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Let you know about PCB copper layer thickness

Friday, August 16th, 2024

In the printed circuit board industry, the most common way to express the copper layer thickness on a PCB is in ounces (oz). 1oz means 1oz of copper evenly covers an area of 1 square foot, which is about 1.4mil. It uses the weight of the tissue area to express the average thickness of the copper foil. Expressed in terms of formula, 1oz=28.35g/FT2 (FT2 is square feet, 1 square foot = 0.09290304 square meters).

What is the standard thickness of a copper layer on a PCB?

In the manufacture of printed circuit boards (PCBs), the thickness of the copper layer is an important parameter that directly affects the electrical performance and reliability of the circuit board. Depending on the application requirements, the thickness of the copper layer can vary within a certain range. Generally speaking, the conventional copper layer thickness is between 1-35μm, with 35μm being the most commonly used thickness. For some applications with high reliability requirements, the copper layer thickness may reach more than 50μm.

The selection of the thickness of the copper layer is a decision-making process that takes into account a variety of factors, including the conductivity, heat dissipation, mechanical strength, cost and manufacturing difficulty of the circuit board. A larger copper thickness can reduce resistance and improve the conductivity and heat dissipation of the circuit board, but it will also increase material costs and production difficulties. Therefore, when designing PCB boards, engineers need to select a suitable copper thickness standard range based on specific application scenarios and design requirements to ensure the performance and reliability of the circuit board.

1oz copper thickness in mm = 0.035mm

0.5 oz copper thickness in mm = 0.0175mm

1.5 oz copper thickness in mils = 0.0525mm

2 oz copper thickness in mils = 0.07mm‌

How thick is PCB copper after plating?

PCB printed circuit boards are usually bonded to glass epoxy substrates with a layer of copper foil, usually 18, 35, 55 and 70 microns thick. The most commonly used copper foil is 35 microns thick.

The copper foil used by PCB manufacturers is generally 35~50 microns thick, and some are thinner than this, such as 10 microns, 18 microns, and thicker such as 70 microns. The thickness of the composite copper foil on a 1~3 mm thick substrate is about 35 microns. The thickness of the composite copper foil on a substrate with a thickness of less than 1MM is about 18 microns, and the thickness of the composite copper foil on a substrate with a thickness of more than 5 mm is about 55 microns.

The copper layer thickness of PCB (printed circuit board) can be adjusted according to different needs and designs. Common copper layer thicknesses include 1oz (35μm), 2oz (70μm), 3oz (105μm), and other thicker options. For most applications, a copper layer thickness of 1oz is sufficient and suitable for general signal transmission. ‌For circuit boards that need to carry large currents, such as switching power supplies, a copper layer thickness of 2oz or higher is usually used. ‌In addition, there are some special cases where manufacturers provide extremely heavy copper up to 20 oz/ft2 (26.8 mils or 0.34 mm) to meet special needs. ‌

When choosing the thickness of the copper layer, factors such as the purpose of the circuit board and the magnitude of the signal voltage and current need to be considered. ‌For example, for circuit boards that require excessive current, a copper thickness of 70μm or 105μm may be used. ‌For thin laminates that require ultra-high density patterns, a copper thickness of 12μm may be used. ‌Therefore, the specific thickness of the PCB after copper plating is determined according to design requirements and specific applications.‌

How thick is 2 oz copper for PCB?

If 1 ounce (28.35 grams) of copper were flattened to evenly cover a surface area of 1 square foot (0.093 square meters), the resulting thickness would be 1.37mils (0.0348mm). A conversion chart for different units of measurement can be found below.

What is the difference between different copper thicknesses in PCB?

‌Copper is an excellent conductive material, and the thickness of the copper layer directly affects the conductive effect of the circuit board. ‌Thicker copper layers can provide lower resistance, reduce signal transmission losses, and are particularly suitable for high-frequency and high-speed digital circuits. ‌

During the operation of electronic equipment, good heat dissipation is a key factor in ensuring the performance and life of components. ‌Thicker copper layers can conduct and dissipate heat more effectively, preventing components from overheating. ‌

In high-power electronic devices, thicker copper layers can carry larger currents, avoiding burnout or performance degradation caused by excessive current.

Below is the conductivity corresponding to different copper thicknesses.

How thick is high current PCB copper?

In PCB design, copper thickness (also called copper thickness) is an important parameter, which directly affects the performance indicators of the circuit board such as current carrying capacity, heat dissipation and reliability. For PCBs that need to withstand high currents, such as high-power LED light strips, power circuit boards, high-power motor control boards or high-power inverter control boards, thicker copper layers are usually used to increase current carrying capacity.

Different uses have different copper foil thicknesses. Common 0.5oz, 1oz, and 2oz are mostly used in consumer and communication products. Thick copper products above 3oz are mostly used for high currents, such as high-voltage products and power boards.

The thickness of copper foil (track width) will affect the current size. Although there is a formula that can directly calculate the maximum current carrying capacity of copper foil, it is not so simple when actually designing the circuit. Therefore, the safety factor should be fully considered during the design.

How thick is the copper in a flex PCB?

The thickness of copper foil in flexible PCB is generally 18μm, 35μm, 55μm and 70μm. These thickness specifications are suitable for different types of circuit board requirements, among which 35μm is the most commonly used copper foil thickness.

For flexible PCB, the choice of copper foil thickness depends on the specific purpose of the circuit board and the size of the signal voltage and current. For example, for PCBs that require excessive current, some parts will use 70μm copper thickness, while for signal transmission, 1oz (35μm) thickness is usually sufficient. In addition, for substrates of different thicknesses, the thickness of copper foil is also different. For example, the thickness of the composite copper foil on a 1mm thick substrate is about 18μm, and on a substrate thicker than 5mm, the thickness of the composite copper foil is about 55μm.

Conclusion:

PCBs for different usage scenarios correspond to different thicknesses of copper, and its thickness directly affects the conductive effect of the circuit board. If the copper layer is too thin, the conductivity may decrease, resulting in signal transmission attenuation or current instability. If the copper layer is too thick, although the conductivity will be very good, it will increase the cost and weight of the circuit board and easily lead to serious glue flow. In PCB manufacturing, it is necessary to select the appropriate copper thickness according to the design requirements and actual applications of the circuit board to achieve the best conductive effect.

BEST Technology is a professional PCB circuit board manufacturer with a large area of site and equipped with useful and experienced production personnel. Corresponding to different thicknesses of copper, we have rich production and processing experience. We can meet the requirements of any circuit board copper layer thickness.‌

What is the SMT?

Surface Mount Technology (SMT) is a production technique used to attach electronic components directly onto the surface of a printed circuit board (PCB). This method enables automated manufacturing to handle most of the assembly process needed to create a functioning board. Components attached in this way are known as surface-mount devices (SMDs). Unlike traditional methods, SMT does not involve inserting components through holes in the board. Instead, components are soldered directly onto the surface using reflow soldering.

Originally known as Planar Mounting, SMT was pioneered by IBM in the 1960s for small-scale computer production, replacing the earlier Through-Hole Technology. However, SMT didn’t gain widespread use until 1986, when surface-mounted components achieved 10% market penetration. By 1990, SMDs had become a dominant feature in most high-tech circuit card assemblies (CCAs).

What is the process of SMT manufacturing?

The SMT manufacturing process can be divided into three main stages: solder paste printing, component placement, and reflow soldering. Due to the complexity of the process, each stage is further broken down as follows:

1. Component and PCB Preparation

This initial stage involves selecting surface-mount components (SMCs) and designing the PCB. The board typically features flat copper pads plated with silver, tin-lead, or gold, which are called solder pads. These pads do not have holes and are used to support the pins of components like chips and transistors.

Another crucial element is the stencil, which is aligned with the solder pads to define the placement of solder paste during the next stage. The PCB and all materials involved must be thoroughly inspected to ensure there are no defects before proceeding with production.

2. Solder Paste Printing

Solder paste printing is a critical phase in SMT production. A stencil and squeegee are used to apply solder paste at an angle of 45° to 60°. The solder paste itself is a combination of powdered metal solder and flux, which temporarily holds components in place and cleans the soldering surfaces of impurities.

The paste is applied to the solder pads, connecting the SMCs to the PCB once melted in the reflow oven. It’s essential that the correct amount of paste is applied to each pad, as improper application can prevent proper connections from forming during reflow.

3. Component Placement

In this stage, pick-and-place machines accurately position components on the PCB. The machines use vacuum or gripper nozzles to remove each component from its packaging and place it onto the board. These machines are fast and precise, capable of placing up to 80,000 components per hour.

Precision is key here, as any misplaced components could lead to costly rework once soldered.

4. Reflow Soldering

After components are placed, the PCB is moved into the reflow oven for soldering. The board passes through several temperature-controlled zones:

Preheat Zone

The temperature is gradually increased to between 140℃ and 160℃ at a rate of 1.0℃-2.0℃ per second to ensure the board and components heat evenly.

Soak Zone

The PCB is maintained at this temperature for 60 to 90 seconds to stabilize the heat across the entire board.

Reflow Zone

The temperature is then raised to 210℃-230℃ to melt the solder paste, bonding the components to the PCB. The molten solder’s surface tension keeps the components in place during this process.

Cooling Zone

In the final zone, the solder is rapidly cooled to solidify the connections and prevent any soldering defects.

For double-sided boards, this process may need to be repeated, either using solder paste or adhesive to secure components.

5. Cleaning and Inspection

Once the soldering process is complete, the PCB is cleaned and inspected for any defects. This is done using magnifying lenses, Automated Optical Inspection (AOI), flying probe testers, X-ray inspection, and other tools to ensure accuracy. Any flaws are repaired before the finished product is packaged and stored.

What are the basics of SMT?

SMT simplifies assembly by reducing the need for drilled holes and using smaller components. Unlike traditional through-hole components, SMT parts are placed on the surface of the PCB, making the design more compact.

The basic elements of SMT include:

PCBs: The base for components, designed with specific pads for each part.
Solder Paste: A mixture of metal solder particles and flux, used to create a bond between components and the board.
SMT Components: Small electronic parts, such as resistors, capacitors, and ICs, that attach to the PCB.

The transition from through-hole technology to SMT has improved manufacturing speed and performance in electronics.

How do I prepare for SMT?

As the core step of electronic product manufacturing, PCBA’s preparation before assembly directly affects the quality and reliability of the final product. The following is a detailed analysis from multiple dimensions:

1. Component inspection

Before assembly, all electronic components must undergo strict screening and inspection. This includes checking that the component type, package, number of pins, etc. are consistent with the BOM (Bill of Materials), as well as performing the necessary electrical performance tests.

2. Take ESD measures

Static damage to electronic components is invisible, but the consequences are serious. Therefore, when distributing materials and testing IQC, warehouse personnel should wear anti-static gloves, reliably ground the instrument, and lay anti-static rubber MATS on the work surface. During the assembly process, the operator should also wear anti-static clothes, anti-static bracelets and other protective equipment to ensure that the workbench and equipment are well grounded.

3. Cleanliness requirements

The work workshop and workbench must be kept clean to prevent contaminants such as dust and impurities from entering the circuit board, affecting the accuracy and quality of the patch. Clean the work surface and workshop floor regularly. Smoking, eating and drinking are strictly prohibited in the work area.

4. Temperature and humidity control

Appropriate temperature and humidity should be maintained in the workshop to reduce static electricity generation and the impact on electronic components. It is usually recommended that the temperature be controlled at 23±3^oC and the humidity be controlled at 45% to 70%RH. This environment helps to ensure the quality of welding and the stability of electronic components.

5. PCB appearance check

Before assembly, the PCB board should be visually inspected to confirm whether it is complete, whether the surface coated solder resistance layer is intact, and whether there are obvious short circuits and defects. Use a multimeter to check whether there is a short circuit between the power supply and the ground terminal on the printed board, and ensure that the printed board is fine.

6. Check the software and hardware

When the PCBA needs to be upgraded, the motherboards produced in different time periods should not be mixed together to avoid mixing problems. Before assembly, check whether the final use of the software is in accordance with customer requirements to ensure that the software and hardware are compatible and correct.

7. Welding process selection

According to the layout of the circuit board and the characteristics of the components, select the appropriate welding process (such as wave soldering, reflow welding, hot blast furnace welding, etc.). Each welding method has specific requirements for the placement, orientation and spacing of components that need to be planned in advance.

8. Manually prepare the post-welding plug-in components

For some components that cannot be automatically welded (such as large connectors, heat sinks, etc.), manual plug-in assembly is required. This requires the operator to have a wealth of experience and skilled skills to ensure the accuracy and robustness of the plug-in.

9. Perform ESD operations

During operation, use an ESD workbench and an ESD container to hold components and semi-finished products. All welding equipment should be grounded, the electric soldering iron must be anti-static type, and tested before use.

10 Cleaning and protective treatment

After the assembly is complete, the product needs to be cleaned to remove the residue and contaminants generated during the welding process. At the same time, appropriate protective treatment of the product, such as spraying three anti-paint, etc., to improve the product’s moisture, dust and corrosion resistance.

Which solder paste is used in SMT?

The type of solder paste used in SMT assembly process depends on several factors, such as the materials of the components and the PCB, as well as the operating conditions of the finished product. Generally, there are mainly include high temperature solder paste, ‌ medium temperature solder paste and low temperature solder paste. ‌

High temperature solder pastes are commonly used in applications where higher temperatures are required for welding. ‌ has a higher melting point and ‌ is suitable for welding electronic components with specific temperature requirements. ‌
Medium temperature solder paste and low temperature solder paste are suitable for medium and low temperature welding respectively, ‌ select the appropriate solder paste type according to the specific welding needs. ‌

In addition, ‌ solder paste can also be classified according to the flux activity level, ‌ including “R” (‌ inactive) ‌, ‌ “RMA” class (‌ moderate activity) ‌, ‌ “RA” class (‌ completely reactive) ‌ and “SRA” class ‌ (‌ super activity). ‌ Different types of activity levels are suitable for different application scenarios, ‌ for example, ‌ “R” grade is usually used for welding aerospace, ‌ avionics products, ‌ and “RA” grade is suitable for consumer electronics products. ‌ This classification allows users to choose the right solder paste according to the specific application needs and cleaning process requirements. ‌

What temperature should a soldering iron be for SMT?

The right temperature for soldering in SMT can vary depending on the solder paste and components you’re using. Typically, the soldering iron should be set between 250°C and 300°C. Using a lower temperature might not properly melt the solder, while a higher temperature could damage components or the PCB.

Of course, different types of PCB requires different temperature. For example, ceramic PCBs has fragile surface, so a lower temperature is good.

What are the disadvantages of SMT?

Small volume (due to the limitation of components)
Fragility
High soldering requirements
Easily damaged or dropped
Challenging to inspect
Complex process and inspection
High equipment investment

How to solder SMT at home?

Soldering SMT components at home can be tricky, but with the right tools and techniques, it’s doable. Here’s a quick guide:

Tools: You’ll need a fine-tip soldering iron, tweezers, solder paste, and flux. You may also want a magnifying glass or microscope for better visibility.
Apply Solder Paste: Use a small amount of solder paste on the pads of the PCB where you want to place your components.
Place Components: With tweezers, carefully place the components onto the solder paste. Make sure they are properly aligned with the pads.
Reflow the Solder: If you have a reflow oven, you can use it to heat the board. Alternatively, a hot air rework station can also work.
Inspect: Once the solder has cooled, check the connections. If necessary, reheat or add more solder to fix any weak joints.

Best Technology is a one-stop PCB & PCB assembly manufacturer founded in 2006, with 5 assembly lines. If you have needs for PCB and PCBA fabrication, we can be your reliable supplier from prototypes to bulk production. In addition, we have SMT factory in Vietnam, if you don’t want to make smt in Shenzhen, then we can support you in Vietnam. Welcome to contact us if you have such PCB and PCBA projects.

What is copper clad laminate?

Copper clad laminate (CCL) is a plate-like material made by impregnating electronic fiberglass cloth or other reinforcing materials with resin, covering one or both sides with copper foil and hot pressing. It is referred to as copper clad laminate.

Printed circuit boards of various forms and functions are selectively processed, etched, drilled and copper-plated on copper clad laminates to make different printed circuits.

It mainly plays the role of interconnection, insulation and support for printed circuit boards, and has a great influence on the transmission speed, energy loss and characteristic impedance of signals in the circuit. Therefore, the performance, quality, processability, manufacturing level, manufacturing cost and long-term reliability and stability of printed circuit boards depend to a large extent on copper clad laminates.

What is flexible copper clad laminate?

Flexible copper clad laminate is a special copper clad laminate, which is composed of a flexible insulating base film and a metal foil. It is usually composed of three different materials: copper foil, film, and adhesive, forming a three-layer flexible copper clad laminate. ‌

If there is no adhesive in the flexible copper clad laminate, it is called a two-layer flexible copper clad laminate. ‌Flexible copper clad laminate is formed by bonding copper foil to one or both sides of a flexible insulating material such as polyester film or polyimide film through a certain process. ‌

This material is widely used in the electronics industry, especially in electronic devices that need to bend, move, and stretch, such as laptops and digital cameras. ‌The characteristics of flexible copper clad laminate include thinness, lightness, and flexibility, which give it obvious advantages in high-density wiring, light weight, and small size. ‌

In addition, flexible copper clad laminate plays an important role in the manufacturing process of electronic products. Its performance directly affects the conductivity, insulation, and support of the PCB circuit board, thereby affecting the overall performance and cost of the product.

What are the performance requirements for copper clad laminates?

Appearance requirements: The appearance of the copper clad laminate should meet certain standards, including that the metal foil surface should not have pits, scratches, resin spots, wrinkles, pinholes, bubbles, white silk and other defects.
Dimension requirements: Including the board size, length, width, diagonal deviation, warpage, etc. should comply with the regulations. The nominal board size and allowable deviation, nominal thickness and deviation, verticality, warpage, etc. of aluminum-based copper clad laminates also have specific requirements23. 3. Electrical performance requirements: Including dielectric constant (Dk), dielectric loss tangent (Df), volume resistance, surface resistance, insulation resistance, arc resistance, dielectric breakdown voltage, electrical strength, comparative tracking index (CTI), ion migration resistance (CAF), etc. ‌
Physical performance requirements: including dimensional stability, peel strength (PS), bending strength, heat resistance (thermal stress, Td, T260, T288, T300), punching, etc. ‌
Chemical performance requirements: including flammability, solderability, chemical resistance, glass transition temperature (Tg), Z-axis thermal expansion coefficient (Z-CTE), dimensional stability, etc. ‌
Environmental performance requirements: including water absorption, pressure vessel boiling test, etc., to ensure that the copper clad laminate can maintain stable performance under specific environmental conditions. ‌
Environmental performance requirements: The copper clad laminate should comply with relevant environmental standards, contain no harmful substances, no odor, and have no adverse effects on the human body and the environment.‌

What are the pros and cons of copper cladding?

Advantages of copper clad laminate for circuit boards

Excellent electrical conductivity: copper clad laminate for circuit boards can provide high electrical conductivity and can be used for high-speed signal transmission and high current transmission.
Good corrosion resistance: The surface of copper clad laminate for circuit boards is coated with a protective copper oxide layer, which can effectively prevent copper from corrosion in humid and acidic environments and extend the life of the circuit board.
Easy to process and print: After processing, copper clad laminate for circuit boards can be processed and printed by etching, gold plating, machining and other methods.
Convenient for the production of multi-layer circuit boards: copper clad laminate for circuit boards can be used as inner copper foil for the production of multi-layer circuit boards, which can improve the performance and density of circuit boards and reduce the volume of circuit boards.

Disadvantages of copper clad laminate for circuit boards

High cost: Compared with other materials such as aluminum substrates, copper clad laminate for circuit boards has a higher manufacturing cost, so the price is relatively expensive.
Large thermal expansion coefficient: The thermal expansion coefficient of copper clad laminate for circuit boards is different from that of other materials, which can cause bending and cracking of circuit boards when different temperatures change.
Corrosion performance needs to be improved: Although the copper clad laminate of the circuit board has good corrosion resistance, it may still be damaged by strong acid, strong alkali or high temperature, which needs further improvement.

What is copper clad laminate made of?

Copper clad laminates are mainly made of electronic fiberglass cloth or other reinforcing materials impregnated with resin, covered with copper foil on one or both sides and hot pressed. This material is referred to as copper clad laminate (Copper Clad Laminate, CCL), which is the substrate material of printed circuit boards (PCBs) and also the carrier of electronic components. ‌

The manufacturing process of copper clad laminates includes impregnating electronic fiberglass cloth or other reinforcing materials with resin, then covering one or both sides with copper foil, and curing it into shape by hot pressing. ‌Such a manufacturing process enables copper clad laminates to have excellent electrical and mechanical properties, which can meet the needs of different applications. ‌

In addition, there are various types of copper clad laminates, including but not limited to high-frequency copper clad laminates, aluminum-based copper clad laminates, copper-based copper clad laminates, etc. These different types of copper clad laminates differ in material composition and application fields, but the common feature is that they are all based on copper foil and resin and are made through different processing techniques.

Copper Clad Laminate Grade?

FR-1 – phenolic cotton paper, this base material is commonly known as bakelite (more economical than FR-2)
FR-2 – phenolic cotton paper,
FR-3 – cotton paper, epoxy resin
FR-4 – Woven glass, epoxy resin
FR-5 – glass cloth, epoxy resin
FR-6 – matte glass, polyester
G-10 – glass cloth, epoxy resin
CEM-1 – cotton paper, epoxy resin (flame retardant)
CEM-2 – cotton paper, epoxy resin (non-flame retardant)
CEM-3 – glass cloth, epoxy resin
CEM-4 – glass cloth, epoxy resin
CEM-5 – glass cloth, polyester
AIN – aluminum nitride
SIC – silicon carbide

What is copper clad laminate used for?

Electronic communication field
Copper clad laminates are widely used in electronic products such as mobile phones, computers, communication equipment, network equipment, etc. Among them, mobile phones are one of the most important application fields of copper clad laminates, and the quality of copper clad laminates used in mobile phones has a great impact on the performance and quality of mobile phones.
Computer field
With the development of computers, the application scope of copper clad laminates has gradually expanded, and gradually become an indispensable part of computer hardware. For example, copper clad laminates are widely used in hardware such as power boards, motherboards, expansion cards, and memory sticks.
Consumer electronics field
With the increasing popularity of consumer electronic products, the application of copper clad laminates in this field has gradually increased. For example, copper clad laminates are used in products such as smart watches and smart homes.
Automotive electronics field
Automotive electronics is one of the future development directions, and copper clad laminates are also widely used in the field of automotive electronics, such as in-vehicle entertainment systems, in-vehicle navigation systems, body control systems, etc.

All electronic machines, including aviation, aerospace, remote sensing, telemetry, remote control, communications, computers, industrial control, household appliances, and even advanced children’s toys, are all important electronic materials that are indispensable.

What is a PCB support column

PCB support columns, also known as circuit board support columns, are mainly used to support and connect circuit boards and are widely used in computer connectors, various PCB assemblies, and electronics. These support columns are usually made of insulating materials such as plastic and nylon, and have good insulation properties and mechanical strength. They have various designs, including aircraft type, flat bottom type, hexagonal type, and other shapes to meet different installation and usage requirements.

Function of PCB support column

PCB support columns play an important role in multiple application scenarios. ‌
To ensure the stability and reliability of PCB in various application scenarios, the support columns are used to support and position the sub-board, ensure that the sub-board is placed flat on the carrier, and thus improve the welding effect between the sub-board and the carrier. ‌In the injection mold, the support column supports the B plate to prevent it from being deformed by pressure during injection molding. ‌In the design of large-load electric cylinders, the support column plays a role in enhancing structural strength, improving pressure resistance, optimizing load capacity, maintaining accuracy and stability, and extending service life. ‌
In addition, in the communication engineering PCB welding and docking support device, the support column is used to clamp and fix the docking plug to ensure that the communication engineering PCB can be stably docked and welded. ‌
In summary, the main function of the PCB support column is to provide stable support and positioning to ensure the stability and reliability of the PCB in various application scenarios.

How to choose PCB support columns?

Choosing a suitable PCB support column requires comprehensive consideration of multiple factors such as performance, material, size, and cost
1.Performance requirements: Determine the performance required by the support column according to the application scenario, such as load-bearing capacity, corrosion resistance, and high temperature resistance. ‌
2.Material selection: Common materials include metal, plastic, etc. Metal support columns are strong and durable, but may be susceptible to corrosion; plastic support columns are light and have good insulation, but may not be strong enough.
3.Size and shape: The size and shape of the support column should match the specifications and installation requirements of the PCB to ensure stable support and connection. ‌
4.Cost and budget: Under the premise of meeting performance requirements, consider the cost and budget of the support column and choose a cost-effective product

PCB support column material?

PCB support columns are widely used in the electronics field. They are mainly used to support and connect circuit boards. ‌ Common PCB support column materials include nylon, plastic, metal (such as brass, stainless steel, aluminum) and resin, etc. Nylon and plastic are the most commonly used materials due to their good insulation performance, easy processing and low cost. Metal materials such as brass and stainless steel are selected in certain specific applications due to their good mechanical strength and conductivity. ‌ Resin materials are also used in the production of some PCB support columns due to their insulation and processing properties.

5.1 Basic parameters of the amplifier board

Working mode: Class D
Quiescent current: 50mA
Working efficiency: 90%
Rated output power: 2200W+400W Frequency response: 20Hz to 20KHz Working voltage: DC24V-42V( Recommended voltage: DC42V Maximum output current: 10A PCB size: 114109MM
Potentiometer center distance: 21.5MM 21.5MM 21.5MM from left to right
Original TPA3223 is used

TPA3223 2.1 Digital Bluetooth 5.1 3034 Amplifier Board

1.The front input capacitor and interstage coupling capacitor use ELNA BP capacitor 10UF, the electrolytic capacitor signal main circuit uses Taiwan famous brand, and the main filter capacitor uses imported electrolytic capacitor 1000UF , ensuring strong and continuous power support.
2.The resistors are made of high-precision chip resistors, and the main circuit uses a five-ring metal film resistor with an accuracy of ±1%, which ensures a good signal-to-noise ratio for the whole machine.
3.The PCB uses a 1.6mm thick double-sided board, 2.0 ounces of copper thickness, and a full tin-spraying process to ensure good passing performance of large and small currents.
4.The fully enclosed dust-proof potentiometer is used, which has more stable performance and is more durable than ordinary potentiometers.
5.The red-gray ring high-current inductor and the fully shielded audio-specific output inductor are used to ensure a crisp and powerful sound.
The Bluetooth uses Qualcomm QCC3034 5.1 version Bluetooth module

5.1 amplifier board of working principle

The core function of the amplifier board is to increase the amplification factor of the signal while protecting the circuit from damage. The amplifier board is usually used for isolation and current amplification between the programmable logic controller (PLC) and the input device or output device to improve the load capacity of the PLC and protect the PLC from faults such as overvoltage, overload, and load short circuit.
The working principle of the amplifier board is based on the amplifier circuit, using electronic components with amplification characteristics, such as transistors. When the tiny current at the input end changes, a large current change will occur at the output end, and the change at the output end is several to hundreds of times greater than the change at the input end. The characteristic of this amplifier circuit is that only one potential point is amplified, and the other potential point is grounded by default. In addition, the integrated circuit (IC) is also an important part of the amplifier board. It integrates many transistors, resistors, capacitors and other components on a small piece of semiconductor silicon single crystal, and uses isolation technology to insulate them from each other in electrical properties, thereby realizing signal amplification and processing.

For example, an analog signal amplifier board can connect multiple sensors, collect differential signals and amplify them to the required multiples through an amplifier circuit. The board can work normally in the temperature range of -15℃ to 70℃, and the humidity can reach 90%, which is suitable for various harsh environments. This amplifier board is widely used in industrial automation, smart home, medical equipment and other fields to ensure stable signal transmission and processing

5.1 amplifier board of working principle

The role of the amplifier board

The main functions of the amplifier board:

This is because some process control equipment such as proportional valves can only receive analog voltage or current signals. Therefore, in order to ensure that these devices can correctly receive and respond to the signals sent by the PLC, an intermediate amplification link, namely the amplifier board, is required.
It can properly amplify the signal output by the PLC D/A module to make the proportional valve work normally.
The amplifier board is also called the IO relay board. Its main functions include isolation, current amplification, and providing additional I/O channels. It can improve the load capacity and reliability of the PLC system and prevent the PLC host from being damaged due to overvoltage, overload or load short circuit. ‌
The amplifier board is widely used in the field of industrial automation. It can not only improve the load capacity and reliability of the PLC system, but also protect the output or input points of the PLC.
The amplifier board can save cabinet space, increase installation speed, facilitate maintenance and replacement, and has protection circuits and built-in insurance, which makes it difficult to damage the amplifier board itself and the load.
The amplifier board can also play the role of amplifying interference, because its input and output are photoelectrically isolated, and the PLC will not be burned out due to high-voltage impact load.
These features make the amplifier board play a vital role in industrial automation systems.

Application of 5.1 amplifier board

5.1 channel amplifiers are mainly used in home theater systems to provide surround sound audio output and an immersive listening experience for the audience. ‌
5.1 channel amplifiers are an indispensable component of home theater systems. They can provide five full-band channels and one low-frequency effect channel. Through carefully designed audio processing, the audience can feel the sound from different directions, thereby enhancing the immersion of movies or concerts.

In addition to home theater applications, 5.1 channel amplifiers are also suitable for professional audio systems, such as conference rooms, performance venues, etc., where high-quality audio output is required. ‌In these occasions, 5.1 channel amplifiers can ensure stable signal transmission and high-quality restoration to meet professional-level audio needs. ‌

In short, the 5.1 channel amplifier board provides multi-channel audio output, bringing a more realistic and three-dimensional sound experience to viewers or listeners, playing an important role in both home entertainment and professional applications.

FAQs About 5.1 amplifier board

Does the 5.1 amplifier front panel consist of 6 front panels?

A true 5.1 should have 6 input interfaces (marked as: 5.1IN) and 6 speakers including a subwoofer.
5.1 is an independent 6-channel amplification and 6-channel speaker restoration, and of course an independent 5.1-channel sound source is required.
The 5.1 speaker requires the amplifier to have an independent 6-channel amplifier. Virtual ring. Winding into multiple channels

How many power amplifiers are there in a 5.1 channel amplifier?
Two situations, the first is 5.1 full-channel power amplification, that is, 6 channels, but in this case the power of the bass channel is small, which can drive 6~8-inch bass, but it can’t drive large ones.
The second is 5-channel power amplification, except for the bass channel, the other channels are power amplified, the bass channel only provides a level signal, and the signal enters the active subwoofer amplifier board to drive the subwoofer, which is more common.

Can the 5.1 channel amplifier board use dual DC?

Ordinary transistor power amplifiers use DC. What do you mean by “using dual DC power”? Does it mean using a backup power supply? … Using a backup power supply is completely possible.
In addition, there are power amplifiers that are powered by [positive and negative symmetrical power supplies]. Such power amplifiers must use DC positive and negative symmetrical power supplies.

Can I make a 5.1 with two 2.1 amplifier boards?

One of them is used for 2.1 (the analog subwoofer circuit is removed as bass amplification), and the other is used for surround channels (remove the subwoofer circuit and change to center). After merging, it is 5.1. The 6 amplification channels must be connected to the 5.1 decoding output.

Can a 5.1 pre-stage board be used with a 2.0 amplifier?
It can definitely be used. The pre-stage board only plays the role of audio adjustment and does not perform power amplification. The input audio signal can be connected to the amplifier after being adjusted and output by the pre-stage board. For the 5.1 channel, just select 2 of the output signals.

What is the Purpose of Teeth Whitening Equipment?

Teeth whitening devices are designed to improve the color of teeth, aiming for a whiter and brighter appearance. These devices apply various techniques, each contributing to the overall effectiveness of the whitening process. Notably, light-based methods have gained prominence, with two prominent technologies standing out: light phototherapy and laser treatments.

Light Phototherapy: This approach involves using specific wavelengths of light to activate whitening agents on the tooth surface. Patients wear protective eyewear while the device emits light, expediting the whitening process.

Laser Treatments: Similar to phototherapy, lasers target whitening agents, enhancing their efficacy. Typically conducted in professional dental settings, laser treatments offer precise and accelerated teeth whitening.

Ultrasonic Vibration: Some devices employ ultrasonic vibration, utilizing the principle of mechanical oscillation to enhance the penetration and effectiveness of whitening agents.

Why choose MCPCB for Teeth Whitening Devices?

Behind the scenes of these advanced teeth whitening technologies lies a critical component – the metal substrate. Often, LED products utilized in teeth whitening devices prioritize metal substrate for their construction. But what exactly is a metal core PCB, and why is it the preferred choice?

Understanding Metal Substrates: The Foundation of Reliability

MCPCB (Metal Core Printed Circuit Board) is a specialized type of printed circuit board characterized by the presence of a layer of metal with excellent thermal conductivity on the substrate. Typically, MCPCBs are composed of a metal core, insulating layer, and copper foil, with the thermal conductivity of the metal core being a significant distinction from conventional FR4 circuit boards.

Key Features of Metal core PCB: Unveiling secret

Superior Thermal Conductivity: Teeth whitening devices often utilize technologies such as light or laser, generating heat during operation. the metal core of MCPCB exhibits exceptional thermal conductivity, effectively dissipating heat to prevent overheating. This property ensures efficient heat dissipation, a critical factor in devices requiring prolonged operation, such as teeth whitening instruments.

Regarding the metal base of MCPCB, aluminum base or copper base are commonly used for MCPCB, it’s also help to make the good heat dissipation than FR4PCB, like aluminum base has 205W/m.k and copper base has 398W/m.k, as you can see the thermal conductivity of copper base is better than aluminum base, so if your products need a more higher heat dissipation, welcome to consider copper core PCB, but please noted that copper is expensive than aluminum, which material depends on your requirement.

As thermal conductivity, it’s more important in MCPCB, since the higher the thermal conductivity, the higher the ability of heat dissipation, for now, the highest thermal conductivity is 8W/m.k in Best Technology, but for normally, 1W/m.k, 2W/m.k and 3W/m.k is enough for LED products.

Enhanced Heat Dissipation: MCPCB excels in dissipating heat, preventing overheating during prolonged use. This characteristic is crucial in teeth whitening devices, where maintaining a balanced thermal environment is essential for both device performance and user comfort.

Mechanical Strength: Metal substrates exhibit high mechanical strength, withstanding the rigors of assembly and use. This durability ensures the stability and reliability of the devices over time.

Structural Robustness: Teeth whitening devices may experience mechanical stress during operation, including vibrations or movements. The metal core of MCPCB provides additional structural support, enabling the device to withstand mechanical pressures and enhance overall durability.

Ideal for LED Products: MCPCBs are often the preferred choice for LED products due to their excellent thermal management and structural stability. LED-based teeth whitening devices benefit significantly from MCPCBs, ensuring the longevity and reliability of the LED components.

Why Metal Substrates for Teeth Whitening Devices?

The choice of metal substrates in teeth whitening devices, especially those employing LED technology, is strategic. The need for a material that offers robust electrical conductivity, efficient heat dissipation, and structural integrity aligns perfectly with the characteristics of metal substrates. In LED products, where precision and reliability are paramount, metal substrates emerge as the preferred foundation.

In conclusion, the convergence of advanced technologies for teeth whitening and the reliability of metal substrates highlights the intricate dance between innovation and foundational support. As we continue to seek brighter smiles through cutting-edge dental aesthetics, the role of metal substrates remains fundamental, quietly empowering the devices that illuminate our smiles and boost our confidence.

Best Technology has involved in MCPCB industry from 2006, over 17years, we can help to design, manufacturing and assembly, providing one-step service for our customers, welcome to share your drawing or idea to us, we will back you the best solution!

Do you know what’s Semi-flex PCB?

A Semi-Flexible PCB (Printed Circuit Board) is a type of PCB that offers a compromise between rigid and flexible circuit boards. It incorporates elements of both rigid and flexible PCBs, allowing it to bend to some extent while still maintaining a degree of stiffness. This innovative flex-to-install design not only ensures cost-effectiveness but also opens up a realm of possibilities for diverse applications, making Semi-flex PCBs a versatile and economical solution in the ever-evolving landscape of electronic design. Embracing cutting-edge technology and adaptability, these boards exemplify the ongoing commitment to pushing the boundaries of innovation in electronic engineering.

Vital Features of Semi-flexible PCBs

In our more than 17 years of experience in the PCB manufacturing field, we take pride in delivering Semi-Flexible PCBs that meet the highest standards of quality and performance. we are happy to share some the key features of our Semi-Flexible PCBs we made:

Flexibility and Bending Capability: The semi-flexible nature of these PCBs allows for bending and shaping, making them suitable for applications with space constraints or those requiring unique form factors.

Reliability: Despite their flexibility, our Semi-Flexible PCBs maintain high levels of reliability and performance. They are designed to withstand bending without compromising the integrity of the circuit.

Space Optimization: The ability to conform to three-dimensional shapes enables better use of available space, making these PCBs ideal for compact electronic devices and innovative product designs.

As we move forward, we invite you to explore the possibilities that Semi-Flexible PCBs offer and to partner with us in shaping the future of electronic engineering. Together, let us continue to embrace the spirit of innovation and unlock new horizons in the dynamic and rapidly advancing field of technology. Trust Best Technology, we are the BEST!