Archive for the ‘PCB News’ Category

High Frequency PCB Communication Circuits

Friday, October 4th, 2024

Best is mainly engaged in the production of High frequency pcb communication circuits, high-speed, microwave and radio frequency printed circuit boards, mainly in sample making and small and medium batches. The main products are: microwave radio frequency high-frequency boards, Rogers high-frequency boards, Rogers multi-layer high-frequency mixed-pressure boards, Rogers radio frequency boards, Taconic microwave boards, Taconic multi-layer circuit boards, Arlon microstrip antenna boards, ARLON high-frequency boards, F4BM antenna boards, F4BM multi-layer mixed-pressure boards, radio frequency amplifier PCB boards, HDI precision multi-layer boards, serving domestic and foreign high-tech enterprises and scientific research institutions.

‌What is a high frequency pcb communication circuits

High frequency pcb communication circuits to a circuit board with an operating frequency in the high frequency band (usually greater than 300MHz or a wavelength less than 1 meter), which is mainly used to transmit high-frequency signals and data. ‌ This type of circuit board is widely used in radio frequency (RF) and microwave fields, such as communication equipment, radar systems, satellite communications, and high-speed data transmission systems.

What is a high frequency pcb communication circuits

The characteristics of high-frequency circuits include challenges such as transmission line effects, signal integrity issues, and electromagnetic interference (EMI). Due to the short wavelength of high-frequency signals, traditional low-frequency circuit design methods are no longer applicable, and special design and processing methods are required to ensure the performance and stability of the circuit.

High-frequency circuit boards are produced on microwave substrate copper-clad boards using ordinary rigid circuit board manufacturing methods or special processing methods. They need to have high-quality electrical properties and chemical stability to meet the requirements of high-frequency signal transmission.

Definition of high frequency pcb communication circuits

High-frequency circuit board, as a special circuit board, is mainly suitable for occasions with high electromagnetic frequency, especially in the fields of high frequency (frequency greater than 300MHz or wavelength less than 1 meter) and microwave (frequency greater than 3GHz or wavelength less than 0.1 meter).

It is a circuit board made on a microwave substrate copper-clad board by adopting some manufacturing processes or special processing methods of ordinary rigid circuit boards. Generally speaking, when the frequency of the circuit board reaches above 1GHz, it can be defined as a high-frequency board.

With the rapid development of science and technology, more and more equipment designs have begun to involve microwave frequency bands (>1GHz) and even expanded to the millimeter wave field (such as 77GHz), especially in popular applications such as 77GHz millimeter wave antennas on vehicles.

This trend not only promotes the continuous increase in frequency, but also puts higher requirements on the substrate of the circuit board.

For example, the substrate material needs to have excellent electrical properties, stable chemical properties, and as the frequency of the power signal increases, the loss on the substrate must be extremely small. Therefore, the importance of high-frequency boards is becoming more and more prominent.

Advantages of high frequency pcb communication circuits

The main advantages of high frequency pcb communication circuits include efficient data transmission, strong anti-interference ability, high-frequency bandwidth and high reliability. ‌

high frequency pcb communication circuits can achieve efficient data transmission. High-frequency signals have a short cycle and can transmit more information per unit time, so they have the advantage of large-capacity transmission. In addition, high-frequency signals can achieve fast signal processing and are suitable for application scenarios that require high-speed data transmission and high real-time requirements.
high frequency pcb communication circuits have strong anti-interference capabilities. Due to the short wavelength of high-frequency signals, they can better avoid external interference and attenuation and have strong anti-interference capabilities. This makes high-frequency signals have advantages in fields such as wireless communications and radar systems, and can achieve stable signal transmission and reception. ‌
high frequency pcb communication circuits also have the advantage of high-frequency bandwidth. High-frequency signals correspond to a larger frequency range and can provide higher bandwidth than low-frequency signals. This means that more data can be transmitted, thereby supporting higher data rates and richer media content. ‌
High reliability of high frequency pcb communication circuits is also one of its advantages. The use of high-quality materials and manufacturing processes can effectively resist external interference and oxidation corrosion, ensure stable performance in high temperature environments, and thus extend the service life of the circuit board.

Classification of high frequency pcb communication circuits

Classification by material:

Organic materials: including phenolic resin, glass fiber/epoxy resin, Polyimide, BT/Epoxy (bismaleimide triazine/epoxy resin), etc.
Inorganic materials: mainly including aluminum, copper-invar-copper, ceramic, etc. These materials are mainly selected for their excellent heat dissipation function.

Classification by the hardness of the finished product:

Rigid PCB: has a solid structure and stable performance.
Flexible PCB: has flexibility and bendability, suitable for occasions requiring flexible wiring.
Rigid-Flex PCB: It combines the characteristics of rigid and flexible boards, and has higher design flexibility and wide application.

Classification by structure:

Single-sided board: A circuit board with a conductive layer on only one side.
Double-sided board: Both sides are coated with conductive layers, separated by insulating materials in the middle.
Multilayer board: It is composed of multiple conductive layers and insulating layers, and has higher circuit integration and reliability.

Classification by use:

Communication board: It is used in various communication equipment and systems.
Consumable electronic board: It is commonly found in consumer electronic products.
Military board: A circuit board that meets special requirements in the military field.
Computer board: A circuit board used in computer hardware.
Semiconductor board: A circuit board used in the manufacturing and testing process of semiconductors.
Electrical test board: A circuit board used in electronic testing and measurement equipment.

How to choose high-frequency circuit board high-speed board

When choosing PCB board, you must find a balance between meeting design requirements, mass production and cost. In short, the design requirements cover two aspects: electrical performance and structural reliability. Especially when designing ultra-high-speed PCB (frequency greater than GHz), the choice of board is particularly important. For example, the commonly used FR-4 material will have a significantly increased dielectric loss (Df, i.e., Dielectric Loss) at a frequency of several GHz, and may no longer be applicable.

Taking the 10Gb/S high-speed digital signal as an example, this signal can be regarded as the superposition of multiple sinusoidal wave signals of different frequencies. Therefore, the 10Gb/S signal contains multiple components of different frequencies: such as a 5GHz fundamental signal, a 3rd-order 15GHz signal, a 5th-order 25GHz signal, and a 7th-order 35GHz signal. In order to ensure the integrity of digital signals, maintain the steepness of the upper and lower edges of the signals, and be compatible with the low-loss, low-distortion transmission of RF microwaves (the high-frequency harmonic part of the digital signal reaches the microwave frequency band), the selection of materials for high-speed digital circuit PCBs has many similarities with the needs of RF microwave circuits.

In actual engineering operations, the selection of high-frequency boards seems simple, but the factors that need to be considered are quite complex. Through the introduction of this article, PCB design engineers or high-speed project leaders can have a deeper understanding of the characteristics and selection of boards. Understand the electrical properties, thermal properties, reliability and other characteristics of the board, and use the stacking design reasonably to create products with high reliability and excellent processability, and achieve the best balance of various factors.

Composition and key components of high frequency pcb communication circuits

High frequency pcb communication circuits are basically composed of passive components, active devices and passive networks. Passive components include resistors, capacitors and inductors, which mainly exhibit resistance characteristics at low frequencies, but also exhibit reactance characteristics at high frequencies. Active devices such as high-frequency triodes have the characteristics of high gain, high frequency response and low noise, and are widely used in television, radio communication, radar and other fields.

Application of high frequency pcb communication circuits

High frequency pcb communication circuits are widely used in long-distance communication systems, with a communication distance of up to thousands of kilometers, and are often used to maintain communication between aircraft and bases. It occupies a high-frequency band of 2~30MHz, uses skywave propagation, and can propagate over long distances. Modern airborne high-frequency communication systems usually use single-sideband communication systems, which can greatly compress the occupied frequency band and save transmission power. However, high-frequency communication is also susceptible to electrical interference such as ionospheric disturbances and lightning, generating radio background noise, and there is fading, and the signal is sometimes strong and sometimes weak.

Design Guidelines for High Frequency PCB Communication Circuits

Design Guidelines

High Frequency PCB Communication Circuits

How to avoid high-frequency interference?

The basic idea of avoiding high-frequency interference is to minimize the interference of the electromagnetic field of high-frequency signals, which is the so-called crosstalk. You can increase the distance between high-speed signals and analog signals, or add ground guard/shunt traces next to analog signals. Also pay attention to the noise interference of digital ground to analog ground.

How to solve the signal integrity problem in high-frequency communication PCB design?

Signal integrity is basically an impedance matching problem. The factors that affect impedance matching include the architecture and output impedance of the signal source, the characteristic impedance of the trace, the characteristics of the load end, and the topology of the trace. The solution is to rely on termination and adjust the topology of the trace.

How is the differential wiring method implemented?

There are two points to note when wiring differential pairs. One is that the length of the two lines should be as equal as possible, and the other is that the spacing between the two lines (this spacing is determined by the differential impedance) should remain unchanged, that is, they should be kept parallel. There are two parallel methods, one is that two lines run on the same routing layer (side-by-side), and the other is that two lines run on two adjacent layers (over-under). Generally, the former side-by-side (side by side, shoulder to shoulder) is more commonly used.

How to implement differential routing for clock signal lines with only one output end?

To use differential routing, it must be meaningful if both the signal source and the receiving end are differential signals. Therefore, differential routing cannot be used for clock signals with only one output end.

Can a matching resistor be added between the differential line pairs at the receiving end?

The matching resistor between the differential line pairs at the receiving end is usually added, and its value should be equal to the value of the differential impedance. This will improve the signal quality.

Why should the routing of differential pairs be close and parallel?

The routing method of differential pairs should be appropriately close and parallel. The so-called appropriate proximity is because this spacing will affect the value of differential impedance, which is an important parameter for designing differential pairs. Parallelism is also required because the consistency of differential impedance must be maintained. If the two lines are sometimes far away and sometimes close, the differential impedance will be inconsistent, which will affect the signal integrity and timing delay.

How to deal with some theoretical conflicts in actual wiring?

Basically, it is right to separate the analog/digital ground. It should be noted that the signal routing should try not to cross the split place (moat), and the return current path of the power supply and signal should not be too large.

The crystal oscillator is an analog positive feedback oscillation circuit. To have a stable oscillation signal, the loop gain and phase specifications must be met. The oscillation specification of this analog signal is easily interfered. Even if ground guard traces are added, it may not be possible to completely isolate the interference. Moreover, if it is too far away, the noise on the ground plane will also affect the positive feedback oscillation circuit. Therefore, the distance between the crystal oscillator and the chip must be as close as possible.

It is true that there are many conflicts between high-speed wiring and EMI requirements. But the basic principle is that the resistors, capacitors or ferrite beads added due to EMI cannot cause some electrical characteristics of the signal to not meet the specifications. Therefore, first use the techniques of arranging routing and PCB stacking to solve or reduce EMI problems, such as routing high-speed signals on the inner layer. Only then use resistors, capacitors or ferrite beads to reduce damage to the signal.

How to solve the contradiction between manual routing and automatic routing of high-speed signals?

Most of the current powerful routing software’s automatic routing tools have set constraints to control the winding method and the number of vias. The winding engine capabilities and constraint setting items of various EDA companies are sometimes very different. For example, whether there are enough constraints to control the winding method of the serpentine, whether the routing spacing of the differential pair can be controlled, etc. This will affect whether the routing method generated by automatic routing can meet the designer’s ideas. In addition, the difficulty of manually adjusting the routing is also related to the ability of the winding engine. For example, the pushing ability of the routing, the pushing ability of the via, and even the pushing ability of the routing to the copper plating, etc. Therefore, choosing a routing tool with a strong winding engine capability is the solution.

About test coupon.

The test coupon is used to measure the characteristic impedance of the produced PCB board with TDR (Time Domain Reflectometer) to see if it meets the design requirements. Generally, the impedance to be controlled is single line and differential pair. Therefore, the trace width and line spacing (when there is a differential pair) on the test coupon should be the same as the line to be controlled. The location of the ground point during measurement is important. In order to reduce the inductance of the ground lead, the grounding point of the TDR probe is usually very close to the probe tip, so the distance and method between the point where the signal is measured on the test coupon and the ground point should be consistent with the probe used.

In high-speed PCB design, the blank area of the signal layer can be copper-plated, and how should the copper of multiple signal layers be distributed in grounding and power supply?

Generally, the copper plating in the blank area is mostly grounded. However, when plating copper next to high-speed signal lines, pay attention to the distance between the copper plating and the signal line, because the copper plating will reduce the characteristic impedance of the trace a little. Also be careful not to affect the characteristic impedance of other layers, such as in the dual strip line structure.

Can the signal line on the power plane be calculated using the microstrip line model? Can the signal between the power and ground planes be calculated using the stripline model?

Yes, both the power plane and the ground plane must be considered as reference planes when calculating the characteristic impedance. For example, a four-layer board: top layer-power layer-ground layer-bottom layer. At this time, the model of the characteristic impedance of the top layer routing is a microstrip line model with the power plane as the reference plane.

Can the automatic generation of test points on high-density printed circuit boards by software generally meet the test requirements of mass production?

Whether the test points automatically generated by general software meet the test requirements depends on whether the specifications for adding test points meet the requirements of the test equipment. In addition, if the routing is too dense and the specifications for adding test points are strict, it may not be possible to automatically add test points to each line. Of course, the places to be tested need to be filled manually.

Will adding test points affect the quality of high-speed signals?

As for whether it will affect the signal quality, it depends on the way of adding test points and how fast the signal is. Basically, the additional test point (without using the existing via or DIP pin as the test point) may be added to the line or a short line may be pulled out from the line. The former is equivalent to adding a very small capacitor to the line, and the latter is an additional branch. Both situations will have some impact on the high-speed signal, and the degree of impact is related to the frequency speed of the signal and the edge rate of the signal. The magnitude of the impact can be known through simulation. In principle, the smaller the test point, the better (of course, it must meet the requirements of the test equipment) and the shorter the branch, the better.

How should the ground wires between the boards of a system be connected when several PCBs are connected to each other?

When the signals or power supplies between the PCB boards are in operation, for example, when the power supply or signal from board A is sent to board B, there will be an equal amount of current flowing back from the ground layer to board A (this is Kirchoff current law). The current on the ground layer will flow back to the impedance. Therefore, at each interface where the power supply or signal is connected to each other, the number of pins allocated to the ground layer should not be too small to reduce the impedance, so as to reduce the noise on the ground layer. In addition, the entire current loop can be analyzed, especially the part with larger current, and the connection method of the ground layer or ground wire can be adjusted to control the flow of current (for example, create low impedance at a certain place to let most of the current flow through this place) to reduce the impact on other more sensitive signals.

What is Fast Turn PCB?

Fast turn PCB refers to a process where printed circuit boards are manufactured in a much shorter time frame compared to the standard process. This expedited service is often used during the prototyping phase, where companies need to validate designs quickly before moving on to mass production. The process is designed to keep pace with the rapidly changing demands of industries like consumer electronics, automotive, aerospace, and telecommunications. Fast turn PCB prototypes are not just a luxury; they are often necessary to meet tight deadlines and ensure product success.

Advantages of Fast Turn PCB Prototypes

The most obvious benefit of fast turn PCB prototypes is speed. However, the advantages extend far beyond just saving time:

Quicker Fabricate Cycles: When a design change is necessary, waiting weeks for a new PCB is no longer acceptable. Fast turn PCB allows you to make design tweaks and receive updated prototypes in a matter of days. This reduces downtime and lets your team stay productive.

Early Issue Detection: When you get your prototype faster, it means you can start testing sooner. This leads to earlier detection of potential issues, allowing you to resolve them before the design moves into mass production. Catching problems early minimizes the risk of costly errors.

Faster Time to Market: In industries where technology changes quickly, getting a product to market before your competitors is vital. Fast turn PCBs enable faster product development, giving you an edge in launching new and innovative products ahead of your competitors.

Design Flexibility: Quick prototyping means you’re free to experiment with different designs without losing valuable time. Whether you’re optimizing a layout or testing new materials, fast turn PCBs provide the flexibility you need to find the perfect solution.

Increased Customer Confidence: For those working with clients, the ability to quickly provide prototypes can enhance customer relationships. When you demonstrate speed and reliability, clients gain confidence in your ability to deliver high-quality final products.

Our Quick Turnaround PCB Services Include

PCB Prototype Assembly
Rigid-Flex PCBs
HDI PCB Fabrication
Flexible PCBs
PTFE Teflon PCBs
Heavy-copper PCBs & Busbar PCB
Metal Core PCBs
BGA Pad pitch down to 0.15mm
Cavity Process
Back drill Process
IC substrate
Extra thin PCBs
Ceramic PCBs
Drone PCB/Bluetooth PCB
High speed PCB
RF PCB
High Tg PCB
Impedance control PCB

Best Technology’s Typical Turnaround Lead Time for Fast Turn PCB

Our commitment to speed is reflected in our turnaround times. For basic, single-layer PCBs, we can often deliver in as little as 24 hours. More complex designs, such as multi-layer boards or rigid-flex PCBs, may take 3 to 5 days. No matter the complexity of your design, we work diligently to meet your timeline without compromising quality. More details please see below chart:

Prototype (<m2)	Layers	Normal Service	Expedited Service
FR4 PCB	1 Layer	1-2 Days	24 Hours
	2 Layers	1-2 Days	24 Hours
	4 Layers	2-3 Days	48 Hours
	6 Layers	3-4 Days	72 Hours
	8 Layers	6-8 Days	72-96 Hours
	10 Layers	10-12 Days	120-168 Hours
	HDI (1+N+1, 2+N+2)	2.5-3.5 Weeks	TBD

This fast pace doesn’t mean we cut corners. Every PCB prototype undergoes rigorous testing to ensure it meets the highest quality standards. From initial design review to final inspection, we ensure that your prototype will perform exactly as expected.

Custom Quote for Fast Turn PCB Prototypes

If you have specific requirements or a tight deadline, we offer custom quotes tailored to your project. Simply provide us with your design files, including details like layer count, material type, and any specific finishing options, and we’ll give you a competitive quote with a guaranteed delivery date. Our team is ready to work with you to find the best solution for your project’s unique needs.

Factors That Affect Lead Time of PCB Prototypes

While we strive to meet tight deadlines, there are several factors that can influence the lead time for your PCB prototype:

Design Complexity

You must know, the more layers and components your PCB requires, the longer it may take to manufacture. Single-layer boards can be produced quickly, while multi-layer designs or HDI boards typically take more time.

Material Availability

Certain materials, like high-frequency laminates or specific copper weights, may not always be immediately available. If your design requires specialized materials, it’s best to check availability early with Best Team in the process to avoid delays.

Finishing Options

Different surface finishes require different processing times. For example, ENIG or immersion silver might take longer than standard HASL finishes. It’s important to choose a finish that fits both your timeline and your design needs.

Quality Assurance Testing

If your design requires additional testing or certifications, this can add time to the process. However, testing is critical to ensure that your prototype meets all necessary performance and safety standards. Best Technology always perform strict testing to control the PCB quality.

Prototype PCB Assembly Services

Beyond manufacturing the PCB itself, we also offer prototype assembly services. This means that once your PCB is produced, we can quickly assemble all the necessary components, giving you a fully functional prototype in a short amount of time. Our assembly services include both surface-mount (SMT) and through-hole technology (THT) processes.

By combining fast turn PCB production with our assembly services, you save valuable time and resources, as you don’t need to coordinate between multiple vendors. We handle everything in-house, ensuring a smooth process from start to finish.

Choosing the Right Fast Turn PCB Prototype Manufacturer

When it comes to selecting a fast turn PCB manufacturer, you want to partner with a company that not only offers speed but also reliability and quality. Rushing a prototype through the production process without the proper quality checks can lead to poor performance and wasted time.

At Best Technology, we are proud of our reputation for delivering high-quality prototypes quickly. Our team of experienced engineers and technicians ensures that every prototype is carefully reviewed and tested before it leaves our facility. We use only the highest-quality materials and components, so you can trust that your prototype will perform as expected.

Additionally, our customer service team is always available to answer your questions, offer technical support, and provide updates on your project’s progress.

Why Should You Choose Best Technology as Your Preferred Partner?

At Best Technology, we don’t just manufacture PCBs — we create solutions. Our fast turn PCB services are designed to help you move through the product development process faster, without compromising on quality. We offer:

1. With turnaround times as fast as 24 hours for simple designs, we help you meet even the most demanding deadlines.

2. Every prototype we produce undergoes strict quality control and it can meet your exact specifications.

3. We can accommodate a wide range of PCB types and materials, including flexible PCBs, HDI boards, and high-frequency designs.

4. Our team is dedicated to helping you one-time succeed. From design review to final delivery, we’re here to support you every step of the way.

What is a single-sided PCB circuit board

Single-sided PCB circuit board is a type of printed circuit board. Only one side of the PCB board has circuits (it can have holes or not), and the other side is a substrate or directly covered with insulating ink. There is no circuit and the whole board is transparent under strong light (except for individual boards and special process requirements). The cross section only contains copper foil on the side with circuits.
Single-sided PCB circuit board is obtained by etching copper-clad board. Copper-clad board consists of board base and copper foil. The board base is usually made of insulating materials such as glass fiber, and is covered with a layer of copper foil (usually oxygen-free copper).

Single layer PCB manufacturer

Single layer PCB manufacturer Best Technology has offered high-quality PCBs and the best PCB assembly & box building service all over the world since 2006. We are professional fabricator on PCB prototype, IPC Class III standard are available. You can get high-quality PCB board and PCBA at a very reasonable price.

Single layer PCB design
Best Technology excels in PCB design, perform PI analysis, SI analysis, EMC test and DFM tests to ensure one-time successed PCB design. Over 20 professional engineers, all of them has more than 15+ years experience in PCB, we make sure every design is optimized for performance and manufacturability.

Single layer PCB prototype
As an industry-leading PCB prototype manufacturer, Best Technology offers 24 hours quick turn PCB prototype, PCB assembly and reliable small-batch PCB production. Free technical support and VIP one-to-one service.

Single layer PCB production
With over 18 years PCB manufacture experience, we dedicated to provide highest quality PCB for customers. We offer turnkey service from PCB design, PCB layout, PCB prototype, mass production and PCB assembly. Contact us to get an instant quote.

Single layer PCB assembly
Professional PCB assembly service, includes DFM/DFA checks, function/ICT testing, X-RAY, Online dual AOI, nitrogen reflow oven. 10+ SMT lines, free passive parts and Thorough Inspections! SMT, Thru-hole, BGA, QFN Assembly at Low Prices! No MOQ, complex and difficulty designs welcome!

Single-sided PCB production process

Cutting
Drilling or punching
Screen printing circuit anti-etching pattern or using dry film
Curing inspection and board repair
Screen printing solder mask pattern (commonly used green oil)
Screen printing character mark pattern, UV curing
Preheating, punching and appearance
Electrical open and short circuit test
Pre-coating flux anti-oxidant (drying) or tin spraying hot air leveling
Packaging and delivery

Single-sided PCB production capacity

Item	Content
Material type :	XPC FR-1 FR-4 CEM-1
Surface finish :	ENIG gold, HASL Immersion Tin, Chemical Silver OSP
Layer No :	Single side, Multilayer PCB
Max PCB size:	1500mm*600mm
Min PCB size:	5mm*5mm
Min space/width:	0.1mm
Warp and Twist:	≤0.5%(board thickness：1.6mm，PCB size ： 300mm*300mm)
Board thickness:	0.3-5.0mm
Copper thickness:	35um-240um
Outline Tolerance:	±0.15mm
V-CUT Precision:	±0.1mm
Capacity:	80000㎡/Month
PTH Dia tolerance:	±0.076mm
Outline tolerance:	CNC ：±0.1mm punch：±0.15mm

What are the single-sided PCB materials?

What are the single-sided PCB materials

Phenolic paper substrate
Phenolic paper substrate (commonly known as cardboard, plastic board, V0 board, flame retardant board, red-letter copper clad board, 94V0). The most commonly used product models of phenolic paper-based copper clad boards are FR-1 (flame retardant) and XPC (non-flame retardant). Single-sided copper clad boards can be easily judged from the color of the characters on the back of the board. Generally, red characters are FR-1 (flame retardant) and blue characters are XPC (non-flame retardant). This type of board is the cheapest compared to other types of boards.

Epoxy fiberglass cloth substrate
Epoxy fiberglass cloth substrate (commonly known as: epoxy board, fiberglass board, fiberboard, FR4), epoxy fiberglass cloth substrate is a type of substrate with epoxy resin as adhesive and electronic grade glass fiber cloth as reinforcing material. Its bonding sheet and inner core thin copper clad board are important substrates for making multi-layer printed circuit boards. The working temperature is high and its own performance is less affected by the environment. In terms of processing technology, it has great advantages over other resin fiberglass cloth substrates. This type of product is mainly used for double-sided PCBs. It is also about twice as expensive as phenolic paper substrates, and the commonly used thickness is 1.5MM.

Composite substrates
Composite substrates (commonly known as powder boards, etc., cem-1 boards are also called 22F in some places in China) mainly refer to CEM-1 and CEM-3 composite-based copper-clad boards. Copper-clad boards made of wood pulp fiber paper or cotton pulp fiber paper as core reinforcement materials and glass fiber cloth as surface reinforcement materials, both of which are impregnated with flame-retardant epoxy resin, are called CEM-1. Copper-clad boards made of glass fiber paper as core reinforcement materials and glass fiber cloth as surface reinforcement materials, both of which are impregnated with flame-retardant epoxy resin, are called CEM-3. These two types of copper-clad boards are the most common composite-based copper-clad boards. This type of board is cheaper than FR4 type boards.

Single-sided PCB circuit board price

Since the cost of single-sided PCB circuit boards is affected by many factors, including the cost of raw materials, production cost, production process, special requirements, etc., its exact pricing needs to be negotiated with its single-sided PCB circuit board supplier. The general unit price calculation formula is: (length MM) × (width MM) × 0.01 × unit price (yuan/square meter) ÷ 10000 (rounded to 3 decimal places)
For specific single-sided PCB quotes, please consult bestpcbs．

Single-sided PCB circuit board price

Single-sided PCB applications and features

Single-sided PCBs are increasingly widely used due to their many unique advantages;
High density: For decades, high-density printed boards have developed with the improvement of integrated circuit integration and the advancement of installation technology.
High reliability: Through a series of inspections, tests and aging tests, PCBs can work reliably for a long time (usually 20 years).
Designability: According to the requirements of various performances (electrical, physical, chemical, mechanical, etc.) of single-sided boards, printed boards can be designed in a short time and efficiently through design standardization.
Manufacturability: Through modern production management, standardization, scale (quantification), automation, etc. can be achieved to ensure the consistency of product quality.
Testability: Complete test methods, standards and various test equipment and instruments have been established to detect and evaluate the qualification and service life of a single PCB.
Assembly: Circuit boards facilitate standardized assembly of various components to achieve automated, large-scale mass production. At the same time, circuit boards and various component assemblies can be assembled into larger components and systems, and even complete machines.

Maintainability: Circuit boards and various component parts are manufactured with standardized designs and scales. If a system fails, components can be replaced quickly and conveniently. The system can recover quickly due to this flexibility. More examples include system miniaturization, lightweight, high-speed signal transmission, etc.

FAQ About single sided pcb

FAQ About single sided pcb

Q: When laying out the board, if the lines are dense, there may be more vias, which will of course affect the electrical performance of the board. How can I improve the electrical performance of the board?
A: For low-frequency signals, vias are not a big deal, but for high-frequency signals, try to reduce vias. If there are many lines, you can consider multi-layer boards;

Q: Is it better to add more decoupling capacitors on the board?
A: Decoupling capacitors need to be added with appropriate values at appropriate locations. For example, add them to the power supply port of your analog device, and use different capacitance values to filter out stray signals of different frequencies;

Q: What are the standards for a good board?
A: Reasonable layout, sufficient power redundancy of power lines, high-frequency impedance, and simple low-frequency routing.

Q: How much difference do through holes and blind holes have on signals? What are the application principles?
A: Using blind or buried holes is an effective way to increase the density of multi-layer boards, reduce the number of layers and board size, and greatly reduce the number of plated through holes. But in comparison, through holes are easy to implement in terms of process and have lower costs, so through holes are generally used in designs.

Q: What kind of layout can achieve the best heat dissipation effect?
A: There are three main sources of heat in PCB: (1) heat generated by electronic components; (2) heat generated by the PCB itself; (3) heat transmitted from other parts. Among these three heat sources, the heat generated by components is the largest and is the main heat source, followed by the heat generated by the PCB board. The heat transmitted from the outside depends on the overall thermal design of the system and is not considered for the time being. The purpose of thermal design is to take appropriate measures and methods to reduce the temperature of components and PCB boards so that the system can work normally at a suitable temperature. This is mainly achieved by reducing heat generation and accelerating heat dissipation.

Q: Can you explain the proportional relationship between the line width and the size of the matching via?
A: This is a good question. It is difficult to say that there is a simple proportional relationship because the two simulations are different. One is surface transmission and the other is ring transmission. You can find a via impedance calculation software on the Internet, and then keep the impedance of the via consistent with the impedance of the transmission line.

Q: In an ordinary PCB circuit board with an MCU control, but without high current and high-speed signal requirements, is it better to lay a layer of ground wire around the outermost edge of the PCB to wrap the entire circuit board?
A: Generally speaking, just lay a complete ground.

Q: How to deal with the avoidance of vias during the wiring process of high-speed PCB, what good suggestions are there?
A: For high-speed PCB, it is best to make fewer vias and solve the need to increase vias by adding signal layers.

Q: How to select the thickness of the power trace in PCB board design? Are there any rules?
A: You can refer to: 0.15×line width (mm)=A, and copper thickness also needs to be considered.

Q: When digital circuits and analog circuits are on the same multi-layer board, should analog ground and digital ground be arranged on different layers?
A: This is not necessary, but analog circuits and digital circuits should be placed separately.

Q: How many vias are generally suitable for digital signal transmission? (Signals below 120Mhz)
A: It is best not to exceed two vias.

What is the thermal conductivity value for copper?

The thermal conductivity of copper is about 401W/m·K. ‌

The thermal conductivity refers to the heat transferred through 1 square meter of area in 1 second under stable heat transfer conditions, with a temperature difference of 1 degree (K, ℃) on both sides of a 1 meter thick material. The unit is watt/meter·degree (W/(m·K)).

The thermal conductivity is a parameter to measure the thermal conductivity of a material. The larger the value, the better the thermal conductivity. Due to its high thermal conductivity, copper is often used to make radiators, heat conductors and other applications that require efficient heat transfer.

What is the thermal conductivity of copper at 25 C?

The thermal conductivity of copper is affected by many factors. On the one hand, temperature is an important influencing factor. Generally speaking, the thermal conductivity of copper decreases with increasing temperature.

At 25℃, the thermal conductivity of copper is about 401W/m.K, and at 100℃, the thermal conductivity of copper is 377W/m・K.

How do you measure thermal conductivity of copper?

The thermal conductivity of copper is usually measured by the steady-state method. ‌

The steady-state method is a classic method for measuring the thermal conductivity of thermal insulation materials. It uses the equilibrium state in which the heat transfer rate is equal to the heat dissipation rate during stable heat transfer.

This method has a simple and clear principle and high accuracy. Although the measurement time is long and the environmental conditions are high, it is suitable for measuring thermal conductivity materials at medium temperatures, especially for low thermal conductivity materials such as rock, plastic, rubber, glass, and thermal insulation materials.

In the steady-state method, commonly used methods include heat flow method, protected heat flow method, and protected hot plate method. The basic principles of these methods are similar, but some standards are formulated for different thermal insulation materials, and the test results are similar.

What metal has the highest thermal conductivity?

Silver has the highest thermal conductivity.

Among metals, silver has a thermal conductivity of 411W/(m·K), which is the highest value among all metals. This property of silver makes it the metal with the best thermal conductivity.

In contrast, copper has a thermal conductivity of 401W/(m·K), which is also very high, but still slightly lower than silver. Other metals such as gold and aluminum have thermal conductivities of 315W/(m·K) and 237W/(m·K), respectively, which are lower than silver and copper. Therefore, from the perspective of thermal conductivity, silver is undoubtedly the metal with the best thermal conductivity.

In addition, although the thermal conductivity of copper is also very high, reaching 401W/(m·K), second only to silver, among pure metals, the thermal conductivity of silver is still the highest. However, in practical applications, copper is widely used because of its good conductivity and relatively low cost.

Which metal is the poorest conductor of heat?

The metal with the worst thermal conductivity is iron. ‌

Among metal materials, the thermal conductivity of iron is 0.163, while that of copper and silver is, and that of aluminum is 0.5. These data indicate that the thermal conductivity of iron is significantly lower than that of other common metals. Therefore, it can be concluded that iron is the metal with the worst thermal conductivity‌.

Why copper has highest thermal conductivity?

Copper has the highest thermal conductivity‌, mainly because of its unique physical and chemical properties. The superior thermal conductivity of copper is mainly attributed to its crystal structure and electronic properties.

Copper is a metal with good electrical and thermal conductivity, which is due to the presence of a large number of free electrons in the crystals of copper. These free electrons can effectively transfer heat when colliding with metal cations in the crystal, making copper extremely thermally conductive.

The thermal conductivity of copper is about 400 W/m·K, which means that copper transfers much more heat per unit time than most other materials. The high thermal conductivity allows copper to quickly transfer heat away, with efficient heat dissipation.

What happens to copper when it is heated?

When copper is heated, its volume increases, its mass remains unchanged, and its density decreases. ‌

When copper is heated, its volume increases due to the property of thermal expansion and contraction. This is because when the copper block is heated, the distance between atoms increases, resulting in an increase in volume. At the same time, the mass of copper is a property of matter, which is only related to the amount of matter contained, and has nothing to do with the position, state, shape, and temperature of the object. Therefore, the mass of copper remains unchanged after heating.

In addition, when copper is heated in the air, if it reacts with oxygen, black copper oxide (CuO) will be generated on the surface. This chemical change will cause the color of copper to change from red to black.

In summary, when copper is heated, not only will its volume increase, its mass remain unchanged, and its density decrease, but it will also react with oxygen to generate copper oxide when heated in the air, resulting in a change in surface color.

Why does copper turn green?

Copper turns green because it is oxidized in the air to form copper rust. The main component of this copper rust is basic copper carbonate, which is green in color. ‌

Copper will be oxidized in the air to form copper rust. This rusting process is the result of a combination of factors, including the reaction of copper with oxygen, water vapor and carbon dioxide in the air.

Specifically, when copper is exposed to oxygen, water and carbon dioxide in humid air for a long time, a chemical reaction will occur to generate basic copper carbonate (Cu2(OH)2CO3), a green inorganic compound, so a green rust layer will form on the copper surface.

This process not only occurs on the surface of copper, but also because the main component of copper rust is basic copper carbonate, the color of copper rust is green, which makes the appearance of copper products appear green.

Copper has become the preferred material for heat conduction in many fields due to its high thermal conductivity, good processing performance and stable thermal conductivity. With the continuous advancement of science and technology, it is believed that copper will continue to play an important role in future development.

What is an ic substrate

IC substrate, also known as ic package substrate, is a substrate used to package bare IC (integrated circuit) chips. It is the core material of chip packaging and has the characteristics of high density, high precision, high performance, miniaturization and thinness.

As an intermediate product, IC substrate connects the chip and the circuit board, plays a role in physical mechanical support, heat dissipation and protection, and provides electronic connection between the chip and the PCB to achieve signal transmission.

It is a key carrier in the packaging and testing process and is widely used in mainstream packaging technologies such as BGA (ball grid array packaging) and CSP (chip size packaging). The main functions of the packaging method include isolating the exposed chip from the air, preventing corrosion of the circuit on the chip, and providing an intermediate bridge for information transmission between highly refined chips and less refined printed circuit boards.

IC substrate definition

IC substrate is the support of semiconductor integrated circuits. Its main function is to connect various electronic components to form a complete circuit system. As a platform, it provides a solid foundation for various components within the IC to ensure the normal operation of the circuit.

IC substrate manufacturing process

How are ic substrates made? IC (Integrated Circuit) substrate manufacturing refers to packaging electronic components onto a circuit board to form a complete circuit system. The IC substrate manufacturing process mainly includes the following steps: design, proofing, printing, drilling, gold plating, welding, testing and packaging.

Design, schematic design and layout design are carried out according to the circuit design requirements, the size and number of layers of the circuit board are determined, and process analysis is carried out to determine the substrate manufacturing process.
Proofing, the designed circuit board sample is generated into a file, and the graphics on the file are transferred to the circuit board through a photolithography machine to form a copper pole, etc.
Printing, the area on the circuit board on the graphics transferred by the photolithography machine is etched to remove unnecessary copper and expose the glass fiber surface.
Drilling, use a drilling machine to make the required holes on the circuit board for welding components.
Gold plating, a layer of metal is covered on the surface of the circuit board through the electroplating process, which can improve the conductivity of the product on the one hand and prevent oxidation on the other hand.
Soldering: solder IC chips and other components to the corresponding positions of the circuit board, using hot plates and brackets for soldering.
Testing: test the soldered circuit board to verify whether the electrical performance, signal path and stability of the circuit board meet the design requirements.
Packaging: label, clean and package the qualified circuit boards to make them suitable for transportation and storage.

how ic substrate differentiate? The IC substrate manufacturing process is a complex and delicate process that requires a series of steps such as design, proofing, printing, drilling, gold plating, welding, testing and packaging. Only by strictly following the process can the quality and performance of the final product be guaranteed.

IC substrate manufacturers

As a leader of IC substrate manufacturer, Best Technology has over 18 years experience, we are so confident that we can provide the highest quality and high specifition IC substrate for you! Backing up with a group of professional engineers, and well established quality system. Best Technology has grown to become a major PCB manufacturer in Asia to serve in diverse customers base. At Best Technology, you can enjoy a full turn-key service from IC substrate design, prototyping, mass production and IC substrate assembly.

IC substrate manufacturers

How ic substrate differentiate

How to distinguish IC substrates? The distinction of IC substrates can be made in many ways, mainly including classification by package type, material properties, and bonding technology.

‌1. Classification by package type‌:

‌BGA IC substrate‌: It performs well in heat dissipation and electrical performance, can significantly increase chip pins, and is suitable for IC packages with more than 300 pins.

‌CSP IC substrate‌: It is a single-chip package with light weight, small size, and similar size to IC. It is mainly used in memory products, telecommunications products, and electronic products with a small number of pins.

‌FC IC substrate‌: By flipping the chip package, it has low signal interference, low circuit loss, good performance, and effective heat dissipation.

‌MCM IC substrate‌: It absorbs chips with different functions into one package, which is light, thin, short, and miniaturized, but because multiple chips are packaged in one package, this type of substrate does not perform well in signal interference, heat dissipation, fine wiring, etc.

‌2. Classification by material properties‌:

‌Rigid IC substrate‌: Mainly made of epoxy resin, BT resin or ABF resin, with a CTE (coefficient of thermal expansion) of about 13 to 17ppm/°C.

‌Flex IC substrate‌: Mainly made of PI or PE resin, with a CTE of 13 to 27ppm/°C.

‌Ceramic IC substrate‌: Mainly made of ceramic materials such as alumina, aluminum nitride or silicon carbide, with a relatively low CTE of about 6 to 8ppm/°C.

3.‌Classification by bonding technology‌:

‌Wire bonding‌

‌TAB (Keyboard Automated Bonding)‌

‌FC bonding

IC substrate vs PCB

The differences between IC substrate and PCB are mainly reflected in the definition, materials, structure, manufacturing process and application scenarios. In this article, Jieduobang will introduce the differences between IC substrate and PCB in detail.

Definition

PCB is the support of electronic components and the carrier for the electrical connection of electronic components; IC substrate is an integrated circuit chip carrier used to install integrated circuit chips and provide electrical connections with extremely high density and reliability.

Materials

PCB uses conductive and insulating materials such as copper clad laminate, glass fiber material and PTFE material; IC substrate mainly uses polymer materials (such as FR-4) and brittle ceramic materials.

Structure

PCB is composed of circuit boards by stacking multiple board layers, which can be connected through holes; the structure of IC substrate mainly includes circuit layer and assembly layer.

Manufacturing process

PCB manufacturing includes steps such as design, graphic layout, patch, welding and testing; IC substrate needs to undergo tedious processes such as preheating, pitting and buttoning.

Application of IC substrates

PCBs are widely used in the field of electronic product manufacturing, such as computer motherboards, mobile phone circuit boards, etc.; IC substrates are small, high-density, and highly reliable, and are widely used in high-end electronic fields, such as aerospace, national defense, and automotive electronics.

What is the Standard Thickness of a PCB?

The standard thickness of a PCB is often 1.6 mm. This has become the go-to thickness in the industry because it balances flexibility, cost, and performance for most applications. However, depending on the requirements of the design, PCB thickness can vary widely.

What are printed circuit board thickness standards?

Manufacturers offer various thicknesses to accommodate specific designs, from 0.4 mm (0.016 inches) for ultra-thin, flexible boards, up to 3.2 mm or even thicker for high-current, rugged applications. The choice of thickness largely depends on the type of application and the mechanical strength needed.

How is PCB Thickness Measured?

Measuring PCB thickness accurately is crucial for ensuring the board meets design specifications and performs optimally in its application. The thickness of a PCB refers to the total height of the board, including all its layers—copper, dielectric, and solder mask. This thickness plays a role in many factors, from electrical performance to mechanical stability, and must be precisely controlled. The tools and methods used to measure PCB thickness include:

1. Micrometers

A micrometer is the most common tool for measuring PCB thickness. It allows precise measurements down to fractions of a millimeter, making it ideal for multilayer PCBs where small deviations can affect performance. The micrometer is placed at various points across the board to ensure uniform thickness.

2. Calipers

Digital or analog calipers are also used to measure the thickness of PCBs. They are particularly useful for quickly gauging thickness across different sections of the board.

3. Cross-Sectioning

In cases where even more precision is required, manufacturers may opt to cross-section the board. This involves cutting a sample of the PCB and measuring it under a microscope to analyze each layer’s contribution to the overall thickness.

PCB thickness is typically measured in mils (1 mil = 0.001 inches) or millimeters, depending on the region and industry. Standard PCB thicknesses usually fall between 0.4 mm (0.016 inches) and 3.2 mm (0.125 inches), but custom designs may require other dimensions.

In mass production, quality control procedures are in place to ensure that the boards maintain a consistent thickness across large batches. Thickness tolerances range from ±10% to ±20%, depending on the manufacturer and materials used.

How Thick is a 2-Layer PCB Board?

A standard 2-layer PCB is typically 1.6 mm thick, but this can vary based on specific requirements. The board consists of two copper layers, one on each side of the insulating core.

Core Thickness: The thickness of the insulating material between the two copper layers is generally around 1.4 mm.

Copper Thickness: Standard copper thickness is 35 μm (1 oz copper), though this can be adjusted for higher current-carrying capacity.

For lighter applications, such as compact consumer electronics, a thinner board of 0.8 mm may be used, providing more flexibility and space-saving. Meanwhile, more robust applications may demand thicknesses exceeding 2.4 mm.

How Thick is a Standard 8-Layer PCB?

When it comes to multilayer PCBs like the 8-layer variant, thicknesses usually range from 1.4 mm to 2.4 mm, depending on the design requirements. With multiple layers of copper and insulating material stacked together, manufacturers must optimize thickness while considering electrical performance and mechanical rigidity.

Each additional layer introduces more copper and insulation, increasing the overall thickness. For high-frequency applications or boards that must handle significant current, thicker boards may be necessary to ensure signal integrity and thermal management.

How Does PCB Thickness Affect Thermal Performance?

The influence of PCB thickness on thermal performance is mainly reflected in heat dissipation efficiency and heat capacity.

The thickness of the PCB directly affects its heat dissipation efficiency. Thicker PCBs have greater heat capacity and better heat conductivity, and are able to conduct the heat generated by electronic components more effectively. This is because copper has good thermal conductivity, and the thicker copper foil layer can more quickly transfer heat from the heating element to the cooling area or external radiator, helping to improve the overall thermal management efficiency and protect sensitive components from thermal damage.

In addition, the thickness of the PCB is also closely related to its mechanical strength and stiffness. Thicker PCB boards have higher flexural stiffness and impact toughness, can withstand greater mechanical stress and vibration, and ensure the stability and reliability of electronic equipment in harsh environments. This is equally important in thermal management, as it helps to maintain the stable operation of electronic equipment in high temperature environments and prevent performance degradation or damage due to overheating.

However, it is important to note that while thicker PCBs are good for heat dissipation, in high-frequency applications, excessively thick PCBs may increase the impedance and coupling of the signal, thus affecting electrical performance.

What Factors Influence PCB Thickness?

PCB board thickness is one of the key parameters to be considered in the design process, which has a great impact on the performance and reliability of the circuit board. When choosing plate thickness, the following factors need to be considered:

1. Signal speed

The thinner the plate, the faster the signal speed, and vice versa. However, when the board thickness is less than 0.8mm, the signal will have a great loss, will produce serious signal interference, affecting the normal work of the circuit board.

2. Heat conduction

The thinner the board thickness, the worse the heat dissipation ability, easy to produce hot spots and thermal runaway phenomenon, affecting the performance and reliability of the circuit board.

3. Mechanical strength

The greater the thickness of the plate, the higher the mechanical strength, the smoother the surface of the plate, and the greater the bending strength. However, too thick a board will affect the assembly and size of the board design.

4. Number of layers

More layers mean a thicker board. A single-layer PCB may be as thin as 0.4 mm, while multilayer boards like an 8-layer PCB may reach over 2 mm.

Taking the above factors into consideration, it is usually appropriate to choose the plate thickness between 1.6mm-2.0mm.

How to Decide PCB Thickness?

According to different applications and needs, PCB board can be divided into a variety of thicknesses, commonly used board thickness is 0.8mm, 1.0mm, 1.2mm, 1.6mm, 2.0mm and so on. When selecting PCB board thickness, it is necessary to make comprehensive consideration according to specific application scenarios and design requirements. Here are a few ways to choose plate thickness:

1. Determine according to the circuit complexity and working environment

When the circuit complexity is high, multiple components need to be connected at the same time, or the circuit board needs to work in a high temperature environment, you are advised to select a thicker board thickness to effectively improve the performance and reliability of the circuit board.

2. Determine the device size and type

If the device size is small and requires precision assembly, a thinner plate thickness is recommended. For large devices, such as power switches and high-power LED lights, it is recommended to choose a thicker board thickness.

3. Determined according to design requirements and cost control

In terms of cost control, the thinner the plate thickness, the higher the corresponding plate cost will be. Therefore, the cost and performance should be considered comprehensively in the design, and the most appropriate plate thickness should be selected.

In addition, as an 18+ years experienced PCB manufacturer, we summarized a small tip for choosing PCB thickness, hope this is help for you.

The board thickness below 1.0mm is generally used for small electronic devices and mobile devices, such as smart watches, Bluetooth headsets and so on.

1.0mm-1.6mm PCB thickness is suitable for most common electronic devices, such as smart phones, tablets, digital cameras, etc.

Thickness >1.6mm is generally used for industrial control equipment, power switches and other large electronic equipment.

Advanced PCB Manufacturer – Best Technology

At Best Technology, we specialize in manufacturing high-quality PCBs tailored to meet your exact design specifications. We offer custom thickness options for single-layer, double-layer, and multilayer boards.

We understand that PCB thickness is critical to performance, whether you’re working on high-current applications or compact designs. Our team of experts can guide you through the selection process, ensuring that your boards are not only optimized for electrical performance but also for thermal and mechanical stability.

MCPCB production process

Substrate preparation: Select appropriate metal substrates, such as aluminum, iron, copper, indium copper, tungsten-molybdenum alloy, etc., as the base of MCPCB. These metal substrates have good thermal conductivity and are the core components of MCPCB.

Insulating dielectric layer coverage: Cover the metal substrate with an insulating dielectric layer. Common insulating dielectrics include modified epoxy resin, polyphenylene ether, polyimide, etc. This layer not only provides the insulation performance required by the circuit, but also enhances the mechanical strength and durability of the MCPCB.

Copper layer laying: Lay the copper layer on the insulating dielectric layer to form the conductive part of the circuit. The copper layer is made through the production process of printed circuit boards, and the corresponding circuits are laid according to the needs of electronic circuits.

Thermocompression bonding process: The metal substrate, insulating dielectric layer and copper layer are combined together through the thermocompression bonding process to form the basic structure of the MCPCB. This step ensures the close bonding between the layers and improves the stability and reliability of the MCPCB.

Circuit production: According to the design requirements, circuit lines are made on the copper layer. This includes drilling, dry film covering, exposure, development and other steps to ensure the accuracy and conductivity of the circuit line.

‌Inspection and testing‌: Inspect and test the completed MCPCB to ensure that its performance meets the design requirements. This includes inspection of the circuit surface and aluminum base surface, as well as testing of conductivity and insulation performance.

What are the advantages of mcpcb

Excellent heat dissipation performance: MCPCB usually adopts aluminum substrate or copper substrate, which has good thermal conductivity, can effectively dissipate the heat generated by electronic components, and improve the stability and reliability of the circuit board. This excellent heat dissipation performance makes MCPCB particularly suitable for high switching power applications, such as LED lighting, power modules, automotive electronics and power electronics, among which LED lighting is one of the most widely used fields of MCPCB.

‌High mechanical strength: The base material of metal core PCB is thicker, with high mechanical strength and bending and torsion resistance, which is conducive to the assembly and transportation of electronic products. This feature makes MCPCB perform well in environments that need to withstand greater physical pressure or frequent movement.

‌Reliable welding performance: After the surface of metal core PCB is coated with solder paste, it has good welding performance and is suitable for surface mount technology (SMT) and plug-in welding technology. This feature improves the applicability of MCPCB in PCBA processing, making it a preferred material in the manufacture of modern electronic products.

‌Corrosion and wear resistance: Metal core PCB has strong corrosion resistance and wear resistance, which is suitable for electronic products in harsh environments. This feature enables MCPCB to work stably for a long time under high temperature, humidity or other extreme conditions, improving the durability and reliability of the product.

‌Space saving‌: Compared with traditional FR-4 substrates, MCPCB has higher heat dissipation performance, which can design smaller electronic products and save space. This advantage is particularly important in devices with limited space, such as portable electronic devices such as smartphones and tablets.

‌Improve reliability‌: Good welding performance and corrosion resistance can improve the reliability and stability of the circuit board and reduce the failure rate. This is especially important in critical systems and equipment, such as medical equipment, industrial control systems, etc., where reliability and stability are crucial factors.

What accessories does a street lamp have?

Lamp holder. The lamp holder of a street lamp is usually an LED lamp, which is the core part of the street lamp. It is responsible for converting electrical energy into light energy to provide lighting services for people. The quality of the lamp holder directly affects the lighting effect and life of the street lamp.
Lamp pole. The lamp pole is the part that supports the lamp holder. It is usually made of metal and has various shapes such as conical poles and prismatic poles. Street lamps in different scenes may require lamp poles of different heights and shapes to meet lighting needs. In addition, safety issues should also be considered, such as anti-theft design and prevention of excessive wind force. In addition, installation accessories such as clamps are also used to fix the lamp pole.
Light source. The light source is an important part of the street lamp, including LED lamp beads, bulbs, etc. The choice of light source is related to key indicators such as brightness, energy consumption and life of the street lamp. At present, LED light sources are widely used in street lamps due to their high efficiency, energy saving and long life.
Electrical control device. The electrical control device includes components such as ballast, trigger, light control switch, etc., which are used to control the working state of the street lamp and protect the circuit safety. For example, light-operated switches can automatically turn streetlights on and off according to ambient light, saving energy. In addition, some advanced streetlights may also be equipped with intelligent control systems to achieve remote monitoring and management.
Installation accessories. These include small parts such as clamps and screws. Although these parts are not conspicuous, they are very important for the installation and maintenance of streetlights. For example, clamps are used to fix the connection between the top of the lamp pole and the lamp head, and screws are used to fix various parts to ensure the stability and safety of the streetlight.

What are the street lights?

Ordinary street lights
Ordinary street lights are the most common lighting facilities on the streets. They usually use light bulbs or LED lamp heads and are installed on light poles to provide basic lighting for pedestrians at night.

Solar street lights
Solar street lights are an environmentally friendly street light that uses solar panels to absorb solar energy, converts energy into electrical energy, stores it in batteries, and lights up the street lights at night through control devices. Solar street lights do not need to be connected to an external power supply, have low maintenance costs, and are widely used in parks, suburban roads and other places.

LED street lights
LED street lights use light-emitting diodes as light sources, which have the advantages of high efficiency, energy saving, long life, safety and reliability. LED street lights have good lighting effects and can be intelligently adjusted according to different environments. They are the first choice for modern urban street light renovation.

Landscape street lights
In addition to the basic lighting function, landscape street lights also emphasize artistic decorative effects. It is usually integrated with the surrounding environment, with unique design and diverse shapes, and is used to increase the beauty and cultural atmosphere of street landscapes.

Multifunctional street lights
Multifunctional street lights integrate multiple functions such as lighting, monitoring, and communication. In addition to providing lighting, this type of street lamp is also equipped with cameras, display screens and other devices for urban management and security monitoring.

What are AC and DC?

1. Definition of alternating current and direct current:

Alternating current (AC) refers to the current whose direction changes periodically over time, and the average current in one cycle is zero.

The waveform of alternating current is usually a sine curve, but there can also be other waveforms, such as triangular waves and square waves. Alternating current is widely used in power transmission and industrial applications.

Inverters and converters? What effect do they have on current flow?

Direct current (DC) refers to the current whose direction is constant.

The magnitude and direction of direct current do not change with time. Common DC power sources include dry batteries and storage batteries. The direction of pulsating direct current does not change, but the magnitude changes with time. It usually needs to be filtered to become smooth direct current.

2. The difference between AC and DC:

The main difference between AC and DC is whether the direction of the current changes over time.

The direction of AC changes periodically, while the direction of DC remains unchanged. In addition, the average value of AC in a cycle is zero, while the current and voltage of DC remain constant.

3. Application scenarios of AC and DC:

AC is mainly used for power transmission and industrial applications because its waveform is a sinusoidal curve, which is suitable for long-distance transmission. DC is often used in situations where constant current is required, such as battery-powered electronic devices.

How do you convert from DC to AC?

DC can be converted into AC through an inverter. The inverter usually consists of an inverter bridge, control logic, and filter circuits.

Inversion is a current conversion process opposite to rectification, which converts DC into AC. When the inverter side, i.e., the AC side, is connected to the power grid, it is called active inversion, and when the inverter side, i.e., the AC side, is directly connected to the load, it is called passive inversion.

The inverter circuit can convert DC power into AC power of any frequency and voltage under the control of the control circuit, so it is widely used, for example, when DC power is needed to supply power to AC loads.

What is dc to ac inverter?

‌Inverter is a device that converts DC power into AC power. ‌‌

The inverter is mainly composed of an inverter bridge, control logic and filter circuit, which can convert DC power (such as batteries, storage batteries) into fixed frequency and voltage or frequency and voltage AC power, usually 220V, 50Hz sine wave.

Inverters are particularly widely used in automobiles. They can drive various electrical appliances and tools by connecting to batteries, making it possible to use household appliances when driving or traveling.

Inverters can be divided into sine wave inverters and square wave inverters according to the output waveform. Although the sine wave inverter is more expensive, it can be applied to various loads, and the output waveform is closer to the mains, which is friendly to electrical equipment.

The efficiency of the inverter is an important indicator of its performance, which indicates the ratio of output power to input power. With the development of technology, inverters are showing a trend of high frequency, high performance and miniaturization, and are widely used in various fields of power electronics technology.

What is dc to ac converter?

An AC to DC converter is a device whose main function is to convert alternating current (AC) into direct current (DC). Such converters are commonly used in household appliances, computers, mobile phone chargers and other devices to convert the AC power provided by the power grid into the DC power required by the device.

The working principle of the AC/DC converter involves converting the AC power into smooth DC power through a rectification and filtering process. This converter can be bidirectional in terms of power flow, that is, power can flow from the power source to the load (called rectification) or from the load back to the power source (called active inversion).

The working principle of the AC/DC converter involves several key steps:

‌Rectification‌: Converting AC power into unidirectional pulsating DC power is achieved by using a rectifier, which can be a half-wave rectifier or a full-wave rectifier, depending on the specific technology used.

‌Filtering‌: Filtering is performed by using capacitors to eliminate the pulsating components generated during the rectification process to obtain a smoother DC power.

‌Voltage stabilization‌: In some applications, voltage stabilization may also be required to ensure the stability of the output voltage.

The design and application of AC/DC converters are limited by many factors, including safety standards, electromagnetic compatibility (EMC) requirements, and power system optimization design.

In addition, the use of high-voltage, high-current switches increases the power consumption, which to a certain extent limits the modularization process of AC/DC converters.

What is the difference between an inverter and converter?

The main difference between an inverter and a converter is that they have different functions and conversion directions. ‌

Although inverters and converters sound similar, their functions and conversion directions are completely different. The main function of an inverter is to convert direct current (DC) into alternating current (AC), while a converter does the opposite, converting AC into DC. This difference makes them play their respective roles in different application scenarios.

1. ‌Inverter‌:

The main application of an inverter includes converting electricity generated by a DC power source (such as a battery) into AC to meet the needs of AC equipment. The advantages of the inverter include high conversion efficiency, fast startup, good safety performance, etc., but it may also generate noise due to its working principle, and corresponding countermeasures need to be taken to reduce the noise.

2. Converter:

Unlike the inverter, the main function of the converter is to convert AC to DC.

This is usually achieved through the process of half-wave rectification and full-wave rectification, which involves passing the positive half-cycle or positive and negative cycles of AC through the rectifier circuit, and then further processing through capacitor filtering and voltage stabilization circuit to finally obtain DC.

Converters are widely used in various electronic devices that need to convert AC power to DC power.

In general, although inverters and converters are similar in name, their functions and conversion directions are completely different. Inverters convert DC to AC and are suitable for using DC power for AC devices; while converters convert AC to DC to meet the needs of devices that require DC power.

Why would you use an inverter?

The main reason for using an inverter is to convert DC to AC to meet the power needs of various devices and systems. ‌

The main function of the inverter is to convert direct current (DC) into alternating current (AC), which is necessary in many fields and scenarios. Here are some of the main uses of the inverter:

1. Household electricity: The inverter can convert the DC power of the car battery or other DC power source into the AC power required by household appliances, so that the car or other DC power source can power household devices.

2. Emergency power supply: In the event of a power outage or power outage, the inverter can convert the DC power of the backup power source (such as gasoline generators, solar panels, etc.) into AC power to provide power support for key equipment.

3. Electronic devices: Many portable electronic devices (such as laptops, mobile phones, cameras, etc.) use DC batteries as power sources. The inverter can convert DC power into AC power to provide power for these devices.

4. Industrial applications: In industrial production, the inverter can convert high-voltage DC power into low-voltage AC power to meet the power needs of different equipment and systems.

5. Electric vehicle charging: With the popularity of electric vehicles, inverters are increasingly used in electric vehicle charging stations, which convert direct current from the power grid into alternating current required by electric vehicle batteries.

6. Radio communication: In radio communication, inverters are used to convert direct current into radio frequency power to transmit and receive radio signals.

Therefore, inverters play an indispensable role in modern society and are widely used in various fields to provide necessary power conversion and support for various devices and systems.

What are the disadvantages of an inverter?

1. Harm to batteries: Inverters increase the burden on batteries and shorten the life of batteries. Inverters generate electromagnetic interference and heat when working, which may interfere with batteries, causing unstable battery voltage or internal damage to batteries.

2. Energy loss: The conversion efficiency of inverters is relatively low, and there will be a certain amount of energy loss.

3. High cost: The cost of inverters is high, which may not be suitable for some low-cost applications.

4. May generate electromagnetic interference and heat: The inverter will generate high-frequency electromagnetic waves and a certain amount of heat when working, which may affect the working performance of other electronic equipment and may even cause safety problems.

In summary, although the inverter provides convenience in many applications, its disadvantages cannot be ignored, including energy loss, high cost, possible electromagnetic interference and heat, and potential safety hazards.

Conclusion:

Inverters and converters are indispensable in modern electrical systems to ensure that energy flows to where it is needed in the right form. Whether it is converting DC to AC for renewable energy systems, using batteries to power equipment, or ensuring uninterruptible power supply, these tools can achieve a smooth transition between different types of current.

Alumina ceramic materials

1). 99 alumina
99 alumina refers to alumina materials with a purity of 99% or higher. It is usually made of chemically pure alumina or high-purity alumina as raw materials, and is made through multiple processes such as high-temperature calcination, crushing, molding, and sintering. Compared with 96 alumina, 99 alumina has higher chemical purity, density and hardness, as well as better high-temperature stability and corrosion resistance.

99 alumina is widely used in electronics, machinery, chemical industry, aerospace and other fields. In the electronics field, 99 alumina is usually used to manufacture high-frequency electronic components, integrated circuit packaging, dielectrics and other devices; in the mechanical field, 99 alumina is mainly used to manufacture high-hardness ceramic tools, bearing balls, etc.; in the chemical field, 99 alumina can be used to manufacture catalysts and adsorbents; in the aerospace field, 99 alumina is often used to manufacture high-temperature structural parts, aircraft engine parts, etc.

2). 96 alumina
96 alumina, also known as industrial alumina or α-alumina, is a high-purity ceramic material. Its chemical formula is Al2O3, which belongs to oxide ceramics. 96 alumina is usually made of alumina powder through pressing, molding, sintering and other processes. The “96” here means that its aluminum oxide purity reaches more than 96%. 96 alumina has the characteristics of high hardness, high strength, high wear resistance, and good high temperature stability. It is widely used in the manufacture of ceramic products, refractory materials, abrasives, electronic devices and other fields.

Advantages of 99 alumina substrate:

High purity, usually reaching a purity level of 99.99%, excellent electrical properties, high dielectric constant and low dielectric loss.
Good high temperature stability, can work stably in high temperature environment, and can usually withstand temperatures up to 1700℃.
High mechanical strength, high strength, high hardness, not easy to be damaged, and can withstand greater force and pressure.
It has excellent corrosion resistance, is not corroded by most chemical substances, and is suitable for chemical media such as acids and alkalis.
It can be prepared into a thinner substrate, which is conducive to the preparation of microelectronic devices.

Advantages of 96 alumina substrate:
Cheaper than 99 alumina substrate, the cost is relatively low.
It is easier to process than 99 alumina substrate, and can be processed by cutting, drilling and other processing, which is convenient for preparing substrates of various shapes.
In some low-temperature and low-electric field strength applications, the dielectric constant and dielectric loss are lower than those of 99 alumina substrate, and it has better signal transmission performance.

Disadvantages:
Compared with 99 alumina substrate, 96 alumina substrate has lower purity, higher dielectric constant and dielectric loss.
It is prone to brittle fracture in high temperature environment.

Alumina ceramic application industry
99 alumina substrate: suitable for high-power LED, high-voltage integrated circuit, high-temperature sensor, high-frequency electronic components and other fields.
96 alumina substrate: suitable for low-power electronic components, sensors, capacitors, micro relays, microwave components and other fields.

Aluminum nitride ceramic material (AlN)

Aluminum nitride ceramic material (AlN)

Aluminum nitride ceramic is a high-performance ceramic material made of aluminum nitride powder sintered at high temperature. Its main component is aluminum nitride (AlN), which has the characteristics of high melting point (about 2800℃), hardness (9.0 to 9.5Mohs), strength and thermal conductivity. At the same time, it also has good insulation performance, chemical stability and high temperature resistance. Due to these characteristics, Sliton aluminum nitride ceramic circuit boards are widely used in microelectronics, optoelectronics, power electronics, aerospace and other fields.

Advantages

High hardness: The hardness of aluminum nitride is close to that of diamond, which is more than 3 times that of traditional alumina. It can be used to make high-strength mechanical parts.
High strength: Aluminum nitride has high strength, good wear resistance and corrosion resistance, and can be used to make high-load, high-wear and corrosion-resistant parts.
High thermal conductivity: The thermal conductivity of aluminum nitride is very high, reaching 170-230W/(m·K), which is more than 4 times that of traditional aluminum oxide. It can be used to make high-power, high-frequency RF components.
High insulation: The dielectric constant of aluminum nitride is low, about 1/3 of that of traditional aluminum oxide, and can be used to make high-frequency, high-precision microwave components.
Anti-oxidation: Aluminum nitride has good anti-oxidation properties at high temperatures and can be used to make parts in high-temperature environments.

Application of aluminum nitride ceramics
Widely used in semiconductors, aerospace, electronics, military and other fields. For example, it is used to make high-frequency RF devices, microwave components, electronic ceramics, thermistors, high-temperature sensors, etc.

Zirconia ceramic material (ZrO2)

Zirconium oxide ceramic material is a ceramic material with high strength, high hardness, high temperature tolerance, corrosion resistance and good insulation performance. Its chemical formula is ZrO2, and it is usually stabilized to improve the stability and wear resistance of its lattice. Zirconia ceramic material has the characteristics of low thermal conductivity and high melting point, so it is widely used in industrial fields with strict requirements such as high temperature, high pressure, high speed and high precision, such as aerospace, electronics, medical and energy.
Advantages

High hardness: The hardness of zirconia ceramics is very high, usually reaching HRA90 or above, even up to HRA95, which is more than 10 times that of steel.
High strength: Zirconia ceramics have extremely high strength, which can reach 900MPa at room temperature, and can still maintain high strength at high temperature.
Good wear resistance: Zirconia ceramics have high surface flatness and high hardness, so they have good wear resistance.
Good corrosion resistance: Zirconia ceramics are chemically inert and not easily corroded by chemicals such as acids and alkalis, and can operate stably for a long time in harsh environments.
Excellent insulation performance: Zirconia ceramics have excellent insulation performance and can be used for high-voltage insulation materials.
Good high-temperature stability: Zirconia ceramics have extremely high melting points and high-temperature stability, and can be used for a long time in high-temperature environments.

Application of Zirconia Ceramics
Widely used in high-end manufacturing, electronics, aerospace, medical equipment, chemical industry and other fields, such as abrasives, high-temperature structures, pneumatic components, medical equipment, sensors, capacitors, etc.

Silicon carbide ceramic material (SiC)

Silicon carbide is a compound with the chemical formula SiC, which is composed of two elements: silicon and carbon. It is a ceramic material that is resistant to high temperature, corrosion, and extremely hard. It is also an industrial material widely used in extreme environments such as high temperature, high frequency, and high pressure. Silicon carbide has excellent mechanical, electromagnetic, and thermal properties, and is therefore widely used in semiconductors, disks, aerospace, and other fields. In addition, silicon carbide has good semiconductor properties and is also widely used in power electronics, optoelectronics, and other fields.
Advantages

High hardness: The hardness of silicon carbide material is 5 times higher than that of steel and 3 times higher than that of aluminum.
High strength: The strength of silicon carbide material is high, and the tensile strength can reach more than 400MPa.
High temperature resistance: Silicon carbide material has a high melting point and can withstand high temperature thermal shock. The general use temperature is 1200℃-1600℃.
Good oxidation resistance: Silicon carbide material can resist high temperature oxidation corrosion and can be used in air.
Good wear resistance: Silicon carbide material has high hardness, low friction coefficient and good wear resistance.
Good thermal conductivity: Silicon carbide material has excellent thermal conductivity, which is 2-3 times that of metal and can effectively dissipate heat.
Good chemical stability: Silicon carbide material has good chemical stability and will not be corroded by acid, alkali, etc.

Silicon carbide ceramic PCB application
Widely used in high temperature, high pressure, high speed, high load, corrosion resistance and other fields, such as power, electronics, machinery, aviation, metallurgy and other industries.

Silicon nitride ceramic material (Si3N4)

Silicon nitride ceramic material is a high-temperature ceramic material based on nitrogen and silicon elements. It has excellent properties such as high strength, high hardness, high wear resistance, high temperature resistance, oxidation resistance, and corrosion resistance. Its chemical stability is extremely high and is not easily corroded by acids, alkalis, solvents, etc. The hardness of silicon nitride ceramic materials is comparable to that of diamond, or even higher, reaching about 24GPa. It is harder and less prone to wear than ordinary ceramic materials. At the same time, it has good insulation properties and thermal stability, and can work stably for a long time in high temperature environments.

Advantages of silicon nitride ceramic PCB materials

High hardness: The hardness of silicon nitride ceramic materials is close to that of diamond, which can reach more than 30GPa.
High strength: The bending strength of silicon nitride ceramic materials is high, which can reach more than 1000MPa.
High wear resistance: Silicon nitride ceramic materials have good wear resistance and can be used to manufacture high-speed bearings and cutting tools, etc.
High temperature resistance: Silicon nitride ceramic materials have high high temperature resistance and can be used in high temperature environments above 1000°C.
Corrosion resistance: Silicon nitride ceramic materials have excellent corrosion resistance and can be used in some acidic and alkaline working environments.
Lightweight: Silicon nitride ceramic materials are lighter than steel and can be used in lightweight design.

Silicon nitride ceramic PCB applications
Widely used in aerospace, optoelectronics, electronics, semiconductors, machinery and other fields.

Piezoelectric ceramic materials

Piezoelectric ceramic materials are ceramic materials with piezoelectric effect, which can deform under external electric field or mechanical stress, and generate electric charge when deformed. They are usually made of materials such as barium lead oxide (Pb(Zr,Ti)O3) or niobium lead oxide (Pb(Mg1/3Nb2/3)O3-PbTiO3) as the main components and sintered.

Advantages

Piezoelectric effect: It can convert mechanical stress into electrical signals, or convert electrical signals into mechanical motion. This effect makes piezoelectric ceramic materials widely used in sensors, actuators, acoustic wave devices and other fields.
Dielectric properties: With high dielectric constant and low dielectric loss, piezoelectric ceramic materials are used as capacitors, filters, etc. in electronic components.
Mechanical properties: With high hardness, strength and wear resistance, piezoelectric ceramic materials are used in mechanical engineering.
Thermal stability: With good thermal stability and high temperature resistance, it can work stably in high temperature environment.
Piezoelectric ceramic PCB applications
Widely used in sensors, actuators, acoustic wave devices, electronic components, mechanical engineering and other fields.

Diamond ceramic material

Diamond ceramic material is a new type of material made by sintering diamond powder and ceramic as raw materials at high temperature and high pressure. Because diamond has extremely high hardness, reaching Mohs hardness level 10, and has excellent wear resistance, corrosion resistance and high temperature oxidation resistance, diamond ceramic material has extremely high physical and chemical properties.

Advantages of diamond ceramic PCB material

Extremely high hardness and strength, more wear-resistant, scratch-resistant and impact-resistant than ordinary ceramic materials;
Excellent corrosion resistance, able to resist corrosive media such as strong acids and alkalis;
Excellent high-temperature oxidation resistance, can be used for a long time at high temperature without damage;
Excellent thermal conductivity and insulation performance;
Easy to process into ceramic products of various shapes and sizes.

Application of diamond ceramic PCB
Diamond ceramic materials are widely used in high-end machinery, electronics, optics, medical and chemical fields, such as bearings, nozzles, cutting tools, hydraulic cylinders, electrical insulation parts, laser parts, etc.

Sapphire ceramic material

Sapphire ceramic material, also known as synthetic sapphire (Synthetic Sapphire), is a man-made single crystal material with excellent properties such as high hardness, high wear resistance and high corrosion resistance. The main component of sapphire ceramic material is aluminum oxide (Al2O3), which is prepared by melting or heat treatment at high temperature.

Advantages of sapphire ceramic material:

High hardness: The hardness of sapphire ceramic material is second only to diamond, and it has high wear resistance.
High corrosion resistance: Sapphire ceramic material has excellent corrosion resistance and can be used stably for a long time in harsh environments such as strong acid and strong alkali.
High light transmittance: Sapphire ceramic material has high light transmittance and can be used in optics, laser and other fields.

What does PCBA mean?

PCBA is the abbreviation of Printed Circuit Board Assembly, which refers to the process of welding, inserting, etc. of electronic components to the circuit board, and welding, inserting, etc. PCBA is an indispensable and important link in the manufacture of electronic products, which directly affects the performance stability and service life of electronic products.

The manufacturing process of PCBA mainly includes components mounting, welding, post-welding processing and functional testing. The first is the component mounting, which is a process of welding the patch components, plug-in components, etc., to the PCB. Then there is welding, through traditional wave soldering or modern lead-free welding and other methods, the components are firmly fixed on the PCB. After that, the welding process is mainly to remove the welding slag on the PCBA surface, clean the PCBA surface, and check the solder joints and components of PCBA. Finally, the functional test is carried out, which is the last step in the PCBA process, and the PCBA is fully functional tested by various test equipment to ensure the stability and reliability of PCBA.

Applications of PCBA

PCBA products are widely used in various electronic products, such as household appliances, communication equipment, automotive electronics, industrial control equipment, etc. You can see it everywhere.

Different electronic products have different requirements for PCBA. Some require PCBA to be small and exquisite, some require PCBA to be high temperature and high pressure resistant, and some require PCBA to be waterproof and dustproof. With the rapid development of 5G, artificial intelligence, Internet of Things and other fields, PCBA will be more widely used, and PCBA’s performance and reliability requirements will also be higher.

Common components on a PCBA and their symbols

1. Resistor

Resistors are one of the most commonly used electronic components in PCBA, used to limit the current in the circuit. According to different materials, structures, and resistance values, resistors can be divided into fixed resistors, variable resistors, and special resistors. Resistors are widely used in various circuits, such as power circuits, amplification circuits, signal processing circuits, etc., to achieve current regulation and control.

2. Capacitor

A capacitor is a component that stores charge and electrical energy, with the characteristic of blocking direct current and passing alternating current. In PCBA, capacitors are commonly used in circuits such as filtering, coupling, tuning, and bypassing to improve circuit performance and stability. According to their different structures and applications, capacitors can be divided into fixed capacitors, variable capacitors, and fine tuned capacitors.

3. Inductor

Inductor, also known as induction coil, has the function of storing magnetic energy. In circuits, inductors can prevent changes in current and play a role in filtering and stabilizing the current. Inductance has a wide range of applications in power filtering, signal processing, and other fields.

4. Diode

A diode is an electronic component with unidirectional conductivity, widely used in circuits such as rectification, detection, and voltage regulation. In PCBA, diodes can achieve functions such as voltage regulation, signal amplification, and switch control in the circuit. Common diodes include silicon diodes and germanium diodes, whose performance parameters such as forward voltage drop and reverse breakdown voltage determine their application scenarios.

5. Transistor

Transistors are electronic components with functions such as amplification and switching, and are the core components that make up various circuits. In PCBA, transistors are commonly used in amplification circuits, oscillation circuits, switch circuits, etc. to achieve signal amplification, frequency conversion, and circuit control. There are many types of transistors, including bipolar transistors, field-effect transistors, etc., each with its own characteristics, widely used in various electronic devices.

6. IC Integrated circuit

Integrated circuit is an electronic component that integrates multiple electronic components on a single chip, with advantages such as small size, low power consumption, and stable performance. In PCBA, integrated circuits are key components for implementing various complex functions, such as digital signal processing, analog signal processing, communication interfaces, etc. Common integrated circuits include operational amplifiers, logic gate circuits, microprocessors, etc., which are widely used in various intelligent devices and systems.

7. Sensor

Sensors can sense physical quantities or states in the environment and convert them into electrical signals for output. In PCBA, sensors are commonly used to detect parameters such as temperature, humidity, light, pressure, etc., providing data support for intelligent control of electronic devices. There are various types of sensors with different performances, and choosing the appropriate sensor is crucial for improving the performance and user experience of electronic devices.

8. Controllable silicon rectifier (SCR)

Also known as thyristors, silicon controlled rectifiers (SCR) are similar to transistors and diodes – their working principle is essentially the coordinated operation of two transistors. Although SCR also has three pins, they are composed of four layers of silicon material instead of three layers, and are only used as switches, not amplifiers. Unlike single transistors that require continuous current to remain on, SCR only requires one pulse to activate the switch. They are very suitable for converting large amounts of electricity.

9. Crystal oscillator

Crystal oscillators provide clock signals in many circuits that require precise and stable timing. By physically oscillating piezoelectric materials (such as crystals), they generate periodic electronic signals, hence their name. Each crystal oscillator is designed to vibrate at a specific frequency, which is more stable, economical, and smaller in size than other timing methods. That’s why they are commonly used for precise timing in microcontrollers, or more commonly as clock components in quartz watches.

10. Switches and relays

A basic and easily overlooked component, a switch is simply a power button that controls the current in a circuit by switching between open or closed circuits. They vary greatly in appearance, from sliders, rotations, buttons, levers, toggles, key switches, and more. Similarly, a relay is an electromagnetic switch that operates through a solenoid, acting like a temporary magnet when a current flows through it. They act as switches and amplify small currents into larger ones.

Now that you’re familiar with some basic electronic components, why not dive into creating your own electronics project? Instead of starting with a complex project featuring advanced functions, begin with a few simple ones. As with any hobby, you’ll encounter challenges along the way, but these hurdles are not insurmountable. With accessible and affordable beginner electronics tools like Arduino and CAD tools, the maker community welcomes new PCB designs and projects every day.

In addition to PCB manufacturing, Best Technology offers a full turnkey service, including parts procurement and assembly. Whether you’re working on prototypes or scaling up to mass production, Best Team provides a one-stop solution for seamless and hassle-free PCB assembly.

Archive for the ‘PCB News’ Category

‌What is a high frequency pcb communication circuits

Definition of high frequency pcb communication circuits

Advantages of high frequency pcb communication circuits

Classification of high frequency pcb communication circuits

How to choose high-frequency circuit board high-speed board

Composition and key components of high frequency pcb communication circuits

Application of high frequency pcb communication circuits

Design Guidelines for High Frequency PCB Communication Circuits

You may also like

What is Fast Turn PCB?

Advantages of Fast Turn PCB Prototypes

Our Quick Turnaround PCB Services Include

Best Technology’s Typical Turnaround Lead Time for Fast Turn PCB

Custom Quote for Fast Turn PCB Prototypes

Factors That Affect Lead Time of PCB Prototypes

Prototype PCB Assembly Services

Choosing the Right Fast Turn PCB Prototype Manufacturer

Why Should You Choose Best Technology as Your Preferred Partner?

You may also like

What is a single-sided PCB circuit board

Single layer PCB manufacturer

Single-sided PCB production process

Single-sided PCB production capacity

What are the single-sided PCB materials?

Single-sided PCB circuit board price

Single-sided PCB applications and features

FAQ About single sided pcb

You may also like

What is the thermal conductivity value for copper?

What is the thermal conductivity of copper at 25 C?

How do you measure thermal conductivity of copper?

What metal has the highest thermal conductivity?

Which metal is the poorest conductor of heat?

Why copper has highest thermal conductivity?

What happens to copper when it is heated?

Why does copper turn green?

You may also like

What is an ic substrate

IC substrate definition

IC substrate manufacturing process

IC substrate manufacturers

How ic substrate differentiate

IC substrate vs PCB

Application of IC substrates

You may also like

What is the Standard Thickness of a PCB?

How is PCB Thickness Measured?

How Thick is a 2-Layer PCB Board?

How Thick is a Standard 8-Layer PCB?

How Does PCB Thickness Affect Thermal Performance?

What Factors Influence PCB Thickness?

How to Decide PCB Thickness?

Advanced PCB Manufacturer – Best Technology

You may also like

MCPCB production process

What are the advantages of mcpcb

What accessories does a street lamp have?

What are the street lights?

You may also like

What are AC and DC?

How do you convert from DC to AC?

What is dc to ac inverter?

What is dc to ac converter?

What is the difference between an inverter and converter?

Why would you use an inverter?

What are the disadvantages of an inverter?

You may also like

Alumina ceramic materials

Aluminum nitride ceramic material (AlN)

Zirconia ceramic material (ZrO2)

Silicon carbide ceramic material (SiC)

Silicon nitride ceramic material (Si3N4)

Piezoelectric ceramic materials

Diamond ceramic material

Sapphire ceramic material

You may also like

What does PCBA mean?

Applications of PCBA

Common components on a PCBA and their symbols