Archive for the ‘Metal Core PCB’ Category

Can I design microvias in multilayer MCPCB?

Saturday, October 12th, 2024

What is a Microvias?

A microvia is a small hole drilled into a PCB that connects different layers. They are essential for high-density interconnections and are commonly used in advanced electronic designs. Typically, microvias equal to or less than 150 microns drilled on the PCB board with a laser. In 2013, the IPC standard changed the definition of microvias to those with an aspect ratio of 1:1. Ratio of aperture to depth (not exceeding 0.25mm). Previously, micropores were less than or equal to 0.15 mm in diameter, so they typically spanned only one layer.

Can I design microvias in multilayer MCPCB?

Because the diameter is very small compared to mechanically drilled through holes (PTH), we define them as microvias, usually connecting only one layer of the board to its adjacent layers. These through holes reduce the possibility of any type of manufacturing defect because they are laser drilled, thus reducing the possibility of any residue remaining after the process. Because of their small size and ability to connect one layer to the next, they can make dense printed circuit boards with more complex designs.

Types of Microvias

There are two types of microvias in the PCB design – stacked microvias and staggered microvias.

Stacked Microvias

Stacked microvias are formed by stacking multiple layers on top of each other to provide a path through which current flows. Create a hole in one layer and drill into another layer below. The top layer is welded or welded to the bottom layer to form an interconnect between the two layers. This allows for fast, efficient routing without compromising performance or reliability.

Staggered Microvias

The interlaced microvias is aligned with the pad of the same layer, but is offset from its center by half of the pad diameter. The distance from its center to the edge of the board is also half the diameter of the pad. Staggered microvias allow you to place two through holes in a single pad without overlapping them or having to route wires on different layers together in this location. This type of microvias can be used for electrical connections to the surrounding brass pads and traces.

What is the Difference Between Vias and Microvias?

Vias and microvias serve similar purposes in connecting different layers of a PCB, but they differ significantly in size and application.

1. Size

One of the most significant differences between vias and microvias is their size. Standard vias typically have a diameter greater than 150 micrometers (μm), while microvias are defined as having a diameter of 150 μm or less.

2. Design Complexity

As technology advances, the demand for higher circuit densities and more complex designs has grown. Microvias enable designers to create intricate multilayer circuits that were not possible with standard vias.

3. Layer Connection

Standard vias can connect any number of layers in a PCB, typically running from the outer layer through to the inner layers. In contrast, microvias are usually used for connecting one or two layers. Microvias are commonly employed in multilayer PCBs, where they can connect the outer layer to one or more inner layers without passing through the entire board.

4. Aspect Ratio

The aspect ratio, which is the ratio of the depth of a via to its diameter, is another important difference. Standard vias generally have lower aspect ratios, making them easier to fabricate. Microvias, due to their smaller size, often have higher aspect ratios. A typical aspect ratio for microvias ranges from 1:1 to 2:1.

5. Applications

Standard vias are commonly used in traditional PCB designs for applications where space is not as critical. They are suitable for general-purpose circuits, power distribution, and less complex layouts. In contrast, microvias are essential in high-density applications, such as smartphones, tablets, and advanced computing devices, where compact designs are necessary.

Microvias vs. Blind Via

Blind vias connect the outer layer of the PCB to one or more inner layers without penetrating the entire board. As the name suggests, these through-holes are “blind holes” because they are not visible from the other side of the PCB. Blind holes have several advantages, such as saving space on the board, enabling a more compact design, and improving signal integrity by reducing the length of the signal path.

The blind via passes through the surface layer of the PCB, extending through only a portion of the board to connect the surface layer to one or more inner layers. They are a key component in current PCB designs, allowing surface components to connect to inner layers while minimizing the number of layers required for wiring. The advantages of using blind vias including:

Increased density

Reduce the number of layers

Improved signal performance

Good for heat dissipation

Improve mechanical strength

Can Microvias be Designed in Multilayer MCPCB?

Yes, microvias can indeed be designed in multilayer MCPCBs. In fact, their small size and efficient design make them ideal for these types of boards. Multilayer MCPCBs often require compact interconnections to accommodate various functionalities, and microvias facilitate this need. By enabling multiple layers to connect efficiently, microvias enhance the overall performance of the MCPCB. Additionally, they contribute to improved thermal management, a critical factor in high-power applications. Their integration in multilayer designs is a significant advantage for modern electronics.

The process for using microvias in multilayer metal-based circuit boards includes the following key steps:

1. Inner laser drilling and plating: This is the first step in the production of microvias, precisely drilled by laser technology, and electroplated.

2. Resin filled: The micro-vias after electroplating are filled with resin to enhance the stability of the structure.

3. Resin grinding: Grind the orifice after the jack hole to ensure a smooth surface.

4. Electroplating: Metallize the surface of the orifice resin to achieve electrical interconnection between layers.

5. Inner circuit etching and outer layer lamination: To complete the production of the inner circuit, and the outer layer of laser drilling and graphic plating, and finally realize the production of multi-layer circuit board.

MCPCB Material in Best Technology

MCPCB Prototype Lead Time (Vary Depends on the MCPCB Design)

What is a 2 Layer Aluminum PCB?

A 2-layer aluminum PCB is a type of metal core circuit board that contains two conductive layers, usually copper, with an aluminum core or base material. Aluminum PCBs are used for their excellent heat dissipation properties, and always used in high-power applications like LED lighting, power supplies, and automotive systems. The aluminum base offers better thermal management than standard FR4 PCBs. In a 2-layer aluminum PCB, the two conductive copper layers allow more complex routing for electrical signals compared to single-layer boards.

2 Layer Aluminum PCB | Metal Core PCB Manufacturer

2 Layer Aluminum PCB Stack-Up

The stack-up of a 2-layer aluminum PCB consists of the following:

Top Copper Layer: This is where the signal traces and components are located. It can vary in thickness, depending on current-carrying requirements.

Dielectric Layer: A layer of insulation that separates the top copper layer from the aluminum core. It plays a key role in electrical isolation and heat transfer.

Aluminum Base: This core provides structural support and excellent heat dissipation properties. It also serves as the grounding plane in some designs.

Bottom Copper Layer: The second conductive layer allows for more advanced routing.

How Thick is a 2 Layer PCB Layer?

The thickness of a 2-layer aluminum PCB can vary depending on the specific design requirements, but typically, the copper layer is about 1 to 2 ounces (35 to 70 microns) thick. The aluminum base itself is thicker, usually between 1.0 mm and 3.0 mm, depending on the board’s required rigidity and heat dissipation needs. The overall board thickness generally ranges between 1.2 mm and 3.2 mm.

A thicker aluminum core improves heat transfer, but the board’s thickness must also align with the product’s mechanical and electrical requirements. Designers often have to balance between sufficient thermal performance and the overall board size for practical applications.

Is Thicker Aluminum PCB have Better Heat Dissipation?

Generally speaking, the thinner the thickness of the aluminum PCB, the faster the heat conduction speed. The thicker the thickness of the aluminum PCB, the slower the heat conduction rate. The thermal conductivity of aluminum-based circuit board mainly depends on its material and structure. Although thickness affects the path length of heat conduction, the more critical factors are the thermal conductivity and structural design of the material. For example, high thermal conductivity materials such as copper, silver and other high thermal conductivity materials will significantly improve the thermal conductivity of aluminum substrate. In addition, the thickness and thermal conductivity of the insulation layer will also affect the overall thermal conductivity effect ‌.

Specifically, the thermal conductivity of the aluminum-based circuit board is also related to the thickness of its insulation layer. The thicker the insulation layer, although it can withstand higher voltage, it will also reduce the heat transfer efficiency. Therefore, choosing the appropriate insulation layer thickness and materials with high thermal conductivity is the key to ensuring efficient thermal conductivity of aluminum-based circuit boards ‌.

2 Layers Aluminum PCB vs. Double Sided Aluminum PCB

Though the terms “2 layers aluminum PCB” and “double-sided aluminum PCB” might sound similar, there are slight differences.

A 2-layer aluminum PCB contains two conductive copper layers. These layers can be arranged to handle signal routing and ground planes separately. In contrast, a double-sided aluminum PCB typically has one copper layer on either side of the aluminum core, offering less flexibility in routing. Here is the stack up of double sided aluminum PCB:

How Much Does Aluminum PCB Cost?

The cost of an aluminum PCB, including a 2-layer version, depends on several factors such as the board’s thickness, copper weight, design complexity, and production volume. On average, 2-layer aluminum PCBs cost more than single-sided aluminum PCBs because of the additional copper layer and routing complexity.

For small orders, prices might range between $5 and $15 per square foot. For larger production runs, costs can decrease significantly due to economies of scale. Factors like the thickness of the aluminum base and copper layer, as well as additional features like surface finishes, can also influence the price.

While aluminum PCBs are more expensive than standard FR4 boards, their enhanced thermal performance can reduce overall system costs by improving reliability and reducing the need for additional cooling measures.

How Many Layers Should a PCB Have?

The number of layers a PCB should have depends on the complexity of the design. For simple applications like LED lighting or power conversion, a 2-layer aluminum PCB is often sufficient. It provides more routing flexibility than a single-layer board while still offering effective heat dissipation.

For more complex designs requiring high-density interconnections or additional functionality, a multi-layer PCB with three or more layers might be necessary. However, multi-layer aluminum PCBs are rare because their primary function is thermal management, which is typically solved within one or two layers. The decision to use more layers depends on the specific application, power requirements, and signal integrity needed in the design.

Aluminum PCB Design Guidelines

When designing a 2-layer aluminum PCB, several factors must be considered to maximize performance:

Thermal Management: Since aluminum PCBs are chosen for their thermal properties, optimizing heat dissipation is critical. Components that generate significant heat should be placed near the aluminum core, allowing for faster heat transfer.

Copper Thickness: The copper thickness should match the current-carrying requirements of the design. Using thicker copper can help manage higher current loads, but it also increases the cost and weight of the PCB.

Dielectric Layer: The thickness and material of the dielectric layer play a crucial role in both thermal and electrical performance. A thinner dielectric layer improves heat dissipation but may limit electrical isolation. Choosing the right dielectric material is key for balancing performance and reliability.

Via Placement: For a 2-layer design, vias must be carefully placed to connect the two copper layers. Vias should be positioned to minimize electrical interference and maintain signal integrity.

Component Placement: Heat-sensitive components should be placed away from high-power components. This minimizes thermal stress on sensitive devices and ensures reliable operation over the PCB’s lifespan.

Aluminum PCBs may come with a higher price tag compared to traditional FR4 boards, but the long-term benefits in heat management, performance, and durability make them an excellent investment for demanding applications. Whether you’re working on power electronics, automotive circuits, or lighting solutions, a 2-layer aluminum PCB can provide the right balance between complexity and thermal efficiency.

If you’re in need of high-quality, custom aluminum PCBs, Best Technology specializes in delivering tailored solutions for your specific design needs. With 18+ years of experience in PCB manufacturing, we ensure top-notch performance, quality, and reliability for all your projects. Let us help you bring your ideas to life with the right aluminum PCB solution!

What is Aluminum PCB Circuit Board?

An aluminum PCB, also known as an aluminum circuit board, is a type of metal core printed circuit board that uses aluminum as its base material. Unlike traditional PCBs, which are typically made with fiberglass, aluminum PCBs offer superior heat dissipation. This makes them ideal for high-power applications where excess heat can damage sensitive components. Aluminum PCBs are widely used in industries such as LED lighting, automotive, and power equipment because they provide better thermal management.

Aluminum PCBs are made from a combination of the following materials:

Aluminum Substrate: The base layer, responsible for mechanical support and heat dissipation.
Dielectric Layer: This layer provides insulation between the conductive layer and the aluminum base, while also helping with thermal transfer.
Conductive Layer: Made of copper, this layer is etched to form the circuit pattern and provides electrical connectivity.
Solder Mask Layer: This is a protective layer to protect the traces.

Aluminum PCB Circuit Board | Aluminum PCB Design & Prototype

Types of Aluminum PCB

Aluminum circuit board is a kind of metal base copper clad plate with good heat dissipation function, the main types include single-sided aluminum PCB, double-sided aluminum PCB and multi-layer aluminum PCB. ‌

Single sided aluminum PCB

The single-sided aluminum substrate is composed of a conductive graphic layer and an insulating material plus aluminum plate, which is relatively simple in structure and suitable for the installation and connection of some basic electronic components.

Double sided aluminum PCB

The double-sided circuit aluminum substrate has two layers of conductive graphics layer and the insulating material plus aluminum plate superimposed together, providing a larger circuit layout space and better heat dissipation effect, which is often used in electronic devices requiring higher integration and better heat dissipation performance.

Multilayer aluminum PCB

Multi-layer printed aluminum-based circuit board consists of three or more layers of conductive graphic layer and insulating material and aluminum plate alternately laminated together, with complex circuit design and excellent heat dissipation performance, suitable for high-end applications such as LED lighting, automotive electronics ‌.

In addition, there are other special types of aluminum-based circuit boards, such as flexible aluminum substrates, mixed aluminum substrates, etc. Flexible aluminum substrate has excellent electrical insulation, flexibility and thermal conductivity, and is suitable for product design in various shapes and angles. The hybrid aluminum substrate is a multilayer component made of conventional FR-4 bonded to an aluminum substrate with a thermoelectric medium, designed to improve heat dissipation and rigidity, and used as a shield ‌.

Aluminum PCB Features

The aluminum substrate, a metal-based cooling plate (including aluminum, copper, and iron substrates), is made from a low-alloyed Al-Mg-Si series high-plastic alloy plate. This material offers excellent thermal conductivity, electrical insulation, and mechanical processing capabilities. When compared to traditional FR-4 materials, aluminum substrates of the same thickness and line width can carry higher currents. Additionally, they can withstand voltages up to 4500V and have a thermal conductivity greater than 2.0, making aluminum substrates the preferred choice in the industry.

● Surface mount technology (SMT);

● Very effective treatment of thermal diffusion in circuit design;

● Reduce product operating temperature, improve product power density and reliability, extend product service life;

● Reduce product volume, reduce hardware and assembly costs;

● Replace fragile ceramic substrate for better mechanical durability.

Aluminum PCB vs. Copper PCB

Both aluminum and copper PCBs have their own advantages, but they cater to different applications:

1. Thermal Conductivity

In general, the higher the thermal conductivity, the more efficient the heat transfer, resulting in better heat dissipation and a longer lifespan. Among metal substrates, copper substrates offer the best thermal conductivity, outperforming aluminum substrates.

2. Electrical Conductivity

Both aluminum and copper are metals and conduct electricity, though their exact levels of conductivity differ. In terms of electrical conductivity, copper is significantly superior to aluminum. In applications that require high electrical conductivity, copper is the ideal choice.

3. Resistance

Resistance is crucial in PCB design as it affects the overall functionality and stability of the components. Given that copper has a higher density than aluminum, its resistance is generally lower. Therefore, in applications requiring thinner circuits and faster power transmission, copper is the better option.

4. Weight

Due to copper’s higher density per unit area, copper PCBs are much heavier than aluminum PCBs with the same design.

In applications where lightweight structures are critical, aluminum is the preferred material. On the other hand, applications where weight is not a major concern often favor the use of copper.

5. Applications

Aluminum substrates are somewhat specialized. They are mainly used in energy-saving lighting products such as indoor lighting, energy-efficient lighting, and street lights. Copper substrates are suitable for high-power lighting equipment like car headlights, tail lights, and some high-tech electronics.

6. Manufacturing Process

The manufacturing process for aluminum-based PCBs is simpler than that for copper-based PCBs, which also impacts their production time and delivery schedules. Below is aluminum PCB and copper core PCB that made by Best Technology:

Aluminum PCB Manufacturing Process

The manufacturing process for aluminum PCBs involves several steps to ensure high quality and performance. Here is a basic manufacturing process of aluminum PCB:

1. Substrate Selection and Preprocessing

Aluminum alloys with high thermal conductivity, such as the 5052 and 6061 series, are selected as the base material. The aluminum sheet is first cut and cleaned to remove surface grease and impurities, ensuring proper adhesion for subsequent processes.

2. Chemical Etching of Patterns

Photosensitive ink is used to form the desired circuit patterns on the aluminum surface. After exposure and development, the ink-covered areas protect the underlying aluminum from being etched by chemicals, while the unprotected areas are etched away, forming the circuit pattern.

3. Insulation Layer Deposition

To achieve electrical isolation, an insulating material, usually thermosetting resin or ceramic-filled epoxy resin, is deposited on the aluminum substrate. This step is typically completed using screen printing or inkjet printing technology to ensure a uniform and appropriately thick insulation layer.

4. Metallization

Creating conductive paths on the insulation layer is a key step. Copper foil is deposited onto the insulation layer using methods such as electroplating, sputtering, or chemical copper deposition. This copper foil serves as the conductive layer for connecting LED chips and other components.

5. Drilling and Metallization

Holes are drilled in the board according to the design to achieve electrical connections between different layers. The hole walls are then metallized to ensure good conductivity inside the holes.

6. Surface Treatment

To improve solderability and corrosion resistance, the aluminum substrate undergoes additional surface treatments, such as tin spraying, gold plating, or silver plating.

7. Assembly and Testing

LED chips, resistors, capacitors, and other components are soldered onto the circuit board to complete the assembly. Here you can see the whole manufacturing process of aluminum metal core PCB.

What Affects Aluminum PCB Circuit Board Price?

First of all, ‌ raw material cost ‌ is one of the important factors affecting the price of aluminum based circuit board. The raw materials of aluminum substrate include aluminum substrate and other auxiliary materials, such as insulating layer materials. The price fluctuation of aluminum substrate will directly affect the production cost of aluminum substrate, and then affect its market price. In addition, the cost of electricity is also a part of the production process cannot be ignored, the fluctuation of electricity price will further affect the production cost ‌.

Secondly, ‌ market supply and demand ‌ is also a key factor in determining the price of aluminum-based circuit boards. If demand increases and supply is insufficient, prices will naturally go up. On the other hand, if there is an oversupply, the price will fall. Changes in demand in the construction, automotive and other industries, as well as changes on the supply side such as the construction of new plants or the closure of old plants, will have a direct impact on the price of aluminum-based circuit boards ‌.

‌The macroeconomic environment ‌ also has an important impact on the price of aluminum-based circuit boards. When economic growth is expected to be good, the demand for aluminum substrate in related industries increases, driving up prices; The expectation of economic recession will lead to a decline in demand and pressure on aluminum substrate prices ‌.

‌Policies and regulations ‌ is also one of the factors affecting the price of aluminum-based circuit boards. The government’s environmental protection policies, trade policies and industry subsidies will have an impact on the aluminum substrate market. For example, environmental policies that limit production may reduce supply and push up prices; The establishment of trade barriers may affect the import and export of aluminum substrate, and then affect the domestic market price.

Aluminum PCB Production Capability – Best Technology

Best Technology is known for its strong production capability when it comes to aluminum PCBs. Our manufacturing facilities are equipped with the latest technology to produce high-quality aluminum PCBs that meet industry standards. We have the ability to produce single-sided, double-sided, and multi-layer aluminum PCBs, below you can see our capability of aluminum PCBs:

Applications of Aluminum PCB

Aluminum PCBs are used in a variety of applications, particularly where heat management is crucial:

LED Lighting
Automotive Electronics
Power Supplies
Consumer Electronics
Medical
Household appliance

FAQs about Aluminum PCB Circuit Board

1. What is the main advantage of aluminum PCBs?

Aluminum PCBs excel in thermal management, making them perfect for heat-sensitive applications.

2. Are aluminum PCBs expensive?

No, aluminum PCBs are generally affordable, making them a cost-effective option for many industries.

3. Can aluminum PCBs be used in consumer electronics?

Yes, aluminum PCBs are commonly used in consumer electronics, especially in devices that generate significant heat.

4. What industries commonly use aluminum PCBs?

Industries such as automotive, LED lighting, and power supplies frequently use aluminum PCBs due to their thermal properties.

5. Is aluminum PCB better than copper PCB?

It depends on the application. Aluminum is better for heat dissipation, while copper excels in electrical conductivity.

What are the holes in a PCB called?

What are the holes on PCB called? What are the holes in the circuit? The holes on PCB can be roughly divided into 3 types, screw holes (mounting holes), conductive holes (vias), and plug-in holes.

Screw holes: Screw holes are used for fixing.

Conductive holes: Conductive holes (also called vias) are used for conducting electricity just like circuits.

Plug-in holes: Plug-in holes are of course used to plug in various parts, such as diodes, transistors, capacitors, inductors, etc.

What is a through hole

What is a through hole? Through holes, also known as perforations, are holes in a PCB that go all the way through the board. Their main purpose is to provide electrical connections for component pins while allowing soldering on both sides of the board.

1.A via is a special through hole whose wall is metallized to achieve electrical connection between different layers on a circuit board. This type of hole is usually used to connect component pins to internal circuits, or to achieve electrical connection between different layers in a multi-layer PCB. Vias need to be metallized during the PCB manufacturing process, which usually includes drilling, desmearing, chemical copper plating, and electroplating.

2.Non-conducting holes are the opposite of through holes. Their hole walls are not metallized, so they do not have electrical connection functions. These holes are mainly used for mechanical fixation, heat dissipation or identification purposes. Non-conducting holes are relatively simple in the PCB manufacturing process, and only drilling operations are required.

What is a blind via?

A blind via is a hole that extends from one side of a PCB to a certain internal layer without penetrating the entire board. The emergence of blind vias is mainly due to the development of HDI technology, which provides circuit designers with greater flexibility and more compact layout. Blind vias are usually used to connect surface mount components (SMD) to internal circuit layers, or to connect circuits between different internal layers.

What are buried vias?

Buried vias are holes located inside the PCB that do not penetrate any side of the board. They are completely hidden inside the board and are used to connect circuits between different internal layers. Buried vias are especially useful in HDI boards because they can reduce the overall thickness of the board while maintaining electrical connections between internal circuits.

What is a microvia?

Microvia refers to a hole with a smaller diameter, usually at the micron level. The emergence of microvia technology enables PCB designers to achieve more complex circuit layouts in a smaller space. Microvias are often used in high-density, high-reliability electronic devices such as mobile phones and tablets. The manufacture of microvias requires high-precision drilling equipment and technology to ensure the accuracy and reliability of the holes.

What are Mounting holes？

What are Mounting holes?Locking holes are auxiliary holes used in the PCB manufacturing and assembly process to accurately locate and fix the circuit board. They are usually located at the edge or specific position of the PCB to ensure that the circuit board can be accurately aligned and fixed during manufacturing, testing and assembly. The locating holes do not participate in the connection of the circuit, but are essential to ensure the quality and performance of the circuit board.

What are Mounting holes？

What are thermal vias?

Thermal vias are holes designed specifically for heat dissipation, usually large and can run through the entire PCB or multiple layers. Their role is to reduce heat buildup on the circuit board by increasing surface area and air flow, thereby improving the stability and reliability of the device. Thermal vias are particularly important in high-performance, high-power electronic devices.

FAQ About board electronics with holes

How to solve the contradiction between manual routing and automatic routing of high-speed signals?

Most of the current powerful routing software’s automatic routing tools have set constraints to control the routing method and the number of vias. The routing engine capabilities and constraint setting items of various EDA companies are sometimes very different. For example, whether there are enough constraints to control the winding method of the serpentine, whether the routing spacing of the differential pair can be controlled, etc. This will affect whether the routing method generated by automatic routing can meet the designer’s ideas. In addition, the difficulty of manually adjusting the routing is also related to the capabilities of the routing engine. For example, the pushing ability of the routing, the pushing ability of the via, and even the pushing ability of the routing pair copper. Therefore, choosing a routing tool with strong routing engine capabilities is the solution.

Will adding test points affect the quality of high-speed signals?

As for whether it will affect the signal quality, it depends on the method of adding test points and how fast the signal is. Basically, the additional test points (not using the existing vias (via or DIP pins) as test points) may be added to the line or a small section of wire may be pulled out from the line. The former is equivalent to adding a very small capacitor to the line, while the latter is an additional branch. Both of these situations will have some impact on high-speed signals, and the extent of the impact is related to the frequency speed of the signal and the edge rate of the signal. The magnitude of the impact can be learned through simulation. In principle, the smaller the test point, the better (of course, it must meet the requirements of the test equipment) and the shorter the branch, the better.

Can you introduce some foreign technical books and data on high-speed PCB design?

Now the application of high-speed digital circuits includes communication networks and calculators and other related fields. In the communication network, the operating frequency of PCB boards has reached around GHz, and the number of layers is as many as 40 layers as far as I know. Due to the advancement of chips, the operating frequency of calculator-related applications, whether it is a general PC or server, has reached 400MHz (such as Rambus) or above. In response to the demand for high-speed and high-density routing, the demand for blind/buried vias, mircrovias and build-up process technology is gradually increasing. These design requirements can be mass-produced by manufacturers.

Does the design of rigid-flexible boards require special design software and specifications? Where can I undertake the processing of such circuit boards in China?

Can I use general PCB design software to design flexible printed circuits (Flexible Printed Circuit). The Gerber format is also used for FPC manufacturers to produce. Since the manufacturing process is different from that of general PCBs, each manufacturer will have its own restrictions on line width, line spacing, and aperture (via) based on their manufacturing capabilities. In addition, some copper foil can be laid at the turning point of the flexible circuit board for reinforcement. As for the manufacturer, you can search for “FPC” as a keyword on the Internet and you should be able to find it.

If the size of the circuit board is fixed, if the design needs to accommodate more functions, it is often necessary to increase the routing density of the PCB, but this may lead to increased mutual interference between the routings, and at the same time, the impedance cannot be reduced if the routing is too thin. Please introduce the techniques in the design of high-speed (>100MHz) high-density PCBs?

When designing high-speed and high-density PCBs, crosstalk interference does need to be paid special attention to because it has a great impact on timing and signal integrity. Here are a few things to note:

Control the continuity and matching of the characteristic impedance of the trace.

The size of the trace spacing. The spacing commonly seen is twice the line width. Through simulation, you can know the impact of trace spacing on timing and signal integrity and find the tolerable spacing. The results of different chip signals may be different.

Choose an appropriate termination method.

Avoid the same routing direction of the upper and lower adjacent layers, or even have traces overlapped up and down, because this kind of crosstalk is greater than the case of adjacent traces on the same layer.

Use blind/buried vias to increase the trace area. However, the production cost of the PCB board will increase. It is indeed difficult to achieve complete parallelism and equal length in actual implementation, but it should be done as much as possible.

In addition, differential termination and common mode termination can be reserved to mitigate the impact on timing and signal integrity.

The RF part, IF part, and even the low-frequency circuit part of the outdoor unit are often deployed on the same PCB. What are the material requirements for such PCB? How to prevent interference between RF, IF, and even low-frequency circuits?

Hybrid circuit design is a big problem. It is difficult to have a perfect solution.

Generally, RF circuits are laid out and wired as an independent single board in the system, and there will even be a special shielding cavity. Moreover, RF circuits are generally single-sided or double-sided boards, and the circuits are relatively simple. All of these are to reduce the impact on the distributed parameters of RF circuits and improve the consistency of RF systems. Compared with general FR4 materials, RF circuit boards tend to use high-Q substrates. The dielectric constant of this material is relatively small, the distributed capacitance of the transmission line is small, the impedance is high, and the signal transmission delay is small. In hybrid circuit design, although RF and digital circuits are made on the same PCB, they are generally divided into RF circuit area and digital circuit area, and laid out and wired separately. Shielding is used between ground vias and shielding boxes.

What is Copper Clad Laminate?

Copper clad laminate short for CCL, it is a foundational material in the electronics industry. It consists of a thin copper foil bonded to one or both sides of a non-conductive substrate like fiberglass or resin. This combination creates a durable and conductive material that serves as the base for creating printed circuit boards (PCBs). The copper layer facilitates the transmission of electrical signals, while the insulating substrate supports the board’s structural integrity.

CCL comes in various thicknesses and types, depending on the application. It’s a critical part of most electronic devices, from smartphones to industrial machines. Its main role is to support the etching of circuit patterns, where unnecessary copper is removed, leaving conductive paths that enable electrical connections. Below is a structure of a double sided copper clad laminate:

What is Copper Clad Board Used For?

Copper clad boards are widely used in PCB manufacturing. Their role is to provide a surface for electrical components to connect through conductive copper traces. CCLs are widely used in applications including, but not limited to:

Electronic products: Copper clad board is the basic material of electronic products, used to manufacture various electronic equipment circuit board, such as TV, radio, computer, computer and so on.

Communication equipment: Mobile phones, tablet computers, routers and other communication equipment a large number of copper clad laminate.

Computers and peripherals: Computer motherboards, graphics cards, hard disks, etc., need a large number of copper-clad boards.

Automotive electronics: Electronic equipment in modern automobiles, such as ABS, air conditioning, navigation, etc., need to use copper clad board.

Military: Electronic components in military equipment also need to use a large number of copper-clad boards.

In addition, copper clad boards are also used in industrial control, medical instruments, national defense, aerospace and other fields. With the development of technology and the increase of application demand, the use of copper clad plate in electronic products is more and more extensive, which plays an important role in promoting the renewal of social production and living tools. For example, the development of the Internet of Things and artificial intelligence, as well as the application of 5G communication technology, have greatly increased the demand for copper clad sheets. ‌

What is the Market Report for Copper Clad Laminate?

The market for copper clad laminate has grown steadily due to the increasing demand for consumer electronics, automotive advancements, and telecommunication developments. The global CCL market is expected to expand significantly over the next few years, driven by technological advancements in 5G, renewable energy systems, and electric vehicles.

Key players in this market are working to develop lighter, thinner, and more efficient CCLs to keep pace with the growing need for high-performance electronics. Manufacturers exploring new materials and production methods to reduce costs while enhancing performance. The future looks promising, with a forecast of rapid growth driven by the electronics industry’s evolution.

Is Copper Clad Better Than Copper?

Copper clad laminate is a more practical option for PCBs than solid copper because it provides the required conductive properties at a lower cost. While copper is an excellent conductor, using copper as metal core PCBs would be expensive and impractical. CCL offers the same conductivity benefits but adds a lightweight, non-conductive layer that provides structural support.

Electrical Conductivity and Cost Efficiency

While pure copper has excellent electrical conductivity, copper clad laminates (CCLs) provide a balance between cost and performance. In a copper clad board, only a thin copper layer is used, which significantly reduces the amount of copper needed compared to using solid copper. For applications like PCBs, where large surfaces need copper conductivity but do not require the full thickness of copper, copper clad is more efficient and economical.

Thermal Management

Copper clad materials often have better thermal management properties due to the substrate’s ability to dissipate heat while maintaining the copper layer’s high conductivity. Pure copper, while an excellent heat conductor, may not offer the same level of thermal dissipation when used alone in complex electronic assemblies. For instance, in multi-layer PCBs, copper clad boards help balance the need for heat management and conductivity by using the copper layer efficiently while the base material manages thermal stress.

Structural Support and Durability

Copper clad laminates provide added structural support compared to pure copper sheets. The non-conductive substrate, often made of fiberglass, resin, or other materials, adds durability and rigidity to the thin copper layer. By contrast, is soft and flexible, making it unsuitable for structural applications without some form of backing material.

Corrosion Resistance

Copper, though highly conductive, is prone to oxidation and corrosion over time, which can affect its performance in certain environments. Copper clad laminates, however, are often treated with protective coatings or layered with other materials to enhance their resistance to corrosion.

Weight Considerations

Another important factor is weight. Copper is a dense metal, and using thick copper layers can significantly increase the weight of a product. In contrast, copper clad laminates achieve high conductivity with only a fraction of the copper’s weight.

How Thick is Copper Clad Board?

The thickness of a copper clad board depends on its intended application. Standard copper thicknesses for CCL are measured in ounces per square foot, typically ranging from 0.5 oz to 2 oz per square foot. This translates to about 17 to 70 microns. For high-power applications, thicker copper, such as 3 oz or more, may be used.

On the other hand, the thickness of the laminate itself can also vary, depending on whether it’s a single-layer, double-layer, or multilayer board. The insulating substrate can range from 0.2 mm to several millimeters, depending on the application. The total thickness of the copper clad board is a combination of the copper foil and the insulating material.

How Much Does Copper Cladding Weigh?

The weight of copper cladding is typically expressed in ounces per square foot. A common weight is 1 oz of copper, which means that a square foot of copper clad board has a 1-ounce copper layer. This is approximately 35 microns thick. Heavier copper cladding, such as 2 oz or 3 oz, is also used for applications that require higher current-carrying capacity or greater durability.

It’s important to balance the weight with the application needs. Higher copper weight provides better conductivity and durability but adds cost and weight to the final product. Therefore, the choice of copper weight in CCL depends largely on the required performance and cost considerations.

Copper Clad Laminate Price

The price of copper clad laminate varies based on several factors such as copper thickness, substrate material, board size, and production volume. Standard-grade CCL is more affordable, while high-end options with specialty substrates like Teflon or ceramic tend to be more expensive.

On average, copper clad laminate costs range from $5 to $15 per square meter for common types. However, high-performance laminates designed for demanding environments, such as those used in aerospace or military applications, can be significantly more expensive.

Global market trends, material shortages, and the demand for electronics heavily influence pricing. Recently, fluctuations in copper prices and supply chain disruptions have impacted the cost of CCL. Still, bulk orders or long-term contracts with suppliers can help reduce costs for large manufacturers.

How to Cut Copper Clad Laminate?

CCL requires careful handling to ensure precise cuts without damaging the copper layer or the substrate. The cutting method will vary depending on the thickness and material, but overall, clean and accurate techniques are key.

1. Choose the Right Tools

The tools you use depend on the thickness of the copper clad laminate. Thin CCL can be cut with a utility knife, while thicker boards require specialized tools like a PCB shear or laser cutter.

2. Prepare the Work Area

Before cutting, ensure that your workspace is clean and stable. Use a flat surface to keep the laminate steady during cutting. For larger boards, use clamps to secure them in place. Always wear protective gear like goggles and a mask, especially when working with power tools to avoid dust and debris.

3. Measure and Mark the Cutting Line

Accurate measurements are crucial for a clean cut. Use a ruler or measuring tape to mark the cutting line and draw it clearly with a permanent marker. Double-check your measurements to avoid mistakes before cutting.

4. Score the Copper Clad Laminate

For thin laminates, use a utility knife to score along the marked line. Score the copper side first, then flip it over and score the substrate. Once both sides are scored, gently bend the laminate along the line until it snaps cleanly.

5. Cut Thick Copper Clad Laminate

For thicker CCL, use a guillotine PCB shear or a Dremel tool. A PCB shear provides a clean, straight cut, while a Dremel is useful for cutting complex shapes. For high precision, a laser cutter is the best choice, especially for intricate designs.

6. Deburr and Smooth the Edges

After cutting, the edges may be rough. Use a file to smooth out any jagged areas, then finish with fine-grit sandpaper.

Safety is important when cutting CCL. Fiberglass and other substrate materials can produce harmful dust. Always wear a dust mask and safety goggles, and work in a well-ventilated area to minimize exposure to particles. In addition to this, avoid over-scoring the laminate, which can damage the substrate or cause copper peeling. Make sure to apply consistent pressure while cutting to prevent uneven edges. Always prioritize safety by using proper protective gear to avoid injuries.

Copper Clad Laminate Suppliers

Numerous suppliers provide copper clad laminate globally. The selection of a supplier depends on factors like the type of laminate, application requirements, and volume needed. Some well-known suppliers include:

Kingboard Laminates
Panasonic
Isola Group
Nan Ya Plastics
Shengyi Technology
Rogers Corporation
Ventec International Group
Doosan Corporation
Iteq Corporation
Mitsubishi Gas Chemical

With over a decade of effort and experience, Best Technology has been actively contributing to the growth of this business. Certified with ISO9001, ISO13485, IATF16949, UL, and RoHS, the company is fully capable of delivering high-quality, eco-friendly PCBs and various types of copper clad laminates at competitive prices.

PCB Full Form

PCB stands for Printed Circuit Board, a key component in almost all electronic devices. It connects and supports electronic components using conductive tracks, pads, and other features. The design and production of PCBs require precise engineering, as they are crucial for the functionality of the final product.

What is PCB Quote Packaging?

PCB quote packaging refers to the process of gathering and organizing all the details needed to estimate the cost of producing a PCB. This includes not only the design specifications but also the materials, manufacturing processes, and other engineering considerations. It’s not just a financial calculation but a complete engineering analysis that ensures the quote is accurate, feasible, and optimized for production.

The quote must consider every detail that affects production—like material types, size, complexity, and production volume. The aim is to package all these details into a clear, comprehensive quote, ensuring the client understands what they are paying for and why.

Why is Engineering Important in PCB Quote Packaging?

Engineering plays a vital role in the PCB quoting process because it’s not just about estimating costs. It’s about understanding the technical requirements and ensuring that every aspect of the design and production is accounted for. Engineers analyze the design, materials, and manufacturing methods to ensure the quote reflects the real cost of production.

Without engineering insight, a quote could be inaccurate, leading to cost overruns or production delays. Engineers make sure that all technical details, such as layer count, trace width, and component placement, are properly considered.

What Are the Key Factors in a PCB Quote?

Several factors come into play when preparing a PCB quote:

PCB Quote Packaging is What Type of Engineering?

1. Type of manufacturing process

The technical type of PCB determines its complexity and cost. For example, simple single panels cost much less than multi-layer panels, while flexible circuits (FPC) or rigid and flexible panels require more complex manufacturing processes and naturally cost more. In addition, whether advanced technologies such as microvias, laser drilling, blind holes or buried holes are required can also have a significant impact on the quotation.

2. Material type

Materials are an important part of PCB costs. Common materials include FR4, ceramics, metal substrates, etc. FR4 is the most common base material and is suitable for most conventional applications, but for high-frequency, high-temperature environments, ceramic or metal-based materials may be more suitable, but their price is relatively high. Choosing the right material not only affects the performance, but also directly affects the cost.

3. IPC level

IPC grades reflect the quality standards of PCB manufacturing, commonly used are IPC-A-600 grades 1, 2 and 3. The higher the grade, the more stringent the manufacturing requirements, and the corresponding increase in cost. For example, grade 3 PCBS are usually used in high-demand fields such as aerospace and medical equipment, which require higher accuracy and quality control, so the price is higher.

4. Circuit design

PCB circuit design complexity directly affects manufacturing costs. Including wire width, spacing, hole size and so on, the production process has put forward different requirements. High density interconnect (HDI) boards typically require more elaborate wiring techniques and may involve the use of microvias, which will increase the difficulty and cost of manufacturing.

5. PCB size and yield

The size of the PCB directly affects the amount of material used, and the larger the board, the more material is needed. In addition, the yield is also an important factor affecting the quotation. PCB manufacturing with complex design or high density lines is prone to defects, resulting in decreased yield. That means manufacturers may need to produce more boards to meet orders, increasing costs.

6. Material thickness

Different applications require different thicknesses of PCB materials. The standard FR4 thickness is usually 1.6mm, but thinner or thicker boards are sometimes used. Changes in material thickness can affect the overall cost, especially if thicker sheets require special processing or higher strength, and manufacturing expenses will increase accordingly.

7. Copper thickness

The copper thickness in the PCB usually has a standard choice, such as 1oz, 2oz or even thicker copper layers. The higher the copper thickness, the better the conductivity of the PCB, suitable for high-current applications, but the increase in copper thickness will significantly increase the manufacturing cost, especially in the plating and etching process requires additional materials and processes.

8. Stack-up method

The stacking mode determines the number of layers and the interlayer structure of the PCB. Complex multilayer boards or HDI boards require more complex lamination processes. For example, the lamination method may involve multiple pressing, the use of prepregs or special insulation materials. Each additional layer requires more manufacturing steps, resulting in increased costs.

9. Quantity

The quantity of the order has a direct impact on the PCB quotation. High-volume production can reduce unit prices by spreading tooling and setup costs, while small-batch orders are typically more expensive due to relatively high production preparation and start-up costs.

10. Delivery date

The shorter the delivery time, the higher the quotation. Rush orders require prioritizing production, which can disrupt the plant’s production schedule and require additional resource deployment. To meet urgent delivery deadlines, manufacturers may need to work overtime or speed up production, increasing overall production costs.

These are just a few examples, but they show how engineering considerations are woven into every part of the quoting process.

PCB Manufacturing Process

How Do Engineers Calculate PCB Manufacturing Costs?

Engineers calculate PCB manufacturing costs by considering the design specifications and the production methods needed to meet those requirements. They start by analyzing the PCB’s layout and design, which determines factors like layer count, trace width, and hole size. Each of these elements has a direct impact on the materials used and the manufacturing process.

They also consider the assembly process—whether it’s surface-mount or through-hole—and what testing will be required. After evaluating these details, they calculate the costs associated with each step of the manufacturing process. This ensures the final quote is both accurate and comprehensive.

What Type of Engineer Designs PCBs?

Engineers who design PCBs typically have a bachelor’s degree or above in electrical engineering, automation, computer science, or a related field ‌ and understand the basics of electronic design, printed circuit board (PCB), and electronics manufacturing in the PCB industry. These engineers need to master PCB design software such as Altium Designer, Eagle PCB, PADS, or CAD, etc., as well as the use of related manufacturing and testing tools. At the same time, they need to have a knowledge of the PCB industry, a certain circuit design and electronic components knowledge, including digital and analog circuits, signal processing, power electronics, embedded systems, communication technology, etc. In addition, holding certificates such as IPC-2221/2222, IPC-A-600/610, and CID (Certified Interconnect Designer) can prove that they have relevant professional knowledge and skills, which can help improve their career competitiveness.

These engineers also need to have a strong sense of responsibility and team spirit, have good communication and coordination skills, and be able to work effectively with customers, manufacturers, and other team members. For junior engineers, it is recommended to study in a single point of depth, such as PCB design, SI simulation, thermal design, EMC design, product testing, etc., and then start from this advantage point to expand the scope of knowledge

What Materials Are Considered During PCB Quote Packaging?

The type of material used for a PCB is a major cost driver. Common materials include:

This is the most common material used in PCBs due to its balance of cost and performance. It’s versatile and reliable for most standard applications.

Metal Core

Metal core PCBs are used in applications where heat dissipation is a concern, such as LED lighting. These boards are more expensive due to the metal layer.

Ceramic

Ceramic materials are used for high-frequency or high-temperature applications. They are more costly but offer better performance in extreme conditions.

Each material has its own manufacturing process, which also affects the cost. For instance, metal core boards may require different drilling techniques compared to standard FR4 boards. Engineers must consider these details when preparing a quote.

How Does the Choice of PCB Manufacturing Methods Impact the Quote?

The method used to manufacture the PCB can greatly impact the final cost. Common methods include:

Surface-Mount Technology (SMT): This is the most common method for modern PCB assembly. It’s efficient and cost-effective for most applications.

Through-Hole Technology (THT): This method is used for components that require a stronger mechanical bond. It’s more labor-intensive and, therefore, more expensive.

Flexible and Rigid-Flex Manufacturing: These types of PCBs require specialized processes and materials, which can increase the cost.

Additionally, advanced techniques like laser drilling for microvias or selective soldering for complex assemblies may be necessary for high-precision designs. Each of these methods requires careful consideration, and engineers must choose the best process for both the design and the budget.

Who Designs PCB?

Since 2006, Best Technology has been the leading PCB quick turn manufacturer specializing in both PCB prototype and production quantities, initially produced single-sided and double-sided printed circuit boards for the consumer electronics market. Now, we provide not only FR4 PCB, but also some special PCB like flex circuit, metal core PCB, ceramic PCB, extra thin PCB, HDI PCB, IC substrate, busbar PCB, heavy copper PCB and so on. We can make 50 layers PCB, and it is not our limit.

Nowadays, Best Technology has grown to become a major PCB manufacturer in Asia to serve in diverse customers base such as electronics appliance, communication, educational electronics, power supplies, automations.

For more information about PCB, or to learn more about the online quote and ordering process, please visit www.bestpcbs.com

What is MCPCB?

‌MCPCB‌, full name Metal Core PCB, is also known as aluminum substrate or aluminum-based circuit board. It is a type of circuit board that attaches the original printed circuit board to a metal with better thermal conductivity to improve the heat dissipation performance at the circuit board level.

This metal-based printed circuit board usually uses aluminum as the substrate, but also includes the use of other metals such as copper or other high thermal conductivity materials. The design of MCPCB combines the high thermal conductivity of metal with the flexibility of printed circuit boards, making it widely used in various industrial electronic devices.

Especially in the LED industry, MCPCB has become an indispensable component due to its strong magnetic conductivity and excellent heat dissipation. In addition, in the production process of MCPCB, in addition to using aluminum substrates, fiberglass boards (FR-4) are also used for some designs, but special heat dissipation pads need to be designed and fixed by screws or glue.

What is the use of MCPCB?

The main use and advantage of MCPCB (metal core printed circuit board) lies in its excellent heat dissipation performance. ‌

MCPCB, full name Metal Core PCB, is a printed circuit board attached to a metal with better heat conduction effect, thereby improving the heat dissipation at the circuit board level.

This design not only improves the heat dissipation performance of the circuit board, but also has some specific application restrictions, such as the temperature cannot exceed 140℃ when the circuit system is operating, which is determined by the characteristic limitations of the dielectric layer.

During the manufacturing process, the temperature must not exceed 250℃~300℃, which must be understood in advance before passing the tin furnace. This design of MCPCB makes it widely used in many fields, including but not limited to:

‌LED lights‌: used for spotlights, high-current PCBs, high-current LEDs, street safety applications, etc.

‌Automotive electronics‌: used in power conditioners, ignition tools, switching converters, variable optical systems, and motors for electric and hybrid vehicles.

‌Power supply equipment‌: such as DC-DC converters, voltage regulators, high-density power conversion, and switching regulators.

‌Audio equipment‌: balanced, input-output, audio, power supply, and pre-shielded amplifiers.

‌Home appliances‌: flat panel displays, motor controls, etc.

‌OA equipment‌: large electronic display substrates, thermal print heads, and printer drivers.

The unique combination of MCPCB (metal plate, insulation layer, and additional copper foil) provides strong magnetic conductivity and excellent heat dissipation, which is particularly important in the LED industry.

In addition, the high thermal conductivity of MCPCB allows the generated heat to dissipate quickly, preventing heat accumulation and ensuring that the LED operates within the optimal temperature range, which plays an important role in improving the performance, thermal management, and overall reliability of UV LEDs.

What is the difference between FR4 and MCPCB?

The main difference between FR4 and MCPCB (metal matrix printed circuit board) is their heat dissipation performance, material composition, and application areas. ‌

1. Heat dissipation performance:

FR4 has a low thermal conductivity and its heat dissipation performance is not as good as MCPCB. MCPCB is based on its metal core (usually aluminum or copper), and transfers heat to the heat sink through the thermal conductive dielectric layer and the metal substrate, and has good heat dissipation ability.

2. Material composition:

FR4 is a multi-layer printed circuit board material composed of glass fiber cloth and epoxy resin. It has good electrical and mechanical processing performance, but general heat dissipation performance.

MCPCB attaches the original printed circuit board to a metal with better thermal conductivity. The design of the metal substrate and the thermal conductive dielectric layer significantly improves the heat dissipation efficiency.

3. Application field:

FR4 is widely used in electronic equipment that requires basic heat dissipation requirements due to its low cost and good electrical performance.

MCPCB is often used in high-power, high-heat-intensive application scenarios due to its excellent heat dissipation performance, such as TVs, monitors and other cost-sensitive products.

In summary, MCPCB has better heat dissipation performance than FR4 through its metal substrate and optimized thermal conductivity design, and is particularly suitable for application scenarios that require high-performance heat dissipation.

What is the structure of MCPCB?

The structure of MCPCB consists of a circuit layer (copper foil layer), a thermal insulation layer and a metal base layer. ‌

‌Circuit layer‌ (copper foil layer): It requires a large current carrying capacity, so thicker copper foil should be used, and the thickness is generally between 35μm~280μm.

‌Thermal insulation layer‌: This is the core technology of PCB aluminum substrate, usually composed of special polymers filled with special ceramics, with low thermal resistance, excellent viscoelastic properties and resistance to thermal aging, and can withstand mechanical and thermal stress.

‌Metal base layer‌: Aluminum or copper metal is used as the base material of the circuit board, and a layer of copper foil or copper plate metal plate is attached to the substrate as a circuit to improve problems such as poor heat dissipation.

How thick is the copper in MCPCB?

The thickness of copper foil in MCPCB is generally 35μm~280μm. ‌

The structure of MCPCB (Metal Core PCB) consists of circuit layer (copper foil layer), thermal conductive insulation layer and metal base layer. The circuit layer requires a large current carrying capacity, so thicker copper foil should be used.

Such thickness can meet the demand of high current carrying capacity. The use of such copper foil guarantees the superiority of MCPCB in electrical performance and thermal conductivity.

What is the thermal conductivity of MCPCB?

The thermal conductivity of MCPCB varies with the materials used, but is generally much higher than that of standard FR4 PCB. Most MCPCBs have a thermal conductivity in the range of 1 W/mK to 5 W/mK. In contrast, the thermal conductivity of FR4 boards is about 0.3 W/mK, which makes them much less efficient in heat dissipation.

The advantage of MCPCB is that its heat dissipation performance is significantly better than that of standard FR-4 structure. This advantage is not only reflected in the thermal conductivity of the dielectric used, which is far higher than that of conventional epoxy glass, but also in its heat transfer efficiency, with a thermal transfer index of one-tenth the thickness being more efficient than that of traditional rigid PCB.

What is MCPCB led?

MCPCB LED refers to a light-emitting diode (LED) that uses a metal core printed circuit board (MCPCB) as a heat dissipation substrate. This technology uses a metal core printed circuit board as a heat dissipation substrate for LEDs to improve the heat dissipation performance of the LED, thereby ensuring stable operation and extending the service life of the LED.

MCPCB is a special printed circuit board in which the metal core acts as a thermal conductive layer, which can effectively conduct the heat generated by the LED to avoid overheating that affects the performance and life of the LED.

In addition, the design and manufacture of MCPCB also consider the needs of electrical connections and physical support to ensure the reliability and stability of the LED module. With the increasing application of high-power LEDs, MCPCB technology has been favored for its excellent heat dissipation performance and has become one of the key technologies in high-power LED packaging.

Conclusion:

MCPCB has a unique structure, including a conductive metal base, a dielectric insulation layer, and a copper circuit layer, which can provide a reliable solution to the heat dissipation challenges in modern electronic products. As the demand for high-performance electronic products continues to grow, the demand for advanced materials such as MCPCB will also continue to grow to meet these thermal management challenges.

What is Aluminum Printed Circuit Board

Aluminum printed circuit board is a metal-based copper-clad board with good heat dissipation function. Generally, a single-sided board consists of three layers, namely the circuit layer (copper foil), the insulation layer and the metal base layer. There are also designs for high-end use as double-sided boards, with the structure of circuit layer, insulation layer, aluminum base, insulation layer, and circuit layer. Very few applications are multi-layer boards, which can be made of ordinary multi-layer boards, insulation layers, and aluminum bases.

LED aluminum printed circuit boards are just circuit boards made of aluminum alloy. In the past, our general circuit boards were made of fiberglass, but because LEDs generate a lot of heat, the circuit boards used for LED lamps are generally aluminum printed circuit boards, which can conduct heat quickly. The circuit boards used for other equipment or electrical appliances are still fiberglass boards!

What are the advantages of aluminum PCB?

Heat dissipation
Many double-sided boards and multi-layer boards have high density and high power, and it is difficult to dissipate heat. Conventional printed circuit board substrates such as FR4 and CEM3 are poor conductors of heat, with insulation between layers, and heat cannot be dissipated. If local heating of electronic equipment is not eliminated, electronic components will fail at high temperatures, and aluminum printed circuit boards can solve this heat dissipation problem.
Thermal expansion
Thermal expansion and contraction are the common nature of materials, and the thermal expansion coefficients of different materials are different. Aluminum-based printed circuit boards can effectively solve the heat dissipation problem, thereby alleviating the thermal expansion and contraction problems of different materials of components on the printed circuit board, and improving the durability and reliability of the whole machine and electronic equipment. In particular, it solves the thermal expansion and contraction problems of SMT (surface mount technology).
Dimensional stability
Aluminum-based printed circuit boards are obviously much more stable in size than printed circuit boards made of insulating materials. Aluminum-based printed circuit boards and aluminum sandwich panels, heated from 30℃ to 140~150℃, have a dimensional change of 2.5~3.0%.
Other advantages
Aluminum-based printed circuit boards have a shielding effect; high strength, replacing brittle ceramic substrates; ease of use, safe use of surface mounting technology; reducing the truly effective area of the printed circuit board; replacing components such as radiators, improving product heat resistance and physical properties; reducing production costs and labor.

How does an aluminum PCB work?

‌The working principle of aluminum printed circuit boards mainly relies on its unique three-layer structure: circuit layer (copper foil), insulation layer and metal base layer. This structure enables aluminum printed circuit boards to have good heat dissipation function.

Specifically, the power device is mounted on the circuit layer. When the device is running, the heat generated is quickly transferred to the metal base layer through the insulation layer, and then the metal base layer transfers the heat away, thereby achieving effective heat dissipation of the device. This design enables aluminum printed circuit boards to significantly reduce thermal resistance, provide excellent thermal conductivity, and maintain excellent mechanical properties.

Aluminum printed circuit boards also comply with RoHS requirements and are more suitable for SMT processes. In the circuit design scheme, heat diffusion is extremely effectively processed, the module operating temperature is reduced, the service life is extended, and the power density and reliability are improved. By reducing the configuration of heat sinks and other hardware, aluminum printed circuit boards can also reduce product size, reduce hardware and assembly costs, and optimize the combination of power circuits and control circuits.

Types of printed circuit board aluminum

‌The classification of aluminum printed circuit boards mainly includes flexible aluminum printed circuit boards, hybrid aluminum printed circuit boards, multi-layer aluminum printed circuit boards and through-hole aluminum printed circuit boards.
‌1. Flexible aluminum printed circuit boards ‌
Utilize flexible dielectric materials to provide excellent electrical insulation, flexibility and thermal conductivity, suitable for a variety of shapes and angles, and eliminate the need for expensive fixtures, cables and connectors.
‌2. Hybrid aluminum printed circuit boards ‌
In a “hybrid” IMS structure, “sub-assemblies” of non-thermal substances are processed independently and then bonded to an aluminum substrate using thermal materials. Common structures are 2-layer or 4-layer sub-assemblies made of FR-4, bonded to an aluminum substrate with thermal dielectrics, which helps dissipate heat, improve rigidity and act as a shield.
‌3. Multi-layer aluminum printed circuit boards ‌
In the high-performance power supply market, it is made of multi-layer thermally conductive dielectrics, with one or more layers of circuits buried in the dielectric, and blind holes are used as thermal vias or signal paths to provide effective heat dissipation solutions for complex designs.
‌4. Through-hole aluminum printed circuit boards‌
Before lamination, the aluminum is plated and filled with dielectric, thermal materials or sub-components are laminated to both sides of the aluminum using thermal bonding materials, and plated through holes pass through the gaps in the aluminum to maintain electrical insulation.

Aluminum PCB Structure

Circuit layer
The circuit layer (generally electrolytic copper foil) is etched to form a printed circuit for assembly and connection of devices. Compared with traditional FR-4, with the same thickness and line width, aluminum printed circuit boards can carry higher currents.
Insulation layer
The insulation layer is the core technology of aluminum printed circuit boards, which mainly plays the role of bonding, insulation and heat conduction. The insulation layer of aluminum printed circuit boards is the largest thermal barrier in the power module structure. The better the thermal conductivity of the insulation layer, the more conducive it is to the diffusion of heat generated by the device during operation, and the more conducive it is to reduce the operating temperature of the device, thereby achieving the purpose of increasing the power load of the module, reducing the volume, extending the life, and increasing the power output.
Metal base
The type of metal used for the insulated metal substrate depends on the comprehensive consideration of the thermal expansion coefficient, thermal conductivity, strength, hardness, weight, surface state and cost of the metal substrate.

Aluminum Printed Circuit Board Process

Material: Aluminum printed circuit board is a heat dissipation material with excellent thermal conductivity. Aluminum alloy materials with high thermal conductivity, high strength and good corrosion resistance are usually selected. Choosing the right substrate material has a very important influence on the stability and heat dissipation performance of aluminum printed circuit boards.

‌Cutting‌: Cut the substrate into plates of appropriate size and into the shape of the entire circuit board. Cutting methods include laser cutting, mechanical cutting, etc. After cutting, it needs to be polished to meet the requirements of the next drilling.

Grinding‌: Grinding is to form a smooth surface on the substrate material and facilitate the next drilling operation. Factors affecting the grinding effect include the type and accuracy of the tool, the type and concentration of the grinding fluid, the pressure, etc.

Drilling‌: Drilling is to form wiring holes for components on the circuit board. Most of them are now using CNC drilling machines, which can make the drilling accuracy higher. Factors affecting the drilling quality include the material and geometric characteristics of the drill bit, the drilling speed, the drilling depth, and the drilling position accuracy.

Chemical treatment: Chemical treatment is an extremely important step in the manufacturing process of aluminum printed circuit boards. The appropriate circuit layer structure is prepared by etching, copper plating, surface treatment and other methods. This step requires strict control of parameters such as the concentration, temperature and time of the corrosive agent and electrolyte to obtain the required surface structure and quality.

Copper plating: Copper plating is to form a copper layer that connects the circuit and the ground wire, usually using methods such as chemical copper plating. Adverse factors of copper plating include uneven copper layer, excessive roughness, pinholes, and deformation of the copper layer.

Welding: Welding is a necessary step to directly solder electronic devices to aluminum printed circuit boards. Welding methods include manual welding and automated welding. During the welding process, the welding temperature, time and welding quality need to be strictly controlled to ensure reliable solder joints.

What is the thermal conductivity of aluminum PCB?

‌‌The thermal conductivity of aluminum printed circuit boards refers to the amount of heat transferred by a material per unit time and per unit area, usually expressed in W/m·K. The difference between 1.0, 1.5, and 2.0 thermal conductivity.

‌1.0 W/m·K‌: The insulation layer of the general-purpose aluminum-based copper-clad laminate is composed of an epoxy glass cloth bonding sheet, which is suitable for the heat dissipation needs of general electronic products.
‌1.5 W/m·K‌: The insulation layer of the high-heat dissipation aluminum-based copper-clad laminate is composed of a high-thermal-conductivity epoxy resin or other resin, which is suitable for occasions requiring higher heat dissipation performance.
‌2.0 W/m·K‌: The insulation layer of the aluminum-based copper-clad laminate for high-frequency circuits is composed of a polyolefin resin or polyimide resin glass cloth bonding sheet.

What is the difference between aluminum PCB and FR4?

The main differences between aluminum printed circuit boards and FR-4 circuit boards are materials, thermal conductivity, mechanical properties, cost, and application areas. ‌

Materials‌:
Aluminum printed circuit boards are mainly composed of aluminum alloys, and the surface is usually coated with an insulating layer with good thermal conductivity, such as aluminum oxide (Al2O3).
The substrate of FR-4 circuit boards is a glass fiber reinforced epoxy resin, which is formed by impregnating glass fiber cloth with epoxy resin to form a composite material.

Thermal conductivity‌:
Aluminum printed circuit boards have good thermal conductivity and are suitable for applications with high heat dissipation requirements, such as LED lighting and electronic power supplies.
FR-4 circuit boards have relatively poor thermal conductivity and are usually used in general electronic devices, not suitable for scenarios with high heat dissipation requirements.
Mechanical properties‌:
Aluminum printed circuit boards are relatively hard and have good mechanical properties, and are suitable for applications that require a certain mechanical strength.
FR-4 circuit boards are relatively soft and easy to process, but may not be as good as aluminum printed circuit boards in terms of mechanical strength.
Cost‌:
Due to the high manufacturing process and material costs of aluminum printed circuit boards, the cost of aluminum printed circuit boards is relatively high.
FR-4 circuit boards have relatively low manufacturing processes and material costs, and are usually an affordable choice.
Application areas:
Aluminum printed circuit boards are mainly used in applications that require good heat dissipation performance, such as LED lamps, power modules, automotive electronics, etc.
FR-4 circuit boards are suitable for general electronic products, such as computer hardware, communication equipment, consumer electronics, etc.

What are aluminum PCBs used for?

Audio equipment: input and output amplifiers, balanced amplifiers, audio amplifiers, preamplifiers, power amplifiers, etc.
Power supply equipment: voltage stabilizers, regulators, DC-AC adapters, etc.
Communication electronic equipment: high-frequency amplifiers, filter appliances, and transmission circuits.
Office automation equipment: motor drivers, etc.
Computers: power supply devices, floppy disk drives, motherboards, etc.
Power modules: inverters, solid-state relays, rectifier bridges, etc.
Electronic control: relays, transistor bases, and cooling of components in various circuits;
Switches, microwaves: radiators, semiconductor device insulation heat conduction, motor controllers;
Industrial vehicles: igniters, voltage regulators, automatic safety control systems, and lighting conversion systems;
LED displays (two modes: LED display; display using LED light sources)
Lamps and lighting: With the promotion of energy-saving lamps, various energy-saving and gorgeous LED lamps are very popular in the market, and aluminum printed circuit boards used in LED lamps have also begun to be used on a large scale.

Aluminum printed circuit boards supplier

Best Technology specializes in providing prototyping service of customized aluminum PCB solutions to meet the diverse needs of our clients. To make sure the one-time success of pcb prototyping, we proceed SI, PI, EMC, DFM analysis during the production. We are committed to be the most reliable aluminum printed circuit boards supplier in the world!

What is MCPCB prototype circuit board?

MCPCB prototype refers to the manufacture of a small number of sample PCB boards before formal mass production, and actual welding and testing to verify the correctness, performance and reliability of the design. This process is usually called “proofing” or “prototype production”. The main purpose of MCPCB prototype is to conduct trial production before mass production of circuit boards to ensure the feasibility of the design and the quality of the product. Through MCPCB prototype, design engineers can find and solve potential problems before actual production, thereby ensuring the performance and reliability of the final product.

Why do we need prototype model?

MCPCB prototypes are to verify the correctness and performance of the design and ensure the quality and reliability of the final product. ‌By making MCPCB prototypes, developers can better optimize product designs, discover potential problems and deficiencies through testing, and make targeted improvements and optimizations.
‌1. Verify the correctness of the design: By making sample boards for testing, design problems can be found, such as errors in component layout and line connection. By discovering problems in advance and making modifications, problems can be avoided during mass production, saving time and cost. ‌
‌2. Evaluate the performance of the circuit board: Through proofing tests, the working condition of the circuit board, signal transmission quality, power supply stability and other aspects can be checked to ensure the reliability and stability of the final product. ‌
‌3. Improve the manufacturing process: During the sample board production process, manufacturing problems can be found, such as poor pads and unreliable line connections, so as to adjust the manufacturing process and workflow in time to improve the overall manufacturing quality and efficiency.

What files are needed to MCPCB prototype ?

‌1. Gerber file: contains the layer information of PCB, such as pads, connections, jacks, etc., and is the basic file for PCB manufacturing.

BOM (Bill of Materials) list: lists the detailed information of all components on the PCB, including component model, quantity, etc., for procurement and assembly.

‌3. Drilling file: contains the location and size information of all holes punched on the PCB, which is very important for the manufacturer to perform drilling processing.

‌4. Circuit diagram: provides the connection method of the design, which is very important for checking whether the connection of the design is correct.

‌5. Special layer file: If the design requires special processes, such as impedance control or metallized hole wall, the corresponding special layer file needs to be provided. ‌

★★Detailed explanation of the role and importance of each file:
★★Installation instructions and precautions: Provide detailed installation instructions, including information such as component direction and polarity, as well as the processing methods of special components
★★Material and thickness instructions: Specify the substrate material, plate thickness, copper foil thickness and other information used to ensure the accuracy of the production process.

What files are needed to MCPCB prototype ?

Prototype pcb manufacturing process

Design phase:

Draw schematics: Use PCB design software (such as Altium Designer, Eagle, KiCad, etc.) to draw circuit schematics and perform error checking.

Generate PCB files: Generate PCB files based on schematics and component libraries, and set parameters such as number of layers, size, line width, and vias.

Export Gerber files and drill files: Gerber files describe PCB layers, and drill files describe via positions and sizes. These files are the main files required by board manufacturers.

Production phase:

Place an order to make PCBs: Package and compress Gerber files and drill files, upload them to the website or software of the board manufacturer, and select appropriate parameters and quantities to place an order and pay.

Wait for delivery: The board manufacturer produces PCBs according to the order and sends them to customers by express delivery, which usually takes a few days to a week. ‌

Subsequent processing (if SMT patch is required): ‌

Transform the schematic diagram and package library: Identify the component type and direction for the patch machine, and modify the schematic diagram and package library. ‌

Export SMT patch coordinate file and bill of materials (BOM): The SMT patch coordinate file describes the component position and angle, and the bill of materials describes the component type and quantity. ‌

Order SMT patch: On the website or software of the board manufacturer, select whether SMT patch is required, and upload relevant files to place an order. ‌

Waiting for delivery: The patch manufacturer performs SMT patch according to the order and sends it to the customer by express delivery. ‌

Testing phase: Test with a flying probe tester to detect defects that affect functionality, such as open circuits and short circuits.

The difference between MCPCB prototype and copy board

The main differences between MCPCB prototypes and copy boards lie in the process flow, production cycle, cost, and applicable scenarios.

Different process flow: Proofing is produced according to the design documents, usually through preparation, board making, drilling, plug-in, welding, coating and other process flows, and finally form a sample consistent with the design documents. Copy board is to reverse design and produce the existing PCB board, generally only need to carry out two process flows of plate making and etching.
Different production cycle: Proofing has a longer production cycle, generally it takes 1-2 weeks to produce samples, mainly because it needs to go through multiple process flows, and the manufacturer needs to carry out strict quality control. Copy board production cycle is relatively short, generally only 3-5 days to produce a copy of the same effect as the original board.
Different cost: Proofing costs are higher, because proofing requires multiple sample production and testing, plus the production cycle is longer, manufacturers need to invest more manpower and material resources. ‌
‌Copy board costs less, because it only needs to be reverse designed and produced once, and the production cycle is short, so the cost is lower. ‌
Different applicable scenarios: ‌
‌Proofing is suitable for scenarios where the performance and reliability of PCB boards need to be verified and tested, such as the research and development stage of new products, verification of new technologies, etc. ‌
‌Copy board is suitable for scenarios where a large number of PCB boards consistent with the original need to be produced quickly, such as mass production, repair and replacement, etc. ‌

How much does a MCPCB prototype cost?

Basic costs: including manufacturing costs, material costs and labor costs. Manufacturing costs include depreciation of production equipment and equipment maintenance costs; material costs mainly refer to the costs of PCB boards, and the prices of different types of boards vary greatly; labor costs include the labor costs of design, board making, welding and other processes. ‌
Process costs: calculated according to the customer’s special requirements for PCB boards, such as multi-layer boards, blind holes, buried holes, impedance control and other advanced processes will increase costs. The more layers, the higher the manufacturing difficulty and cost; the processing of special holes requires more sophisticated equipment and technology, so it will increase costs; impedance control In order to meet the stability of signal transmission, impedance control of PCB boards is sometimes required, which will also increase certain costs.
Logistics costs: mainly include express delivery costs and insurance costs. It is calculated based on the number and weight of PCB boards, as well as the distance between the place of shipment and the place of receipt. In order to ensure the safety of goods during transportation, customers can choose to purchase insurance, and this part of the cost will also be added to the proofing price.
Other costs: including taxes, surcharges, etc. According to the tax laws of different countries and regions, customers may need to pay corresponding taxes; if customers require expedited services or special services, additional fees may be incurred.

Why do prototypes cost so much?

‌1. Material cost‌: Multilayer PCBs require more substrates and prepregs, and the quality of these materials directly affects the functionality and reliability of the circuit. Although using high TG (glass transition temperature) materials will increase costs, it can improve the stability of PCBs in high temperature environments. ‌
‌2. Manufacturing process‌: The production process of multilayer PCBs is more complicated, involving multiple pressing, drilling, and copper plating processes. ‌These steps require sophisticated equipment and technology, which pushes up production costs. ‌
‌3. Design complexity‌: The design of multilayer PCBs is usually more complex, involving more circuits and more compact spatial layout. Designers need to invest more time and energy in design optimization to ensure signal integrity and electromagnetic compatibility. ‌
‌4. Testing and verification‌: To ensure that the performance of multilayer PCBs meets the standards, rigorous testing and verification are required, including electrical testing, thermal stress testing, etc., which adds additional costs. ‌
‌5. Quantity and delivery time‌: The number of samples and the delivery time required by the customer will also affect the price. ‌Urgent orders often require additional expedited fees. ‌
‌6. Documentation and component research: The quantity and quality of documentation that may need to be completed to accompany the prototype build, and the manufacturer must update or create the necessary documentation to proceed with the build. Components in the design may need to be improved, and component engineers will need to spend time researching suitable alternatives. ‌
‌7. Engineering analysis: The design may be more conceptual rather than production-ready, requiring more engineering analysis to ensure that potential manufacturing errors have been corrected. ‌
‌8. Design and debug: It is often necessary to include more elements, such as design for assembly, design for test, and design for debug. Debugging design is essential in prototyping.

What is the full form of MCPCB

mcpcb full form is metal core printed circuit board
Attach the original printed circuit board to another metal with better heat conduction effect to improve the heat dissipation at the circuit board level. Metal-based PCBs usually consist of three layers: circuit layer (copper foil layer), thermal conductive insulation layer and metal base layer.

What is MCPCB

Metal Core PCB is a printed circuit board whose substrate uses metal material as a support layer or heat dissipation layer, usually an aluminum substrate or a copper substrate. It has excellent electrical conductivity and thermal conductivity.
Metal Core PCB is usually composed of a metal substrate, an adhesive and copper foil. It is characterized by high reliability, good heat dissipation, and is suitable for high-speed transmission and high-frequency circuits.

What is MCPCB

What is mcpcb led

Metal-based LED lamps are LED lighting fixtures that use metal-based circuit boards (MCPCBs) as light source boards. This type of circuit board, called aluminum-based copper-clad circuit boards (ALPCBs), has excellent thermal conductivity and high cost-effectiveness, and has rapidly become the first choice for light source boards of LED lighting fixtures since 2007. The basic structure of a metal-based circuit board includes a conductive layer (copper foil layer), an insulating heat dissipation layer, and a metal base layer (mostly aluminum or copper), which together provide good electrical insulation and heat dissipation.

In LED lamps, it can conduct heat quickly, which is very effective in dealing with the problem of high heat generation of LEDs. Aluminum substrates also support surface mount technology (SMT), which effectively handles heat diffusion in circuit design solutions, ensuring that LED lamps have better performance and longer service life

What is the thermal conductivity of Mcpcb?

The thermal conductivity of MCPCB ranges from 1.0-4W/mK, while high-performance MCPCB can reach 230W/mK.

The thermal conductivity of MCPCB depends on its design and the materials used. ‌Generally speaking, the thermal conductivity of MCPCB is between 1.0-4W/mK, which can already meet the heat dissipation needs of most electronic devices. ‌However, for applications that require higher thermal conductivity, MCPCBs with thermal conductivity as high as 230W/mK have appeared on the market. This high-performance MCPCB uses special materials and designs to provide better heat dissipation. ‌

MCPCB material

Aluminum substrate: Aluminum substrate is a metal-based copper-clad plate with good thermal conductivity and electrical insulation properties. It is usually composed of an aluminum alloy base layer and an insulating dielectric layer, and is suitable for electronic devices that require efficient heat dissipation, such as LED lighting and power supplies. Aluminum substrates can not only effectively conduct heat from the circuit board to the heat sink, but also have good mechanical strength and electromagnetic shielding effects.
Copper substrate: Copper substrates are known for their excellent electrical conductivity and can provide low-resistance paths, which helps improve circuit performance. Copper’s thermal expansion coefficient is similar to that of many semiconductor materials, which helps reduce thermal stress and increase component reliability.
Tungsten substrate: Tungsten substrate has good high-temperature stability and is suitable for electronic devices in high-temperature environments. Tungsten has a low thermal expansion coefficient, which helps maintain the dimensional stability of components at different temperatures, and is suitable for high-performance electronic devices that require compact designs.
Nickel substrate: Nickel substrate has good magnetic properties and is suitable for the application of magnetic components. Nickel substrates exhibit excellent corrosion resistance and mechanical strength under certain environments, and are suitable for electronic devices in some special environments. ‌
Stainless steel substrate: Stainless steel substrate is well-known for its excellent corrosion resistance and is suitable for electronic devices in some special environments. The durability and stability of stainless steel substrate make it an ideal choice for some harsh environments.

Advantages of MCPCB

High thermal conductivity: The thermal conductivity of metal substrate PCB is much better than that of traditional plastic substrates such as FR4. It can effectively conduct the heat generated by components, reduce the operating temperature of components, and improve the reliability and life of circuit boards.
Good thermal stability: Metal substrate PCB can maintain good dimensional stability and electrical performance in high temperature environments, and is suitable for high temperature working environments.
High strength and rigidity: Metal substrate PCB has high mechanical strength and rigidity, is not easy to deform and break, and can withstand large external forces and vibrations.
Excellent electrical insulation performance: Through the special insulation layer design, good electrical insulation performance is guaranteed to avoid electrical short circuits between components.
Low impedance: The conductive layer of metal substrate PCB is made of metal material, which has low impedance, which is conducive to signal transmission and processing.
Good processability: Metal substrate PCB can be processed by conventional mechanical processing methods such as drilling and cutting, which is convenient for the production of circuit boards with complex shapes and sizes. ‌
Widely used: Aluminum substrates are widely used in audio equipment, computers, automobiles, lamps and lighting. Copper substrates are suitable for high-frequency circuits and areas with large changes in high and low temperatures.

Application of MCPCB

Automotive electronics: The stability and reliability of metal-based PCBs make them an ideal choice in the automotive electronics field, ensuring the stable operation of automotive electronic systems.
Medical devices: In medical devices, the high reliability and good electromagnetic compatibility of metal-based PCBs are essential to ensure the accuracy and safety of medical equipment.
Industrial automation: Industrial automation equipment has high requirements for reliability and performance. The mechanical strength and high thermal conductivity of metal-based PCBs make them the preferred choice in the field of industrial automation.
Communication base stations and radar systems: Communication base stations and radar systems need to process a large amount of data transmission and high-frequency signals. The excellent electrical properties and high-frequency characteristics of metal-based PCBs meet the needs of these applications.
Antennas and filters: In the field of wireless communications, the electromagnetic shielding performance and stability of metal-based PCBs are essential to improving communication quality and reducing electromagnetic interference.

How to make MCPCB

The process flow of metal-based PCB includes inner-layer circuit production, lamination, drilling, hole metallization, outer-layer dry film, outer-layer circuit, silk-screen printing, surface processing and post-processing. ‌

Inner-layer circuit production: This step is mainly to produce the inner-layer circuit of the PCB circuit board, including cutting, pretreatment, lamination, exposure, DE (development, etching, film removal) and other processes, the purpose is to produce the inner-layer circuit of the PCB circuit board. ‌
Lamination: Press the copper foil, prepreg and brown-treated inner-layer circuit board into a multi-layer board. This step is to press multiple inner-layer boards into one board. ‌
Drilling: Use a drilling machine to drill holes of different diameters and sizes on the board according to customer requirements, so that the holes between the boards are convenient for subsequent processing of plug-ins, and can also help the board dissipate heat. ‌
Hole metallization: Metallizing the non-conductor part on the hole wall can make the subsequent electroplating process more convenient. ‌This step is to plate copper in the hole so that the circuits on each layer of the board are conductive. ‌
Outer layer dry film: The required circuit is exposed on the dry film through graphic transfer technology, in order to facilitate the subsequent process to make the circuit. ‌
Outer layer circuit: The purpose is to plate the copper thickness to the thickness required by the customer and complete the circuit shape required by the customer. ‌
Silk screen printing: The protective layer of the outer layer circuit is used to ensure the insulation, protective plate, and solder mask of the PCB. ‌
Surface processing: Complete the processing according to the customer’s requirements, and test it to ensure the final quality audit. ‌Both THT and SMT parts are installed on the PCB using machinery and equipment. ‌
Post-processing: Complete the processing according to the customer’s requirements, and test it to ensure the final quality audit.

Metal PCB Manufacturers

Welcome to our website! With over 18 years of experience in designing and manufacturing MCPCBs, we take pride in being your one-stop supplier. Our original factory spans 30,000㎡, and with a team of 229+ staff and advanced equipment, we achieve a daily peak production of up to 100k pieces.

As a trusted supplier, we hold certifications including UL, ISO13485, ISO9001, IATF16949 and SGS, enabling us to meet the high standards of clients across Europe, America, Israel, India, and so on. Our success is built on core values such as honesty, integrity, teamwork, appreciation, self-confidence, pragmatism, continuous learning, self-discipline, and fostering win-win cooperation. Experience reliability, efficiency, and quality with us. Explore our services and let us help you fulfill your MCPCB needs.

Printed circuit board assembly metal core

The preparation processes of metal matrix composite materials include contact reaction method (CR method), mixed salt reaction method (LSM method), hot pressing preparation process, stirring casting method, semi-solid composite casting method, impregnation solidification method (MI technology) and centrifugal casting method.

Contact reaction method (CR method) is to mix the matrix element or alloy powder and the strengthening element or alloy powder in a certain proportion, cold press into a prefabricated block with a certain density, and then immerse it in an alloy melt at a certain temperature. After the reaction, a fine strengthening phase is generated in the alloy melt, and after stirring and standing, it can be cast into various castings. This method has been used to prepare a variety of metal matrix composite materials, such as Al-based, Mg-based, Cu-based, Ti-based, Fe-based, Ni-based composite materials, showing excellent mechanical properties. ‌
The mixed salt reaction method (LSM method) is to mix salts containing Ti and B, such as KBF4 and K2TiF6, and add them to high-temperature metal melt. The Ti and B in the salt are reduced by the metal under high temperature and react in the melt to form a reinforcing phase. After slag removal, it can be cast to obtain a reinforced metal matrix composite material. ‌
The hot pressing preparation process is a solid phase composite process for preparing metal matrix composite materials by diffusion bonding continuous fibers and matrix alloys at a certain heating temperature and pressure.
The stirring casting method is to add ceramic particles to the molten metal, and after uniform stirring, pour it into the mold to obtain products or secondary processing blanks. This method is easy to achieve mass production and has low cost, but the main disadvantage is that the combination of matrix metal and reinforcing particles is limited. ‌
The semi-solid composite casting method is developed from the semi-solid casting method. Through strong stirring, the dendrite network skeleton is broken and the dispersed granular structure is retained, which improves wettability and promotes interface bonding. ‌
The impregnation solidification method (MI technology) is a method of impregnating a pre-prepared reinforcement phase formed body with a high porosity into a molten matrix metal, allowing the matrix metal to penetrate the preform and then solidify it to prepare a composite material. ‌
The centrifugal casting method is widely used in the casting of hollow parts. It forms a bimetallic layered composite material through a two-step casting method. This method is simple and has the advantages of low cost and high density of the casting, but the interface quality is not easy to control.

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