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Do You Know Who Is the King Among the Metal Core PCBs?
星期六, 14 10 月, 2023

Have you ever encountered these problems: your LED beads overheat, lose brightness, and shorten their lifespan? Have you ever thought of using a better PCB material to solve these problems?

If you are considering this question and your answer is yes, then you must learn about thermal-electric separation copper PCB, the king of Metal Core PCB (MCPCB), which can make your LED lamps achieve unprecedented effects.

What is Metal Core PCB?

It is a type of printed circuit board that uses metal material as the heat dissipation layer, commonly used in LED and other high-power electronic products. There are many types of metal core PCB, among which the most common one is aluminum PCB, which has a thermal conductivity of about 1W, suitable for low-power LED lamps.

However, with the development of high-power electronic products and high-frequency PCBs, aluminum PCBs can no longer meet the requirements of heat dissipation and volume. Therefore, more and more products choose copper PCB, which has a thermal conductivity of up to 400W, 400 times that of aluminum PCB. But ordinary copper PCB also has a drawback, that is, its circuit layer and heat layer are on the same layer, which requires connecting the beads and the heat layer through an insulating thermal conductive material, which will reduce the thermal efficiency. To solve this problem, a more advanced copper PCB structure has emerged, called thermal-electric separation copper PCB or SinkPad PCB.

(Thermal_electric_separation_copper_pcb)

Introduction to Thermal-electric Separation Copper PCB

The feature of thermal-electric separation copper PCB is that its circuit layer and heat layer are on different layers so that the beads can directly contact the heat layer, achieving zero thermal resistance heat dissipation. This structure can greatly improve the luminous efficiency and lifespan of the beads, and reduce light decay and heating. Thermal-electric separation copper PCB is very suitable for single high-power beads, especially the COB package, which can make the lamp achieve better effects. In addition, thermal-electric separation copper PCB can also be made into different shapes and structures according to different design needs, such as copper protrusions, copper recesses, parallel heat dissipation, etc.

Below is the structure diagram of ordinary copper PCB and copper substrate bump thermoelectric separation as an example to give you a more intuitive understanding of the advantages of thermoelectric separation copper substrate processing technology.

(Diagram_structure_comprasion)

From the ordinary copper PCB diagram on the left, it can be seen that the heat dissipation needs to pass through the insulating and thermally conductive material (purple part in the picture), which is more convenient to process. However, after passing through the insulating and thermally conductive material, the thermal conductivity is not so good. This kind of suitable for low-power LED lights, which is enough.

If the heat dissipation requirements are very large on automotive LED lamp beads or high-frequency PCBs, both normal aluminum PCB and copper core PCB cannot meet the requirements. It is common to use thermoelectric separation of copper substrates. Because the circuit trace and thermal layer are on the different layers, the thermal layer part directly contacts the LED beads (as shown on the right side of the picture above) to achieve the best heat dissipation (zero thermal resistance) effect.

Besides, there are also many various surface treatment options for the thermal electric separation copper PCB, such as OSP, immersion gold, ENIG, immersion silver, silver plating, ENEPIG, etc. It can be carried out according to different needs, and the surface treatment layer and lifespan are reliable.

Who Can Make Thermal-electric Separation Copper PCB for You?

When you are considering to sample or order thermal-electric separation copper PCBs, it is recommended to choose Best Technology. Best team is a professional PCB manufacturer who specializes in PCB manufacturing for over 17 years of experience and provides excellent before and after-sales service. Now, Best Technology highly recommends thermal-electric separation copper PCB for you, and the price is very favorable right now. And we promise that we will make satisfactory thermal-electric separation copper PCB for you with the fastest speed and the highest quality. This is what we are proud of.

If you have any questions or comments about thermal-electric separation copper PCB or more information about our company, please feel free to contact us or e-mail us at sales@bestpcbs.com. We will serve you wholeheartedly.

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What Is Ceramic Metallization Technology? – Series 1
星期六, 7 10 月, 2023

Due to the different surface structures of ceramic susbtrates and metal materials, welding/soldering often cannot wet the ceramic surface or form a strong bond with it. Therefore, the joining of ceramics and metals is a special process, which called as metallization.

What Ceramic Metallization Technology Is?

Ceramic metallization refers to the process of firmly attaching a thin layer of metal film to the surface of a ceramic material to achieve a bond between the ceramic and metal. There are various methods for ceramic metallization, commonly including molybdenum-manganese (Mo-Mn) method, directly copper plate (DPC), directly bonded copper (DBC), active metal brazed (AMB) method and more.

Which Ceramics Can Be Used Metallization Technology?

At present, there are four common ceramic substrates that always used for metallization, they are BeO, Al2O3, AlN and Si3O4. But different ceramic has different characteristics, so its metallization method also is different.

  • BeO Ceramic

The most common method for metallizing BeO ceramics is the Mo-Mn method. This involves applying a paste-like mixture of pure metal powders (Mo, Mn) and metal oxides to the ceramic surface, followed by high-temperature heating in a furnace to form a metal layer.

  • Al2O3 Ceramic

The primary metallization methods for Al2O3 ceramics are DBC and DPC. This method involves placing a treated copper foil on the surface of Al2O3 ceramics, introducing an inert gas with a certain oxygen content, and then heating. During heating, the copper surface undergoes oxidation, and when the temperature reaches the eutectic liquid phase region, a eutectic liquid phase is formed, wetting both Al2O3 ceramics and copper, achieving a tight bond. In a chemical sense, the adhesion used by DBC is stronger than DPC since it has thicker copper.

  • AlN Ceramic

Common methods for AlN ceramics include DBC and Active Metal Brazing (AMB). DBC is similar to the method used for Al2O3 ceramics but requires pre-oxidation treatment of AlN ceramics since AlN is a non-oxide ceramic. AMB involves connecting AlN ceramics and copper foils using active metal brazing materials, often Ag-Cu-Ti alloys.

  • Si3N4 Ceramic

Si3N4 ceramics cannot be directly metallized using the direct copper plating method because they do not generate an oxide layer on the surface like AlN ceramics. Si3N4 ceramics are typically connected to metals using the AMB method, where chemical reactions between Si3N4 and active metals (Ti, Cr, V) form continuous nitride layers at the interface.

What is the Metallization Temperature?

During the metallization process, the sinter temperature should be controlled strictly. Normally, it can be divided into four ranges:

  • Ultra-High Temperature (Above 1600°C):

This temperature range is reserved for specific applications where extreme heat resistance is required.

  • High Temperature (1450°C to 1600°C):

High temperatures are essential to ensure that the glass phase spreads and migrates effectively, enabling a strong bond. However, excessively high temperatures can lead to reduced metallization strength.

  • Mid-Temperature (1300°C to 1450°C):

This range is chosen to balance the need for effective metallization with the preservation of material properties.

  • Low Temperature (Below 1300°C):

Lower temperatures are used when the primary concern is avoiding thermal stress on the materials involved.

Proper high sintering temperature is necessary, otherwise, the glass phase will not spread and migrate. But if the temperature is too high, the metallization strength will be poor. So, choose a suitable temperature is important to make sure the metallization effective.

This is all the information about metallization technology, in our next blog, we will delve into what factors will affect the metallization. If you are interested in metallization or other technologies about ceramic circuit boards, please leave your message and keep your eyes in Best Technology website.

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What Is The Difference Between Thin Film and Thick Film Ceramic PCBs?
星期一, 25 9 月, 2023

We know due to the rapid development of electronic devices, Ceramic circuit boards have gradually developed into an ideal packaging substrate for a new generation of integrated circuits and power electronic modules. Among them, thick film ceramic substrate and thin film ceramic PCB are the most popular ceramics that be used in package, because they are made by metallization process.

Why use film technology?

Compared with three-dimensional ceramic materials, film has relatively thin thickness and small size, it can be regarded as a two-dimensional structure. Thick film is made by printing process, the thick film can be made independently and the thickness is usually 10~25μm. Thin film is formed by the composition of the conductor materials and it was sputtering on the ceramic substrate directly. Normally the thickness of thin film is equal or less than 1μm. If the metallization thickness between 1μm to 10μm, then we called it as Directly Plated Copper (DPC) ceramic circuit board.

(ceramic_pcb_with_green_glass_glaze)

Thick Film Technology

Thick film technology is a method of direct deposition of slurry on substrate through screen printing technology, and sintering at high temperature to form conductive traces and electrodes. After the material is sinter at high temperature, it will form a strong adhesion film on the ceramic circuit board, and after repeated many times, it will form a multi-layer interconnected ceramic circuit board with resistor or capacitor. The thick film manufacturing process is more easier than thin film.

(Simply_process_for_thick_film_ceramic)

Thin Film Technology

Thin film ceramic PCB is a chip manufacture technology, which is the main method of metal film deposition in microelectronics fabrication. It was made through evaporation and PVD process firstly to deposited a 200-500nm copper layer as the seed layer. Then using electroplating process to increase the copper foil to required thickness. Finally through stripping and etching to generate the circuits. Thin film ceramic circuit is widely used in LED package fields because its fine traces, high accuracy and heat dissipation.

(Manufacturing_process_of_thin_film_ceramic)

Thin film and Thick film ceramic PCB comparison

In addition to the technology manufacturing difference, their performance and limitations also is different. Here we summarized in below table:

TechnologyThick FilmThin Film
Conductor thick10-25um<=1um
Manufacture processScreen printing, sinterPVD, DES
TCR(50-300) *10-6/C(0-50) *10-6/C
CostRelatively LowHigh for prototype
Line widthThicker line widthFine traces, suitable for RF
Bonding abilityNot suitable for bondingGood for wire bonding
ResistanceAvailableNeed mount resistors
Solder maskAvailableAvailable

Application difference between Thin film and Thick film ceramic PCB

The applications of thin film and thick film also are different because of their different features. Thick film ceramics are widely used in high power devices such as automotive field, power electronics, aerospace due to its ability to handle high current and voltage. Thick film enables to provide excellent thermal management and can dissipation heat effectively. Thin film ceramic PCBs trend to micro-electronics and RF devices because of its fine lines, low resistance, and high-frequency performance.

Each technology has its unique advantages and limitations, it needs to be properly used to make it suitable for different electronic devices and industries. Choose the right ceramic PCB substrate for laymen is a big challenge, so seeking for a reliable supplier is important. Best Technology engaging ceramic circuit board manufacturing for over 10 years. And our core engineering team are deep in this industry for more than 20 years, we are so confident that we can provide the best solution for you. If you are interested in this, welcome to contact us at sales@bestpcbs.com.

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What is Bus Bar PCBs in the Electronics Landscape?
星期五, 22 9 月, 2023

Bus Bar PCBs are a specialized type of printed circuit board (PCB) that stand out from traditional PCBs due to their integrated conductive bus bars. These bus bars are typically made of copper or aluminum and are positioned on the surface or within the PCB. They serve the purpose of connecting electronic components, devices, or connectors and transmitting electrical currents.

Key Characteristics:

Outstanding Heat Dissipation:

Bus Bar PCBs are renowned for their exceptional heat dissipation capabilities. The integrated conductive bus bars efficiently conduct and dissipate the heat generated within the circuit, making them an ideal choice for high-power applications. Whether it’s in industrial electronics, electric vehicles, or solar inverters, this characteristic ensures that electronic components stay cool, enhancing overall system reliability.

Compact Space Utilization:

Space is often a precious resource in electronic devices. Bus Bar PCBs optimize space utilization through their integrated conductive bus bars. Unlike traditional wiring systems that can be space-consuming, Bus Bar PCBs save space, reducing the overall footprint of electronic systems.

Enhanced Electrical Performance:

The integration of conductive bus bars reduces the overall resistance and inductance of the circuit, resulting in improved electrical performance. Lower resistance translates to reduced power loss, while decreased inductance facilitates faster signal propagation. This, in turn, leads to higher efficiency and improved signal integrity.

Conclusion:

Bus Bar PCBs represent a force of innovation in the field of electronics, with their exceptional heat dissipation, space-saving design, and enhanced electrical performance making them highly favored across a multitude of applications. As technology continues to advance, Bus Bar PCBs are expected to play an increasingly pivotal role in the design and manufacturing of electronic systems.

If you have any interest in Bus Bar PCBs or any related requirements, please feel free to contact us. We have been in the field of heavy copper PCB manufacturing and bus bar PCB manufacturing more than 17 years. We are committed to providing you with outstanding products and services. Let’s explore the limitless possibilities of Bus Bar PCBs together, bringing innovation and success to your projects!

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Why do ceramic substrates contribute to the breakthrough of 905nm lidar technology?
星期五, 1 9 月, 2023

LiDAR (Light Detection And Ranging, referred to as “LiDAR”) measurement is a system that integrates three technologies: laser, GPS (Global Positioning System), and IMU (Inertial Measurement Unit, inertial measurement unit), used to obtain data and Generate accurate DEMs (Digital Elevation Models). The combination of these three technologies can highly accurately locate the spot of the laser beam on the object, and the ranging accuracy can reach the centimeter level. The biggest advantage of lidar is accurate, fast, and efficient operation.

Lidar is currently widely used in the field of driverless cars and robots. It is known as the “eye” of a generalized robot. It is an active measurement device that measures the precise distance between an object and a sensor by emitting laser light.

  As an indispensable sensor for L3 and above automatic driving, lidar has significantly improved the reliability of the automatic driving system with its excellent ranging capability, high angular resolution and sensitivity to ambient light, and has become the key to improving reliability. A key element of autonomous driving systems, but its application is constrained by cost and technical challenges.

  In the past, lidar was difficult to apply to mass-produced vehicles due to its high cost. However, recently, with the continuous evolution of technology and market competition, the cost of lidar has gradually decreased, thereby accelerating its application in the field of autonomous driving.

In this evolution process, the emergence of ceramic substrates has played a vital role in the breakthrough of lidar technology – 905nm wavelength lidar has become mainstream. Traditional materials such as FR-4 and FE-3 are difficult to meet the high heat dissipation requirements of lidar, while ceramic substrates rely on their excellent thermal conductivity. For example, the thermal conductivity of aluminum nitride ceramic substrates is as high as 200W/M.K. It effectively solves the heat dissipation problem and provides a guarantee for the stability and life of the lidar.

In lidar, the transmitter is one of the links with the highest value and the highest barriers. On the transmitter side, with the rise of China’s domestic industrial chain and the adjustment of the overall technical route of the industry, among them, 905nm VCSEL laser chips and other products have achieved breakthroughs in the market and become a hot topic in the industry.

The “heart” of the transmitter is the light source. Laser transmitter is the core component of laser technology, and its composition includes laser working medium, excitation source and resonant cavity. In this system, why choose a ceramic substrate as a component? The main reason lies in its unique advantages in heat dissipation. Especially for VCSEL (Vertical Cavity Surface Emitting Laser) chips, due to their low power conversion efficiency, the problem of heat dissipation is particularly prominent. The application of ceramic substrates has become the best choice to solve the problem of thermoelectric separation.

The ceramic substrate has excellent heat dissipation performance and can effectively conduct the heat generated inside the laser transmitter. The high thermal conductivity of the ceramic substrate allows it to efficiently conduct heat generated inside the lidar, preventing performance degradation due to overheating. In addition, ceramic materials have the advantages of high strength, hardness, thermal shock resistance, insulation, and chemical stability, which can further extend the service life of products, improve sensitivity, and enhance the response speed of lidar.

Ceramic substrates also enable high-density assembly, supporting miniaturization and integration of devices. Its stability ensures that the sensor signal is not distorted, and the matching with the thermal expansion coefficient of the chip ensures the reliability of the product in harsh environments such as high temperature, high vibration, and corrosion. In addition, the metal crystallization performance of the ceramic substrate is excellent, which ensures the stability of the circuit and further improves the quality control level of the lidar.

As a leading manufacturer of ceramic substrates, Best Technology provides a variety of ceramic substrates of different materials, including 96% alumina, 99% alumina, aluminum nitride, zirconia, silicon nitride, sapphire ceramic bases, etc. The heat dissipation properties of these different materials are different, such as aluminum nitride (AlN): thermal conductivity of 170-230 W/mK, silicon nitride (Si3N4): thermal conductivity of 20-80 W/mK, sapphire (Al2O3): thermal conductivity Coefficient 25-40W/mK.

Therefore, choosing a high-quality ceramic substrate not only helps to solve the problem of thermal and electrical separation of laser emitters, but also provides stable heat dissipation and electrical performance, providing reliable support for efficient operation and performance improvement of laser emitters. In the development of lidar technology, ceramic substrates play an increasingly important role, providing key support for performance breakthroughs and innovations in laser transmitters. We are witnessing a revolution in the auto industry brought about by China’s autonomous driving assistance systems.

If you are designing a ceramic PCB and seeking a reliable manufacturer, welcome to leave you message or contact us directly.

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What You Know About Counterbores in PCB Design and Manufacturing
星期五, 18 8 月, 2023

In the world of design and manufacturing, precision is paramount. Every detail, down to the placement of a single component, can impact the performance and appearance of a product. This is where the concept of counterbores comes into play, a technique employed in various industries to create recessed areas for components or fasteners.

But firstly, what is counterbore?  Today we will show you the definition and applications of the countersink in a PCB design. 

Definition and Applications:

A counterbore is a cylindrical, flat-bottomed hole that is strategically cut into a material to accommodate specific components or fasteners. It is commonly used in various industries, including woodworking, metalworking, and mechanical engineering. The purpose of a counterbore is to create a recessed area where a component, such as a bolt head, nut, or other hardware, can sit flush with or below the surface of the material. This technique ensures a smooth appearance, prevents interference with other components, and provides mechanical stability.

Counterbores in PCB Design and Manufacturing

In the realm of printed circuit boards (PCBs), counterbores play a crucial role in achieving efficient and functional designs. PCBs are essential components in electronic devices, and their design requires careful consideration of component placement, connectivity, and mechanical stability. Counterbores in PCBs serve several important functions:

  1. Component Alignment and Clearance:  Certain components on a PCB, such as connectors, switches, or specialized modules, require precise alignment and clearance for optimal functionality. A counterbore can be introduced to create a recessed area that accommodates these components, ensuring proper alignment with neighboring components and minimizing the risk of interference.
  • Flush Mounting: To maintain a sleek and compact design, some components need to be mounted flush with the surface of the PCB. A counterbore creates a flat-bottomed recess that allows the component to sit at the same level as the PCB surface, contributing to an aesthetically pleasing and functional layout.
(Counterbore_hole_in_heavy_copper_PCB)
  • Mechanical Support: Components that are susceptible to mechanical stress or impact may benefit from additional support. By incorporating a counterbore, the PCB design can provide a more secure location for these components, reducing the risk of damage.
  • Heat Dissipation Enhancement: In applications where certain components generate significant heat, such as power amplifiers or processors, heat sinks are often employed to dissipate the heat. A counterbore can facilitate proper alignment and contact between the heat sink and the component, optimizing heat transfer and overall thermal performance.
(Detail_counterbore_hole)

The production of counterbores in PCBs involves specialized manufacturing techniques. BEST Technology as a professional PCB manufacturer, we will use precision drilling and routing equipment to create accurately sized and positioned counterbores.

If you want to know more about the counterbores, welcome to follow our post or contact us.

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Heavy Copper PCB for Industrial Power Supply
星期六, 29 7 月, 2023

All of us know the printed circuit board, but do you know what is the heavy copper PCB? Best Tech is a very experienced heavy copper PCB fabricator since year 2006. Heavy Copper PCB is a type of printed circuit board that features with thicker copper layers than standard FR4 PCBs. While conventional PCBs typically have copper thicknesses ranging from 1 to 3 ounces (per square foot), heavy copper PCBs have copper thicknesses exceeding 3 ounces and can go up to 20 or more ounces. These copper layers are typically found in the inner and outer layers of the PCB, heavy copper providing enhanced current-carrying capacity and improved heat dissipation capabilities.

The increased copper thickness in heavy copper PCBs allows them to handle higher currents without experiencing excessive heat buildup or voltage drops. This makes them well-suited for applications that require high power handling, such as industrial power supplies, power converters, motor drives, and automotive electronics. Heavy copper PCBs are designed to withstand harsh operating conditions and provide robust performance and reliability.

Today, we would like to talk about the heavy copper PCB used in Industrial Power Supply. In this blog post, we will explore the realm of Industrial Power Supply, delving into the design considerations, material selection, production challenges, exceptional heat dissipation, and unrivaled conductivity of Heavy Copper PCBs. Join us on this enthralling journey as we uncover the secrets behind their application in Industrial Power Supply scenarios, including the testing of inductance, capacitance, and resistance. Get ready to witness the power of Heavy Copper PCBs in the realm of Industrial Power Supply!

Firstly, before you are moving start for the design, it need to get to understand the Design guideline rules of heavy copper PCB.

From the guidelines of heavy copper PCB, it could get to know it encompass considerations such as trace width, trace spacing, and thermal relief patterns. The increased copper thickness necessitates wider traces to accommodate higher currents, while proper spacing is crucial to avoid thermal hotspots and ensure reliable operation. Additionally, selecting suitable materials with excellent mechanical strength and thermal properties is vital to ensure the robustness and longevity of Heavy Copper PCBs. Hope this will bring some ideas to you during your design.

Secondly, as a heavy cooper PCB manufacturing vendor, Best Tech would like to advise the Production Challenges for the heavy copper PCB.

During producing Heavy Copper PCBs presents manufacturers with a set of intricate challenges. Achieving uniform copper thickness across the board’s surface demands advanced plating techniques and precise control over process parameters. Careful attention must be given to the etching process to prevent over-etching, which can compromise the integrity of the copper layers. Moreover, the additional weight of copper requires a sturdy substrate to support the board’s structure. Manufacturers must navigate these challenges with expertise and precision to deliver high-quality Heavy Copper PCBs.

You may have a question in mind, why we need to use the heavy copper PCB for the Industrial Power Supply, because the heavy copper PCB have Exceptional Heat Dissipation and Conductivity: One of the standout features of Heavy Copper PCBs is their unrivaled heat dissipation capabilities. The increased copper thickness acts as a robust conductor, efficiently channeling heat away from power components. This exceptional heat dissipation prevents thermal stress and ensures the longevity and reliability of Industrial Power Supply systems. Additionally, the high conductivity of Heavy Copper PCBs enables efficient power transmission, reducing losses and improving overall system efficiency.

Furthermore, Heavy Copper PCBs undergo rigorous testing to ensure optimal performance in Industrial Power Supply applications. Inductance testing verifies the effectiveness of copper layers in reducing magnetic interference. Capacitance testing evaluates the ability of the PCB to store electrical energy, while resistance testing determines the conductivity and resistance of copper traces. These tests play a crucial role in validating the quality and performance of Heavy Copper PCBs in demanding power supply scenarios.

Heavy Copper PCBs find widespread applications in the field of Industrial Power Supply, particularly in the production of robust and efficient power control products. They are integral components in industrial power converters, motor drives, uninterruptible power supplies (UPS), and various automation systems. The exceptional heat dissipation and high current-carrying capacity of Heavy Copper PCBs make them ideal for handling the power demands of these applications, ensuring reliable and efficient power delivery.

Finally, in the world of Industrial Power Supply, Heavy Copper PCBs emerge as true powerhouses, combining meticulous design, advanced manufacturing processes, and exceptional heat dissipation capabilities. By adhering to design guidelines, overcoming production challenges, and conducting thorough testing, Heavy Copper PCBs prove their mettle in demanding power supply scenarios. As they continue to evolve, these powerhouses will shape the future of Industrial Power Supply, empowering systems with reliability, efficiency, and unrivaled performance. Prepare to witness the electrifying impact of Heavy Copper PCBs in the realm of Industrial Power Supply!

If you have more question heavy copper PCB for Industrial Power Supply, warmly welcomed to contact Best Tech for more get more information of heavy copper PCB which used in Industrial Power Supply. You can visit www.bestpcbs.com to know more about us.

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Exploring the Fascinating World of HDI PCBs
星期二, 6 6 月, 2023

In the ever-evolving realm of printed circuit boards (PCBs), High-Density Interconnect (HDI) technology stands out as a game-changer. HDI PCBs have revolutionized the electronics industry by enabling the creation of smaller, lighter, and more advanced electronic devices. In this blog, let us delve into the captivating world of HDI PCBs, exploring their unique processes and craftsmanship. We also attached some photos for your ref.

What is HDI PCB?

HDI PCBs, short for High-Density Interconnect PCBs, are a specialized type of circuit board designed to accommodate a higher number of components within a smaller footprint. Unlike traditional FR4 PCBs, HDI boards incorporate intricate designs and advanced manufacturing techniques to achieve denser routing and interconnections.

  • Miniaturization and Component Density

One of the standout features of HDI PCBs is their ability to achieve significant miniaturization. There are fine-pitch traces, microvias, blind and buried vias. You can see the below photo, there are many kinds of the vias.

HDI boards allow for more compact layouts and increased component density. This makes them ideal for applications where space is a premium, such as smartphones, tablets, wearables, and medical devices.

  • Advanced Manufacturing Techniques

Creating HDI PCBs involves a sophisticated blend of state-of-the-art manufacturing processes. These techniques include laser drilling, sequential lamination, and advanced imaging technologies. Laser drilling enables the creation of microvias, which are tiny holes used for interconnection between different layers of the board. Sequential lamination involves bonding multiple layers together, creating a compact stack-up with enhanced electrical performance. Advanced imaging technologies ensure precise alignment and accuracy during the fabrication process.

Benefits of HDI PCBs

HDI PCBs offer a multitude of advantages that make them highly sought after in today’s electronics industry:

1. Improved Signal Integrity: With their reduced parasitic effects and shorter signal paths, HDI boards provide superior signal integrity and enhanced electrical performance.

2. Increased Reliability: HDI PCBs minimize the risk of failures due to reduced interconnection lengths, better thermal management, and enhanced impedance control.

3. Enhanced Thermal Efficiency: The compact design of HDI boards allows for better heat dissipation and thermal management, ensuring optimal performance of heat-sensitive components.

4. Design Flexibility: HDI technology opens up new design possibilities, enabling engineers to create innovative and compact product designs without compromising on functionality.

Applications of HDI PCBs

The versatility of HDI PCBs makes them indispensable in various industries, including:

  • Consumer Electronics: Smartphones, tablets, laptops, and wearable devices.
  • Automotive Electronics: Advanced driver assistance systems (ADAS), infotainment systems, and autonomous driving technology.
  • Medical Devices: Miniature medical implants, diagnostic equipment, and patient monitoring systems.
  • Aerospace and Defense: Avionics, satellites, and military-grade electronics.
  • Industrial Automation: Robotics, control systems, and IoT devices.

We have many customers from various industries, the PCBs of the below photos are what we produced for our customers.

Conclusion

As technology advances, HDI PCBs will undoubtedly play a crucial role in driving innovation and pushing the boundaries of what is possible in the world of electronics.

We hope this exploration into the captivating world of HDI PCBs can make you know more about HDI PCB. If you’re interested in any HDI PCB, please feel free to contact us any time. Let us supply you an excellent solution and awesome boards for you.

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What is UVLED? Is MCPCB important for UVLED?
星期六, 3 6 月, 2023

UVLEDs, a subset of light-emitting diodes (LEDs), emit light within the ultraviolet spectrum instead of visible light like traditional LEDs. The UV spectrum is further divided into three main categories based on wavelength: UVA, UVB, and UVC. In this blog, we will explore the critical role of Metal Core Printed Circuit Board (MCPCB) in UVLED technology, highlighting its significance in improving efficiency, heat management, and overall lifespan.

UVA (315-400nm):

UVA, also known as near-ultraviolet, emits long-wave ultraviolet light. It is closest to the visible light spectrum and finds applications in UV curing, forensic analysis, counterfeit detection, tanning beds, and more.

UVB (280-315 nm):

UVB emits medium-wave ultraviolet light and is renowned for its biological effects. It is used in medical treatments, phototherapy, disinfection applications, and even for inducing vitamin D synthesis in the skin.

UVC (100-280 nm):

UVC emits short-wave ultraviolet light and possesses powerful germicidal properties. Its applications include water purification, air disinfection, surface sterilization, and eradication of bacteria, viruses, and other microorganisms.

UVLEDs typically operate within a temperature range of -40°C to 100°C (-40°F to 212°F). However, it is crucial to note that excessive heat can impact the performance, efficiency, and lifespan of UVLEDs. Therefore, appropriate thermal management techniques such as heat sinks, thermal pads, and adequate airflow are commonly employed to dissipate heat and keep UVLEDs within the optimal temperature range.

In conclusion, MCPCB plays a vital role in UVLED technology, offering essential advantages such as efficient heat dissipation, enhanced thermal conductivity, reliability in harsh environments, and electrical isolation. These qualities are paramount for maximizing UVLED performance, ensuring longevity, and maintaining optimal operating temperatures. The significance of MCPCB lies in its ability to enhance efficiency, improve heat management, and provide a reliable foundation for UVLED systems. Without MCPCB, UVLED applications would face challenges in heat dissipation, performance stability, and overall safety.

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Key Challenges in Solder Mask Printing for Heavy Copper PCBs
星期二, 23 5 月, 2023

As the demand for higher power and miniaturization of electronics increases, so does the need for Heavy Copper Printed Circuit Boards (PCBs). From our last blog – Why choose Heavy Copper PCB for your High Current Project, we know the heavy copper PCBs are defined as those with copper thicknesses greater than 3 oz. These PCBs are designed to withstand high current and thermal loads, making them suitable for power electronics applications. However, the increased copper thickness also poses challenges during the solder mask printing process.

(16_layers_heavy_copper_PCB_with_10oz_each_layer)

Understanding solder mask

Solder mask (short for S/M in the industry) is a protective coating applied to PCBs to prevent solder bridges and improve solder joint quality. The solder mask is coated to the PCB surface using a screen-printing process, where the desired pattern is created using a stencil and the solder mask ink is then deposited onto the PCB. The ink is then cured, either through heat baking or UV light, to form a solid coating.

There are several types of solder mask materials available, including epoxy, acrylic, and liquid photo imageable (LPI) solder mask. Each type has its advantages and disadvantages, depending on the application requirements.

The benefits of using solder mask in PCB manufacturing include increased reliability, improved solderability, and reduced risk of short circuits and corrosion. The solder mask we usually use is Taiyo, which has high reliability and excellent heat resistance.

(Solder_mask_manually_printing)

Challenges in solder mask printing of heavy copper PCBs

While solder mask printing is a critical step in PCB manufacturing, the increased copper thickness in heavy copper PCBs presents several challenges for printing process as I mentioned before. It’s difficult to apply enough solder mask to cover thick copper pattern and base material with severe height difference.

1. The high copper thickness and thermal conductivity of heavy copper PCBs make it difficult for the solder mask ink to adhere properly to the surface. This can result in insufficient coverage and registration accuracy, which can affect the overall quality and reliability of the PCB.

2. The high copper thickness can cause stress on the solder mask, leading to mask cracking and peeling. The navigation mark on the substrate has specific ink thickness requirements due to limitations in the ink thickness that can be applied to the substrate. If the ink thickness on the substrate is too thick, it may result in solder resist cracks in the substrate position after the printed circuit board is soldered. This can occur during reflow soldering or thermal cycling, resulting in poor solder joint quality and reduced reliability.

3. The thick solder mask is also more difficult to exposure and develop. If the exposure energy is too weak or not enough, then some undercut problem may happen.

How to overcome this challenge?

To address these challenges, it is essential to choose the right solder mask materials and optimize the application process.

  • Choosing the right solder mask materials is crucial for ensuring proper adhesion and coverage on heavy copper PCBs. LPI solder mask is often preferred for heavy copper PCBs due to its excellent adhesion and thermal stability. However, epoxy and acrylic solder mask materials can also be used with proper surface preparation.
  • Optimizing the solder mask application process can also help address the challenges of heavy copper PCBs. This can include using a thinner stencil for improved registration accuracy and applying multiple coats of solder mask for better coverage. Advanced solder mask technology, such as laser direct imaging (LDI), can also help improve registration accuracy and reduce the risk of mask cracking and peeling.
  • Optimizing the printing process, now in Best Technology, we always make the substrate first, fill the substrate with the solder mask and then treat it as a normal PCB for normal printing solder mask.
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If you are in the process of designing a complex multi-layer heavy copper PCB and are looking for a high-quality and experienced manufacturer, feel free to reach out to us at sales@bestpcbs.com, Best Technology can support you by OEM and ODM service to ensure your design is cost-effective and can be easily manufactured.

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