What is SMT POP (Package on Package) Process?

September 3rd, 2024

What is smt pop process?Package on Package (PoP) means that a logical package with high integration at the bottom is superimposed on another matching large-capacity memory package to form a new package as a whole. Laminated packaging can be the same shape of the logic and memory chip package can be reintegrated, without the use of stacked logic-memory chip packaging method in the manufacturing and commercial problems. This new form of high-density packaging is mainly used in a variety of consumer electronic products such as smart phones, digital cameras, and portable wearable devices.

What is SMT POP (Package on Package) Process?

What Does POP Do in Assembly?

In an era where consumer electronics are becoming smaller and more powerful, saving PCB space is crucial. PoP allows for the vertical stacking of components, such as processors and memory, on top of each other. This is especially important in devices like smartphones, tablets, and wearable technology, where space is at a premium.

One of the significant advantages of PoP is the ability to individually test and replace the stacked components before final assembly. This step-by-step verification ensures higher yields during manufacturing, as defective components can be identified and replaced early in the process. Additionally, since each component is tested separately, the overall cost of assembly can be reduced, as fewer defective products reach the final stages of production.

Moreover, PoP provides manufacturers with the flexibility to mix and match different types of components. For example, different memory types can be combined with various processors, depending on the requirements of the final product.

SMT POP Structure

POP stacking assembly typically involves placing components on top of each other, usually combining logic and memory devices. The structure can range from 2 to 4 layers, with memory PoP going up to 8 layers. Although the overall height increases slightly, each component can be tested individually before assembly, ensuring higher yield rates and minimizing total assembly costs.

PCB Assembly Layers of PoP:

Amkor PoP Typical Structure:

Bottom PSvfBGA (Package Stackable very thin fine pitch BGA)

Top Stacked CSP (fine pitch BGA)

Bottom PSvfBGA Structure:

Dimensions: 10-15mm

Pad pitch: 0.65mm, with bottom ball pitch at 0.5mm (0.4mm)

Substrate: FR-5

Ball material: 63Sn37Pb/Pb-free

Top SCSP Structure:

Dimensions: 4-21mm

Bottom ball pitch: 0.4-0.8mm

Substrate: Polyimide

Ball material: 63Sn37Pb/Pb-free

Ball diameter: 0.25-0.46mm

SMT POP Manufacturing Process

The manufacturing process for Package on Package technology is a multi-step procedure that demands precision and careful attention to detail to ensure the successful assembly of high-performance electronic devices. Here’s an extended explanation of each stage in the PoP manufacturing process:

1. Non-PoP Side Component Assembly

The PoP process begins with the assembly of components on the non-PoP side of the PCB. This involves standard SMT assembly processes:

Stencil Printing: Solder paste is applied to the designated pads on the PCB using a stencil.

Component Placement: Using automated pick-and-place machines, surface-mount components are accurately positioned onto the solder-pasted pads.

Reflow Soldering: The PCB is then passed through a reflow oven, where the solder paste is heated to its melting point, securing the components to the board.

Inspection: The solder joints are inspected using Automated Optical Inspection (AOI) to ensure that they are correctly formed and that the components are properly placed.

2. Solder Paste Printing on the PoP Side

After completing the assembly on the non-PoP side, the PCB is flipped, and solder paste is printed on the pads where the bottom PoP component will be placed. This step is crucial, as the quality of the solder paste application directly affects the integrity of the solder joints between the PoP components.

3. Placement of Bottom Components and Other Devices

The bottom components, which typically include the logic processor, are placed onto the solder-pasted pads using high-precision pick-and-place equipment. This placement must be extremely accurate to ensure proper alignment with the top component in the subsequent steps.

4. Flux or Solder Paste Dipping for the Top Components

Before the top component is placed, it is dipped in flux or a thin layer of solder paste. This dipping ensures that the solder joints between the top and bottom components are robust and reliable. The flux helps to clean the surfaces and promote better solder flow during reflow, while the solder paste provides additional material for the solder joints.

5. Placement of Top Components

The top component, typically a memory chip, is then placed onto the bottom component. This step requires precise alignment to ensure that the solder balls on the top component correctly match the pads on the bottom component. Any misalignment can lead to defective connections and, consequently, a malfunctioning device.

6. Reflow Soldering and Inspection

Once the top component is placed, the entire assembly is subjected to reflow soldering. During this process, the PCB passes through a reflow oven where the solder paste re-melts, forming solid connections between the components. The temperature profile during reflow must be carefully controlled to prevent warping or damaging the delicate PoP structure.

After reflow, the assembly is inspected using AOI or X-ray inspection to verify the quality of the solder joints, particularly the hidden joints between the top and bottom components. X-ray inspection is often employed because it can penetrate the layers and provide a clear view of the solder joints, ensuring there are no voids, misalignments, or insufficient solder.

7. Final Testing and Quality Control

The assembled PoP structure undergoes a series of electrical tests to ensure functionality. This includes testing for continuity, shorts, and the performance of the integrated components. High-quality PoP assemblies should pass all functional tests without issue, confirming that the solder joints and component placements are reliable.

8. Packaging and Shipping

After passing the final tests, the PoP assemblies are cleaned to remove any residual flux or contaminants. They are then packaged according to the customer’s requirements and prepared for shipping. Proper packaging is essential to protect the sensitive PoP structures from damage during transit.

POP Design Considerations

Factors affecting the spatial relationship include substrate and component design, substrate manufacturing processes, component packaging processes, and SMT assembly processes. Key aspects to consider are:

Pad design
Solder mask opening
Ball size and height variation
Amount of flux or solder paste applied
Placement accuracy
Reflow environment and temperature
Warpage of components and substrate
Bottom component molding thickness

What are the advantages of POP smt process?

POP is mainly a system integration 3D package developed for mobile devices, and its structure mainly has the following characteristics.

Storage devices and logic devices can be freely combined, and can be tested or replaced separately to ensure the yield.
POP is stacked in the vertical direction, saving the board area and improving the system packaging density.
The vertical interconnection of stacked devices replaces the traditional two-dimensional package interconnection, which can realize faster data transmission between logic devices and storage devices.

With the development of technology, the following main types of POP structures have emerged.

Solder Ball Connected PoP

Logic chips have more I/0 ports, so they are often packaged with Flip Chip (FC) technology and used as the bottom component. The bottom chip adopts Capillary Under Fill (CUF) technology.

MLP Connected PoP

In order to develop a thinner PoP Package structure, MoldimgLaser Package (MLP) technology came into being, also known as Through Mold Via (TMV) technology on the market. The method is to first weld the tin ball around the bottom chip and directly plastic seal, and then use laser perforation to expose the tin ball for subsequent connection with the upper components.

Folded and BVA Connected PoP

In order to meet the requirements of thin size, strong function and large I/0 number of PoP products, flexible circuit boards are used to connect various package components and fold to form PoP structure, and BVA (Bond Via Array) is used to improve product performance and reduce pin spacing.

POP Applications

1. Smartphones: PoP is widely used in smartphones, like the Meizu 16S, for integrating application processors and memory.

2. Wearable Devices: PoP is commonly used in next-generation wearable devices.

3. Electronic Watches: PoP packaging is key for improving performance and reducing costs in electronic watches.

4. Earphones: The Meizu POP Pro noise-cancelling earphones utilize PoP technology.

5. Health Watches: Huami’s Amazfit Pop, one of the most affordable blood oxygen monitoring watches, uses PoP technology.

For more information about our POP Assembly capabilities, please contact us any time! We can be reached via email at sales@bestpcbs.com, or toll free at +86-755-2909-1601.

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What file type is used for PCB schematic drawings?

September 3rd, 2024

PCB printed circuit boards are essential to achieving the functionality of electrical devices, but before the final board can be manufactured, a carefully drawn schematic is essential. The PCB schematic is the blueprint that guides the actual design and manufacture of the circuit board. The schematic and Gerber files are key elements in the PCB manufacturing process, and each plays a different role.

What is the schematic file for PCB?

The schematic file is the foundation of any PCB design. It represents the logical connections and relationships between different components in the circuit. Think of it as a map showing how each component, such as resistors, capacitors, and microcontrollers, is connected to form a functional circuit.

What file type is used for PCB schematic drawings?

When creating a PCB, the schematic file is the first step. It is used to document the design and is essential to ensure that the final product functions as expected. Engineers use specialized software to create these schematic files, which can then be converted into the layout of the physical PCB.

What is PCB CAD file?

‌PCB CAD files‌ are files directly output or saved by EDA software for PCB design. These files contain information about each layer of the PCB, network connection information, component information, etc. They are very comprehensive and contain almost all the information of the circuit board.

This format is mainly used for the storage and exchange of circuit board design, and contains information such as the layout, connection, pad, and drilling of each component on the circuit board.

In circuit board design, designers use circuit board design software to draw circuit schematics, layout, connection, component placement, etc., and finally generate a PCB file, and then load the file onto the circuit board to realize the production of the circuit board.

In addition, PCB CAD files play an important role in the offline programming of SMT placement machines. Offline programming refers to the work of compiling SMT placement programs on a computer using offline programming software and PCB CAD design files.

This programming method can save online programming time, thereby reducing the downtime of the entire PCBA processing and improving the utilization of equipment. Offline programming software is often used in automated production processes to ensure efficient and accurate completion of the placement of electronic components.

What files are needed to make a PCB?

Creating a PCB is a multi-step process involving multiple different files, each with its own unique purpose.

1. Schematic file (.sch, .dsn): represents the logical connection of the circuit and is the blueprint of the entire PCB design process.

2. Netlist file (.net, .xml): generated based on the schematic, lists all components and their connections.

3. Gerber file (.gbr, .pho): Gerber file is the most important file for manufacturing PCB. Define each layer of the PCB, including copper wire, solder mask and silk screen printing layer, each layer of the PCB requires its own Gerber file.

4. Drill file (.drill, .drl): specifies the location of the holes drilled on the PCB. It includes information on the size and location of each hole.

5. Bill of Materials (BOM, .bom, .csv): BOM lists all the components required to assemble the PCB. Including part number, quantity and other details required for procurement.

6. Pick and place file (.txt, .csv): used in the assembly process to specify the precise location of each component on the circuit board.

What is the file type for circuit schematic?

The file type for a circuit schematic can vary depending on the software used to create it.

1. .SCH: This is the most common file extension for schematic files.

2. .DSN: This is another standard for schematic files.

3. .PDF: Although PDF is not a design file, it is often used to share schematics for review. It provides a non-editable version of the schematic that can be easily viewed.

4. .XML: Some tools export schematics as XML files for compatibility with other software. This format is useful for exchanging data between different design tools.

5. .PNG/.JPG: Image formats such as PNG or JPG are sometimes used to share simple schematics. These are not editable, but can provide a quick way to visualize the circuit.

What does a Gerber file contain?

Gerber is actually a description file that focuses more on PCB manufacturing and production. It should be said that it was originally designed for plotters. Therefore, the content of Gerber basically includes the information required for PCB manufacturing, such as copper foil circuit layer, solder mask layer, silk screen layer, legend layer, drill layer, etc. Even solder paste printing layer, image recognition layer, annotations and production notes can be included in it in layers.

Advantages and Disadvantages of Gerber Files

Gerber files are not suitable for being used as a storage file format for current PCB design. Because the Gerber file format does not contain the connection information between the various circuit layers of the PCB.

If you look closely at the Gerber file structure, you will find that each layer is a small file, which means that the layers of Gerber are independent and unrelated to each other. They are like independent drawings. This feature had little impact on wiring engineers when PCBs were only single-sided or double-sided in the early days, but it is very disadvantageous in design, operation, debugging and verification for the increasingly complex multi-layer PCBs. Therefore, almost no one uses Gerber files as the file format for PCB design.

Because the amount of information in Gerber files is small, its file size is much smaller than other design files drawn by EDA or CAD software. In addition, its format is more irreversible in design and protects the original design. In addition, its vector image layered format is still very suitable for use in PCB manufacturing. Today, PCB production generally follows this layer to divide the process into different stages for production, so Gerber files are still widely used in PCB production.

Therefore, some design companies with high confidentiality requirements will convert the design files into Gerber before sending them to the PCB factory for production, trying to keep confidentiality.

Conclusion:

For anyone working in the electronics industry, it is essential to understand the various file types used in PCB design. From the initial schematic file to the final Gerber file, every step in the design process relies on accurate and compatible files. BEST Technology has a professional PCB design team with rich experience in different PCB designs. We can solve all your PCB design problems.

Tags: PCB, pcb design, PCB schematic, PCBA
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What is an LED circuit board?

September 3rd, 2024

In today’s fast-growing electronics industry, LED (light-emitting diode) technology has become a game-changer in lighting and display applications. LED PCB (printed circuit board) is essential for effectively powering and controlling LEDs. It plays a key role in ensuring the efficiency, lifespan and performance of LED lighting systems.

As the demand for energy-efficient lighting solutions continues to increase, understanding the complexity of LED light PCB design has become critical for engineers, designers and manufacturers. These circuit boards require special manufacturing steps in addition to design guidelines.

What is led light circuit board?

LED light circuit board is the abbreviation of printed circuit board, which is mainly used to carry and connect electronic components of LED lamps. ‌LED light circuit board is usually made of aluminum substrate and FR-4 fiberglass circuit board, where the LED aluminum substrate is printed on the aluminum plane with good thermal conductivity, and then the electronic components are soldered on it. ‌This design helps to improve the heat dissipation performance and stability of LED lamps, and ensure that the LED lamps can work stably for a long time.

What is an LED circuit board? How to make it?

The main function of LED light circuit board is to provide power to LED lamp beads and control the brightness and color of its LED lamp beads. In order to light up the LED lamp beads, an LED driving circuit is required, which includes constant voltage driving, constant current driving, PWM driving and other methods, which are usually integrated on the small circuit board of the LED lamp.

In addition, the design and manufacture of the LED lamp circuit board take into account the characteristics of LED, such as long life, high light efficiency, no radiation and low power consumption. Compared with traditional light sources, such as incandescent lamps and fluorescent lamps, LED lamps have significant advantages in efficiency, life and environmental protection.

How to make led light circuit board?

The process of making LED lamp circuit boards involves multiple steps, including welding, self-inspection, mutual inspection, cleaning, friction, wiring, etc.

Determine the direction of the lamp: the front side is facing up, and the side with the black rectangle is the negative end.

Determine the direction of the circuit board: the front side is facing up, and the end with two internal and external wiring ports is the upper left corner.

Welding: Carefully weld each solder joint to ensure fullness, cleanness, and no false soldering or leaking. ‌

Self-inspection: After completing the welding, first check whether there is a cold solder joint, leaking solder joint, etc. Use a multimeter to touch the positive and negative terminals of the circuit board to check whether the LED lights are on at the same time. ‌

Mutual inspection: After the self-inspection, it will be handed over to the person in charge for inspection. Only with the consent of the person in charge can it flow into the next process. ‌

Cleaning: Use 95% alcohol to scrub the circuit board to remove residues and keep the circuit board clean.

Friction: Use fine sandpaper (coarse sandpaper if necessary) to grind off the burrs on the edge of the circuit board so that the circuit board can be placed flatly in the fixing seat. ‌

Wiring: Use blue and black thin wires to connect the circuit board. The wiring point close to the inner circle is negative and connected to the black wire; the wiring point close to the outer circle is positive and connected to the red wire. ‌ Make sure the wires are connected from the back to the front. ‌

Self-check and mutual check: Check the wiring to ensure that each wire passes through the pad, the length of the wires on both sides of the pad that remain on the surface should be as short as possible, and the thin wires will not break or loosen when gently pulled. ‌‌

Through the above operations, the production of the LED lamp circuit board can be completed. ‌Each step is crucial, especially the welding and wiring parts. It is necessary to ensure the quality of the welding points and the correct connection of the wires to ensure the normal operation of the circuit board and the normal lighting of the LED lamp.

Why do you need a resistor with an LED?

When using LED, a resistor needs to be connected in series to control the current, prevent excessive current from damaging the LED, and ensure that the LED can emit light normally. ‌

LED is a semiconductor device that can directly convert electrical energy into light energy. Due to its special material properties, LED is very sensitive to current, and excessive or insufficient current may cause the LED to malfunction or be damaged.

Therefore, when the LED is connected to the power supply, a resistor is needed to limit the current to ensure that the LED can work stably and safely.

The main function of this resistor is voltage division and current limiting. It is used to adjust the current passing through the LED to prevent the LED from burning out due to excessive current, while also ensuring that the LED can emit light of appropriate brightness.

Specifically, when current passes through the LED, the resistor will produce a certain voltage drop, thereby reducing the voltage applied to both ends of the LED, thereby controlling the current passing through the LED.

What resistor to use with LED?

Use an LED resistor calculator to help determine the required resistor value. ‌

When using LEDs, in order to protect the LED and ensure its normal operation, it is usually necessary to limit the current by connecting an appropriate resistor in series. This is because each LED has a maximum current value, exceeding which may cause the LED to be damaged.

Using an LED resistor calculator can help you determine the required resistor value to ensure that the current does not exceed the maximum tolerance of the LED.

By entering the relevant parameters of the LED (such as the rated current and voltage), the calculator will automatically calculate the required resistor value to protect the LED from overcurrent damage.

This method is a common practice and is applicable to any situation where a number of LEDs are used in series. In this way, the safe operation of the LED can be ensured while avoiding damage caused by excessive current.‌

How to improve the heat dissipation performance of LED light circuit boards?

The key to improving the heat dissipation performance of LED light circuit boards is to optimize the heat dissipation path, use efficient heat dissipation materials, and adopt advanced heat dissipation technology.

Optimize the heat dissipation path:

Understanding the heat transfer path of the heat generated by LED components is the first step to improve heat dissipation performance. Heat moves from the LED components through the package wires to the circuit board, and then dissipates through the heat sink.

The heat dissipation efficiency can be effectively improved by using materials with good thermal conductivity, expanding the cross-sectional area of the path (such as using thick copper wire), and applying thermal lubricants to reduce the gaps in the connection parts.

Use efficient heat dissipation materials:

Metals such as copper and aluminum are often used to make heat sinks because of their good thermal conductivity. In addition, new materials such as graphene are also used to make heat sinks because of their excellent thermal conductivity. These materials can significantly improve heat dissipation efficiency. ‌

Adopting advanced heat dissipation technology:

Micro-groove group composite phase change integrated cooling technology is an advanced heat dissipation technology. It effectively removes the heat of high-power electronic devices by changing the closed-circulation cooling medium into a nano-scale water film and utilizing its strong evaporation ability and latent heat exchange ability.

As an excellent thermal conductive medium, thermal conductive silicone grease has excellent electrical insulation and thermal conductivity. It can penetrate into the tiny depressions on the metal surface, increase the contact area, and improve the efficiency of heat conduction from the LED chip to the aluminum substrate.

Are LED PCBs only used in lighting systems?

The application range of LED PCB (printed circuit board) is far more than lighting systems. In addition to lighting systems, LED PCB is also widely used in other fields. For example, LED lamps are one of the most common products using LED PCBs. Whether it is home lighting, commercial lighting or outdoor lighting, LED lamps occupy a large market share.

Compared with traditional incandescent lamps and energy-saving lamps, LED lamps have higher luminous efficiency, longer service life and lower energy consumption. They also have features such as dimming and color change, which can meet the needs of different scenarios. ‌

In addition, LED PCB is also used in LED display screens, LED backlight sources and automotive lighting. LED display screens provide high-definition and high-brightness display effects in large-scale events such as sports events, concerts, and exhibitions, bringing a shocking visual experience to the audience.

LED backlight sources have become the mainstream choice in electronic products such as LCD monitors, mobile phones, and tablet computers. Compared with traditional cold cathode fluorescent lamps, LED backlight sources have higher brightness, longer service life and lower energy consumption. At the same time, they can achieve local dimming, improve display effects and reduce energy consumption.‌

In the field of automotive lighting, with the advancement of automotive lighting technology, more and more cars are beginning to use LED lamps. Compared with traditional halogen and xenon lamps, LED car lights have higher brightness, longer service life, lower energy consumption, faster response speed and better heat dissipation performance, which improves driving safety. ‌

From this we can know that the application of LED PCB is not limited to lighting systems, but is widely used in many fields, including but not limited to lighting, display technology, backlight sources of electronic products, and automotive lighting. ‌

Conclusion:

Designing PCB for LED lights is a complex but critical task that requires careful consideration of various influencing factors, from the selection of manufacturing materials to the testing of thermal conductivity and the quality testing of finished products. Choosing Best Technology has expert design assistance and reliable manufacturing processes, which will allow you to obtain the best results for LED light PCB design. ‌

Tags: LED, LED circuit board, PCB, pcb design, PCBA
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How much does a custom pcb cost per unit? How to calculate?

September 2nd, 2024

In the field of electronic manufacturing, PCB (Printed Circuit Board) is an indispensable basic component. For electronic equipment manufacturers, it is very important to accurately calculate the cost of PCB circuit boards.

In the PCB processing plant, the cost estimation method of PCB is composed of many factors. Most of the cost comes from the number of layers, materials, drilling volume, and surface treatment process of the board. Generally speaking, the board cost is about half of the total cost.

What is the average cost of a PCB?

The average cost of PCB varies due to many factors, and there is no fixed value. ‌

The cost of PCB is mainly composed of the following parts:

1. Substrate cost: Substrate is the basic component of PCB. Common material types include FR4, CEM-1, aluminum substrate, etc. The price of different types of substrates varies greatly.

How much does a custom PCB cost per unit? How to calculate?

2. Process cost: The manufacturing process of PCB includes inner layer circuit production, lamination, drilling, electroplating, outer layer circuit production, solder mask treatment, text printing and surface treatment. Each step requires professional equipment and technicians to operate, so there will be corresponding costs.

3. Inspection cost: After the PCB is manufactured, a series of tests are required to ensure its quality, including electrical performance testing, reliability testing, and appearance inspection.

4. Other additional expenses: In addition to the above main costs, there are some additional expenses to consider, such as special design or modification services may require additional design fees. In addition, additional costs such as packaging, transportation, and taxes also need to be taken into consideration.

In summary, the cost of PCB is composed of multiple aspects, including substrate cost, process cost, inspection cost, and other additional expenses, which need to be comprehensively evaluated based on specific board type, number of layers, drilling amount, surface treatment process, and other factors.

How to calculate PCB design cost?

‌Material cost is an important part of design cost, including board, solder mask ink, chemical agents, etc. These costs are relatively easy to calculate, but the additional losses caused by material loss and risks during storage and use need to be considered.

‌Process cost covers equipment use time, worker wages, energy consumption, etc. When calculating the cost of equipment use, the frequency and duration of equipment use and the total investment cost should be taken into account.

‌Equipment depreciation and maintenance costs‌ are also a part that cannot be ignored, including the original price of the equipment, accumulated depreciation, and maintenance and repair costs.

‌Other related costs‌ such as administrative costs, quality control costs, and R&D costs, although more difficult to calculate, have a significant impact on the total cost of the project.

Material costs include substrate materials, circuit board materials, and copper foil, processing costs involve drilling, copper plating, graphic etching and other processes, and labor costs include direct and indirect labor costs. Through these calculations, plus a reasonable profit margin, the final PCB quotation is obtained.

What is the most expensive PCB?

The most expensive PCB may be an electroless nickel electroless palladium immersion gold (ENEPIG) PCB.

This electroplating material has a copper-nickel-palladium-gold layer structure that can be directly bonded to the electroplating layer through wires. The last layer of gold is very thin, just like electroless nickel immersion gold (ENIG).

The gold layer is soft, so excessive mechanical damage or deep scratches may expose the palladium layer. Although the gold layer is soft, ENEPIG’s PCB is often considered the first choice in high-end applications due to its high-quality electrical performance and durability, so its cost is relatively high.

In addition, the production of high-end precision PCB circuit boards is also expensive, including multi-layer boards, boards with BGA, HDI circuit boards, etc. These products usually require more complex production processes and higher material quality, so the cost is also relatively high.

How much does PCB assembly cost per component?

The PCB assembly cost of each component is composed of multiple factors, including board costs, processing costs, testing costs, and other additional costs. ‌

Board costs are an important part of PCB assembly costs. The types of boards, such as FR4, CEM-1, aluminum substrates, etc., have large price differences.

FR4 boards are widely used due to their excellent electrical and processing properties, but their prices are affected by fluctuations in the prices of raw materials such as international copper prices, epoxy resins, and glass fiber cloth.

Aluminum substrates are favored in certain specific applications due to their good heat dissipation performance, but their prices are usually much higher than FR4 boards.

‌Processing costs‌ cover multiple links in the PCB manufacturing process, such as inner layer circuit production, lamination, drilling, electroplating, outer layer circuit production, solder mask, text printing and surface treatment.

Each link requires professional equipment and technicians to operate, so there will be corresponding costs. In particular, the costs of steps such as drilling and electroplating will vary according to factors such as the number of holes, the area and thickness of the electroplating.

‌Testing costs‌ are an important link to ensure the quality of PCBs. After the production is completed, the PCB needs to undergo a series of tests, including electrical testing, reliability testing, and appearance inspection.

These tests require not only professional testing equipment, but also experienced testers to operate and analyze the results, so certain costs will also be incurred.

‌Other additional costs‌ include additional design fees that PCB manufacturers may charge if customers require special design or modification services. In addition, there are some additional costs such as packaging, transportation and taxes that need to be taken into account.

In summary, the PCB assembly cost of each component is determined by the board cost, processing cost, testing cost and other additional costs, and the specific cost will vary according to the specific needs of the project and the manufacturer’s quotation.

What is the cheapest PCB finish?

The cheapest PCB surface treatment process is hot air solder leveling (HASL). ‌

HASL is a commonly used PCB surface treatment process, which is divided into lead-containing tin and lead-free tin. It is one of the most commonly used and relatively inexpensive surface treatment processes.

This process is to immerse the circuit board in molten solder (tin/lead), and then the solder covers all exposed copper surfaces on the board to form a HASL surface finish.

HASL is not only one of the cheapest types of PCB surface treatment, but its process temperature is 250℃, the shelf life can reach 12 months, and the surface treatment thickness ranges from 1-40um, making it an economical and practical choice.

In addition, HASL is divided into leaded and lead-free. Although the leaded version is gradually replaced by the lead-free version for environmental reasons, the lead-free HASL still maintains a low cost, making it the preferred choice for projects with limited budgets‌.‌

Do vias make PCBs more expensive?

Vias may indeed increase the cost of PCBs. ‌

Vias are an important part of multi-layer PCB boards, and they play a key role in the design and manufacturing process of circuit boards. Vias can be divided into buried vias, blind vias and through holes. Among them, through holes pass through the entire circuit board and are used to achieve internal interconnection or component installation and positioning. They are the most commonly used types.

The number and type of vias directly affect the cost of the PCB, because each via needs to go through processes such as drilling and electroplating, which account for a considerable part of the cost of PCB board manufacturing.

Factors that affect the cost of PCBs also include the size of the vias. The smaller the via, the greater the manufacturing difficulty, and the corresponding increase in cost.

In addition, different types of vias require different processing technologies and materials, which also affects the cost. For example, the processing processes and difficulties of blind and buried vias are different, resulting in different prices.

The price difference between blind and buried vias is mainly caused by many factors such as material cost, complexity of processing process and difficulty of processing. Blind vias require double-sided or multi-layer composite boards, which have higher material costs, while buried vias can be processed using single-sided boards, which have relatively low costs.

In addition, the processing processes of blind vias are diverse, the process is complex, and higher technology and cost are required. The processing time is long and the manufacturing cost is relatively high.

In summary, the number, type, size and processing method of vias will affect the cost of PCB. When designing PCB, it is necessary to find a balance between function and cost to optimize the design and cost control.

Conclusion:

The unit cost of PCB is affected by many factors, including but not limited to the number of layers, material, drilling amount, and surface treatment process of the board. BEST Technology has many years of experience in PCB board design and has skilled experience in handling various factors that affect PCB cost. It can help you find the best way to solve all your concerns about PCB cost.

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What file types are used for PCB design?

September 2nd, 2024

What file type is used for pcb designs?Generally, PCB boards require Gerber files, drilling files, bill of materials (BOM), manufacturing drawings and assembly drawings. The Gerber file suffix is .gbr, the drilling file suffix is (.drl), and the PCB schematic file suffix is .schdoc. The drilling file is usually in Excellon format (.xin). The center coordinate file is also called the pick and place file, which is provided in CSV (comma separated value) format.

Ｗhether it is an individual or a company making PCB boards, PCB boards generally require Gerber files, drilling files, bill of materials (BOM), manufacturing drawings and assembly drawings. Among them, Gerber files are a set of files, which are the most important and contain information about each layer of the PCB to be used in production.

What files do I need to make a PCB?

Making PCBs (printed circuit boards) requires a series of files to ensure the smooth progress of the manufacturing process and the quality of the product.

‌Gerber file‌: This is the most common and crucial file in PCB manufacturing. It contains the geometric information of each layer of the PCB, such as copper lines, pads, solder mask layers and silk screen layers, and also includes separate files for each PCB layer, such as top copper, bottom copper, solder mask, silk screen layer, etc. ‌

What file types are used for PCB design?

‌Drill file‌: Provides drilling coordinates and size information for PCBs, and specifies the aperture size of components, vias and mounting holes. Drill files are usually generated in Excellon format or as separate ASCII files‌.

‌Bill of Materials (BOM): A BOM is a detailed list of all components used in a PCB design, including information such as part number, component value, description, and quantity, which helps ensure that all required components are correctly sourced and placed on the PCB.

‌Center Coordinate File: Also known as a pick and place file, it provides coordinate and orientation information for each component on the PCB and is essential for the automated assembly process. Center coordinate files are usually provided in CSV format.

‌Fabrication Drawing: This is an engineering drawing that includes key information about the PCB, such as board dimensions, drill hole dimensions, layer stackup, tolerances, surface finish, and other manufacturing-related details, which serves as a reference for PCB manufacturers during the production process.

‌Assembly Drawing: Provides additional information for the PCB assembly process, including component placement details, reference numbers, orientation, and any special instructions for assembly technicians.

In addition, depending on the specific design and production needs, other documents may also be required, such as circuit diagrams, special layer files, installation instructions and precautions, etc. ‌ The preparation and provision of these documents is a key step in ensuring a smooth PCB production process.

What are Gerber files? What information do they contain?

Gerber files are a series of ASCII vector format files that define PCB design specifications. They are generated using electronic design automation (EDA) or computer-aided design (CAD) tools and provide information such as board configuration parameters, aperture descriptions, XY coordinate locations, and drawing instructions.

Configuration details include the size and shape of the PCB to be manufactured. Each layer of the board information is recorded in a different file to define components such as copper traces, pads, vias, solder mask, silk screen, and logos. The Gerber file indicates the XY coordinate location of each geometric shape and uses instructions to draw these shapes on the physical board.

The basic components of the Gerber file include: board size, shape, top assembly, top silk screen, top solder mask, top paste, top copper, internal signals, inner layers, bottom copper, bottom paste, bottom solder mask, bottom silk screen, bottom assembly, and manufacturing information (providing stackup, drilling details, cutting, etc.).

Gerber files generated by computer-aided manufacturing (CAM) tools have user-selected extensions, usually using project naming such as “.TOP” for top layer, “.BOT” for bottom layer, and “.drl” for drill data.

How is a PCB designed?

PCB design is a complex process that involves multiple steps and considerations to ensure the functionality and reliability of the final product.

‌Schematic Design‌: First, you need to prepare a schematic and component library. The schematic is the blueprint of the circuit design, while the component library contains information about the various components used in the circuit.

‌Component Symbols and Packages‌: The symbol of the component is used to represent the component in the schematic, while the package defines the physical form of the component on the PCB. The component symbol is used in the schematic design stage, while the package is used in the PCB layout and routing stages.

How is a PCB designed?

‌PCB Layout‌: The layout stage involves placing electronic components on the PCB, and factors that need to be considered include the orientation, size, and relative position of the components.

‌Routing‌: After the layout is completed, the next step is the routing stage, which is to connect the various components according to the needs of the circuit.

‌DRC Check‌: Design rule checking (DRC) is performed during the design process to ensure that the design complies with predetermined electrical and physical rules. This includes checking for shorts, open circuits, and other possible design errors.

‌Solder mask and solder paste layer‌: The solder mask is used to prevent unnecessary soldering, while the solder paste layer is used to specify solder joints. The correct design of these layers is critical to ensuring the reliability and manufacturability of the circuit board.

‌Network and DRC Check‌: In the final stage of design, network checks are performed to ensure that all components are properly connected, while DRC checks are performed to verify that the design complies with all electrical and physical rules.

‌Through the above steps, designers are able to transform the circuit design in the schematic into an actual, manufacturable PCB. This process requires comprehensive consideration of multiple factors such as the functionality, reliability, and manufacturing cost of the circuit.

‌What is the schematic file for PCB?

‌PCB schematic files are the main files used for circuit design, analysis, and debugging. They mainly show the electrical connection relationship between electronic components, but do not reflect the actual physical location of these components on the PCB board. ‌

Schematic Diagram is the basis of circuit design. It uses symbols and lines to express the connection and working principle of the circuit in a concise and clear manner, and pays more attention to the functional expression of the circuit.

Schematic diagram does not involve the specific layout and wiring of electronic components on the PCB board, so it focuses on the logical representation of the circuit rather than the physical implementation. ‌

In contrast, PCB design files plan the precise location and wiring of electronic components on the PCB board in detail, taking into account the connectivity of the circuit, and also comprehensively considering factors such as signal integrity, power distribution, thermal design, and mechanical strength. ‌

These design files are the main files used to manufacture actual electronic devices, including PCB layout and PCB wiring. The layout determines the location of electronic components on the circuit board, while the wiring involves the electrical connection between components. ‌

In general, schematic files and PCB design files play different roles in the design and manufacturing process of electronic products. The former focuses on the expression of circuit logic and function, while the latter focuses on converting this logic into actual physical implementation, including the specific location and connection method of components. ‌

What is the difference between PCB design and schematic design?

The main difference between PCB design and schematic design lies in their purpose, content and application scenarios. ‌

‌Purpose and content‌:

Schematic design focuses on describing the logical relationship and electrical performance of the circuit, using graphic symbols to display power, components and connections, and can clearly show the logical relationship of the internal circuit of the electronic device. It is mainly used for circuit analysis and design, helping to understand the working principle of the equipment and perform fault diagnosis‌.

PCB design focuses on describing the actual physical size, position and wiring of components, and is the actual circuit board layout and wiring design based on the schematic diagram. It is mainly used to guide the manufacture and assembly of PCBs, reflecting the actual layout and wiring of electronic equipment‌.

‌Application scenarios‌:

Schematic design plays an important role in the process of R&D, debugging and maintenance, and is a key tool for understanding the working principle of the equipment and performing fault diagnosis‌.

PCB design files are an important basis for the actual PCB board manufacturing and subsequent assembly, debugging and other processes‌.

In short, schematic design is the basis of electronic product development. It provides information such as the logical relationship and electrical performance of the circuit, while PCB design is the key link to convert the schematic into an actual circuit board. It is necessary to design components layout and wiring according to the requirements of the schematic.

What is a PCB stencil file?

A PCB stencil file is a pre-designed file template used to quickly generate PCB design files containing specific information.

These template files usually contain basic information such as board size, board layer settings, grid settings, and title bar settings. Users can quickly generate new PCB design files based on these templates, thereby speeding up the design process.

By using these templates, designers can avoid designing these basic settings from scratch, saving time and energy, and focusing on more complex circuit design details.

Conclusion:

There are many types of PCB design files, among which Gerber files are the most important. The information they contain is the most and the most important. The final quality of the PCB circuit board depends on the first step of design. BEST Technology has very professional PCB designers who have many years of industry experience and can meet all your needs.

Tags: PCB, pcb design, PCBA, printed circuit board
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USB interface: From Type-A to Type-C, which interface do you use most?

September 2nd, 2024

What are USB Ports?

The USB end is a connection for connecting a consumer electronics device such as an accounting machine. USB’s general name is a universal skewer line. USB end support USB support for connection. If you have a USB connection, you can set up a number of numbers. In addition, a USB port is also available, as well as a power supply. This end is fully equipped with the power.

The USB calculation function has additional functions, and one small adjustment can be made alternately. Please contact us if you have any questions about USB. With the advancement of technology, the current functionality of the USB end is greatly enhanced. Because of this, this is a small change to the end of the road. USB is important for three major directions. In this regard, the dimensions are the external size, the number of speeds, the visual power of the power.

USB interface: From Type-A to Type-C, which interface do you use most?

Usb connector types

Types of USB connectors: different types of connectors with different shapes and directions, USB connectors can be separated into different types:

Type-A port: This is the most common type of USB port, the shape is long and rectangular, and the support is heat-resistant. Computer equipment such as printing machine, keypad, mouse button, driving device, etc. Type-A interface has USB 2.0 and USB 3.0 in different editions, among which USB 3.0 has faster speed, color is usually blue, and USB 2.0 has slow speed, color is black.

Type-B contact: Type-B contact shape is round shape, demand-specific connection. For general use, external equipment such as audio equipment, viewing equipment, etc., such as a 3.5 inch movable screen, stamping machine, display device, etc.Type-B verbal usage scene is relatively small, so this is an unusual sight in daily life.

Usb connector types:Type-A port:Type-B contact

Type-C port: Type-C port is a new type of USB port that has emerged in recent years. Built-in USB 3.1, Type-C interface configuration, mainstream interface type, intelligent handheld computer, flat panel battery, notebook battery, etc. The biggest feature of the Type-C interface is its support and double-sided insertion, making it convenient and convenient to use.

Type-C interface support further improves the speed and power of the power, and provides more advanced usage experience. Previously, when I came here, I was confused as to how to get around the main machine.

Mini USB port Micro USB port

Mini USB port Micro USB port: There are many types of ports for transfer equipment, digital reading machine, digital image machine, metering equipment, etc. Mini USB port ratio Micro USB port size is small, also known as a USB port, Micro USB port is smaller, thinner, supports OTG function, and provides a number of additional power functions. The Micro USB port is convenient and easy to use, and has various types of portability.

What functions does USB have?

Power Delivery of USB Ports
Some USB cables can deliver power as well as transfer data, but most USB cables can do both. Power delivery of USB ports is mainly divided into three categories: fast charging, quick charging, and power only.
USB Data Transfer Speed
USBs come in various sizes and shapes. Also, USB types have multiple speed standards. It is important to know that some USB cables are designed for data transfer only, while some can only deliver power. However, some USB cables can serve both purposes at the same time. Therefore, it is necessary to verify the performance of the cable before purchasing it.
USB Video Transfer
The ability of USB ports to power devices and transfer data between devices is already impressive enough. However, you can decide to integrate USB-C to connect a monitor in place of a VGA cable or HDMI. In addition, USB-C also supports 4K video transmission.

What are the advantages of USB interface?

Standard uniformity. The most common ones are hard disks with IDE interfaces, mouse and keyboards with serial ports, and printers and scanners with parallel ports. However, with USB, all these application peripherals can be connected to personal computers using the same standard. At this time, there are USB hard disks, USB mice, USB printers, etc.
Easy to carry. Most USB devices are known for being “small, light, and thin”, which is very convenient for users to carry large amounts of data with them.
Hot-swappable. That is, when users use external devices, they do not need to shut down and restart the computer, but directly plug in the USB when the computer is working.
Multiple devices can be connected. USB often has multiple interfaces on personal computers, and several devices can be connected at the same time. If a USB HUB with four ports is connected, four USB devices can be connected, and so on. You can connect all the devices to a personal computer at the same time without any problems (up to 127 devices can be connected).

How Do USB Ports Work?

USB is an external bus standard used to regulate the connection and communication between computers and external devices. The USB interface has plug-and-play and hot-swap functions. The USB interface can connect 127 peripherals, such as mice and keyboards. USB was jointly launched by Intel and other companies in 1994 and has successfully replaced serial and parallel ports since 1996. It has become a must-have interface for computers and a large number of smart devices today. For most engineers, the main obstacles to developing USB2.0 interface products are: facing the complex USB2.0 protocol, writing USB device drivers by themselves, and being familiar with microcontroller programming.

Why USB Ports Are Replacing Serial Ports

USB has three major advantages. It is superior to serial ports in several aspects.

Speed
USB ports are able to transfer data at a much faster speed. They work ten times faster than regular parallel ports. Also, they are much faster than serial ports. On average, serial ports offer a data transfer rate of 150kbps. On the other hand, USB ports offer about 12 Mbps. The data transfer rate depends on the type of USB port. For example, USB 2.0 has a maximum data transfer rate of 480 Mbps.

Compatibility
USB ports have replaced serial ports in the past few years. Various industrial devices are equipped with serial ports. This replacement has brought problems. USB ports are generally compatible with most USB devices.

Durability
USB ports are more durable than serial ports. The tiny pins on a serial port can break or bend easily. Whereas USB ports are very sturdy.

Frequently Asked Questions

The USB interface cannot be used. It may be due to a problem with the system. You need to check whether the system service is disabled or reinstall the operating system.

‌BIOS setting problem‌. If USB is disabled in BIOS or CMOS, you need to restore it to the factory default settings.

‌USB driver is not installed or the driver is deleted‌. You need to install the USB universal driver.

‌The front USB cable is not connected properly‌. Try to insert the USB flash drive into the USB interface on the back of the chassis.

‌The USB interface voltage is insufficient. When the mobile hard disk is connected to the front USB interface, it may not be recognized due to insufficient voltage. You should use a hard disk box with an external power supply or replace the power supply.

‌Compatibility issues between the motherboard and the system‌. For example, the compatibility issues between the NF2 motherboard and USB require the installation of the latest dedicated USB2.0 driver and patch.

‌System or BIOS problem‌. When USB is disabled in the BIOS or operating system, you need to enable options related to USB devices.

‌Be careful when plugging and unplugging. Do not unplug during reading and writing, otherwise the chip may be burned.

‌If the USB device is frequently disconnected‌, it may be that the USB cable connection is unstable or there is a problem with the USB port. Try changing the cable or connecting to another USB port.

‌If the USB device cannot be recognized or charged‌, make sure the device is compatible and the cable is intact. Try connecting to another computer or updating the driver.

Tags: PCBA, SMT, usb
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Aluminum Printed Circuit Board Design＆Prototyping

September 2nd, 2024

As a leading aluminum printed circuit boards manufacturer with over 18 years experience, we provide full turn-key service for all the world. In our aluminum base print circuit boards factories, we equipped with advanced high precision manufacturing and testing equipment to ensure the high quality and fast delivery.

What is Aluminum Printed Circuit Board

Aluminum printed circuit board is a metal-based copper-clad board with good heat dissipation function. Generally, a single-sided board consists of three layers, namely the circuit layer (copper foil), the insulation layer and the metal base layer. There are also designs for high-end use as double-sided boards, with the structure of circuit layer, insulation layer, aluminum base, insulation layer, and circuit layer. Very few applications are multi-layer boards, which can be made of ordinary multi-layer boards, insulation layers, and aluminum bases.

LED aluminum printed circuit boards are just circuit boards made of aluminum alloy. In the past, our general circuit boards were made of fiberglass, but because LEDs generate a lot of heat, the circuit boards used for LED lamps are generally aluminum printed circuit boards, which can conduct heat quickly. The circuit boards used for other equipment or electrical appliances are still fiberglass boards!

What are the advantages of aluminum PCB?

Heat dissipation
Many double-sided boards and multi-layer boards have high density and high power, and it is difficult to dissipate heat. Conventional printed circuit board substrates such as FR4 and CEM3 are poor conductors of heat, with insulation between layers, and heat cannot be dissipated. If local heating of electronic equipment is not eliminated, electronic components will fail at high temperatures, and aluminum printed circuit boards can solve this heat dissipation problem.
Thermal expansion
Thermal expansion and contraction are the common nature of materials, and the thermal expansion coefficients of different materials are different. Aluminum-based printed circuit boards can effectively solve the heat dissipation problem, thereby alleviating the thermal expansion and contraction problems of different materials of components on the printed circuit board, and improving the durability and reliability of the whole machine and electronic equipment. In particular, it solves the thermal expansion and contraction problems of SMT (surface mount technology).
Dimensional stability
Aluminum-based printed circuit boards are obviously much more stable in size than printed circuit boards made of insulating materials. Aluminum-based printed circuit boards and aluminum sandwich panels, heated from 30℃ to 140~150℃, have a dimensional change of 2.5~3.0%.
Other advantages
Aluminum-based printed circuit boards have a shielding effect; high strength, replacing brittle ceramic substrates; ease of use, safe use of surface mounting technology; reducing the truly effective area of the printed circuit board; replacing components such as radiators, improving product heat resistance and physical properties; reducing production costs and labor.

How does an aluminum PCB work?

‌The working principle of aluminum printed circuit boards mainly relies on its unique three-layer structure: circuit layer (copper foil), insulation layer and metal base layer. This structure enables aluminum printed circuit boards to have good heat dissipation function.

Specifically, the power device is mounted on the circuit layer. When the device is running, the heat generated is quickly transferred to the metal base layer through the insulation layer, and then the metal base layer transfers the heat away, thereby achieving effective heat dissipation of the device. This design enables aluminum printed circuit boards to significantly reduce thermal resistance, provide excellent thermal conductivity, and maintain excellent mechanical properties.

Aluminum printed circuit boards also comply with RoHS requirements and are more suitable for SMT processes. In the circuit design scheme, heat diffusion is extremely effectively processed, the module operating temperature is reduced, the service life is extended, and the power density and reliability are improved. By reducing the configuration of heat sinks and other hardware, aluminum printed circuit boards can also reduce product size, reduce hardware and assembly costs, and optimize the combination of power circuits and control circuits.

Types of printed circuit board aluminum

‌The classification of aluminum printed circuit boards mainly includes flexible aluminum printed circuit boards, hybrid aluminum printed circuit boards, multi-layer aluminum printed circuit boards and through-hole aluminum printed circuit boards.
‌1. Flexible aluminum printed circuit boards ‌
Utilize flexible dielectric materials to provide excellent electrical insulation, flexibility and thermal conductivity, suitable for a variety of shapes and angles, and eliminate the need for expensive fixtures, cables and connectors.
‌2. Hybrid aluminum printed circuit boards ‌
In a “hybrid” IMS structure, “sub-assemblies” of non-thermal substances are processed independently and then bonded to an aluminum substrate using thermal materials. Common structures are 2-layer or 4-layer sub-assemblies made of FR-4, bonded to an aluminum substrate with thermal dielectrics, which helps dissipate heat, improve rigidity and act as a shield.
‌3. Multi-layer aluminum printed circuit boards ‌
In the high-performance power supply market, it is made of multi-layer thermally conductive dielectrics, with one or more layers of circuits buried in the dielectric, and blind holes are used as thermal vias or signal paths to provide effective heat dissipation solutions for complex designs.
‌4. Through-hole aluminum printed circuit boards‌
Before lamination, the aluminum is plated and filled with dielectric, thermal materials or sub-components are laminated to both sides of the aluminum using thermal bonding materials, and plated through holes pass through the gaps in the aluminum to maintain electrical insulation.

Aluminum PCB Structure

Circuit layer
The circuit layer (generally electrolytic copper foil) is etched to form a printed circuit for assembly and connection of devices. Compared with traditional FR-4, with the same thickness and line width, aluminum printed circuit boards can carry higher currents.
Insulation layer
The insulation layer is the core technology of aluminum printed circuit boards, which mainly plays the role of bonding, insulation and heat conduction. The insulation layer of aluminum printed circuit boards is the largest thermal barrier in the power module structure. The better the thermal conductivity of the insulation layer, the more conducive it is to the diffusion of heat generated by the device during operation, and the more conducive it is to reduce the operating temperature of the device, thereby achieving the purpose of increasing the power load of the module, reducing the volume, extending the life, and increasing the power output.
Metal base
The type of metal used for the insulated metal substrate depends on the comprehensive consideration of the thermal expansion coefficient, thermal conductivity, strength, hardness, weight, surface state and cost of the metal substrate.

Aluminum Printed Circuit Board Process

Material: Aluminum printed circuit board is a heat dissipation material with excellent thermal conductivity. Aluminum alloy materials with high thermal conductivity, high strength and good corrosion resistance are usually selected. Choosing the right substrate material has a very important influence on the stability and heat dissipation performance of aluminum printed circuit boards.

‌Cutting‌: Cut the substrate into plates of appropriate size and into the shape of the entire circuit board. Cutting methods include laser cutting, mechanical cutting, etc. After cutting, it needs to be polished to meet the requirements of the next drilling.

Grinding‌: Grinding is to form a smooth surface on the substrate material and facilitate the next drilling operation. Factors affecting the grinding effect include the type and accuracy of the tool, the type and concentration of the grinding fluid, the pressure, etc.

Drilling‌: Drilling is to form wiring holes for components on the circuit board. Most of them are now using CNC drilling machines, which can make the drilling accuracy higher. Factors affecting the drilling quality include the material and geometric characteristics of the drill bit, the drilling speed, the drilling depth, and the drilling position accuracy.

Chemical treatment: Chemical treatment is an extremely important step in the manufacturing process of aluminum printed circuit boards. The appropriate circuit layer structure is prepared by etching, copper plating, surface treatment and other methods. This step requires strict control of parameters such as the concentration, temperature and time of the corrosive agent and electrolyte to obtain the required surface structure and quality.

Copper plating: Copper plating is to form a copper layer that connects the circuit and the ground wire, usually using methods such as chemical copper plating. Adverse factors of copper plating include uneven copper layer, excessive roughness, pinholes, and deformation of the copper layer.

Welding: Welding is a necessary step to directly solder electronic devices to aluminum printed circuit boards. Welding methods include manual welding and automated welding. During the welding process, the welding temperature, time and welding quality need to be strictly controlled to ensure reliable solder joints.

What is the thermal conductivity of aluminum PCB?

‌‌The thermal conductivity of aluminum printed circuit boards refers to the amount of heat transferred by a material per unit time and per unit area, usually expressed in W/m·K. The difference between 1.0, 1.5, and 2.0 thermal conductivity.

‌1.0 W/m·K‌: The insulation layer of the general-purpose aluminum-based copper-clad laminate is composed of an epoxy glass cloth bonding sheet, which is suitable for the heat dissipation needs of general electronic products.
‌1.5 W/m·K‌: The insulation layer of the high-heat dissipation aluminum-based copper-clad laminate is composed of a high-thermal-conductivity epoxy resin or other resin, which is suitable for occasions requiring higher heat dissipation performance.
‌2.0 W/m·K‌: The insulation layer of the aluminum-based copper-clad laminate for high-frequency circuits is composed of a polyolefin resin or polyimide resin glass cloth bonding sheet.

What is the difference between aluminum PCB and FR4?

The main differences between aluminum printed circuit boards and FR-4 circuit boards are materials, thermal conductivity, mechanical properties, cost, and application areas. ‌

Materials‌:
Aluminum printed circuit boards are mainly composed of aluminum alloys, and the surface is usually coated with an insulating layer with good thermal conductivity, such as aluminum oxide (Al2O3).
The substrate of FR-4 circuit boards is a glass fiber reinforced epoxy resin, which is formed by impregnating glass fiber cloth with epoxy resin to form a composite material.

Thermal conductivity‌:
Aluminum printed circuit boards have good thermal conductivity and are suitable for applications with high heat dissipation requirements, such as LED lighting and electronic power supplies.
FR-4 circuit boards have relatively poor thermal conductivity and are usually used in general electronic devices, not suitable for scenarios with high heat dissipation requirements.
Mechanical properties‌:
Aluminum printed circuit boards are relatively hard and have good mechanical properties, and are suitable for applications that require a certain mechanical strength.
FR-4 circuit boards are relatively soft and easy to process, but may not be as good as aluminum printed circuit boards in terms of mechanical strength.
Cost‌:
Due to the high manufacturing process and material costs of aluminum printed circuit boards, the cost of aluminum printed circuit boards is relatively high.
FR-4 circuit boards have relatively low manufacturing processes and material costs, and are usually an affordable choice.
Application areas:
Aluminum printed circuit boards are mainly used in applications that require good heat dissipation performance, such as LED lamps, power modules, automotive electronics, etc.
FR-4 circuit boards are suitable for general electronic products, such as computer hardware, communication equipment, consumer electronics, etc.

What are aluminum PCBs used for?

Audio equipment: input and output amplifiers, balanced amplifiers, audio amplifiers, preamplifiers, power amplifiers, etc.
Power supply equipment: voltage stabilizers, regulators, DC-AC adapters, etc.
Communication electronic equipment: high-frequency amplifiers, filter appliances, and transmission circuits.
Office automation equipment: motor drivers, etc.
Computers: power supply devices, floppy disk drives, motherboards, etc.
Power modules: inverters, solid-state relays, rectifier bridges, etc.
Electronic control: relays, transistor bases, and cooling of components in various circuits;
Switches, microwaves: radiators, semiconductor device insulation heat conduction, motor controllers;
Industrial vehicles: igniters, voltage regulators, automatic safety control systems, and lighting conversion systems;
LED displays (two modes: LED display; display using LED light sources)
Lamps and lighting: With the promotion of energy-saving lamps, various energy-saving and gorgeous LED lamps are very popular in the market, and aluminum printed circuit boards used in LED lamps have also begun to be used on a large scale.

Aluminum printed circuit boards supplier

Best Technology specializes in providing prototyping service of customized aluminum PCB solutions to meet the diverse needs of our clients. To make sure the one-time success of pcb prototyping, we proceed SI, PI, EMC, DFM analysis during the production. We are committed to be the most reliable aluminum printed circuit boards supplier in the world!

Tags: Aluminum Printed Circuit Board, MCPCB
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What is BGA? What is its use?

August 30th, 2024

Ball grid array (BGA) is a surface mount package for integrated circuits. Its ability to accommodate a large number of pins while maintaining a small footprint makes it ideal for modern electronic devices with limited space. BGA packages are used in a variety of applications, from consumer electronics such as smartphones and laptops to industrial equipment and automotive systems.

What is BGA?

Ball grid array (BGA) is a common surface mount package that is derived from pin grid array (PGA) technology. It uses a grid of solder balls or leads to conduct electrical signals from the integrated circuit board. Instead of using pins like PGA, BGA uses solder balls placed on a printed circuit board (PCB). By using conductive printed wires, PCBs support and connect electronic components.

Unlike PGA, which has hundreds of pins and is difficult to solder, BGA solder balls can be evenly distributed without accidentally connecting them together. Solder balls are first placed in a grid pattern on the bottom of the package and then heated. By using surface tension when melting the solder balls, the package can be aligned with the circuit board. The solder balls cool and solidify, with accurate and consistent distances between each other.

What does a BGA do?

The main role of BGA (Ball Grid Array) packaging technology includes providing high-density, high-performance packaging solutions for microprocessors, ASICs, DSPs, PDAs, PLDs and other devices. This technology achieves surface mounting by making array solder balls on the bottom of the package substrate as the I/O end of the circuit to interconnect with the printed circuit board (PCB).

BGA packaging technology is small, light, and high-performance. It can provide more pins than other packaging technologies such as dual in-line package (DIP) or quad flat package (QFP). The entire bottom surface of the device can be used as pins instead of only the periphery.

This allows BGA packages to have shorter average wire lengths than periphery-limited package types, thereby providing better high-speed performance.

The advantages of BGA packaging are not only its high density and high performance, but also its less stringent requirements for welding accuracy. Even during the soldering reflow process, even if the solder ball is offset from the pad, the device position can be automatically corrected due to the surface tension of the solder.

What are the disadvantages of BGA?

The disadvantages of BGA packaging technology mainly include difficulty in detection, high difficulty in repair, relatively high production cost, stricter requirements on the reliability of solder joints, and sensitivity to temperature and humidity. ‌

1. Difficulty in detection: Since the solder ball is located at the bottom of the chip, the traditional optical inspection method cannot effectively detect the welding quality, and X-ray detection and other equipment must be used, which increases the cost and time of detection. ‌

2. High difficulty in repair: If there is a welding problem, the BGA packaged device needs to be disassembled and reassembled. This process has high technical requirements and certain risks. ‌

3. Relatively high production cost: Compared with QFP packaging, BGA packaging has higher material, production and inspection costs. ‌

4. More stringent requirements on the reliability of solder joints: Due to its small size, the BGA packaging method has very high requirements on solder joints. If there are problems such as empty solder joints and cold solder joints in the solder joints, the BGA package will fail.

5. Sensitive to temperature and humidity: BGA packaged components are very sensitive to temperature and humidity and need to be stored under constant temperature and dry conditions.

These shortcomings have limited the widespread application of BGA packaging technology to a certain extent, especially in application scenarios with high requirements for cost, reliability and environmental adaptability.

How is BGA made?

The production process of BGA (ball grid array package) mainly includes several key steps, which ensure the high quality and high reliability of BGA package. ‌

1. Wire bonding PBGA packaging process flow:

Substrate preparation: extremely thin copper foil is laminated on both sides of the BT resin/glass core board, and then drilling and through-hole metallization are performed.

‌Graphic production: Use conventional PCB processing technology to make graphics on both sides of the substrate.

‌Solder mask production: Add solder mask and make graphics to expose electrodes and welding areas to improve production efficiency. A substrate usually contains multiple PBGA substrates.

2. ‌BGA area via plugging‌:

The vias in the BGA pad area generally need to be plugged to prevent foreign matter in the hole or to protect the service life of the via, and to prevent the via from tinning during the reflow soldering of the SMT patch, causing a short circuit on the other side.

3. ‌Via in the plate, HDI design‌:

For BGA chips with small pin spacing, when the pin pad cannot be connected due to the process, it is recommended to directly design the via in the plate, and use the HDI blind buried hole wiring method to design the PCB, punch the via in the plate on the BGA pad, punch the buried hole in the inner layer, and conduct the wiring in the inner layer.

4. ‌BGA welding process‌:

‌Printing solder paste‌: Apply an appropriate amount of solder paste evenly on the PCB pad to ensure that the patch components and the corresponding pads on the PCB achieve good electrical connection and sufficient mechanical strength during reflow soldering.

‌Device placement‌: Use a placement machine to accurately mount the chip components to the corresponding position on the PCB surface printed with solder paste or patch glue.

5. Special size design and automated production:

BGA features include high pinhole density, easy automated production, high reliability, and the ability to design special sizes to achieve a more compact chip layout.

What is the difference between PCB and BGA?

The main differences between PCB and BGA are their structure, function, and application scenarios. ‌

1. Structure:

PCB (printed circuit board) is a basic electronic component that provides an electrical connection path between components. BGA (ball grid array package) is an advanced packaging method that connects components to PCB through a spherical pad array, with the advantages of high density and high reliability.

The pins of BGA are spherical and are generally directly soldered on the PCB board. Desoldering requires a special BGA rework station, and individuals cannot desolder; while the pins of PGA (pin grid array package) are pin-shaped. When installing, the PGA can be inserted into a special PGA socket for easy disassembly.

2. Functions and application scenarios:

BGA packaging effectively uses PCB space, which helps save enough space for customization in PCB and improve its efficacy. The size of BGA package is very small, so these PCBs have less heat dissipation and are easy to achieve the dissipation process.

There are no bendable or fragile pins in BGA package, so the durability of these PCBs is increased, and good electrical performance is also ensured. The pads of BGA package are large enough to make it easy to solder and easy to operate, so easy soldering and handling make it very fast to manufacture.

In summary, BGA, as an advanced packaging technology, has been widely used in high-performance electronic products through its unique ball grid array structure and high density and high reliability characteristics. Traditional PCBs provide basic electrical connection paths and are the basic components of electronic devices.

How many types of BGA are there?

There are many types of BGA, mainly including:

1. PBGA (plastic package BGA): This is the most commonly used BGA packaging form, made of plastic materials and plastic processes.

2. CBGA (ceramic BGA): This packaging type uses a multi-layer substrate with precious metal interconnect circuits.

3. CCGA (ceramic solder column array)

4. TBGA (BGA with tape)

5. MBGA (metal BGA)

6. FCBGA (flip chip BGA)

7. EBGA (BGA with heat sink)

In addition, BGA can be divided into staggered type, full array type, and peripheral type according to the arrangement of solder balls.

Conclusion:

Ball grid array (BGA) packaging is a key technology in modern electronic products. It makes it possible to develop more powerful and compact devices. BGA has become the first choice for applications that require high performance, reliability and miniaturization.

BGA packaging is famous for its advanced packaging technology. BEST Technology is recognized as the most trusted one-stop electronic circuit solution provider in the world, and BGA production is one of its most important projects. We specialize in the production and assembly of PCBs containing BGA packaging.

Tags: BGA
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What is an Amplifier Board? – Definition, Types, Uses

August 30th, 2024

What is an Amplifier Board?

An amplifier board is an electronic circuit designed to amplify audio signals. It takes a low-power input signal, such as the sound from a music player, and increases its strength to a level that can drive speakers or other audio output devices effectively. This amplification process ensures that the sound is louder and clearer when played through the speakers.

Amplifier boards are commonly used in various audio applications, including home theater systems, car audio setups, and professional sound equipment. They are essential for delivering high-quality audio performance, especially in environments where louder sound output is needed. Amplifier boards come in different types, each suited for specific applications, and are designed to handle various power levels and sound quality requirements.

What is an Amplifier Board? – Definition, Types, Uses

What Does an Amplifier Board Do?

An amplifier board serves the crucial function of boosting the power of audio signals. In any audio system, the original signal generated by a source, such as a smartphone, MP3 player, or microphone, is usually weak. This weak signal is insufficient to drive speakers or produce audible sound at a volume that is satisfactory. The amplifier board steps in to enhance this signal, increasing its power so that it can drive speakers effectively.

Beyond simply making the sound louder, a well-designed amplifier board ensures that the audio signal remains clear and free from distortion throughout the amplification process. This means that whether you’re listening to music, watching a movie, or using a public address system, the sound you hear is rich, clear, and true to the original input.

Amplifier boards are versatile and can be found in various settings, from home audio systems and portable Bluetooth speakers to car audio systems and professional sound equipment. Each of these applications demands different levels of power and sound quality, and amplifier boards are designed to meet these specific needs.

Types of Amplifier Boards

Wiring Harness
2 Channel Stereo Amp
Battery & Power
1 Channel Mono Amp
2.1 Channel Amp
Interface
Preamp
4 Channel Amp
Bluetooth / Wi-Fi Receiver
Panels & Mounting Acc.
Panels & Mounting Acc.-Wiring Harness
10 Channel Amp
3 Channel Amp
6 Channel Amp

What Is the Function of the Amplifier?

The primary function of an amplifier is to increase the amplitude of an audio signal, making it strong enough to drive loudspeakers and other audio output devices. An amplifier takes in a low-power audio signal, processes it, and outputs a much stronger signal without significantly altering the original sound’s characteristics.

This function is crucial in ensuring that the sound produced by the speakers is loud enough to fill a room, stadium, or outdoor space, depending on the application. For example, in a home theater system, the amplifier ensures that the dialogue, music, and sound effects are all heard clearly, even during quieter scenes or moments of intense action.

In addition to boosting the signal, amplifiers often have other functions, such as controlling volume, adjusting equalization (bass, treble, midrange), and managing different audio inputs. This makes the amplifier a central component in any audio system, responsible for not just increasing volume but also enhancing overall sound quality.

What Kind of Amplifier Do I Need for Speakers?

Choosing the right amplifier for your speakers involves considering several factors, including the power rating of the speakers, their impedance, and the environment in which they’ll be used. The goal is to find an amplifier that can provide sufficient power to drive the speakers without overpowering them.

1. Matching Power Rating

The amplifier’s power output should generally match the speaker’s power handling capacity. For instance, if your speakers are rated at 100 watts, you’ll want an amplifier that can deliver 100 to 150 watts per channel. This ensures that the amplifier can drive the speakers efficiently without causing distortion or damage.

2. Impedance Compatibility

Speakers have an impedance rating, usually measured in ohms, that the amplifier must match. Common impedance values are 4, 6, or 8 ohms. The amplifier should be capable of driving the speaker’s impedance; otherwise, it may overheat or fail to deliver optimal sound quality.

3. Application and Environment

Consider where and how the speakers will be used. For a small room, a lower-powered amplifier might be sufficient, while larger spaces or outdoor settings may require a more powerful amplifier. If you’re setting up a home theater system, you might need an amplifier that supports multiple channels to handle different speakers in a surround sound configuration.

4. Sound Quality Preferences

If you’re an audiophile or someone who values high-quality sound, you might opt for an amplifier that prioritizes sound fidelity, such as a Class A or Class AB amplifier. For more general purposes or where efficiency is key, a Class D amplifier might be more suitable.

What Is the Difference Between a Mixing Board and an Amplifier?

A mixing board, also known as an audio mixer, combines multiple audio signals into one or more outputs. It allows you to adjust levels, EQ, and other parameters for each input channel. On the other hand, an amplifier boosts the power of the audio signal to drive speakers. While a mixing board controls the audio mix, an amplifier ensures that the mix is loud enough for playback through speakers.

What Is the Main Advantage of an Amplifier?

The main advantage of an amplifier is its ability to enhance audio signals, allowing them to be played at higher volumes while maintaining sound clarity and fidelity. This is particularly important in situations where audio needs to be heard clearly over background noise or across large distances.

1. Loudness and Clarity: Amplifiers ensure that audio signals are strong enough to drive speakers and produce sound at desired volume levels. This is essential for ensuring that music, speech, and other audio content are heard clearly, whether in a small room, a large auditorium, or an outdoor event.

2. Improved Sound Quality: A well-designed amplifier can improve the overall sound quality of an audio system by minimizing distortion and noise, ensuring that the output remains true to the original recording.

3. Versatility and Control: Amplifiers often come with features that allow users to control various aspects of the audio signal, such as volume, balance, and equalization.

What Happens if an Amp is Too Powerful for Speakers?

Using an amplifier that is too powerful for your speakers can result in speaker damage. When an amplifier delivers more power than the speakers can handle, it can cause the speaker components to overheat or even blow out. It’s essential to match the amplifier’s power output to the speaker’s power rating to avoid such issues. Always refer to the manufacturer’s specifications to ensure compatibility.

How Many Watts is Good for a Speaker?

The appropriate wattage for a speaker depends on the intended use and the size of the space in which it will be used. For small rooms, speakers with a power rating of 20 to 50 watts per channel may suffice. For larger spaces or outdoor use, speakers rated at 100 watts or more per channel are recommended. It’s important to match the amplifier’s power output to the speaker’s rating to ensure optimal performance and longevity.

What is the Basic Use of an Amplifier?

An amplifier’s basic use is to boost the power of audio signals so that they can drive loudspeakers effectively. Without amplification, the audio signal would be too weak to produce a meaningful sound output from the speakers. Amplifiers are used in various audio systems, including home theaters, car audio systems, and public address systems, to ensure that the sound is loud and clear.

Which Class Amplifier is Best for Sound Quality?

For sound quality, Class A amplifiers are often considered the best. They provide a consistent and high-quality output, making them ideal for high-fidelity audio systems. However, they are less efficient and generate more heat compared to other classes. For a balance between sound quality and efficiency, Class AB amplifiers are a popular choice, offering good sound quality while being more power-efficient than Class A.

Does an Amplifier Improve Sound Quality?

Yes, an amplifier can improve sound quality, especially when it’s well-matched to the speakers and the rest of the audio system. A good amplifier ensures that the audio signal is amplified without introducing distortion or noise. It also provides the necessary power to drive speakers, allowing them to perform at their best. However, it’s important to choose an amplifier that complements your audio setup to achieve the best sound quality.

Amplifier Board HS Code

The Harmonized System (HS) code for amplifier boards varies depending on the specific type and application. Generally, amplifier boards fall under the category of electronic integrated circuits or modules, which are typically classified under HS code 8542.90. However, it’s advisable to consult with a customs expert or refer to your country’s specific tariff schedule for precise classification.

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What is the use of relay in power system?

August 30th, 2024

Relays in power systems are important components that play a vital role in controlling circuits. The core of a relay is an electric switch that can automatically or manually open or close a circuit according to the design. Relays are commonly used in a variety of applications, from small electronic devices to large power systems, and they provide a reliable way to control high-power circuits using low-power signals.

What is relay?

Relay refers to a transfer device in a circuit that controls the switch through the electromagnetic principle to achieve the purpose of automatic control. In power systems, relays can control the switch of circuits by detecting changes in parameters such as current and voltage to achieve protection and control of the system.

What is the use of relay in power system?

The basic working principle of a relay is to use the electromagnetic effect to control the on and off of mechanical contacts. When the coil with an iron core is energized, the coil current generates a magnetic field, which attracts the armature to move, thereby opening and closing the contacts.

Why would you need a relay?

The reasons for needing a relay mainly include safety isolation, remote control, timing or delay control, protection equipment, signal conversion, etc. ‌

1. ‌Safety isolation‌: When a low-voltage device (such as a microcontroller or sensor) is used to control a high-voltage device, the relay can act as an isolation layer to ensure safe operation.

2. ‌Remote control‌: When a device needs to be controlled at a longer distance or in a longer environment, the relay can transmit and amplify the signal to achieve remote control.

3. ‌Timing or delay control‌: When a device needs to be started or shut down at a specific time or after a delay, the relay can achieve timing or delay control.

4. ‌Protective device‌: As a protective device, the relay can prevent the device from being affected by faults such as overload and short circuit.

5. ‌Signal conversion‌: When one signal needs to be converted to another, the relay can perform signal conversion, such as converting an analog signal to a digital signal, or converting a wireless signal to a wired signal.

In addition, relays have the advantages of high reliability, long life, and low power consumption, which can improve the safety and stability of the equipment. Therefore, relays are indispensable and important components in automated control circuits, remote control, telemetry, communication, automatic control, mechatronics and power electronic equipment.

What is the main function of a relay?

The main functions of relays include amplifying signals, realizing remote control, protecting circuits, realizing logical control and improving system reliability and stability. ‌

‌Amplifying signals‌: Relays can convert weak control signals into stronger control signals. Because the contact capacity of relays is large, they can control loads with large currents and high voltages.

‌Remote control‌: Through input signals, relays can control the switch state of load equipment at a distance and realize the function of remote control.

‌Protect circuit‌: Relays have overload protection and short-circuit protection functions. When abnormal conditions occur in the circuit, such as overload, short circuit, etc., the relay can automatically cut off the power supply to prevent the fault from expanding and protect the safety of circuits and equipment.

‌Realize logical control‌: Relays can realize complex logical control through multiple sets of normally open and normally closed contacts, and are widely used in automation control systems, industrial control and other fields.

‌Improve the reliability and stability of the system ‌: Relays have high stability and reliability, which can reduce the failure rate in the system and improve the stability and reliability of the entire system.

In addition, relays also have isolation functions, which can protect the control circuit from the influence of the external environment and prevent electric shock accidents, which is very useful in some occasions with high safety requirements. ‌

What is the difference between a switch and a relay?

Switches and relays have significant differences in function, application, structure and usage scenarios. ‌

1. ‌Function and application‌

Switches are mainly used to connect and disconnect circuits, while relays are mainly used to control the on and off of circuits to achieve protection and control of circuits.

Switches can be regarded as a basic electrical component used to simply connect or disconnect circuits, while relays control the on and off of large currents by controlling small currents in the circuit to achieve remote control or automatic control‌.

2. ‌Structure and design‌

The contacts of switches may be small and are generally used to control small currents. In contrast, the contact switches of relays are larger and can be used to drive larger loads.

Contactors generally have arc extinguishing devices, while relays do not. This shows that relays and switches are different in design and application. Relays are more suitable for use in control circuits, while switches are used in main circuits.

3. Use scenarios

Switches are usually used to directly control the on and off of the main circuit, such as motor start-up, shutdown control, etc. Relays are more used in auxiliary circuits, such as the on and off of the control circuit, or after power is on or off, the on and off of the circuit is controlled by the change of position state, or the output node is given to other circuits.

Although switches and relays both play important roles in electrical systems, they have obvious differences in design, function and purpose. Switches are mainly used for simple circuit on and off operations, while relays are more used for the protection and control of control circuits, controlling the on and off of large currents by small currents, and realizing remote control or automatic control.

What is a relay vs fuse?

Fuses and relays play different roles in automotive circuits and have obvious differences. ‌

‌Fuse‌ is a non-resettable one-time thermal protection device, mainly used for overload protection. When a circuit fails or is abnormal, the current continues to increase. The increased current may damage some important components in the circuit, burn the circuit, or even cause a fire.

The function of the fuse is to disconnect the power supply of the electrical equipment on the vehicle when a short circuit or overload occurs, so as to protect other electrical appliances and lines.

The relay is an automatic control device. When the input (electricity, magnetism, sound, light, heat) reaches a certain value, the output will change in a jump-like manner. Relays are mainly used for overload protection. They control larger currents with smaller currents, and play the role of automatic adjustment, safety protection, and circuit conversion.

The working principle of the relay is to generate a magnetic field through the electromagnet coil, magnetize the iron core, attract it to the magnetic pole of the electromagnet, and then drive the contacts to close or open, so as to realize the switch control of the circuit.

In short, the function of the fuse is to cut off the current automatically when the current abnormally rises to a certain height and heats up, so as to protect the safe operation of the circuit; while the relay protects the circuit and electrical equipment from the influence of overload, short circuit and other faults by controlling the circuit, and at the same time improves the reliability of the circuit operation.

Conclusion:

As technology continues to evolve, relays become more sophisticated and in a world where the demand for power is increasing and the need for reliable power systems is more important than ever, relays will continue to play a vital role in ensuring our power systems remain safe, efficient, and more.

Tags: power supply circuit, relay
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