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How Does the Ceramic PCB Works in IGBT Modules?
Friday, January 19th, 2024

IGBT (Insulated Gate Bipolar Transistor) is a bipolar junction transistor (BJT) with a MOS gate, or we can say that an IGBT module is a combination of BJT and MOS module. Despite its small size, the IGBT chip can control the transmission of electrical energy. It can switch the current 100,000 times within 1 second under an ultra-high voltage of 650 million volts.

What is the Working Principle of IGBT?

IGBT combines the features of a transistor and a switching circuit, making it a new type of electronic component that can control current efficiency. Its structure allows it to achieve current control from turn on to off without generating excessive leakage current, as well as not affecting the operation of other circuits.

The working principle of IGBT modules including two parts – the current control of MOS gate and BJT transistor. When the voltage of MOS gate changes, it affects the conduction of the transistor, thus controlling the flow of current. When the BJT comes into play, it controls the flow of current, so that improve the working efficiency of the IGBT.

(Working_principle_of_IGBT)

How Does A Ceramic PCB Protect IGBT Modules from Overheat?

As you know, IGBT modules have been applied for many years in various industries such as automotive, industrial, aerospace, consumer electronics, and more. However, optimizing the thermal dissipation of IGBT packaging is crucial to enable the modules to operate at higher power conditions. If heat dissipation is improved, IGBT modules can be used in more advanced applications.

You might be wondering how much heat does an IGBT module generate during running? It’s equivalent to the heat produced by 100 electric furnaces. This substantial amount of heat must be dissipated immediately from the IGBT chip, that’s why the ceramic circuit board stands out.

(Ceramic_pcb_with_DPC_technology)

In IGBT modules, ceramic PCBs are placed beneath the IGBT chip, or we can say the chip is assembled on the ceramic circuit board. The ceramic PCB connects and supports the chip, rapidly dissipating heat to the outer package. This method protects the chip from the adverse effects of heat.

Why ceramic PCBs Are Suitable for IGBT thermal dissipation?

Ceramic materials exhibit excellent thermal dissipation and electrical insulation properties. Unlike aluminum metal core PCBs, ceramic PCBs do not use insulation layers that hinder heat dissipation. In the manufacturing process of ceramic PCBs, copper foil is directly bonded to the ceramic substrate under high pressure and temperature (it depends on the different technology and different copper thickness). During PCB manufacturing, IGBT and other components are mounted on the circuit board through assembly technology.

Ceramic materials have extremely high insulation capabilities, enduring breakdown voltages up to 20KV/mm. At present, there are three ceramic materials that can be used for IGBT modules, they are 99% or 96%　Alumina (Al₂O₃), Aluminum Nitride (AlN), and Silicon Nitride (Si₃N₄).

The thermal conductivity of alumina PCB is 15-35W/mK, aluminum nitride PCB is 170-230W/mK, and silicon nitride PCB is 80+W/mK. In contrast, aluminum core circuit boards only have a thermal conductivity of 1-12W/mK.

Applications of Ceramic PCBs in IGBT Packaging

Alumina PCBs are the most commonly used circuit boards in IGBT modules due to their lower cost. But if IGBT modules have higher power or precision requirements, AlN ceramic PCBs and Si3N4 PCBs are the most suitable choices. Because they have higher thermal dissipation and thermal expansion coefficients (CTE) close to semiconductors. Since different ceramic substrate has different features, the uses of ceramic PCB should depend on the specific requirements of IGBT modules.

In addition, with the development of Silicon Carbide (SiC) and Gallium Nitride (GaN) materials, they are starting to be used for IGBT chips due to their high-frequency, high-power, and high-temperature characteristics. Maybe in the future, aluminum nitride PCBs and silicon carbide PCBs will be increasingly applied to high-power IGBT modules in high-density three-dimensional packaging.

Common Properties of Using Ceramic Circuit Board

  • Excellent thermal conductivity and voltage resistance of ceramic substrates.
  • Copper trace layers has extremely high current-carrying capacity.
  • Strong adhesion and reliability between circuit layers and ceramic substrates.
  • Good soldering performance, suitable for wire bonding.
(Ceramic_PCB)

How to Solve the Overheat Issues in IGBT?

Though the ceramic PCB is good at heat dissipation, there still some overheat occasions happened if small power or long-time operation. Here we summarized some solutions for such issues.

1. Clean the heat sink to ensure tight contact between the IGBT and the heat sink.

2. Clean the fan, including the fan blades and lubricate the bearings if needed.

3. Clear the airflow path of the fan.

4. Replace with higher power IGBTs, ensuring the withstand voltage is not lower than the original IGBT’s value.

Above all are the information that we’d shared, welcome to contact us if you want to know more. Best Technology is a historic company which has over 17 years PCB manufacturing experience, here you can enjoy the one-stop ODM & OEM service, one-to-one after sales, quick delivery and high-quality products.

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Do You Know How Does the ENEPIG Working for Wire Bonding Circuit Boards?
Friday, November 10th, 2023

The electronics industry has continuously pursued smaller and faster electronic products with increased functionality. To meet these demands, the electronic packaging industry has focused on developing more advanced packaging methods, aiming to increase the density of components on a circuit board while integrating multiple functions into a densely package.

The increasing density of packaging and interconnection has driven the progression of assembly methods from through-hole technology (THT) to surface-mount technology (SMT). Additionally, the use of wire bonding to connect chips to substrates has become more prevalent. The adoption of smaller interconnect pitches and chip-scale packaging (CSP) has further increased component density, while multi-chip modules (MCM) and system-in-package (SiP) have enabled the integration of more functions on a single package.

This post describes the key factors affecting the reliability of interconnections, with a particular focus on the specific properties of surface-treated wire bonding, emphasizing the selection of wire bonding surface treatments.

Selection of Surface Treatment for Wire Bonding

While electroless nickel gold provides excellent performance for wire bonding, it has three main drawbacks that hinder its application in cutting-edge technologies:

1. The relatively high demand for gold layer thickness leads to lengthy process costs.

2. Thick gold layers are prone to the formation of weak tin-gold intermetallic compounds (IMC), reducing the reliability of solder joints. To enhance solder joint reliability, alternative surface treatments may be used, but this increases additional process costs.

3. The electroplating process requires the use of electroplating lines, limiting the design freedom and wiring density of the packaging substrate.

The limitations posed by electroplated nickel-gold provide an opportunity for the adoption of chemical plating. The techniques of chemical plating include Electroless Nickel Immersion Gold (ENIG), Electroless Nickel Electroless Gold (ENEG), and Electroless Nickel Palladium Immersion Gold (ENEPIG).

Among these three options, ENIG is generally unproblematic due to its lack of high reliability in gold wire bonding properties (although it has been used in some low-end consumer products). On the other hand, ENEG shares the high production cost and presents complex challenges in terms of the manufacturing process, similar to electroplated nickel-gold.

ENEPIG was initially introduced in the late 1990s, its market acceptance was delayed until around the year 2000 due to fluctuations in palladium metal prices (which were inflated to unreasonable levels around 2000). However, ENEPIG can meet the requirements of many new packaging applications, providing reliable performance and conform to lead-free/ROHS requirements, with a recent strong surge in market demand.

In addition to the advantages in packaging reliability, the cost of ENEPIG is another benefit. With the recent rise in gold prices surpassing US$800/oz, it becomes challenging to control costs for electronic products requiring thick gold plating. The price of palladium (US$300/oz), relative to gold, is less than half, making palladium a cost-effective alternative with surface-related advantages.

Comparison of Surface Treatments

Up to now, for printed circuit boards accommodating fine-pitch QFP/BGA components, there are primarily four lead-free surface treatments:

Immersion Tin (IT)

Immersion Silver (IAg)

Organic Solderability Preservatives (OSP)

Electroless Nickel Immersion Gold (ENIG)

The table below compares these four surface treatments with ENEPIG. Among these surface treatments, none can simultaneously meet all the requirements of lead-free assembly processes, especially when considering multiple reflow experiences, pre-assembly shelf life, and gold wire bonding experiences. In contrast, ENEPIG offers good shelf life, solder joint reliability, gold wire bonding capability, and can serve as a touch button surface, providing surface-related advantages. Moreover, in the final gold replacement deposition reaction, the chemical palladium layer in ENEPIG works to protect the nickel layer, avoiding excessive corrosion during gold replacement.

(Table 1 – Comparison_of_Different_Surface_Treatment_Performances)

What Are Advantages of ENEPIG?

ENEPIG has several crucial advantages, demonstrating reliable solderability and gold wire bonding concurrently. The key benefits are outlined as follows:

  • Prevention of “Black Nickel Problem” – The absence of gold replacement attacking nickel on the surface prevents interfacial corrosion.
  • The chemical palladium layer acts as a barrier, preventing copper from diffusing to the surface, ensuring satisfactory solderability.
  • Palladium layer enable to completely dissolves in the solder, preventing the exposure of a high-phosphorus layer at the alloy interface. After the dissolution of the chemical palladium layer, the chemical nickel layer is revealed, forming a satisfactory nickel-tin alloy.
  • Capability to Withstand Multiple Lead-Free Reflow Cycles
  • Excellent Gold Wire Bonding Properties

These advantages make ENEPIG a preferred choice in various applications, ensuring reliable performance in both soldering and wire bonding processes while offering cost efficiency. As a one-stop PCB supplier in Asia, Best Technology possesses advanced technology and high-tech manufacturing equipment that can meet the “multi-variety, small volume, high quality, strong capability, short delivery” requirements. Welcome to contact us if you are going to find a reliable circuit board manufacturer.

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How Can I Reduce and Optimize the Cost of My PCB in A Best Way? – Series 2
Saturday, October 28th, 2023

At our latest blog, may the readers have understood the factors that will affect the PCB price, or maybe one of your have put it into practice that get a price lower than your budget. However, people are always not satisfied by the existing situation. If this is bother you as well, keep reading since this time we are going to sharing some useful tips that enable to optimize your PCB price until to the best.

  • Reduce board complexity

It can be said that try to simplest your design/layout and make it easy to fabricate is the simplest way to reduce your PCB cost. The more complex and irregular the forms, the higher the cost. Just remember: for every circuit board, no need to maintain a fancy diagram to demonstrate its excellence, perform functionality correctly is enough.

  • Design it in right size and thickness

Design your board in right size doesn’t means make it smaller as possible. You must know, if your design is complex and layouts are density, that means maker need to spend more time to assemble them. Highly compact sizes are always expensive, don’t skimp when it counts. Otherwise, more money will be spent to afford what you saved.

And in theory, the more layers and thickness the board, the more cost that manufacturer spend. Numerous layers in the PCB will have an influence for holes and diameters. It is recommended that if thinner thickness is enough, then just do it. 

  • Shapes, holes and rings should be regularly

Normally, keep the PCB as square or rectangular shapes is cheaper than irregular shapes like pentagon.  And large holes and rings enable to smooth the production run and easy to create. For smaller holes and rings means the driller must be smaller and delicate control.

  • Consider volume and choose manufacturer

In our last blog, we emphasize manufacturers will set a minimum order quantity (MOQ), it is common in this industry. So, consider your volume and check multiple quantities before ordering can help to recognize which one is the most cost-effective.

During the evaluation period, talk to your suppliers as soon as possible, knowing more about the material specifications, technical and PCB tolerances. A wrong choice will lead to much time waste and some unnecessary cost. This is we call “trial and error cost”. Try to make all things are clear and correct before production.

  • Pick the best vias

There are totally three types of vias in PCB: though-hole, blind, buried. The through hole can be passed through the whole board, while blind vias is created from top or bottom side to the middle of the board without through to bottom or top side. Buried vias, just as its names, it is buried inside the boards and we can’t see it by naked eyes.

Obviously, through hole is cost performance than other two vias, try to use more instead of blind or buried vias enable to decrease your cost. In additionally, blind and buried vias are always necessary in HDI PCB and RF board, otherwise, you don’t usually use them.

  • Make sure all SMT components on the one side

Trying to make all the surface mounted (SMT) components on the one side of circuit board if possible. In this way, assembler can finish the SMT process in one-time, so that can save much manufacturing time and cost. But if the components are distributed on both sides, it is needed to assemble two times, that is top side first – bottom side second (or sometimes bottom first).

  • Select easily replaceable component parts

It is assumed that one of part on your circuit becomes obsolete, then you must search for replaceable part or update your design if you would like to continuedly use this board. As an extensive experienced PCB manufacturer, we strongly recommend that select components that has standard dimension, so that it is easy to match alternative one.

In addition, visit some manufacturer’s website carefully to see if any components are marked as “obsolete” or “not recommended for new designs” before finishing your design. This enables to avoid secondary update.

  • Follow manufacturer’s PCB fabricate standards

Understand and follow manufacturer’s fabricate standards can keep your unit PCB price in a relative lower cost. When designing a new project, please make sure to following below tips.

  1. Use standard stack-up with standard materials.
  2. Design 2-4 layers PCB if possible.
  3. Keep your minimum line width and spacing within the standard spacing.
  4. Avoid adding extra special requirements as much as possible.
  • Use SMT components as possible

Choose surface mounted (SMT) components instead of through hole (THT) component whenever possible. SMT and THT are almost treated as separated manufacturing processes. Hence, if all the THT components can be replaced by mounted parts, the THT process will be eliminated completely. It is not only decreasing the manufacturing cost, but also reducing delivery time. Of course, it is not always possible, but it’s worth trying.  

Whatever decisions you make, the best solution is to consult and discuss with your suppliers. They be always to give you the best one that can save your money and meet your requirements as well. Meanwhile, if you don’t believe the suppliers, you are welcome to reach us. We promise that we can give you a most favorable price and high-quality product.

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The Differences Between Copper PCB and Heavy Copper PCB?
Saturday, October 21st, 2023

With the fast development of digital era, printed circuit board (PCB) has won a huge market in the electronic industry. Nowadays, electronics can be found everywhere, I can say for each electronic products, you will find a PCB or several pcbs are inside. But not every PCB are the same, each printed circuit board plays its unique roles. When it comes to copper pcb, may someone will think about heavy copper pcb, or even think they are the same. But actually, they are totally different, totally from constructure and functions.

What is Copper PCB?

Copper PCB, also known as Copper Core PCB, Copper-based PCB or Copper Clad PCB, which is a type of metal core PCB (MCPCB) that uses copper core as the base substrate. Among all of the PCB types, copper clad pcb is well-known for its extreme high thermal conductivity, which enables to achieve to 401W/m.K, that’s why some people think it is the king of the metal core PCB.

(Copper_core_PCB)

Copper-based PCB consists of three layers: copper foil layer, dielectric layer and base copper layer. Copper foil layer is the electric layer, which is mainly used for components electric connection. Dielectric layer is made by insulation material, so it also called insulation layer. Though it is function as insulation, it has good heat transfer capacity. The base copper layer is the support stone for the whole PCB. Copper core PCB is commonly used in LED lighting and other applications where need good heat dissipation.

What is Heavy Copper PCB?

Heavy copper PCB doesn’t have a clear definition in IPC standard, it is a kind of special PCB just like HDI PCB and extra thin PCB. Generally, for copper thickness equal or exceed 3ounces will be default as heavy copper pcb. For those copper thickness ranges from 20~200ounces is classified as extreme heavy copper PCB.

(Heavy_copper_PCB)

The base substrate of heavy copper PCB can be FR4 material or aluminum, instead of copper base. This is a significant difference between copper pcb and heavy copper pcb. Heavy copper normally used for a various product but not limited to: high power distribution, bas bur, planar transformers, power convertors, and so on. Due to it enables to carry high current and provide high power, people also called it power supply PCB and high-power PCB.

Differences Between Copper PCB and Heavy Copper PCB?

Except the structural composition, there are still some other differences between the copper core circuit board and heavy copper board. Let’s dive into together.

Copper Thickness

Copper core PCBs typically have thinner copper traces, whereas Heavy Copper PCBs have significantly thicker copper layers. If the trace width is certain, increasing the copper thickness is equivalent to increasing the section area of the circuit, so that it can carry more current.

Current-Carrying Capacity

Copper-based circuit boards are suitable for low to medium current applications. In contrast, Heavy Copper PCBs have thicker copper layers, which enables to handle higher currents without overheating. That’s why it is recommended heavy copper circuit board for high power electronics and high-power applications such as electric car.

Heat Dissipation

Actually, both of them are good in heat dissipation capabilities. But due to the copper clad circuit board is made by copper base, while heavy copper printed circuit board uses epoxy resin or aluminum as the base material, copper core PCB is superior to heavy copper PCB in heat dissipation. So, if your application requires better heat transfer but no need to carry higher power, copper core board is the go-to-choice.

Cost Effective

Among the various metal core PCBs, copper core PCB is the most expensive since the copper core itself is expensive, around 6-7 times than the aluminum core PCB.

Heavy copper PCB also is expensive since it has complex manufacturing processes and thick copper layers. But its price mainly depends on how thick copper thickness it needs. So comprehensive consideration, heavy copper pcb is the most cost-effective.

Applications

Copper PCBs are well-suited for smaller consumer electronics, where cost is a significant factor, and heat generation is minimal.

Heavy Copper PCBs are used in power electronics, automotive applications, and industrial equipment, where high current handling and heat management are essential.

Choosing the Right PCB for Your Project

When choosing between Copper Core PCBs and Power Supply PCBs, consider the following factors:

  • Your project’s power requirements
  • Thermal management needs
  • Budget constraints
  • Durability and expected lifespan

By evaluating these aspects, you can make an informed decision on which type of PCB is the best fit for your project.

In summary, the choice between Copper PCBs and Heavy Copper PCBs depends on the specific requirements of your electronic project. Copper PCBs are suitable for low to medium current applications with minimal heat generation. On the other hand, Heavy Copper PCBs offer higher current-carrying capacity and superior heat dissipation, making them ideal for high-power applications. Assess your project’s needs carefully to determine which type of PCB will serve you best.

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Do You Know Who Is the King Among the Metal Core PCBs?
Saturday, October 14th, 2023

Have you ever encountered these problems: your LED beads overheat, lose brightness, and shorten their lifespan? Have you ever thought of using a better PCB material to solve these problems?

If you are considering this question and your answer is yes, then you must learn about thermal-electric separation copper PCB, the king of Metal Core PCB (MCPCB), which can make your LED lamps achieve unprecedented effects.

What is Metal Core PCB?

It is a type of printed circuit board that uses metal material as the heat dissipation layer, commonly used in LED and other high-power electronic products. There are many types of metal core PCB, among which the most common one is aluminum PCB, which has a thermal conductivity of about 1W, suitable for low-power LED lamps.

However, with the development of high-power electronic products and high-frequency PCBs, aluminum PCBs can no longer meet the requirements of heat dissipation and volume. Therefore, more and more products choose copper PCB, which has a thermal conductivity of up to 400W, 400 times that of aluminum PCB. But ordinary copper PCB also has a drawback, that is, its circuit layer and heat layer are on the same layer, which requires connecting the beads and the heat layer through an insulating thermal conductive material, which will reduce the thermal efficiency. To solve this problem, a more advanced copper PCB structure has emerged, called thermal-electric separation copper PCB or SinkPad PCB.

(Thermal_electric_separation_copper_pcb)

Introduction to Thermal-electric Separation Copper PCB

The feature of thermal-electric separation copper PCB is that its circuit layer and heat layer are on different layers so that the beads can directly contact the heat layer, achieving zero thermal resistance heat dissipation. This structure can greatly improve the luminous efficiency and lifespan of the beads, and reduce light decay and heating. Thermal-electric separation copper PCB is very suitable for single high-power beads, especially the COB package, which can make the lamp achieve better effects. In addition, thermal-electric separation copper PCB can also be made into different shapes and structures according to different design needs, such as copper protrusions, copper recesses, parallel heat dissipation, etc.

Below is the structure diagram of ordinary copper PCB and copper substrate bump thermoelectric separation as an example to give you a more intuitive understanding of the advantages of thermoelectric separation copper substrate processing technology.

(Diagram_structure_comprasion)

From the ordinary copper PCB diagram on the left, it can be seen that the heat dissipation needs to pass through the insulating and thermally conductive material (purple part in the picture), which is more convenient to process. However, after passing through the insulating and thermally conductive material, the thermal conductivity is not so good. This kind of suitable for low-power LED lights, which is enough.

If the heat dissipation requirements are very large on automotive LED lamp beads or high-frequency PCBs, both normal aluminum PCB and copper core PCB cannot meet the requirements. It is common to use thermoelectric separation of copper substrates. Because the circuit trace and thermal layer are on the different layers, the thermal layer part directly contacts the LED beads (as shown on the right side of the picture above) to achieve the best heat dissipation (zero thermal resistance) effect.

Besides, there are also many various surface treatment options for the thermal electric separation copper PCB, such as OSP, immersion gold, ENIG, immersion silver, silver plating, ENEPIG, etc. It can be carried out according to different needs, and the surface treatment layer and lifespan are reliable.

Who Can Make Thermal-electric Separation Copper PCB for You?

When you are considering to sample or order thermal-electric separation copper PCBs, it is recommended to choose Best Technology. Best team is a professional PCB manufacturer who specializes in PCB manufacturing for over 17 years of experience and provides excellent before and after-sales service. Now, Best Technology highly recommends thermal-electric separation copper PCB for you, and the price is very favorable right now. And we promise that we will make satisfactory thermal-electric separation copper PCB for you with the fastest speed and the highest quality. This is what we are proud of.

If you have any questions or comments about thermal-electric separation copper PCB or more information about our company, please feel free to contact us or e-mail us at sales@bestpcbs.com. We will serve you wholeheartedly.

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What Is Ceramic Metallization Technology? – Series 1
Saturday, October 7th, 2023

Due to the different surface structures of ceramic susbtrates and metal materials, welding/soldering often cannot wet the ceramic surface or form a strong bond with it. Therefore, the joining of ceramics and metals is a special process, which called as metallization.

What Ceramic Metallization Technology Is?

Ceramic metallization refers to the process of firmly attaching a thin layer of metal film to the surface of a ceramic material to achieve a bond between the ceramic and metal. There are various methods for ceramic metallization, commonly including molybdenum-manganese (Mo-Mn) method, directly copper plate (DPC), directly bonded copper (DBC), active metal brazed (AMB) method and more.

Which Ceramics Can Be Used Metallization Technology?

At present, there are four common ceramic substrates that always used for metallization, they are BeO, Al2O3, AlN and Si3O4. But different ceramic has different characteristics, so its metallization method also is different.

  • BeO Ceramic

The most common method for metallizing BeO ceramics is the Mo-Mn method. This involves applying a paste-like mixture of pure metal powders (Mo, Mn) and metal oxides to the ceramic surface, followed by high-temperature heating in a furnace to form a metal layer.

  • Al2O3 Ceramic

The primary metallization methods for Al2O3 ceramics are DBC and DPC. This method involves placing a treated copper foil on the surface of Al2O3 ceramics, introducing an inert gas with a certain oxygen content, and then heating. During heating, the copper surface undergoes oxidation, and when the temperature reaches the eutectic liquid phase region, a eutectic liquid phase is formed, wetting both Al2O3 ceramics and copper, achieving a tight bond. In a chemical sense, the adhesion used by DBC is stronger than DPC since it has thicker copper.

  • AlN Ceramic

Common methods for AlN ceramics include DBC and Active Metal Brazing (AMB). DBC is similar to the method used for Al2O3 ceramics but requires pre-oxidation treatment of AlN ceramics since AlN is a non-oxide ceramic. AMB involves connecting AlN ceramics and copper foils using active metal brazing materials, often Ag-Cu-Ti alloys.

  • Si3N4 Ceramic

Si3N4 ceramics cannot be directly metallized using the direct copper plating method because they do not generate an oxide layer on the surface like AlN ceramics. Si3N4 ceramics are typically connected to metals using the AMB method, where chemical reactions between Si3N4 and active metals (Ti, Cr, V) form continuous nitride layers at the interface.

What is the Metallization Temperature?

During the metallization process, the sinter temperature should be controlled strictly. Normally, it can be divided into four ranges:

  • Ultra-High Temperature (Above 1600°C):

This temperature range is reserved for specific applications where extreme heat resistance is required.

  • High Temperature (1450°C to 1600°C):

High temperatures are essential to ensure that the glass phase spreads and migrates effectively, enabling a strong bond. However, excessively high temperatures can lead to reduced metallization strength.

  • Mid-Temperature (1300°C to 1450°C):

This range is chosen to balance the need for effective metallization with the preservation of material properties.

  • Low Temperature (Below 1300°C):

Lower temperatures are used when the primary concern is avoiding thermal stress on the materials involved.

Proper high sintering temperature is necessary, otherwise, the glass phase will not spread and migrate. But if the temperature is too high, the metallization strength will be poor. So, choose a suitable temperature is important to make sure the metallization effective.

This is all the information about metallization technology, in our next blog, we will delve into what factors will affect the metallization. If you are interested in metallization or other technologies about ceramic circuit boards, please leave your message and keep your eyes in Best Technology website.

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What Is The Difference Between Thin Film and Thick Film Ceramic PCBs?
Monday, September 25th, 2023

We know due to the rapid development of electronic devices, Ceramic circuit boards have gradually developed into an ideal packaging substrate for a new generation of integrated circuits and power electronic modules. Among them, thick film ceramic substrate and thin film ceramic PCB are the most popular ceramics that be used in package, because they are made by metallization process.

Why use film technology?

Compared with three-dimensional ceramic materials, film has relatively thin thickness and small size, it can be regarded as a two-dimensional structure. Thick film is made by printing process, the thick film can be made independently and the thickness is usually 10~25μm. Thin film is formed by the composition of the conductor materials and it was sputtering on the ceramic substrate directly. Normally the thickness of thin film is equal or less than 1μm. If the metallization thickness between 1μm to 10μm, then we called it as Directly Plated Copper (DPC) ceramic circuit board.

(ceramic_pcb_with_green_glass_glaze)

Thick Film Technology

Thick film technology is a method of direct deposition of slurry on substrate through screen printing technology, and sintering at high temperature to form conductive traces and electrodes. After the material is sinter at high temperature, it will form a strong adhesion film on the ceramic circuit board, and after repeated many times, it will form a multi-layer interconnected ceramic circuit board with resistor or capacitor. The thick film manufacturing process is more easier than thin film.

(Simply_process_for_thick_film_ceramic)

Thin Film Technology

Thin film ceramic PCB is a chip manufacture technology, which is the main method of metal film deposition in microelectronics fabrication. It was made through evaporation and PVD process firstly to deposited a 200-500nm copper layer as the seed layer. Then using electroplating process to increase the copper foil to required thickness. Finally through stripping and etching to generate the circuits. Thin film ceramic circuit is widely used in LED package fields because its fine traces, high accuracy and heat dissipation.

(Manufacturing_process_of_thin_film_ceramic)

Thin film and Thick film ceramic PCB comparison

In addition to the technology manufacturing difference, their performance and limitations also is different. Here we summarized in below table:

TechnologyThick FilmThin Film
Conductor thick10-25um<=1um
Manufacture processScreen printing, sinterPVD, DES
TCR(50-300) *10-6/C(0-50) *10-6/C
CostRelatively LowHigh for prototype
Line widthThicker line widthFine traces, suitable for RF
Bonding abilityNot suitable for bondingGood for wire bonding
ResistanceAvailableNeed mount resistors
Solder maskAvailableAvailable

Application difference between Thin film and Thick film ceramic PCB

The applications of thin film and thick film also are different because of their different features. Thick film ceramics are widely used in high power devices such as automotive field, power electronics, aerospace due to its ability to handle high current and voltage. Thick film enables to provide excellent thermal management and can dissipation heat effectively. Thin film ceramic PCBs trend to micro-electronics and RF devices because of its fine lines, low resistance, and high-frequency performance.

Each technology has its unique advantages and limitations, it needs to be properly used to make it suitable for different electronic devices and industries. Choose the right ceramic PCB substrate for laymen is a big challenge, so seeking for a reliable supplier is important. Best Technology engaging ceramic circuit board manufacturing for over 10 years. And our core engineering team are deep in this industry for more than 20 years, we are so confident that we can provide the best solution for you. If you are interested in this, welcome to contact us at sales@bestpcbs.com.

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What is Bus Bar PCBs in the Electronics Landscape?
Friday, September 22nd, 2023

Bus Bar PCBs are a specialized type of printed circuit board (PCB) that stand out from traditional PCBs due to their integrated conductive bus bars. These bus bars are typically made of copper or aluminum and are positioned on the surface or within the PCB. They serve the purpose of connecting electronic components, devices, or connectors and transmitting electrical currents.

Key Characteristics:

Outstanding Heat Dissipation:

Bus Bar PCBs are renowned for their exceptional heat dissipation capabilities. The integrated conductive bus bars efficiently conduct and dissipate the heat generated within the circuit, making them an ideal choice for high-power applications. Whether it’s in industrial electronics, electric vehicles, or solar inverters, this characteristic ensures that electronic components stay cool, enhancing overall system reliability.

Compact Space Utilization:

Space is often a precious resource in electronic devices. Bus Bar PCBs optimize space utilization through their integrated conductive bus bars. Unlike traditional wiring systems that can be space-consuming, Bus Bar PCBs save space, reducing the overall footprint of electronic systems.

Enhanced Electrical Performance:

The integration of conductive bus bars reduces the overall resistance and inductance of the circuit, resulting in improved electrical performance. Lower resistance translates to reduced power loss, while decreased inductance facilitates faster signal propagation. This, in turn, leads to higher efficiency and improved signal integrity.

Conclusion:

Bus Bar PCBs represent a force of innovation in the field of electronics, with their exceptional heat dissipation, space-saving design, and enhanced electrical performance making them highly favored across a multitude of applications. As technology continues to advance, Bus Bar PCBs are expected to play an increasingly pivotal role in the design and manufacturing of electronic systems.

If you have any interest in Bus Bar PCBs or any related requirements, please feel free to contact us. We have been in the field of heavy copper PCB manufacturing and bus bar PCB manufacturing more than 17 years. We are committed to providing you with outstanding products and services. Let’s explore the limitless possibilities of Bus Bar PCBs together, bringing innovation and success to your projects!

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Why do ceramic substrates contribute to the breakthrough of 905nm lidar technology?
Friday, September 1st, 2023

LiDAR (Light Detection And Ranging, referred to as “LiDAR”) measurement is a system that integrates three technologies: laser, GPS (Global Positioning System), and IMU (Inertial Measurement Unit, inertial measurement unit), used to obtain data and Generate accurate DEMs (Digital Elevation Models). The combination of these three technologies can highly accurately locate the spot of the laser beam on the object, and the ranging accuracy can reach the centimeter level. The biggest advantage of lidar is accurate, fast, and efficient operation.

Lidar is currently widely used in the field of driverless cars and robots. It is known as the “eye” of a generalized robot. It is an active measurement device that measures the precise distance between an object and a sensor by emitting laser light.

  As an indispensable sensor for L3 and above automatic driving, lidar has significantly improved the reliability of the automatic driving system with its excellent ranging capability, high angular resolution and sensitivity to ambient light, and has become the key to improving reliability. A key element of autonomous driving systems, but its application is constrained by cost and technical challenges.

  In the past, lidar was difficult to apply to mass-produced vehicles due to its high cost. However, recently, with the continuous evolution of technology and market competition, the cost of lidar has gradually decreased, thereby accelerating its application in the field of autonomous driving.

In this evolution process, the emergence of ceramic substrates has played a vital role in the breakthrough of lidar technology – 905nm wavelength lidar has become mainstream. Traditional materials such as FR-4 and FE-3 are difficult to meet the high heat dissipation requirements of lidar, while ceramic substrates rely on their excellent thermal conductivity. For example, the thermal conductivity of aluminum nitride ceramic substrates is as high as 200W/M.K. It effectively solves the heat dissipation problem and provides a guarantee for the stability and life of the lidar.

In lidar, the transmitter is one of the links with the highest value and the highest barriers. On the transmitter side, with the rise of China’s domestic industrial chain and the adjustment of the overall technical route of the industry, among them, 905nm VCSEL laser chips and other products have achieved breakthroughs in the market and become a hot topic in the industry.

The “heart” of the transmitter is the light source. Laser transmitter is the core component of laser technology, and its composition includes laser working medium, excitation source and resonant cavity. In this system, why choose a ceramic substrate as a component? The main reason lies in its unique advantages in heat dissipation. Especially for VCSEL (Vertical Cavity Surface Emitting Laser) chips, due to their low power conversion efficiency, the problem of heat dissipation is particularly prominent. The application of ceramic substrates has become the best choice to solve the problem of thermoelectric separation.

The ceramic substrate has excellent heat dissipation performance and can effectively conduct the heat generated inside the laser transmitter. The high thermal conductivity of the ceramic substrate allows it to efficiently conduct heat generated inside the lidar, preventing performance degradation due to overheating. In addition, ceramic materials have the advantages of high strength, hardness, thermal shock resistance, insulation, and chemical stability, which can further extend the service life of products, improve sensitivity, and enhance the response speed of lidar.

Ceramic substrates also enable high-density assembly, supporting miniaturization and integration of devices. Its stability ensures that the sensor signal is not distorted, and the matching with the thermal expansion coefficient of the chip ensures the reliability of the product in harsh environments such as high temperature, high vibration, and corrosion. In addition, the metal crystallization performance of the ceramic substrate is excellent, which ensures the stability of the circuit and further improves the quality control level of the lidar.

As a leading manufacturer of ceramic substrates, Best Technology provides a variety of ceramic substrates of different materials, including 96% alumina, 99% alumina, aluminum nitride, zirconia, silicon nitride, sapphire ceramic bases, etc. The heat dissipation properties of these different materials are different, such as aluminum nitride (AlN): thermal conductivity of 170-230 W/mK, silicon nitride (Si3N4): thermal conductivity of 20-80 W/mK, sapphire (Al2O3): thermal conductivity Coefficient 25-40W/mK.

Therefore, choosing a high-quality ceramic substrate not only helps to solve the problem of thermal and electrical separation of laser emitters, but also provides stable heat dissipation and electrical performance, providing reliable support for efficient operation and performance improvement of laser emitters. In the development of lidar technology, ceramic substrates play an increasingly important role, providing key support for performance breakthroughs and innovations in laser transmitters. We are witnessing a revolution in the auto industry brought about by China’s autonomous driving assistance systems.

If you are designing a ceramic PCB and seeking a reliable manufacturer, welcome to leave you message or contact us directly.

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What You Know About Counterbores in PCB Design and Manufacturing
Friday, August 18th, 2023

In the world of design and manufacturing, precision is paramount. Every detail, down to the placement of a single component, can impact the performance and appearance of a product. This is where the concept of counterbores comes into play, a technique employed in various industries to create recessed areas for components or fasteners.

But firstly, what is counterbore?  Today we will show you the definition and applications of the countersink in a PCB design. 

Definition and Applications:

A counterbore is a cylindrical, flat-bottomed hole that is strategically cut into a material to accommodate specific components or fasteners. It is commonly used in various industries, including woodworking, metalworking, and mechanical engineering. The purpose of a counterbore is to create a recessed area where a component, such as a bolt head, nut, or other hardware, can sit flush with or below the surface of the material. This technique ensures a smooth appearance, prevents interference with other components, and provides mechanical stability.

Counterbores in PCB Design and Manufacturing

In the realm of printed circuit boards (PCBs), counterbores play a crucial role in achieving efficient and functional designs. PCBs are essential components in electronic devices, and their design requires careful consideration of component placement, connectivity, and mechanical stability. Counterbores in PCBs serve several important functions:

  1. Component Alignment and Clearance:  Certain components on a PCB, such as connectors, switches, or specialized modules, require precise alignment and clearance for optimal functionality. A counterbore can be introduced to create a recessed area that accommodates these components, ensuring proper alignment with neighboring components and minimizing the risk of interference.
  • Flush Mounting: To maintain a sleek and compact design, some components need to be mounted flush with the surface of the PCB. A counterbore creates a flat-bottomed recess that allows the component to sit at the same level as the PCB surface, contributing to an aesthetically pleasing and functional layout.
(Counterbore_hole_in_heavy_copper_PCB)
  • Mechanical Support: Components that are susceptible to mechanical stress or impact may benefit from additional support. By incorporating a counterbore, the PCB design can provide a more secure location for these components, reducing the risk of damage.
  • Heat Dissipation Enhancement: In applications where certain components generate significant heat, such as power amplifiers or processors, heat sinks are often employed to dissipate the heat. A counterbore can facilitate proper alignment and contact between the heat sink and the component, optimizing heat transfer and overall thermal performance.
(Detail_counterbore_hole)

The production of counterbores in PCBs involves specialized manufacturing techniques. BEST Technology as a professional PCB manufacturer, we will use precision drilling and routing equipment to create accurately sized and positioned counterbores.

If you want to know more about the counterbores, welcome to follow our post or contact us.

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