum substrates, hybrid aluminum substrates, multi-layer aluminum substrates, etc., suitable for different application needs.

What are the disadvantages of aluminum PCB?

The main disadvantages of aluminum PCB include high cost, difficult process, electrical strength and withstand voltage problems, mismatched thermal conductivity test, inconsistent material specifications, and more defective products. ‌

First, the price of aluminum PCB is relatively high, usually accounting for more than 30% of the product price. This is because the production of aluminum PCB requires the use of high-purity aluminum materials and special processing technology, all of which push up the cost. ‌

Second, the process of aluminum PCB is difficult, especially when it is made into a double-sided board, the process complexity is higher, and it is easy to have problems in electrical strength and withstand voltage. In addition, the mismatch of thermal conductivity test methods and results of aluminum PCB is also a problem. ‌

In addition, the material specifications of aluminum PCB have not yet been unified, and there are multiple standards such as CPCA industry standards, national standards, and international standards, which brings certain uncertainties to production and application. ‌

Why is aluminum no longer used in integrated circuits?

The main reason why aluminum is no longer used in integrated circuits is that copper has replaced aluminum as an interconnect metal material. Copper has lower resistivity and better anti-electromigration performance than aluminum, which makes copper more reliable and effective in high-speed integrated circuits. ‌

Specifically, aluminum may experience electromigration under long-term current, that is, aluminum atoms migrate inside the wire, causing the wire to break or form voids, which in turn causes the integrated circuit to fail. In addition, as the interconnection spacing decreases, the resistance of the aluminum wire increases and the capacitance between the wires increases, resulting in increased RC delay, which is not conducive to high-speed integrated circuits.

Copper has a lower resistivity than aluminum, can transmit current more efficiently, and can carry more current in thinner metal wires. Copper also has higher electromigration resistance than aluminum, making copper interconnects more reliable under high current conditions. These advantages make copper a preferred material for advanced integrated circuit technology.

Aluminum-based PCB depaneling is an important link in the electronic manufacturing process, which directly affects the quality and performance of electronic equipment. By selecting the appropriate depaneling method, controlling the depaneling accuracy, and avoiding damage to the PCB, the quality and efficiency of aluminum-based PCB depaneling can be effectively improved.

What is a 2 Layer Aluminum PCB?

A 2-layer aluminum PCB is a type of metal core circuit board that contains two conductive layers, usually copper, with an aluminum core or base material. Aluminum PCBs are used for their excellent heat dissipation properties, and always used in high-power applications like LED lighting, power supplies, and automotive systems. The aluminum base offers better thermal management than standard FR4 PCBs. In a 2-layer aluminum PCB, the two conductive copper layers allow more complex routing for electrical signals compared to single-layer boards.

2 Layer Aluminum PCB | Metal Core PCB Manufacturer

2 Layer Aluminum PCB Stack-Up

The stack-up of a 2-layer aluminum PCB consists of the following:

Top Copper Layer: This is where the signal traces and components are located. It can vary in thickness, depending on current-carrying requirements.

Dielectric Layer: A layer of insulation that separates the top copper layer from the aluminum core. It plays a key role in electrical isolation and heat transfer.

Aluminum Base: This core provides structural support and excellent heat dissipation properties. It also serves as the grounding plane in some designs.

Bottom Copper Layer: The second conductive layer allows for more advanced routing.

How Thick is a 2 Layer PCB Layer?

The thickness of a 2-layer aluminum PCB can vary depending on the specific design requirements, but typically, the copper layer is about 1 to 2 ounces (35 to 70 microns) thick. The aluminum base itself is thicker, usually between 1.0 mm and 3.0 mm, depending on the board’s required rigidity and heat dissipation needs. The overall board thickness generally ranges between 1.2 mm and 3.2 mm.

A thicker aluminum core improves heat transfer, but the board’s thickness must also align with the product’s mechanical and electrical requirements. Designers often have to balance between sufficient thermal performance and the overall board size for practical applications.

Is Thicker Aluminum PCB have Better Heat Dissipation?

Generally speaking, the thinner the thickness of the aluminum PCB, the faster the heat conduction speed. The thicker the thickness of the aluminum PCB, the slower the heat conduction rate. The thermal conductivity of aluminum-based circuit board mainly depends on its material and structure. Although thickness affects the path length of heat conduction, the more critical factors are the thermal conductivity and structural design of the material. For example, high thermal conductivity materials such as copper, silver and other high thermal conductivity materials will significantly improve the thermal conductivity of aluminum substrate. In addition, the thickness and thermal conductivity of the insulation layer will also affect the overall thermal conductivity effect ‌.

Specifically, the thermal conductivity of the aluminum-based circuit board is also related to the thickness of its insulation layer. The thicker the insulation layer, although it can withstand higher voltage, it will also reduce the heat transfer efficiency. Therefore, choosing the appropriate insulation layer thickness and materials with high thermal conductivity is the key to ensuring efficient thermal conductivity of aluminum-based circuit boards ‌.

2 Layers Aluminum PCB vs. Double Sided Aluminum PCB

Though the terms “2 layers aluminum PCB” and “double-sided aluminum PCB” might sound similar, there are slight differences.

A 2-layer aluminum PCB contains two conductive copper layers. These layers can be arranged to handle signal routing and ground planes separately. In contrast, a double-sided aluminum PCB typically has one copper layer on either side of the aluminum core, offering less flexibility in routing. Here is the stack up of double sided aluminum PCB:

How Much Does Aluminum PCB Cost?

The cost of an aluminum PCB, including a 2-layer version, depends on several factors such as the board’s thickness, copper weight, design complexity, and production volume. On average, 2-layer aluminum PCBs cost more than single-sided aluminum PCBs because of the additional copper layer and routing complexity.

For small orders, prices might range between $5 and $15 per square foot. For larger production runs, costs can decrease significantly due to economies of scale. Factors like the thickness of the aluminum base and copper layer, as well as additional features like surface finishes, can also influence the price.

While aluminum PCBs are more expensive than standard FR4 boards, their enhanced thermal performance can reduce overall system costs by improving reliability and reducing the need for additional cooling measures.

How Many Layers Should a PCB Have?

The number of layers a PCB should have depends on the complexity of the design. For simple applications like LED lighting or power conversion, a 2-layer aluminum PCB is often sufficient. It provides more routing flexibility than a single-layer board while still offering effective heat dissipation.

For more complex designs requiring high-density interconnections or additional functionality, a multi-layer PCB with three or more layers might be necessary. However, multi-layer aluminum PCBs are rare because their primary function is thermal management, which is typically solved within one or two layers. The decision to use more layers depends on the specific application, power requirements, and signal integrity needed in the design.

Aluminum PCB Design Guidelines

When designing a 2-layer aluminum PCB, several factors must be considered to maximize performance:

Thermal Management: Since aluminum PCBs are chosen for their thermal properties, optimizing heat dissipation is critical. Components that generate significant heat should be placed near the aluminum core, allowing for faster heat transfer.

Copper Thickness: The copper thickness should match the current-carrying requirements of the design. Using thicker copper can help manage higher current loads, but it also increases the cost and weight of the PCB.

Dielectric Layer: The thickness and material of the dielectric layer play a crucial role in both thermal and electrical performance. A thinner dielectric layer improves heat dissipation but may limit electrical isolation. Choosing the right dielectric material is key for balancing performance and reliability.

Via Placement: For a 2-layer design, vias must be carefully placed to connect the two copper layers. Vias should be positioned to minimize electrical interference and maintain signal integrity.

Component Placement: Heat-sensitive components should be placed away from high-power components. This minimizes thermal stress on sensitive devices and ensures reliable operation over the PCB’s lifespan.

Aluminum PCBs may come with a higher price tag compared to traditional FR4 boards, but the long-term benefits in heat management, performance, and durability make them an excellent investment for demanding applications. Whether you’re working on power electronics, automotive circuits, or lighting solutions, a 2-layer aluminum PCB can provide the right balance between complexity and thermal efficiency.

If you’re in need of high-quality, custom aluminum PCBs, Best Technology specializes in delivering tailored solutions for your specific design needs. With 18+ years of experience in PCB manufacturing, we ensure top-notch performance, quality, and reliability for all your projects. Let us help you bring your ideas to life with the right aluminum PCB solution!

What is the Thermal Conductivity Coefficient?

The thermal conductivity coefficient is a measure of how well a material conducts heat. It’s represented by the symbol k or λ, and it is measured in units of watts per meter-kelvin (W/m·K). It’s defined as the amount of heat that passes through a material 1 meter thick, with a temperature difference of 1 degree (K or °C) between its two sides, in one second, over an area of 1 square meter.

In general, the higher the thermal conductivity coefficient, the better the material is at transferring heat, so in some high power or power supply electronics, thermal conductivity value is important to transfer heat out. Materials with a high k value, like metals such as copper, allow heat to flow through them easily, which is why they are used in applications that require efficient heat dissipation. In contrast, materials with low thermal conductivity coefficients, such as insulators, are used to minimize heat transfer and preserve energy.

The thermal conductivity is only for the heat transfer form with thermal conductivity. When there are other forms of heat transfer, such as radiation, convection, mass transfer and other forms of heat transfer, the composite heat transfer relationship. The composite heat transfer relationship is often referred to as the apparent thermal conductivity, the dominant thermal conductivity, or the effective thermal transmissivity of material. In addition, the thermal conductivity is for homogeneous materials, in the actual situation, there are also porous, multi-layer, multi-structure, anisotropic materials, the thermal conductivity obtained by this material is actually a comprehensive thermal conductivity performance, also known as the average thermal conductivity.

According to Fourier’s law, the thermal conductivity is defined as

Where x is the direction of heat flow.

qx’’ is the heat flux in this direction in W/m2, and another is the temperature gradient in this direction, expressed in K/m.

For an isotropic material, the thermal conductivity is the same in all directions.

What Is the k Value of Copper?

The thermal conductivity of copper is about 401W/m.K. Copper is a transition element, pure copper is a soft metal, when it is cut on the surface, it is red-orange, and its ductility is good, thermal conductivity is relatively high, so it is a more commonly used material in cables and electronic components, can be used as building materials, and it is composed of many kinds of alloys.

What is the thermal conductivity coefficient of copper?

Copper’s high k value meaning it can quickly absorb and distribute heat. That is why copper is used extensively in heat sinks, electrical wiring, and cooling systems. Because of this, it’s highly valued in industries that rely on rapid heat dissipation. Whether in electronics or heavy machinery, the high thermal conductivity of copper ensures that heat does not build up, preventing overheating.

Thermal Conductivity of Common Solid Materials

Here are the thermal conductivity values of some common materials:

Aluminum: 237 W/m·K at 300°C

Copper: 401 W/m·K at 100°C

Iron: 61 W/m·K at 18°C

Steel: 45 W/m·K at 18°C (for carbon steel with 1% carbon)

Silver: 412 W/m·K at 100°C

Graphite: 151 W/m·K at 0°C

These values highlight the differences in heat conduction across materials, with metals like copper and silver being among the most efficient conductors of heat, while materials like steel and graphite have comparatively lower conductivity.

Is Copper a Good Conductor of Heat?

Yes, copper is an exceptionally good conductor of heat. For example, in electronics, copper is often used to cool down processors by transferring heat away quickly, thus ensuring systems run smoothly without overheating. In plumbing, copper pipes help distribute hot water faster, enhancing energy efficiency. From cookware to cooling systems, copper’s outstanding ability to conduct heat makes it indispensable across many fields.

Copper vs. Aluminum PCB: Which is Better?

Both copper and aluminum are excellent conductors of heat in circuit boards manufacturing, but how do they compare? Let’s discuss them from below aspects:

1. Thermal conductivity

First, let’s take a look at the thermal conductivity of aluminum and copper, which is a key indicator of the material’s heat dissipation performance. The higher the thermal conductivity, the better the material’s ability to transfer heat.

Copper: 401W/m.k

Aluminum: 237W/m.k

It can be seen from the data that the thermal conductivity of copper is almost twice that of aluminum, which means that under the same conditions, copper can transfer heat more efficiently. For this reason, copper is often the material of choice in applications that require extremely high thermal performance.

2. Density

Aluminum: Density of about 2.7 g/cm³.

Copper: Density of about 8.96 g/cm³.

Copper is nearly three times as dense as aluminum, which makes copper much heavier than aluminum. In some weight-sensitive applications, such as portable electronic devices, heavy cooling components may affect the portability and user experience of the product. Therefore, in these scenarios, although aluminum is not as conductive as copper, it is still a very popular choice due to its lower weight.

3. Cost

The prices of aluminum materials are low, and processing costs are relatively low. At the same time, aluminum is easy to process into a variety of shapes, which makes aluminum very cost-effective in the manufacturing process. However, the cost of copper is much higher and the manufacturing process is more complex, so the overall cost is much higher than aluminum.

4. Corrosion resistance

Aluminum and copper also have significant differences in corrosion resistance. Aluminum has good oxidation resistance, and the aluminum oxide layer formed on the surface can effectively protect the internal material from further corrosion. However, the corrosion resistance of copper is relatively poor, and it is easy to generate patina (carbonate of copper) in humid environments, which not only affects the appearance but also reduces the heat dissipation performance.

Why Does Copper Have the Highest Thermal and Electrical Conductivity?

Copper has very good conductivity because it has a large number of freely moving electrons in its interior. When a voltage is added to both ends of a metal, the positive electrode piles up positive charges, and the negative electrode piles up negative charges, because the same charges attract each other and the dissimilar charges repel each other, forcing the electrons to move in a directional way, thus forming a current. In addition, copper has a very low resistivity of only 1.68×10^-8Ω·m, second only to silver, and is the second most widely used conductive material.

Copper’s good thermal conductivity is also related to its internal free electrons. Metal nuclei have a weak ability to bind electrons, allowing free electrons to move freely within the metal and transfer heat rapidly. When one end of a metal is heated, the electrons of atoms or molecules at that end absorb energy and begin to vibrate. These vibrations are passed on to the electrons of neighboring atoms or molecules, forming a heat flow ‌4. Copper is metal-bonded in a way that makes it easier for its electrons to transfer energy inside the metal, and thus heat faster.

Here is the end of this blog sharing, if you have other questions about copper material, welcome to e-mail us: sales@bestpcbs.com.

What is Aluminum PCB Circuit Board?

An aluminum PCB, also known as an aluminum circuit board, is a type of metal core printed circuit board that uses aluminum as its base material. Unlike traditional PCBs, which are typically made with fiberglass, aluminum PCBs offer superior heat dissipation. This makes them ideal for high-power applications where excess heat can damage sensitive components. Aluminum PCBs are widely used in industries such as LED lighting, automotive, and power equipment because they provide better thermal management.

Aluminum PCBs are made from a combination of the following materials:

Aluminum Substrate: The base layer, responsible for mechanical support and heat dissipation.
Dielectric Layer: This layer provides insulation between the conductive layer and the aluminum base, while also helping with thermal transfer.
Conductive Layer: Made of copper, this layer is etched to form the circuit pattern and provides electrical connectivity.
Solder Mask Layer: This is a protective layer to protect the traces.

Aluminum PCB Circuit Board | Aluminum PCB Design & Prototype

Types of Aluminum PCB

Aluminum circuit board is a kind of metal base copper clad plate with good heat dissipation function, the main types include single-sided aluminum PCB, double-sided aluminum PCB and multi-layer aluminum PCB. ‌

Single sided aluminum PCB

The single-sided aluminum substrate is composed of a conductive graphic layer and an insulating material plus aluminum plate, which is relatively simple in structure and suitable for the installation and connection of some basic electronic components.

Double sided aluminum PCB

The double-sided circuit aluminum substrate has two layers of conductive graphics layer and the insulating material plus aluminum plate superimposed together, providing a larger circuit layout space and better heat dissipation effect, which is often used in electronic devices requiring higher integration and better heat dissipation performance.

Multilayer aluminum PCB

Multi-layer printed aluminum-based circuit board consists of three or more layers of conductive graphic layer and insulating material and aluminum plate alternately laminated together, with complex circuit design and excellent heat dissipation performance, suitable for high-end applications such as LED lighting, automotive electronics ‌.

In addition, there are other special types of aluminum-based circuit boards, such as flexible aluminum substrates, mixed aluminum substrates, etc. Flexible aluminum substrate has excellent electrical insulation, flexibility and thermal conductivity, and is suitable for product design in various shapes and angles. The hybrid aluminum substrate is a multilayer component made of conventional FR-4 bonded to an aluminum substrate with a thermoelectric medium, designed to improve heat dissipation and rigidity, and used as a shield ‌.

Aluminum PCB Features

The aluminum substrate, a metal-based cooling plate (including aluminum, copper, and iron substrates), is made from a low-alloyed Al-Mg-Si series high-plastic alloy plate. This material offers excellent thermal conductivity, electrical insulation, and mechanical processing capabilities. When compared to traditional FR-4 materials, aluminum substrates of the same thickness and line width can carry higher currents. Additionally, they can withstand voltages up to 4500V and have a thermal conductivity greater than 2.0, making aluminum substrates the preferred choice in the industry.

● Surface mount technology (SMT);

● Very effective treatment of thermal diffusion in circuit design;

● Reduce product operating temperature, improve product power density and reliability, extend product service life;

● Reduce product volume, reduce hardware and assembly costs;

● Replace fragile ceramic substrate for better mechanical durability.

Aluminum PCB vs. Copper PCB

Both aluminum and copper PCBs have their own advantages, but they cater to different applications:

1. Thermal Conductivity

In general, the higher the thermal conductivity, the more efficient the heat transfer, resulting in better heat dissipation and a longer lifespan. Among metal substrates, copper substrates offer the best thermal conductivity, outperforming aluminum substrates.

2. Electrical Conductivity

Both aluminum and copper are metals and conduct electricity, though their exact levels of conductivity differ. In terms of electrical conductivity, copper is significantly superior to aluminum. In applications that require high electrical conductivity, copper is the ideal choice.

3. Resistance

Resistance is crucial in PCB design as it affects the overall functionality and stability of the components. Given that copper has a higher density than aluminum, its resistance is generally lower. Therefore, in applications requiring thinner circuits and faster power transmission, copper is the better option.

4. Weight

Due to copper’s higher density per unit area, copper PCBs are much heavier than aluminum PCBs with the same design.

In applications where lightweight structures are critical, aluminum is the preferred material. On the other hand, applications where weight is not a major concern often favor the use of copper.

5. Applications

Aluminum substrates are somewhat specialized. They are mainly used in energy-saving lighting products such as indoor lighting, energy-efficient lighting, and street lights. Copper substrates are suitable for high-power lighting equipment like car headlights, tail lights, and some high-tech electronics.

6. Manufacturing Process

The manufacturing process for aluminum-based PCBs is simpler than that for copper-based PCBs, which also impacts their production time and delivery schedules. Below is aluminum PCB and copper core PCB that made by Best Technology:

Aluminum PCB Manufacturing Process

The manufacturing process for aluminum PCBs involves several steps to ensure high quality and performance. Here is a basic manufacturing process of aluminum PCB:

1. Substrate Selection and Preprocessing

Aluminum alloys with high thermal conductivity, such as the 5052 and 6061 series, are selected as the base material. The aluminum sheet is first cut and cleaned to remove surface grease and impurities, ensuring proper adhesion for subsequent processes.

2. Chemical Etching of Patterns

Photosensitive ink is used to form the desired circuit patterns on the aluminum surface. After exposure and development, the ink-covered areas protect the underlying aluminum from being etched by chemicals, while the unprotected areas are etched away, forming the circuit pattern.

3. Insulation Layer Deposition

To achieve electrical isolation, an insulating material, usually thermosetting resin or ceramic-filled epoxy resin, is deposited on the aluminum substrate. This step is typically completed using screen printing or inkjet printing technology to ensure a uniform and appropriately thick insulation layer.

4. Metallization

Creating conductive paths on the insulation layer is a key step. Copper foil is deposited onto the insulation layer using methods such as electroplating, sputtering, or chemical copper deposition. This copper foil serves as the conductive layer for connecting LED chips and other components.

5. Drilling and Metallization

Holes are drilled in the board according to the design to achieve electrical connections between different layers. The hole walls are then metallized to ensure good conductivity inside the holes.

6. Surface Treatment

To improve solderability and corrosion resistance, the aluminum substrate undergoes additional surface treatments, such as tin spraying, gold plating, or silver plating.

7. Assembly and Testing

LED chips, resistors, capacitors, and other components are soldered onto the circuit board to complete the assembly. Here you can see the whole manufacturing process of aluminum metal core PCB.

What Affects Aluminum PCB Circuit Board Price?

First of all, ‌ raw material cost ‌ is one of the important factors affecting the price of aluminum based circuit board. The raw materials of aluminum substrate include aluminum substrate and other auxiliary materials, such as insulating layer materials. The price fluctuation of aluminum substrate will directly affect the production cost of aluminum substrate, and then affect its market price. In addition, the cost of electricity is also a part of the production process cannot be ignored, the fluctuation of electricity price will further affect the production cost ‌.

Secondly, ‌ market supply and demand ‌ is also a key factor in determining the price of aluminum-based circuit boards. If demand increases and supply is insufficient, prices will naturally go up. On the other hand, if there is an oversupply, the price will fall. Changes in demand in the construction, automotive and other industries, as well as changes on the supply side such as the construction of new plants or the closure of old plants, will have a direct impact on the price of aluminum-based circuit boards ‌.

‌The macroeconomic environment ‌ also has an important impact on the price of aluminum-based circuit boards. When economic growth is expected to be good, the demand for aluminum substrate in related industries increases, driving up prices; The expectation of economic recession will lead to a decline in demand and pressure on aluminum substrate prices ‌.

‌Policies and regulations ‌ is also one of the factors affecting the price of aluminum-based circuit boards. The government’s environmental protection policies, trade policies and industry subsidies will have an impact on the aluminum substrate market. For example, environmental policies that limit production may reduce supply and push up prices; The establishment of trade barriers may affect the import and export of aluminum substrate, and then affect the domestic market price.

Aluminum PCB Production Capability – Best Technology

Best Technology is known for its strong production capability when it comes to aluminum PCBs. Our manufacturing facilities are equipped with the latest technology to produce high-quality aluminum PCBs that meet industry standards. We have the ability to produce single-sided, double-sided, and multi-layer aluminum PCBs, below you can see our capability of aluminum PCBs:

Applications of Aluminum PCB

Aluminum PCBs are used in a variety of applications, particularly where heat management is crucial:

LED Lighting
Automotive Electronics
Power Supplies
Consumer Electronics
Medical
Household appliance

FAQs about Aluminum PCB Circuit Board

1. What is the main advantage of aluminum PCBs?

Aluminum PCBs excel in thermal management, making them perfect for heat-sensitive applications.

2. Are aluminum PCBs expensive?

No, aluminum PCBs are generally affordable, making them a cost-effective option for many industries.

3. Can aluminum PCBs be used in consumer electronics?

Yes, aluminum PCBs are commonly used in consumer electronics, especially in devices that generate significant heat.

4. What industries commonly use aluminum PCBs?

Industries such as automotive, LED lighting, and power supplies frequently use aluminum PCBs due to their thermal properties.

5. Is aluminum PCB better than copper PCB?

It depends on the application. Aluminum is better for heat dissipation, while copper excels in electrical conductivity.

What are the holes in a PCB called?

What are the holes on PCB called? What are the holes in the circuit? The holes on PCB can be roughly divided into 3 types, screw holes (mounting holes), conductive holes (vias), and plug-in holes.

Screw holes: Screw holes are used for fixing.

Conductive holes: Conductive holes (also called vias) are used for conducting electricity just like circuits.

Plug-in holes: Plug-in holes are of course used to plug in various parts, such as diodes, transistors, capacitors, inductors, etc.

What is a through hole

What is a through hole? Through holes, also known as perforations, are holes in a PCB that go all the way through the board. Their main purpose is to provide electrical connections for component pins while allowing soldering on both sides of the board.

1.A via is a special through hole whose wall is metallized to achieve electrical connection between different layers on a circuit board. This type of hole is usually used to connect component pins to internal circuits, or to achieve electrical connection between different layers in a multi-layer PCB. Vias need to be metallized during the PCB manufacturing process, which usually includes drilling, desmearing, chemical copper plating, and electroplating.

2.Non-conducting holes are the opposite of through holes. Their hole walls are not metallized, so they do not have electrical connection functions. These holes are mainly used for mechanical fixation, heat dissipation or identification purposes. Non-conducting holes are relatively simple in the PCB manufacturing process, and only drilling operations are required.

What is a blind via?

A blind via is a hole that extends from one side of a PCB to a certain internal layer without penetrating the entire board. The emergence of blind vias is mainly due to the development of HDI technology, which provides circuit designers with greater flexibility and more compact layout. Blind vias are usually used to connect surface mount components (SMD) to internal circuit layers, or to connect circuits between different internal layers.

What are buried vias?

Buried vias are holes located inside the PCB that do not penetrate any side of the board. They are completely hidden inside the board and are used to connect circuits between different internal layers. Buried vias are especially useful in HDI boards because they can reduce the overall thickness of the board while maintaining electrical connections between internal circuits.

What is a microvia?

Microvia refers to a hole with a smaller diameter, usually at the micron level. The emergence of microvia technology enables PCB designers to achieve more complex circuit layouts in a smaller space. Microvias are often used in high-density, high-reliability electronic devices such as mobile phones and tablets. The manufacture of microvias requires high-precision drilling equipment and technology to ensure the accuracy and reliability of the holes.

What are Mounting holes？

What are Mounting holes?Locking holes are auxiliary holes used in the PCB manufacturing and assembly process to accurately locate and fix the circuit board. They are usually located at the edge or specific position of the PCB to ensure that the circuit board can be accurately aligned and fixed during manufacturing, testing and assembly. The locating holes do not participate in the connection of the circuit, but are essential to ensure the quality and performance of the circuit board.

What are Mounting holes？

What are thermal vias?

Thermal vias are holes designed specifically for heat dissipation, usually large and can run through the entire PCB or multiple layers. Their role is to reduce heat buildup on the circuit board by increasing surface area and air flow, thereby improving the stability and reliability of the device. Thermal vias are particularly important in high-performance, high-power electronic devices.

FAQ About board electronics with holes

How to solve the contradiction between manual routing and automatic routing of high-speed signals?

Most of the current powerful routing software’s automatic routing tools have set constraints to control the routing method and the number of vias. The routing engine capabilities and constraint setting items of various EDA companies are sometimes very different. For example, whether there are enough constraints to control the winding method of the serpentine, whether the routing spacing of the differential pair can be controlled, etc. This will affect whether the routing method generated by automatic routing can meet the designer’s ideas. In addition, the difficulty of manually adjusting the routing is also related to the capabilities of the routing engine. For example, the pushing ability of the routing, the pushing ability of the via, and even the pushing ability of the routing pair copper. Therefore, choosing a routing tool with strong routing engine capabilities is the solution.

Will adding test points affect the quality of high-speed signals?

As for whether it will affect the signal quality, it depends on the method of adding test points and how fast the signal is. Basically, the additional test points (not using the existing vias (via or DIP pins) as test points) may be added to the line or a small section of wire may be pulled out from the line. The former is equivalent to adding a very small capacitor to the line, while the latter is an additional branch. Both of these situations will have some impact on high-speed signals, and the extent of the impact is related to the frequency speed of the signal and the edge rate of the signal. The magnitude of the impact can be learned through simulation. In principle, the smaller the test point, the better (of course, it must meet the requirements of the test equipment) and the shorter the branch, the better.

Can you introduce some foreign technical books and data on high-speed PCB design?

Now the application of high-speed digital circuits includes communication networks and calculators and other related fields. In the communication network, the operating frequency of PCB boards has reached around GHz, and the number of layers is as many as 40 layers as far as I know. Due to the advancement of chips, the operating frequency of calculator-related applications, whether it is a general PC or server, has reached 400MHz (such as Rambus) or above. In response to the demand for high-speed and high-density routing, the demand for blind/buried vias, mircrovias and build-up process technology is gradually increasing. These design requirements can be mass-produced by manufacturers.

Does the design of rigid-flexible boards require special design software and specifications? Where can I undertake the processing of such circuit boards in China?

Can I use general PCB design software to design flexible printed circuits (Flexible Printed Circuit). The Gerber format is also used for FPC manufacturers to produce. Since the manufacturing process is different from that of general PCBs, each manufacturer will have its own restrictions on line width, line spacing, and aperture (via) based on their manufacturing capabilities. In addition, some copper foil can be laid at the turning point of the flexible circuit board for reinforcement. As for the manufacturer, you can search for “FPC” as a keyword on the Internet and you should be able to find it.

If the size of the circuit board is fixed, if the design needs to accommodate more functions, it is often necessary to increase the routing density of the PCB, but this may lead to increased mutual interference between the routings, and at the same time, the impedance cannot be reduced if the routing is too thin. Please introduce the techniques in the design of high-speed (>100MHz) high-density PCBs?

When designing high-speed and high-density PCBs, crosstalk interference does need to be paid special attention to because it has a great impact on timing and signal integrity. Here are a few things to note:

Control the continuity and matching of the characteristic impedance of the trace.

The size of the trace spacing. The spacing commonly seen is twice the line width. Through simulation, you can know the impact of trace spacing on timing and signal integrity and find the tolerable spacing. The results of different chip signals may be different.

Choose an appropriate termination method.

Avoid the same routing direction of the upper and lower adjacent layers, or even have traces overlapped up and down, because this kind of crosstalk is greater than the case of adjacent traces on the same layer.

Use blind/buried vias to increase the trace area. However, the production cost of the PCB board will increase. It is indeed difficult to achieve complete parallelism and equal length in actual implementation, but it should be done as much as possible.

In addition, differential termination and common mode termination can be reserved to mitigate the impact on timing and signal integrity.

The RF part, IF part, and even the low-frequency circuit part of the outdoor unit are often deployed on the same PCB. What are the material requirements for such PCB? How to prevent interference between RF, IF, and even low-frequency circuits?

Hybrid circuit design is a big problem. It is difficult to have a perfect solution.

Generally, RF circuits are laid out and wired as an independent single board in the system, and there will even be a special shielding cavity. Moreover, RF circuits are generally single-sided or double-sided boards, and the circuits are relatively simple. All of these are to reduce the impact on the distributed parameters of RF circuits and improve the consistency of RF systems. Compared with general FR4 materials, RF circuit boards tend to use high-Q substrates. The dielectric constant of this material is relatively small, the distributed capacitance of the transmission line is small, the impedance is high, and the signal transmission delay is small. In hybrid circuit design, although RF and digital circuits are made on the same PCB, they are generally divided into RF circuit area and digital circuit area, and laid out and wired separately. Shielding is used between ground vias and shielding boxes.

What is aluminum base material PCB?

Aluminum base material PCB (Printed Circuit Board) refers to a special type of PCB that uses aluminum as the substrate material. This PCB usually includes three main parts:

What is aluminum base pcb board? How to choose?

1. Circuit layer: This is the part where the circuit pattern is installed, usually a layer of copper foil, which is etched to form a circuit path.

2. Insulating thermal conductive layer: Located between the circuit layer and the metal base layer, this layer of material not only needs to provide electrical insulation between circuits, but also has good thermal conductivity to transfer the heat generated when the circuit is working to the metal base layer.

3. Metal base layer: Usually a layer of aluminum plate, its function is to quickly dissipate the heat from the circuit layer.

Due to its good thermal conductivity, aluminum base PCB is very popular in application scenarios that require efficient heat dissipation, in LED lighting, power management, automotive electronics, communication equipment, and other electronic devices that require high power output and good thermal management.

Compared with traditional FR-4 fiberglass PCBs, aluminum base pcb boards can manage heat more effectively, thereby improving the reliability and life of electronic components. ‌

Why Aluminum is used in PCB?

There are several main reasons for using aluminum in PCBs (printed circuit boards):

1. Good heat dissipation performance

High thermal conductivity: Aluminum is an excellent thermal conductive material with a relatively high thermal conductivity. During the operation of the PCB, electronic components will generate heat, and the aluminum substrate can quickly conduct this heat away to avoid damage to electronic components caused by excessive local temperatures, thereby improving the stability and reliability of electronic equipment and extending the service life of components.

Uniform heat dissipation: The aluminum substrate can evenly distribute heat across the entire PCB, prevent hot spots from concentrating, and reduce the risk of failures caused by local overheating.

2. Higher mechanical strength

Vibration resistance: Aluminum has a certain rigidity and toughness, and can withstand the vibration and impact that electronic equipment may be subjected to during use, which can ensure that the PCB will not be easily damaged by external forces.

Dimensional stability: The dimensional changes of aluminum substrates are relatively small under different temperature and humidity conditions, which can maintain the structural stability of PCBs and ensure the welding reliability of electronic components.

3. Good insulation performance

The surface of the specially treated aluminum substrate has a good insulation layer, which can effectively prevent circuit short circuits and leakage. At the same time, the insulation layer can also withstand a certain voltage to meet the electrical insulation requirements of different electronic equipment.

Good compatibility with other insulating materials: It can be well combined with the packaging materials and welding materials of various electronic components to ensure the overall performance of electronic equipment.

4. Good processing performance

Strong processability: Aluminum substrates can be made using traditional PCB processing techniques, such as etching, drilling, cutting, etc., which is convenient and fast and can meet different design requirements.

Surface processability: The surface of the aluminum substrate can be processed in a variety of ways, such as copper plating, gold plating, tin spraying, etc., to improve welding performance and corrosion resistance.

5. Cost-effectiveness

Relatively low material cost: Aluminum is a common metal material with abundant resources and relatively stable prices. Compared with some high-performance heat dissipation materials, the cost of aluminum substrates is low, which can reduce the manufacturing cost of electronic equipment while ensuring performance.

High production efficiency: Due to the good processing performance of aluminum substrates, large-scale automated production can be achieved, which can improve production efficiency and further reduce costs.

How to choose aluminum base pcb board?

Choosing the right aluminum base pcb board is crucial to the performance and reliability of electronic equipment. In the selection process, multiple factors need to be considered, including glass transition temperature, heat resistance, flatness, thermal expansion coefficient and electrical performance.

(I) Glass transition temperature

Glass transition temperature (Tg) is one of the important parameters for measuring the heat resistance of PCB substrates. Generally speaking, substrates with higher Tg are more stable in high temperature environments and are not prone to deformation or damage.

For application scenarios with higher operating temperatures, aluminum base pcb boards with Tg higher than the circuit operating temperature should be selected. The Tg of the current mainstream FR-4 board is about 130-140 degrees. If the circuit operating temperature is close to or exceeds this value, it is necessary to consider choosing an aluminum substrate material with a higher Tg.

(II) Heat resistance

Aluminum-based PCB boards should have high heat resistance to ensure that they can still work normally in high temperature environments.

Generally, a heat resistance of 250℃/50S is required. This means that the board will not undergo significant performance changes under short-term high temperature exposure.

(III) Flatness

In SMT (surface mount technology), it is required to use boards with a small degree of curvature as much as possible. Aluminum base PCB boards with good flatness can ensure accurate installation of components and good welding quality. If the flatness of the board is poor, it may cause the components to be installed loosely, and even cause problems such as cold soldering and short circuits during the welding process.

(IV) Thermal expansion coefficient

The thermal expansion coefficient (CTE) is one of the key factors to consider when selecting aluminum base pcb boards. Due to the inconsistent thermal expansion coefficient in the thickness direction, it is easy to cause PCB deformation, and in severe cases, it will cause the metallized holes to break, resulting in damage to components.

The thermal expansion coefficient of the aluminum substrate is 50×10⁻⁶cm/cm℃, which is smaller than that of the general FR-4 board and closer to the thermal expansion coefficient of copper foil. When selecting, try to choose a board with a low thermal expansion coefficient and matching other components to reduce the thermal stress caused by the difference in thermal expansion coefficient.

(V) Electrical performance

For high-frequency circuits, materials with high dielectric constant and low dielectric loss are required. Insulation resistance, withstand voltage strength, and arc resistance must meet product requirements.

In communication electronic equipment, high-frequency amplifiers, filters and other circuits have high requirements for electrical performance, and aluminum base pcb boards with good electrical performance need to be selected to ensure accurate signal transmission and stability.

In summary, according to application requirements, factors such as glass transition temperature, heat resistance, flatness, thermal expansion coefficient and electrical performance can be comprehensively considered to select a suitable aluminum base pcb board to ensure the performance and reliability of electronic equipment.

Which is a major disadvantage of aluminum?

Although aluminum has many advantages, it also has some inherent disadvantages as a material that may limit its use in certain applications.

1. Lower conductivity than copper: Although aluminum has a relatively high conductivity, it is still lower than copper.

2. Easy to deform: Aluminum has a relatively low hardness, so it is more likely to undergo plastic deformation when subjected to external forces.

3. Cold flow phenomenon: Aluminum becomes more brittle at low temperatures, and may exhibit cold flow (creep) phenomenon in high temperature environments, that is, slow deformation under constant load.

4. Difficult welding: The surface of aluminum is prone to form an oxide film, which affects the quality of welding and makes aluminum welding more difficult than other metals.

5. Corrosion resistance condition restrictions: Although aluminum itself has a certain degree of corrosion resistance, aluminum may accelerate corrosion in certain specific environments, such as salt water, alkaline solutions or halogens.

6. Connection reliability: When aluminum is in direct contact with other metals such as copper, corrosion problems may occur in some cases due to electrochemical reactions, especially in humid environments, which may affect the long-term reliability of the connector.

7. Large thermal expansion coefficient: Aluminum has a relatively high thermal expansion coefficient, which means that in an environment with large temperature changes, aluminum products may change in size due to thermal expansion and contraction, which may cause problems for applications that require precise matching.

What is the dielectric layer of aluminum PCB?

The dielectric layer of aluminum PCB is an insulating layer, which is located between the circuit layer and the metal layer and plays a role of isolation and insulation.

This insulating layer uses a thermally conductive insulating material that can quickly transfer the heat generated by the LED to the aluminum substrate. At the same time, the thermal resistance of this thermally conductive insulating material is a key factor that affects the efficiency of heat transfer.

In the design of aluminum substrates, the insulating layer is an indispensable part, which ensures the normal operation of the circuit while allowing heat to be effectively transferred to the aluminum base layer, thereby improving the thermal and mechanical properties of the entire structure.

Why don’t we use aluminum instead of copper?

The main reasons for not using aluminum instead of copper in PCBs (printed circuit boards) include the following:

‌Conductivity difference‌: Copper has significantly better conductivity than aluminum. This means that in circuits that require good conductivity, using copper can provide more stable current transmission‌.

‌Thermal conductivity difference‌: Copper substrates have higher thermal conductivity than aluminum substrates, which means that copper performs better in transmission efficiency, heat dissipation, and service life.

‌Resistance difference‌: Since copper has a higher density than aluminum, copper generally has lower resistance than aluminum. Using copper can reduce power loss and improve power transmission efficiency‌.

‌Weight difference‌: Copper has a higher density per unit area, resulting in copper PCBs weighing much more than aluminum PCBs under the same design. But if weight is not the main consideration, copper is widely used for its excellent electrical properties‌.

‌Production process‌: The production process of aluminum substrate PCBs is relatively simple, but this does not mean that aluminum is a better choice. In some cases, although aluminum substrates may be produced faster, copper substrates are preferred in many applications due to their superior electrical properties‌.

In summary, although aluminum as a lightweight, low-cost material may have advantages in some cases, copper is still the preferred material in PCB manufacturing due to its better electrical conductivity, thermal conductivity, low resistance and applicability in most applications.

In short, as a new type of PCB material, aluminum base pcb board has the advantages of excellent heat dissipation, high mechanical strength, good electrical properties and environmental protection and recyclability. With the continuous development and progress of electronic technology, market demand will continue to increase. BEST Technoloby, as a professional aluminum substrate manufacturer, has rich manufacturing experience. The aluminum substrates produced have been tested by the market for a long time, and the service quality is in the first echelon. Choose us and you will get the best experience.

What is an aluminum substrate?

Aluminum substrate, the full name of which is aluminum-based copper clad laminate, has good heat dissipation, electrical insulation and mechanical processing performance. It is widely used in LED lighting, power modules, automotive electronics, communication equipment and other fields.

Aluminum pcb suppliers, High Quality&Customization

In these fields, aluminum substrates can effectively dissipate the heat generated by electronic components quickly, thereby ensuring the normal working temperature of electronic components and extending their service life. At the same time, the high insulation performance of aluminum substrates can prevent the occurrence of safety problems such as electrical short circuits and leakage.

In addition, the mechanical processing performance of aluminum substrates also enables it to adapt to various complex electronic equipment structure design requirements.

How to choose an aluminum pcb suppliers?

1. Conduct market research

Before choosing an aluminum pcb supplier, you need to conduct sufficient market research. Understand the product quality, technical strength, production capacity, service quality and price of different suppliers, and make comparisons and analyses.

You can get more information about suppliers through online searches, industry exhibitions, and consulting industry insiders. At the same time, you can also refer to the evaluations and recommendations of other customers to understand the reputation and credibility of the supplier.

2. On-site inspection of suppliers

After determining some potential suppliers, you can conduct on-site inspections. On-site inspections can give you a more intuitive understanding of the supplier’s production equipment, production processes, quality control systems, and management levels.

During the on-site inspection, you can communicate with the supplier’s technical personnel and management personnel to understand their technical strength and service level. At the same time, you can also view the supplier’s product samples to understand the quality and performance of the products.

3. Conduct sample testing

Before selecting an aluminum pcb supplier, you can ask the supplier to provide samples for testing. Sample testing can give you a more intuitive understanding of the supplier’s product quality and performance, and whether it meets your needs.

When conducting sample testing, you need to test according to your actual use requirements, such as heat dissipation performance, electrical insulation performance, mechanical processing performance, etc. At the same time, you also need to check the appearance quality of the sample to ensure that there are no obvious scratches, stains, and defects.

How strong is BEST Technology?

BEST Technology has a strict quality control system. From raw material procurement to production and processing to product testing, every link is strictly controlled. And BEST Technology’s products have passed many international certifications, such as ISO9001 quality management system certification, UL certification, etc.

BEST Technology also has a strong technical R&D team, which can continuously launch new products and technologies to meet the needs of the market and customers. For example, the high thermal conductivity aluminum substrate they developed has a heat dissipation performance that is more than 30% higher than that of traditional aluminum substrates, and has been widely praised by customers.

BEST Technology also has advanced production equipment and process technology, using automated production lines and advanced surface treatment technology to ensure product production efficiency and quality. Their production capacity is in a leading position in the industry and can ensure on-time delivery of orders.

What are the classifications of aluminum-based PCBs?

‌Aluminum-based PCB‌ (aluminum-based copper-clad laminate) is mainly divided into the following categories:

‌General-purpose aluminum-based copper-clad laminate‌: The insulation layer of this type of aluminum-based copper-clad laminate is composed of epoxy glass cloth bonding sheets, which is suitable for the manufacture of general electronic products, providing basic electrical insulation and certain heat dissipation performance.

‌High heat dissipation aluminum-based copper-clad laminate‌: Its insulating layer is composed of highly thermally conductive epoxy resin or other resins, which is designed to provide better heat dissipation and is suitable for high-power electronic devices.

‌Aluminum-based copper-clad laminate for high-frequency circuits‌: The insulating layer of this type of copper-clad laminate is composed of polyolefin resin or polyimide resin glass cloth bonding sheet, which is particularly suitable for electronic devices that require high-speed signal transmission and high integration.

What are the characteristics of aluminum-based PCBs?

The characteristics of aluminum-based PCBs mainly include excellent heat dissipation, dimensional stability, insulation, durability, lightness and environmental protection. ‌

‌Excellent heat dissipation‌: Aluminum-based PCBs have excellent thermal conductivity because they use aluminum as the base material, which can effectively transfer heat from heating devices or important devices, thereby improving the overall performance of the product‌.

‌Dimensional stability‌: The dimensional stability of aluminum substrates is higher. Compared with printed boards made of insulating materials, the dimensional changes of aluminum substrates are smaller, which helps to improve the reliability and durability of products‌.

‌Insulation‌: Aluminum substrates have good insulation properties and can provide the electrical isolation required by electronic devices. At the same time, they are hard and can replace easily broken ceramic plates, effectively reducing the actual area required for printed circuit boards, so that products do not need to install radiators, etc., thereby improving the heat dissipation of products and improving product efficiency and reducing costs.‌

‌Durability‌: Due to its high hardness, aluminum substrates can reduce the risk of accidental damage during production, handling and daily use, and provide strength, toughness and durability that glass fiber substrates cannot provide.‌

‌Lightweight‌: Aluminum substrates enhance the strength and elasticity of products without adding extra weight, which helps to reduce the overall weight of products.‌

‌Environmental protection‌: Aluminum is non-toxic and recyclable, which helps to reduce the impact of electronic waste on the environment.‌

In summary, aluminum-based PCBs provide electronic products with multiple advantages such as efficient heat dissipation, dimensional stability, excellent electrical performance, durability, lightness and environmental protection through their unique physical and chemical properties, making aluminum-based PCBs widely used in high-end electronic devices.‌

What are the application scenarios of aluminum-based PCBs?

The application scenarios of aluminum-based PCBs are very wide, mainly including the following aspects:

‌High-power LED lighting‌: Aluminum-based PCBs can quickly and effectively transfer the heat generated by LEDs to the external environment, reduce the impact of high temperature on the life of LED chips, and improve the life and reliability of lamps.

‌Power supply equipment‌: Such as switching power supplies, DC/AC converters, voltage regulators and other high-power density power modules, aluminum-based PCBs can quickly dissipate heat to ensure stable operation of the circuit.

‌Audio equipment‌: The heating elements in audio devices such as audio amplifiers, power amplifiers, and preamplifiers can be well managed by aluminum-based PCBs.

‌Communication electronic equipment‌: Components in communication systems such as high-frequency devices, filters, signal transmission and reception circuits, etc., use aluminum-based PCBs to improve system reliability.

‌Computers and peripherals‌: Some areas on the motherboard, power supply modules, and hardware such as graphics cards may use aluminum-based PCBs to improve the heat dissipation effect.

‌Office automation equipment‌: Motor drivers and other components that require effective heat dissipation.

‌Automotive electronics‌: Including electronic speed regulators, ignition devices, power controllers and other vehicle-mounted applications.

‌Industrial control field‌: High heat density circuit boards inside industrial control equipment such as frequency converters and inverters.

Aluminum-based PCBs are widely used in many fields due to their excellent heat dissipation and electrical insulation properties, especially in situations where efficient heat dissipation and stable operation are required.

Choosing a high-quality aluminum pcb supplier is crucial for electronics manufacturers. When choosing a supplier, it is necessary to consider the key points comprehensively. Choose a suitable aluminum pcb suppliers through market research, field visits and sample testing.

What is aluminum PCB?

Aluminum PCB board is a metal-based copper-clad board with good heat dissipation function. This board is mainly used for high-end applications. When designed as a double-sided board, the structure is a circuit layer, an insulating layer, an aluminum pcb board, and then an insulating layer and a circuit layer.

In rare cases, aluminum pcb board can also be designed as multi-layer boards, which are formed by laminating ordinary multi-layer boards with insulating layers and aluminum pcb board.

The unique advantage of aluminum pcb board lies in their excellent heat dissipation performance. The power device is mounted on the circuit layer on the surface. The heat generated by the device during operation is quickly transferred to the metal base layer through the insulating layer, and then the metal base layer transfers the heat away to achieve effective heat dissipation of the device.

This design enables the aluminum pcb board to minimize thermal resistance and has excellent thermal conductivity. At the same time, compared with traditional materials, aluminum pcb board can reduce volume, extend life, and improve power density and reliability while carrying higher currents.

In addition, aluminum pcb board also meet RoHS requirements, are more suitable for SMT processes, and effectively handle heat diffusion in circuit design schemes, reduce the assembly of heat sinks and other hardware, reduce costs, improve the optimal combination of power circuits and control circuits, replace fragile ceramic substrates, and obtain better mechanical durability.

How do you make aluminum PCB?

The production process of aluminum pcb board mainly includes the following steps:

Cutting: First, cut the aluminum pcb board material according to the design requirements.

Drilling: Drill holes on the aluminum pcb board according to the circuit design requirements to prepare for subsequent circuit production.

Dry film photo imaging: Cover the dry film on the aluminum pcb board and transfer the circuit pattern to the aluminum pcb board through photo imaging technology.

Board inspection: Check whether the circuit pattern on the aluminum pcb board meets the design requirements.

Etching: Use chemical etching to remove the part not covered by the dry film to form a circuit pattern.

Etching inspection: Check the etched aluminum pcb board again to ensure the accuracy of the circuit pattern.

‌Green paint‌: Apply protective paint to prevent the circuit from being oxidized and corroded.

‌Character‌: Print necessary logos and information on the aluminum pcb board.

‌Green inspection‌: Check the aluminum substrate after applying protective paint to ensure quality.

‌Hinning‌: Spray tin on the aluminum substrate to improve welding performance.

Surface treatment‌: Treat the surface of the aluminum substrate, such as applying thermal conductive slurry to optimize heat dissipation performance.

‌Punching‌: Cut the aluminum substrate as needed to form the final product shape.

‌Final inspection‌: Perform final quality inspection on the finished aluminum substrate.

‌Packaging and shipment‌: Pack qualified aluminum substrates and prepare for shipment.

This series of steps ensures that the production quality and performance of the aluminum substrate meet the design and use requirements. Aluminum substrates are widely used in high-end electronic devices due to their excellent heat dissipation and machining performance.

How much does aluminum PCB cost?

The cost of aluminum substrate PCB is about 230 yuan to 400 yuan per square meter. ‌

The cost of aluminum substrate PCB is affected by many factors, including board type, production process, testing cost and other additional expenses.

Aluminum substrate PCB is a metal-based copper-clad board with good heat dissipation function. This board is highly praised in certain specific application scenarios due to its efficient heat dissipation performance, but correspondingly, its cost is usually much higher than other types of PCB.

‌Board cost‌ is one of the main costs of aluminum substrate PCB. The board cost used in aluminum substrate is higher because of its special materials and manufacturing process.

‌Processing cost‌ also occupies a certain proportion. The processing process of aluminum substrate includes cutting, drilling, electroplating, lamination and other links. The equipment and process requirements of each link will affect the final cost.

‌Quality inspection cost‌ is also not to be ignored. Strict quality inspection is required during the production process, including environmental adaptability testing, electrical performance testing, etc. The number and strictness of these inspection items will also affect the production cost.

In summary, the cost of aluminum substrate PCB is affected by many factors, roughly between 230 yuan and 400 yuan per square meter, and the specific price will vary according to specific needs and production conditions.

What are the layers of aluminum PCB?

The number of layers of aluminum-based PCB can be single-sided, double-sided or multi-layer. ‌

‌Single-sided aluminum substrate‌: On this type of PCB, the parts are concentrated on one side and the wires are concentrated on the other side. Since the wires only appear on one side, this PCB is called a single-sided aluminum substrate.

‌Double-sided aluminum substrate‌: There are wiring on both sides of the circuit board, but to use the wires on both sides, there must be appropriate circuit connections between the two sides.

‌Multilayer board‌: In order to increase the area that can be wired, multilayer boards use more single-sided or double-sided wiring boards. The printed circuit board that is alternately connected by the positioning system and insulating adhesive materials and the conductive patterns are interconnected according to the design requirements becomes a four-layer or six-layer printed circuit board, also known as a multilayer printed circuit board.

How thick is aluminum clad PCB?

The thickness of aluminum clad PCB usually ranges from 0.12mm to 0.18mm, with an error of ±0.01mm.

The thermal conductivity of aluminum substrate is one of the important indicators for evaluating its quality, and the thermal conductivity of aluminum substrate is generally 2.0-0.1, which means that the thermal conductivity of aluminum substrate is excellent and can effectively improve the heat dissipation efficiency of circuit boards.

In addition, the thickness of the insulation layer of aluminum substrate is usually 0.003 to 0.006 inches, which is composed of UL-certified aluminum plate cladding and insulating materials, while the base layer is a metal substrate, usually aluminum or copper.

What are the disadvantages of aluminum PCB?

The disadvantages of aluminum PCB mainly include high cost, high process difficulty, non-uniform board material, and easy problems in pressure resistance and electrical strength. ‌

‌High cost‌: The cost of aluminum PCB is relatively high, usually more expensive than other types of PCBs, and the price accounts for more than 30% of the total cost of the product.

‌High process difficulty‌: When making aluminum PCB, due to its special material and structure, the process of making double-sided boards is difficult, and during the manufacturing process, problems in pressure resistance and electrical strength are also easy to occur.

‌Inconsistent board materials‌: There is no unified international standard for the material specifications of aluminum PCBs. There are multiple specifications such as CPCA industry standards, national standards and international standards, which increases the complexity of selection and use‌.

‌Problems with withstand voltage and electrical strength‌: Aluminum substrates are prone to fail to meet the withstand voltage index, which may lead to safety problems during use‌.

Why is aluminum no longer used in integrated circuits?

The main reason why aluminum is no longer used in integrated circuits is that its high resistivity and easy electromigration are gradually exposed with the increase of chip integration and the reduction of feature size, which limits its application in high-performance chips. ‌

Aluminum is one of the earliest widely used metals in semiconductor chips. Due to its good conductivity and relatively low cost, it has been widely used as an interconnect metal in early integrated circuits.

However, with the increase of chip integration and the reduction of feature size, the shortcomings of aluminum gradually emerge. In addition, aluminum wires may experience electromigration under the action of long-term current, which will cause the failure of integrated circuits.

As an alternative material, copper has lower resistivity and higher electromigration resistance than aluminum, can carry larger current in thinner metal wires, and is more reliable under high-speed current conditions.

With the continuous development of electronic technology, aluminum substrates are also constantly innovating and developing. In the future, aluminum substrates will pay more attention to product quality, performance and environmental protection, and provide more reliable support for the development of electronic equipment. BEST Technology focuses on circuit board design and production, and has many years of experience in aluminum substrate manufacturing. Choosing BEST Technology will provide you with the best service.

Reasons for the development of aluminum substrate

The continuous updating and improvement of aluminum substrate technology has provided a strong driving force for the development of manufacturers. In terms of thermal conductivity, in order to meet the application needs of different fields, the thermal conductivity of aluminum substrates has been continuously improved, and has now reached more than 180W/mK.

Aluminum pcb manufacturer, High Quality&Customization

In terms of molding and processing technology, commonly used molding processes include cutting, punching and bending, and the continuously optimized molding and processing technology has improved the production efficiency and product quality of aluminum substrates.

In addition, technological innovation has also promoted the diversified development of aluminum substrate products, such as ultra-thin aluminum substrates, high-frequency and high-speed aluminum substrates, flexible aluminum substrates, composite functional aluminum substrates, environmentally friendly aluminum substrates and other new products have emerged continuously, meeting the needs of different industries and application fields.

What are the types of aluminum substrates?

(I) Flexible aluminum substrate

The material system of flexible aluminum substrate is usually a polyimide resin system with ceramic fillers, which can provide excellent electrical insulation, flexibility and thermal conductivity.

For example, in some portable electronic devices that require special shapes, flexible aluminum substrates can better adapt to the internal space of the device, eliminating expensive fixtures, cables and connectors, and reducing overall costs.

At the same time, due to its good flexibility, it can also play an important role in some bendable electronic products, such as foldable displays.

(II) Multilayer aluminum substrate

In the high-performance power supply market, multilayer aluminum substrates are made of multiple layers of thermally conductive dielectrics. These structures have one or more layers of circuits buried in the dielectric, and blind holes are used as thermal vias or signal paths.

Although it is more expensive and less efficient to transfer heat with a single-layer design, they provide a simple and effective heat dissipation solution for more complex designs. For example, in some high-end server power supplies, industrial power supplies and other fields, the heat dissipation requirements are extremely high. Multilayer aluminum substrates can meet the heat dissipation needs of these complex electronic devices and ensure the stable operation of the equipment.

(III) Through-hole aluminum substrate

In the most complex structures, a layer of aluminum can form the “core” of a multi-layer thermal structure.

Before lamination, the aluminum is pre-plated and filled with dielectrics. Thermal materials or sub-assemblies can be laminated to both sides of the aluminum using thermal bonding materials. Once laminated, the completed assembly is similar to a traditional multi-layer aluminum substrate through drilling.

The plated through-holes pass through the gaps in the aluminum to maintain electrical insulation. Alternatively, the copper core can allow direct electrical connection as well as insulating through-holes. This complex structure makes it play an important role in some high-end electronic devices with extremely high requirements for electrical insulation.

What is the dielectric material of aluminum PCB?

The dielectric material selection of aluminum PCB is diverse, designed to meet different performance requirements. Epoxy resin is widely used for its toughness and heat resistance, while polyimide is known for its high temperature stability and chemical stability.

Polystyrene is favored for its low dielectric constant and dielectric loss tangent, while acrylic ester is selected for its excellent light transmittance. In addition, ceramic materials such as alumina, silicon nitride, zirconium oxide, etc. are also commonly used dielectric materials for aluminum PCBs due to their excellent insulation, thermal conductivity, oxidation resistance, and high-temperature stability.

Different dielectric materials have different dielectric constants and thermal properties, which are particularly important for applications in high-frequency and high-temperature environments. Polytetrafluoroethylene (PTFE) and ceramic substrates are particularly suitable for high-frequency and high-temperature environments due to their high temperature resistance and low dielectric constant.

In summary, there are a wide variety of dielectric materials for aluminum PCBs, including epoxy resin, polyimide, polystyrene, acrylic ester, alumina, silicon nitride, zirconium oxide, etc. These materials are selected based on their respective advantages to meet the performance requirements of aluminum PCBs in specific applications.

What is the thermal resistance of aluminum PCB?

The thermal resistance of aluminum PCBs ranges from 1℃/W to 2℃/W. ‌This data is in sharp contrast to the thermal resistance of FR4 PCBs, which ranges from 20℃/W to 22℃/W.

This shows that aluminum PCB is significantly better than FR4 PCB in heat dissipation performance. Aluminum material has good heat dissipation effect, which can effectively reduce the heat generated by electronic equipment during operation and keep components running at a suitable working temperature, thereby improving the stability and service life of the equipment.

What are the production processes of aluminum substrates?

First, the material is cut, and the incoming material inspection is strengthened to ensure that the sheet with a protective film on the aluminum surface is used. After cutting, there is no need to bake the sheet, and it should be handled with care, paying attention to protecting the protective film on the aluminum base surface.

Next is drilling. The drilling parameters are the same as those of FR-4 sheet materials. At the same time, the aperture tolerance must be strictly controlled, especially for 4OZ-based Cu. Pay attention to controlling the generation of flash, and drill with the copper skin facing up.

Then enter the dry film optical imaging link, including incoming material inspection, grinding, filming, board clapping, exposure and development.

When inspecting the board, the circuit surface must be inspected according to MI requirements for various contents, and the dry film on the aluminum base surface must not have film falling or damage.

In the etching process, since the copper base is generally 4OZ, etching is difficult. After the aluminum surface without protective film is taken out of the film stripping liquid, it should be washed with water in time to prevent the alkali solution from biting the aluminum surface.

The production process of the green oil process is grinding the plate (only brushing the copper surface) → silk screen printing green oil (first time) → pre-baking → silk screen printing green oil (second time) → pre-baking → exposure → development → grinding machine pickling soft brush → post-curing → next process.

Before spraying tin, tear off the protective film of the aluminum substrate with protective film, hold the edge of the plate with both hands, and it is strictly forbidden to touch the inside of the plate directly with your hands. Pay attention to the operation to prevent scratches.

What are the characteristics of aluminum substrate manufacturers?

(I) Good processing and production effect

Aluminum substrate manufacturers can make full use of the material properties of the aluminum substrate itself according to the actual processing size to bring better processing and production effects for building material design.

(II) Stable and reliable quality

Aluminum substrate manufacturers focus on product quality and stability, and use high-quality raw materials and strict production standards. They have a complete production system and quality control system to ensure the quality and stability of products.

(III) Advanced production technology

Aluminum substrate manufacturers use advanced production technology and equipment to ensure product accuracy and stability. They have professional sales and technical teams that can provide high-quality products and technical support.

(IV) Energy saving and environmental protection

Aluminum substrate manufacturers focus on the energy saving and environmental protection of their products, and use energy-saving and environmentally friendly materials and production processes. They have strong R&D and technical strength, and continue to launch new energy-saving and environmentally friendly products and technological innovations.

What is the market prospect of aluminum substrate manufacturers?

The continuous emergence of new generation electronic products, such as smart phones, tablets, wearable devices, etc., has higher and higher requirements for heat dissipation performance and thinness. Aluminum substrates, as a metal-based copper-clad laminate with good heat dissipation function, just meet these needs.

The development of emerging technologies such as 5G has also brought new opportunities to the aluminum substrate market. Aluminum substrates, as a metal-based copper-clad laminate with good heat dissipation and electrical properties, just meet the needs of 5G communication technology.

The trend of lightweight vehicles and the expansion of the new energy vehicle market have also brought new opportunities to the aluminum substrate market. Aluminum substrates, as a metal-based copper-clad laminate with the characteristics of lightweight, high strength and corrosion resistance, just meet the needs of lightweight vehicles.

In short, aluminum substrate manufacturers play an important role in the electronics field. They provide high-quality aluminum substrate products to the electronics industry with advanced technology, strict quality control, continuous innovation and research and development, and good customer service.

Archive for the ‘mcpcb’ Category

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