How to Distinguish Hard Gold and Soft Gold Plating on PCB?

June 14th, 2024

Gold plating is a common surface finish in PCB manufacturing, also known as nickel gold electroplating. It provides excellent conductivity, corrosion resistance and good durability to electronic devices. However, not all gold plating is created equal. There are two primary types of gold plating are used in PCB fabricating: hard gold plating and soft gold plating. They differ in properties, manufacturing process and applications, let’s explore it today!

How to Distinguish Hard Gold and Soft Gold Plating on PCB?

What are Hard Gold Plating and Soft Gold Plating?

In the manufacturing process of printed circuit boards (PCBs), we often hear the words “soft gold” and “hard gold”. They are actually describing the different metal materials used in the gold-plating process.

Hard gold usually refers to an alloy formed by electroplating process. This alloy is doped with other metal elements, such as nickel, cobalt, etc., to make it harder and more resistant to friction. Hard gold is especially suitable for places that require force and friction, such as the edge contact points of circuit boards (commonly known as “gold fingers”), because it can withstand frequent insertion and removal operations. Although the processing process of hard gold is complex, it can be doped with other metals to improve the hardness of gold, making it more suitable for making hollow jewelry or for industrial applications.

Soft gold refers to the state of pure gold or close to pure gold, because of the high purity of gold, it is relatively soft. Soft gold is mainly used for aluminum wire on COB (Chip On Board), or the contact surface of mobile phone keys, because it can maintain good electrical conductivity and weldability. The processing process of soft gold is relatively simple, does not require complex alloying process, and maintains the soft characteristics of gold, which is suitable for the production of solid jewelry or for applications requiring good electrical conductivity.

Properties and applications: hard gold plating vs soft gold plating

Hard gold plating is known for its high hardness, typically achieved by alloying gold with small amounts of nickel or cobalt. So, it has highly resistant to wear and mechanical stress. The thickness of hard gold plating is usually greater than that of soft gold plating, ranging from 30 to 50u’’ or more. Best Technology can make up to 50u’’ if you required. Due to the hardness of the hard gold plating, they are commonly used in edge connectors, keypads, and contact points where repeated mechanical action occurs.

The manufacturing process of soft gold plating involves a chemical process to deposit a thinner layer of pure gold onto the PCB surface. The coated pure gold without any alloying elements, resulting in a softer finished compared to the hard gold plating. Additionally, the thickness of soft gold plating is typically thinner than that of hard gold plating, usually around 1 to 3u’’. Due to the softness and conductivity properties, the soft gold plating technology is often used in applications requiring high conductivity and precision, such as wire bonding and fine-pitch components in high-frequency and high-speed circuits.

What’s the difference between gold plating and immersion gold?

Actually, Immersion Gold is mostly called ENIG (electroless nickel immersion gold) surface treatment method. The advantage of this method is that nickel and gold can be attached to copper without electroplating process, and its surface is smoother than gold plating, which is especially important for the shrinking electronic parts and components requiring flatness.

The method of leaching gold is chemical deposition. A coating is formed by chemical redox reaction, which is generally thick. Electroplating gold is based on the principle of electrolysis, also known as electroplating. Most other metal surface treatments are electroplating. In actual product applications, 90% of the gold PCB board is dipped in gold, because the poor weldability of the electric gold-plated board is its fatal defect.

Nickel gold coating with stable color, good brightness, smooth coating and good weldability can be deposited on the surface of printed circuit by gold leaching process. It can be divided into four stages: pretreatment (degreasing, micro-etching, activation, post-leaching), nickel plating, gold leaching, post-treatment (waste gold washing, DI washing, drying). The thickness of gold leaching is 0.025-0.1um. Gold is used in the surface treatment of the circuit board because gold has strong electrical conductivity, good oxidation resistance and long service life. General applications such as keyboard board, gold finger board, etc.

Choosing between hard gold plating and soft gold plating for your PCB depends on your specific application requirements. At Best Technology, we offer expert guidance and high-quality PCB manufacturing services to help you select the best surface finish for your needs. Choose us as your trusted PCB supplier to ensure reliable and efficient solutions for all your electronic projects.

Tags: hard gold, surface treatment
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Bus Bar PCB: What are the Considerations During Designing?

June 8th, 2024

In the electronics industry especially for new-energy vehicles, a Bus Bar PCB plays an important role to achieve specific function. It transmits large amounts of current through metal strips or conductive paths, making it ideal for high-power applications. The design of busbar PCBs is a key technical area for designers or engineers who engaged in power distribution or who require efficient current management. In this article, we would like to share some information about the considerations during a bus bar circuit board designing, hope this may help you to design a desired PCB successfully.

What is a Bus Bar PCB?

Bus bar PCB is one of a new type of heavy copper PCB and it was made by FR4 fiber glass material and laminated with metal alloys. It transmits electrical energy from one point to multiple output points through integrated conductive paths, which are typically made of copper or aluminum. Busbar PCBs are designed to reduce resistance and inductance, thereby maximizing current transfer efficiency and minimizing energy loss.

Generally, if it is used in a charging pile product, there are generally at least 2 busbar circuit boards, one is the main control board (a larger one), and the other is a smaller board, both of two need to use the bus bar process.

Bus bar PCB is widely used in power distribution systems, electric vehicles, industrial equipment and other occasions requiring high current. They are designed to simplify system wiring, reduce electromagnetic interference (EMI), and improve overall reliability and performance of the product.

Why is High Current Bus Bar PCB Important?

Bus bar PCB has irreplaceable advantages in current transmission and power distribution. They mainly feature three functions when used in electronics. First of all, they are able to efficiently handle large currents without generating excessive heat. This is what standard FR4 PCB cannot achieved. Secondly, bus bar PCB has ability to significantly reduce the complexity of the circuit layout design. By integrating the current transfer path, they can reduce the number and length of circuits required by the system, thereby simplifying system design and reducing potential failures.

In addition, bus bar PCB helps reduce electromagnetic interference. Due to the design optimization of the conductive path, the noise generated during current transmission can be effectively suppressed. This characteristic makes it perform well in high-noise environments, ensuring the stability and reliability of electronic devices.

What Should We Consider When Designing A Bus Bar PCB?

Due to it is a new innovation in the industry, it is a not a simple thing to design a bus bar circuit board successfully. It’s a complex task that requires consideration of several technical factors to ensure its effectiveness and reliability. The following are the main aspects to focus on when designing a bus bar PCB.

Copper Thickness

The first important thing is what’s the copper thickness of busbar you want to. You must know, thicker copper allows for higher current carrying capacity, but not thicker thickness is better, it should be calculated according to the voltage and current it will used in.

Current capacity and temperature management

The bus bar PCB should be designed to carry the maximum expected current while keeping the temperature within a safe range. This is usually achieved by selecting the appropriate conductor material and optimizing the cross-sectional area of the conductor. For example, for 100A current requirements, a typical design would use copper strips with a thickness of 5mm to ensure that the temperature rise does not exceed 20C.

Resistance and inductance

Low resistance and low inductance are key to bus bar PCB design. The shape, thickness and layout of conductors should reduce resistance and inductance as much as possible to improve the efficiency of current transmission. For example, the use of trapezoidal or flat conductors can effectively reduce inductance, thereby improving current transmission performance.

Electromagnetic compatibility (EMC)

Bus bar PCB design also needs to consider electromagnetic compatibility issues to ensure that it does not produce too much electromagnetic interference (EMI), while being able to resist external electromagnetic interference. By optimizing the conductor layout and using shielding materials, the electromagnetic compatibility of the bus PCB can be significantly improved.

Thermal management

Because bus bar PCB aims to transmit high current, thermal management is an important part of the design. The thermal design should ensure that the PCB can effectively dissipate heat and prevent overheating damage. For high power applications, radiators or active cooling are often used to ensure temperature control within design specifications.

Best Technology Manufacturing Capability of Bus Bar PCBs

As the one of leading PCB manufacturers in China, Best Technology has exceptional capabilities in the production of busbar PCBs. Our manufacturing capabilities include high-precision metal processing technology to produce busbar PCBs with complex geometry and tight tolerances. In addition, we also have the production capacity of multi-layer bus bar PCB to meet the needs of different applications.

Best Technology is committed to providing customers with high-quality, high-performance busbar PCBs to support their power management and distribution systems. Below is a basic parameter of our bus bar PCB manufacturing capability. For more details, welcome to e-mail us at sales@bestpcbs.com.

(Best technology capability of bus bar pcb)

Nowadays, bus bar PCBs are widely used in power distribution systems, electric vehicles, industrial equipment and other occasions requiring high current. According to statistics, the global busbar market is expected to grow at a compound annual growth rate (CAGR) of 6.5% between 2023 and 2028, demonstrating the growing importance of this technology in multiple industries.

With the rapid development of the eras, the most important thing for designers or buyers is to find a reliable bus bar PCB manufacturer to meet the high demands of the market. As the expert of the bus bar PCB fabricating, Best Technology has the mature technology and advanced equipment to produce high quality bus bar PCBs. Contact us right now to get your own bus bar PCB solutions!

Tags: Bus Bar PCB, Busbar PCB
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Why is FR4 Material the Most Commonly Used PCB Material?

June 5th, 2024

FR4 material is a highly popular and widely used substrate in the PCB industry due to its exceptional mechanical strength, electrical insulation, and flame retardant properties. It has become the standard for PCB fabrication.

What is FR4 Material and Why is it Used in PCBs?

FR4 is a type of fiberglass-reinforced epoxy laminate. The term “FR4” comes from its flame-retardant properties, meeting the UL94V-0 standard. It is made from woven fiberglass cloth and epoxy resin, which together provide great strength and durability.

Electrical engineers and designers prefer FR4 because of its many benefits, such as:

Low cost
High dielectric strength
Excellent strength-to-weight ratio
Moisture resistance
Temperature endurance
Good electric loss characteristics
Flame retardance and self-extinguishing capabilities
Mechanical robustness
Insulating properties

FR4 is also suitable for marine PCBs because it absorbs very little water. In a standard FR4 PCB, a layer of FR4 is placed between two thin layers of laminated copper.

What are the Key Performances of FR4 Material?

FR4 material, also recognized as flame retardant 4, is a composite of glass fabric and epoxy resin, predominantly utilized as a foundational material for printed circuit boards. Familiarity with the specifications of FR4 is crucial for selecting the appropriate substrate for PCB manufacturing. Key specifications include:

1. The thickness of FR4 sheet is usually 0.2 mm to 3.2 mm, and other special thickness also available.

2. The specific gravity of FR4 material is about 1.85g/cm³, which means that it is heavier than water.

3. Coefficient of thermal expansion of FR4 is about 1.0×10^-5cm/cm/℃, which means that its length or width will expand slightly when the temperature changes.

4. The thermal decomposition temperature of FR4 materials is usually between 280C and 320C, which makes it able to withstand high temperature applications.

5. FR4 material has a dielectric constant around 4.0-4.8, which makes it an ideal material for circuit board manufacturing.

6. FR4 has good arc resistance, which means that in the case of high voltage, it can effectively prevent arc discharge.

7. FR4 material good hydrolysis resistance and can maintain good performance even in a humid environment.

What are the Types of PCB Materials in the Industry?

PCB materials can be broadly categorized based on their composition and intended application. Nowadays, the commonly used are including FR4, polyimide (PI), Metal material (copper or aluminum), ceramic substrate like Al2O3, AlN, Si3N4, and so on. Different materials have its unique functions and well-suited in specific environment. Here we introduce their properties and suited applications simply.

FR4 (Fiberglass Epoxy Laminate)

At present, almost of PCB you seen in the market or electronics used the FR4 material. It widely used because of its superb equilibrium of mechanical strength, electrical insulation, and cost-efficiency. Actually, according to the different reinforcement materials, the circuit board is mainly classified into the following types:

1) FR-4

2) FR-1, FR-2, etc.

3) CEM series: Composite substrate

FR-4 used frequently because of its high fire resistance rating.

High Tg FR4

Though normal FR4 material has good electrical insulation, it is not an ideal option for high frequency circuit board. And then, high Tg FR4 stands out by using an advanced technology. “Tg” refers to glass transition temperature, the juncture at which the material transitions from a rigid, glassy state to a pliable, rubbery state. High Tg FR4 boasts a Tg of 170°C or higher.

Polyimide (PI)

Polyimide materials are renowned for their excellent flexibility, superior thermal stability and chemical resistance. It is always used as raw material of flex circuits, rigid flex circuit boards or membrane switches. Due to the good chemistry properties, they can endure temperatures up to 260°C and are highly flexible, making them ideal for those small and limited PCB designs.

Metal base material

Metal materials always used in metal core PCBs (MCPCB), usually used aluminum core or copper core. The metal base has great thermal conductivity to enhance the thermal management of the device, buy using metal core, the device can dissipate heat away from the critical component such as LED chips, ICs, BGAs, to remain the reliability and performance of the PCB.

Ceramic substrate

Ceramic PCB substrate offers excellent thermal conductivity and stability than that metal core PCBs, making them suitable for high-power and high-frequency applications. But due to the high cost and complex manufacturing, the ceramic PCB is much expensive than metal core PCB, therefore, they are always be used in high-end applications, such as the military, defense, aerospace and some special fields where requires excellent thermal management.

Understanding these materials enable to help engineers and designers in selecting the most appropriate substrate for their projects, ensuring optimal performance and cost-efficiency. Best Technology provides a comprehensive array of PCB materials, guaranteeing high-quality solutions for all your electronic needs.

What are the Applications of FR4 PCB Material in Various Industries?

FR4 material is versatile and finds applications in numerous industries, including:

Consumer Electronics like smartphones, laptops, and other personal electronic devices.
Applied in vehicle electronics for infotainment systems, engine control units, and more.
Industrial Equipment such as control systems, power supplies, and industrial automation.
Essential for telecommunications, network devices, routers, and communication infrastructure.
Medical instrumentation and diagnostic equipment.
Aerospace and defense in avionics, radar systems, and defense electronics.

This is all of this sharing, thanks for your reading. Welcome to contact us if you have other questions about FR4 or other raw materials of PCB. Best Technology engaging in the PCB manufacturing about 18 years, we are one of the leading PCB manufacturers in China. And we have such confidence to provide with you the best PCB and PCBA fast solution for your projects.

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What are HDI PCBs and Their Basic Parameters?

June 5th, 2024

High-Density Interconnect (HDI) PCBs are revolutionizing the electronics industry with their advanced capabilities and compact designs. As technology continues to evolve, the demand for smaller, faster, and more efficient electronic devices has led to the widespread adoption of HDI PCBs.

What is Definition of HDI PCB?

HDI board refers to High Density Interconnect, that is, high density interconnect board, which is a relatively new technology developed by the PCB industry at the end of the 20th century.

The drilling of the traditional PCB board is affected by the drilling tool, and when the drilling aperture reaches 0.15mm, the cost is already very high, and it is difficult to improve again. The drilling of HDI board no longer relies on traditional mechanical drilling, but uses laser drilling technology. (This is why it is sometimes called a laser plate.) The hole diameter of the HDI board is generally 3-5mil (0.076-0.127mm), the line width is generally 3-4mil(0.076-0.10mm), the size of the pad can be greatly reduced, so more line distribution can be obtained within the unit area, and the high-density interconnection comes from this.

Smaller device spacing, more I/O pins and embedded passive devices Larger ASiCs and FPGAs with increasingly shorter rise times and higher frequencies all require smaller PCB feature sizes, which is driving a strong demand for HDI/ micro through-holes. The typical high density interconnector designs are including:

1+N+1
2+N+2
3+N+3
4+N+4

What are the benefits of HDI PCB?

HDI is a compact circuit board designed for small volume users. Compared with ordinary FR4 PCB, the most significant feature of HDI is the high wiring density, and the difference between the two is mainly reflected in the following three aspects.

1. HDI is smaller and lighter

HDI board is a traditional dual panel as the core board, through continuous stacking layer by layer. This kind of circuit board made by continuous layering is also called Build-up Multilayer (BUM). Compared with traditional circuit boards, HDI circuit boards have the advantages of “light, thin, short and small”.

The electrical interconnection between the HDI board is realized through the conductive through hole, buried hole and blind hole connection, its structure is different from the common multi-layer circuit board, and a large number of micro-buried blind holes are used in HDI board. HDI uses direct laser drilling, while standard PCBS usually use mechanical drilling, so the number of layers and aspect ratio tend to be reduced.

The high density of HDI board is mainly reflected in the hole, line, pad density, and layer thickness.

● Micro-via hole

The HDI board contains the design of micro-pilot holes such as blind holes, which is mainly reflected in the micro-hole formation technology with a diameter less than 150um, and the high requirements of cost, production efficiency and hole position precision control. In the traditional multilayer circuit board, there are only through holes and no tiny buried blind holes.

● Fine line width and line distance

Its main performance in the wire defects and wire surface roughness requirements are more and more stringent. Generally, the line width and line distance do not exceed 76.2um.

● High pad density

The density of welded contacts is greater than 50 per square centimeter.

● Thinning of medium thickness

It is mainly manifested in the trend of the thickness of the interlayer medium to 80um and below, and the thickness uniformity requirements are becoming more and more stringent, especially for high-density plates and packaging substrates with characteristic impedance control.

2. Better electrical performance

HDI not only enables end-product designs to be miniaturized, but also to meet higher standards of electronic performance and efficiency at the same time.

The increased interconnect density of HDI allows for increased signal strength and improved reliability. In addition, the HDI board has better improvement for RF interference, electromagnetic wave interference, electrostatic discharge, heat conduction and so on. HDI also uses full digital signal process control (DSP) technology and a number of patented technologies, with a full range of load adaptability and strong short-term overload capability.

3. The HDI board has very high requirements for buried holes

It can be seen from the above that whether it is the volume of the board, or the electrical performance, HDI is better than ordinary PCB. Where the coin has two sides, the other side of HDI is as a high-end PCB manufacturing, its manufacturing threshold and process difficulty are much higher than ordinary PCB, and there are more problems to pay attention to when producing – especially the buried hole jack.

What are the basic parameters of HDI PCB?

HDI PCB has greater different with normal FR4 PCB, from the stack up, material selection, manufacturing and cost. So, it is vital to understanding the basic parameters of a high-density interconnect board before start your designing trip. The standard parameters of HDI board mainly include the following aspects:

Numbers of layers

Generally, the number of layers of HDI board is 4-20 layers, and the high-end HDI board can reach to 40-50 layers.

Line width/spacing

Due to the HDI PCB are always used in high-end applications, their line width and spacing are usually very strict, and the common requirement is that the line width/spacing is 4/4mil (0.1mm), or even smaller.

Blind hole, buried hole, bus

These are one of the characteristics of the HDI board, blind hole and buried hole can reduce the area of the circuit board, make your design more density, and the bus enable to improve the signal transmission rate of the PCB.

Board thickness

The board thickness of HDI board is usually range from 0.8 to 3.2mm, of which 1.6mm is the most common thickness.

The pad on the HDI board is generally very small, and the common pad size is 0.2mm to 0.5mm. Different factory has different capabilities, it is best to ask your supplier or manufacturer to get a manufacturing capability document.

Impedance control

For high-speed signal transmission circuits, the impedance control of the HDI board is very important, and the requirements are very strict. It is needed to tell your vendor if your HDI board will be used in high-speed devices.

Material

The main materials of HDI board are FR4, BT, PI, PET, etc. Different materials can meet different requirements.

This is the end of this sharing, contact us today to learn more about our HDI PCB solutions and how we can help you achieve your technological goals. In our next chapter, we will introduce the manufacturing process and methods of HDI boards, let me know if you are interested in it.

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What Should We Consider When Designing A High Power PCB?

June 1st, 2024

With the continuous growth of new energy demand and the transformation of energy structure, the market size of high-power technology continues to expand. The high power pcb includes heavy copper pcb, bus bar pcb. As an important part of the battery module in the energy storage system, the high power PCB plays a key role in the safety and performance of the entire system. This article explores key considerations when designing high power PCBs, providing insights to help you optimize your designs for demanding applications.

How Important is Thermal Management in High Power PCB Design?

Thermal management is crucial in high power PCB design to prevent overheating and ensure reliable operation. High power components generate significant heat, which can damage the PCB and reduce its lifespan if not managed effectively. Here are some key strategies:

Use thicker copper layers to improve thermal conductivity as much as possible. For example, a 2 oz/ft² copper layer can carry approximately 10 amps of current.
Thermal Vias are important elements in the complex designs, they serve as the heat dissipation paths to conduct heat away from high power components.
Select appropriate heat sinks based on the power dissipation requirements. For instance, a heat sink with a thermal resistance of 1°C/W can handle 50W of power dissipation with a 50°C temperature rise.

How to Optimize Power Distribution in High Power PCBs?

Normally, high power PCBs are featuring in thick copper thickness, wider trace space and distance, less or no BGA or fine pitch components. And because of the operation of high current, the circuit board is more likely to have the problem of heating, so the high-power PCB always do some heat treatment to avoid overheating, such as design dissipation via holes or adding some heat sinks. Anyway, effective power distribution is essential to ensure stable operation and prevent voltage drops in high power PCBs. Here we summarize some tips to optimize the power distribution when designing a high-power PCB.

High-Performance Materials

Choose materials suitable for high current applications like FR-4, metal substrates, or composite materials. These materials have lower resistance, higher thermal conductivity, and better mechanical strength to handle high currents and heat concentration.

Current Distribution Balance

Implement balanced current distribution by adding current balancers, balancing resistors, or current balance layers. This reduces the resistance and hot spots, enhancing reliability and stability.

Avoid Cross-Talk Between Power and Signal Traces

Keep high current paths separate from digital signal paths to minimize interference. This reduces electromagnetic interference (EMI) and improves overall performance.

Solid Copper Pour for High Current Paths

Use solid copper pours for high current paths. This increases current-carrying capacity, improves heat dissipation, and minimizes voltage drops.

Thermal Management for Power Paths

Use large copper areas, vias, and exposed copper to enhance heat dissipation. Proper thermal management prevents component and product damage due to overheating.

EMC Radiation Control

Use wider trace widths, larger hole diameters, and increased spacing to manage EMC radiation. Keep high current paths short and place them away from sensitive components.

Why is Copper Thickness Critical in High Power PCB Design?

Copper thickness plays a vital role in determining the current-carrying capacity and thermal performance of high power PCBs. Here are some data points:

Standard Thickness: For high power applications, copper thickness typically ranges from 2 oz/ft² to 6 oz/ft².

Current Capacity: A 2 oz/ft² copper layer can handle approximately 10 amps, while a 6 oz/ft² layer can carry up to 30 amps.

Thermal Performance: Thicker copper layers improve heat dissipation, reducing the risk of overheating.

How Does PCB Layout Affect Signal Integrity in High Power Designs?

PCB layout is a critical factor that influences signal integrity and overall performance in high power designs. Consider these points:

Trace Length: Minimize the length of high-speed signal traces to reduce signal loss.

Consistent Trace Widths: Maintain consistent trace widths to ensure uniform current distribution.

Separation of Power and Ground Planes: Reduces noise and crosstalk.

Differential Pairs: Use differential pairs for high-speed signals to enhance signal integrity.

Adequate Spacing: Ensure adequate spacing between traces to prevent interference.

Designing a high power PCB requires a comprehensive understanding of various factors, including thermal management, material selection, power distribution, copper thickness, and PCB layout. By addressing these considerations, you can optimize your PCB designs for high power applications, ensuring reliability and performance. At Best Technology, we specialize in high power PCB solutions tailored to meet your specific needs. Our expertise and commitment to quality make us the ideal partner for your high power PCB projects. Choose Best Technology for unparalleled performance and reliability in your PCB designs.

Tags: Bus Bar PCB, heavy copper pcb, high power pcb
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What Are Vias on Printed Circuit Board (PCB)?

May 31st, 2024

In PCB design, engineers often use via holes to connect the same electrical network located in different layers, vias and through holes PAD is very similar, the difference is that through holes pad is generally used to insert plug-in components, while via holes are generally small. Vias are very popular in some complex and multi-layer design, because it can serve as a pathway between the different layers.

What are vias in printed circuit boards (PCBs)?

Vias in printed circuit boards (PCBs) are essentially small holes that are drilled or etched into the board’s surface. These small, cylindrical holes are plated with conductive material, typically copper, to ensure electrical continuity between the layers. They serve as conduits for electrical connections between different layers of the PCB or between components mounted on the surface of the board and the internal circuitry.

They are important for creating multilayer PCBs, where multiple layers of copper traces are separated by insulating layers. Without vias, it would be impossible to establish connections between these layers, limiting the complexity and functionality of electronic devices.

A via hole in PCB is mainly composed of three parts, hole, pads around the holes, and power layer isolation area. The process of via hole is to plate a layer of copper foil on the cylindrical surface of the hole wall by chemical deposition to connect the copper foil that needs to be connected in the middle of each layer. In this way, the upper and lower sides of the hole are made into ordinary pad shape, which can be directly connected with the traces of the upper and lower sides. The wall thickness of the plating is 1mil or 2mil, and completed hole diameter may be 2mil-4mil smaller than the drilled hole.

Why Employ Vias in PCBs?

Vias in PCBs primarily facilitate electrical connections across different board layers, enabling designers to craft intricate and compact circuit layouts by permitting signal and power traversal through layers. This capability is paramount in multi-layer PCBs, where space is constrained, and high-density component placement is requisite.

Space Optimization

Vias permit the stacking of multiple circuit layers, optimizing PCB real estate, resulting in more compact devices.

Enhanced Electrical Performance

Providing direct electrical signal pathways, reducing interference and loss, thereby enhancing overall circuit performance.

Thermal Management

Thermal vias, specifically engineered for heat dissipation, aid in managing PCB temperatures, ensuring component reliability and longevity.

Design Flexibility

Vias afford greater flexibility in routing traces and component placement, fostering more innovative and efficient PCB designs.

What are the different types of vias used in PCB design?

There are several types of vias, each serving different purposes based on their placement and function. Understanding the different types and their applications is crucial for designing efficient and reliable PCBs. The most common types include through-hole vias, blind vias, and buried vias. Each offers unique advantages depending on the design requirements and constraints of the PCB.

1. Through-Hole Vias: These are the most common type of vias, extending through the PCB’s entire thickness, linking all layers. They are straightforward to manufacture and cost-effective.

2. Blind Vias: These vias connect an outer layer of the PCB to one or more inner layers but do not go through the entire board. They conserve space and simplify board layout complexity.

3. Buried Vias: Located entirely within the inner layers of the PCB, buried vias connect two or more internal layers without reaching the outer surfaces. They are useful for high-density and multi-layer PCBs where space is limited.

4. Micro Vias: Smaller than standard vias, micro vias are typically utilized in high-density interconnect (HDI) PCBs. They can connect adjacent layers or span multiple layers using stacked or staggered configurations.

What is the difference between a PCB hole and a via?

The terms “PCB hole” and “via” are often used interchangeably, yet they denote distinct features within a PCB:

PCB hole generally refers to any drilled PCB hole, serving various purposes such as mounting components (e.g., plug-in components), positioning holes or mechanical mounting points. PCB holes are not necessarily conductive. While vias specifically denotes a conductive hole connecting different PCB layers. They are plated with conductive materials, usually copper, to ensure electrical continuity between layers.

In essence, while all vias are PCB holes, not all PCB holes are vias. Vias are a subset of PCB holes with the specific function of establishing electrical connections between layers, whereas PCB holes can serve a broader range of purposes, including mechanical and non-electrical functions.

What should we consider when designing vias in PCB?

In a PCB design, seemingly simple via holes often bring great negative effects to the design of the circuit. In order to reduce the adverse impact of the parasitic effect of the hole, PCB engineers can try their best to consider below points:

Vias cannot be designed on the pads.
The area extending 1.5mm outward from the contact region between the device’s metal housing and the PCB should not design any vias.
Vias should not be present in the areas where adhesive dots are applied or printed for surface-mount components, such as the PCB areas beneath CHIP and SOP components when using adhesive dot application or printing processes.
In principle, through-hole diameters should be at least 0.2mm (8mil) with an outer diameter of at least 0.4mm (16mil). For some special areas, the outer diameter must be controlled to 0.35mm (14mil).
For BGA designs with a pitch of 0.65mm and above, it is advisable to avoid using blind or buried vias, as they significantly increase costs.
The spacing between vias should not be too close to prevent drilling from causing breaks. Generally speaking, the hole spacing should be 0.5mm or more. Spacings of 0.35mm-0.4mm should be avoided as much as possible, and spacings of 0.3mm or less are prohibited.
The number of vias used for power trace inter-layer connections should meet the current carrying requirements, which is 1A per 0.3mm diameter via.

This is the end of this informational sharing, welcome to contact us if you want to know more about PCBs.

Tags: via holes, vias
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What is the Flexible Aluminum PCB?

May 29th, 2024

Flexible aluminum PCB is a new development in the recent years, it enables people decrease the size of certain products in some area. Different from the rigid flex PCB, flexible aluminum PCB combines the flex circuit and aluminum core circuit board (or can be copper core PCB), so it has the rigidity and good thermal management of traditional Aluminum PCBs with the flexibility of polyimide, these hybrid boards offer a host of advantages.

To increase the thermal conductivity in high power applications, and meet the flexibility requirements, flexible aluminum PCB is a good option. This article explores the key benefits of flexible Aluminum PCBs, highlighting why they are becoming increasingly popular in various applications.

What is Flexible Aluminum PCB?

Flexible aluminum PCBs are a type of printed circuit board that uses an aluminum base material and is designed to be flexible. Unlike standard aluminum PCBs, these boards can bend and conform to different shapes, making them ideal for applications where space and flexibility are crucial. And Have you ever heard about our another aluminum board that we called bendable aluminum PCB? This is a special metal core circuit board that uses special material makes the circuit board bendable while won’t damage the board. May you think both of two are the same product? No, they are different in the constructure and raw materials, and the manufacturing processes are different as well.

Bendable aluminum PCB uses aluminum alloy as the raw material, considering it must meet the bendable requirement as well as the good thermal management during using, it must be specially designed aluminum alloy composite material. And the aluminum base thickness also is a key consideration, 0.2mm to 1.0mm always are the common bending metal substrate thickness. Meanwhile, the bending radius of bendable aluminum PCB also should be calculated before manufacturing, making it follow the bending design standard to smooth the manufacturing. It is the same as flexible aluminum PCB.

What Are the Constructure of Flexible Aluminum PCB?

Flexible aluminum PCBs combine the benefits of aluminum’s excellent thermal management with the flexibility required for modern electronic designs. These PCBs are constructed using a combination of materials and layers that provide flexibility, durability, and efficient heat dissipation. And compared with original aluminum PCB, it adds the flexible insulation layer and the content of adhesive glue is different.

Aluminum base layer

The aluminum base layer serves as the foundation of the flexible aluminum PCB. It provides structural support and excellent thermal conductivity. Typically, high-quality aluminum is used for this layer due to its superior thermal properties and mechanical strength.

Dielectric layer

It acts an insulator between the aluminum base and copper foil, it can allow the heat pass through while electrically insulating the conductive pathways.

Copper foil

The copper foil forms the conductive pathways that carry electrical signals and power across the PCB. It is essential for the functioning of the electronic components connected to the PCB.

Flexible layer

Common materials for this layer include polyimide (PI) or polyester (PET), both known for their flexibility, thermal stability, and insulating properties. It contributes to the overall flexibility of the PCB, allowing it to bend and conform to various shapes.

Protective overlayer

This layer is applied over the copper circuits to protect them from environmental factors such as moisture, dust, and physical damage. It also provides mechanical support to the flexible areas. Normally called solder mask layer.

The Difference Between Flexible Aluminum PCB and Flex Circuits

While both aluminum flex PCBs and flexible printed circuits (FPCs) offer flexibility, they differ significantly in their materials and manufacturing costs:

Item	Flexible Aluminum PCB	Flex Circuit (FPC)
Base Material	Aluminum core	Polyimide or PET
Conductive Material	Copper foil and aluminum for the conductive traces	Various materials like polyimide, PET or the copper foil
Flexibility	Limited in specific area	Flexible everywhere
Thermal Conductivity	High thermal conductivity	Depends on the material used
Manufacturing Process	Complex	Relatively simple
Specific Advantage	Fast heat dissipation	General part in electronics
Cost	High	Cost-effective

(Comparison between flexible aluminum PCB and flex circuit)

What Are the Benefits of Using Flexible Aluminum PCB?

Flexible aluminum PCB has numerous advantages that make it highly preferrable for specific applications, including:

Excellent thermal management

Due to the applied of aluminum base, efficient heat dissipation prevents overheating and extends the lifespan of electronic components.

Lightweight and flexible design

Due to the flexible and lightweight features in the flex aluminum PCB, it can be bent and shaped the PCB reduces the need for additional connectors and saves space in compact designs.

Improve reliability

Aluminum based PCB has good durable, ensures the long-lasting performance of the whole product, even in harsh conditions.

High density integrated

The flexible aluminum PCB allows for the higher density circuit layouts than normal aluminum PCB.

Effective electromagnetic shielding

Aluminum material provides electromagnetic shielding in a certain degree, which helps to reduce the impact of electromagnetic interference on the circuit.

How to Choose A Reliable Flexible Aluminum PCB Manufacturer?

Selecting the right manufacturer for flexible aluminum PCBs is crucial for ensuring quality and reliability. Make sure your supplier has extensive experience in this field and obtained relevant certifications like UL, CE, ISO9001 and so on.

Best Technology is a China-based PCB and PCBA manufacturer, who has over 17-years-experience circuit board manufacturing. At Best Technology, we specialize in providing high-quality flexible aluminum PCBs tailored to meet your specific needs. And we were certificated by ISO9001 quality control system, ISO13485 for medical device and IATF16949 for automotive system. Our expertise and commitment to excellence ensure that you receive the best solutions for your electronic applications. Choose Best Technology for your PCB requirements and experience the benefits of advanced PCB technology.

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What is the Rogers Printed Circuit Boards?

May 13th, 2024

Rogers Printed Circuit Board (short for Rogers PCB) is a printed circuit board (PCB) manufactured using a special high-frequency material produced by Rogers Corporation. These boards are designed to meet the demanding performance requirements of high-frequency electronic devices, especially in wireless communications, microwave technology, high-speed digital signal processing, radio frequency (RF) products, and applications requiring extremely high stability and low signal loss.

What are the Main Features of Rogers Printed Circuit Board?

Rogers boards are made of a proprietary amide resin material, which gives them excellent dielectric properties, thermal stability and mechanical strength. Even in extreme working environments such as high temperature and humidity, high frequency and high speed, Rogers PCB board can maintain stable operation, showing its strong adaptability and reliability. Whether it is to improve the performance of electronic equipment, or to ensure the stability of the system, Rogers PCB board plays a vital role. Below are some main features and benefits of Rogers PCB.

Special substrates

Unlike traditional PCB materials based on glass fiber reinforced epoxy resins such as FR-4, Rogers PCBs are ceramic filled or based on high-performance substrates such as liquid crystal polymers (LCP), for example, RO4350B, RT/duroid series, TMM series and TC series. These substrates provide excellent electrical properties, such as low dielectric constant (εr) and low dielectric loss factor (Df), ensuring low signal loss and high-speed during transmission.

High frequency performance

Rogers PCB is particularly suitable for high frequency applications, because its material characteristics make the circuit board can maintain extremely low signal attenuation and stable electrical performance at operating frequencies up to tens or even hundreds of GHz. This makes them excellent in radar systems, satellite communications, 5G/6G network equipment, radio frequency identification (RFID) systems, high-speed data transmission interfaces (such as USB, PCIe) and other applications.

Temperature stability

Rogers material has excellent thermal stability and low coefficient of thermal expansion (CTE), which matches the thermal expansion rate of copper foil, helping to reduce the stress and deformation caused by temperature changes, ensuring the reliability of the circuit when working in a wide temperature range.

Mechanical strength and heat resistance

Due to the use of high-performance composite materials, Rogers PCB usually has high mechanical strength and good high temperature resistance, and can adapt to harsh environmental conditions and heat dissipation requirements.

Surface treatment

Rogers PCB can carry out a variety of surface treatments, such as gold plating, silver plating, organic welding film (OSP), etc., to meet the specific requirements of different applications for weldability, oxidation resistance, contact resistance, etc.

Multi-layer structure and fine traces

Rogers PCB can be made into single-layer to multi-layer structure, support high density interconnect (HDI) design, with fine lines (such as line width/line distance up to 0.3mm or smaller) and small aperture (such as 0.3mm), suitable for complex and precise high-frequency circuit design.

Low moisture absorption

Rogers material moisture absorption rate is very low, even in high humidity environment can maintain stable electrical performance, reduce the impact of moisture on dielectric properties, to ensure long-term reliability. In summary, Rogers printed circuit board is a high-end, professional-grade circuit board product, with its excellent high frequency characteristics, stable electrical performance, excellent temperature stability, and wide applicability, becoming the ideal choice to meet the demanding requirements of modern high performance electronic equipment and communication systems.

Why Use Rogers Printed Circuit Boards?

High frequency PCBs often need high performance with low signal losses, low electrical noise, or high board temperatures. To meet this need Rogers Corp. PCB materials are often used as they are cost effective vs. many of the alternatives. Here are some typical Applications for Rogers PCB:

All kinds of the Microwave equipment.

5G Cellular Base Station Antennas and Power Amplifiers

Automotive Radar and Sensors

RF Identification (RFID) Tags

Direct Broadcast Satellites for low noise block downconverter

Medical equipment such as monitoring instrument, cardiac pacemaker, MRI, etc.

Military and aerospace

Rogers series is often used in RF PCBs with frequencies 6+ GHz and in high heat applications that need ceramic laminates and low signal losses. It may also be used to minimize electrical noise to meet stringent performance requirements.

In our next blog from Best Technology, we are going to share more information about different material from Rogers PCB. pls follow us and if you want to know more about the Rogers PCB, warmly welcomed to visited www.bestpcbs.com or email us, it would be our great pleasure to answer all the questions for Rogers PCB.

Tags: rogers pcb
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What Are Stamp Holes and What’s the Design Standard About It?

May 6th, 2024

Have you ever seen several small holes on the rails of the PCBs or located at the board edges? They look like trails bites by mouse, do you know what they are? And what’s the function of these? This blog may make you sense about it.

What is Stamp Hole on PCB and its Purpose?

Stamp holes, also sometimes called breakaway holes or mouse bites, are small holes drilled in a row or array along the rails or edges of each circuit board within the panel. They look like the edges of a stamp, so people call it “stamp holes”.

Stamp hole is used primarily in the process of depanelized PCBs. De-paneling is the process of separating individual PCBs from a larger panel, which is a common method in PCB manufacturing to improve production efficiency and reduce costs. The larger panel makes handling and processing multiple PCBs easier during the manufacturing process. In some ways, panel also improves the utilization of the raw materials. Once the manufacturing steps are complete, the individual PCBs need to be separated for use in their corresponding devices. And these holes between the single PCBs can create a weak point along which the boards can be easily broken apart after manufacturing be completed.

Why Use Stamp Holes Expertise In PCBs?

It is possible to use stamp holes if the boards are abnormal shaped or round. The stamp hole is connected between each circuit boards, which mainly plays a supporting role and avoid PCB be scattered. Most commonly, they are used to create PCB stand-alone modules, such as Wi-Fi, Bluetooth, or core board modules, which are then used as stand-alone components placed on another board during PCB assembly.

The use of stamp holes allows for a relatively clean break along the separation line, but it may leave behind rough edges or require additional finishing steps to smooth out the remnants of the perforation points. This method of depaneling is a cost-effective solution and can be used for various types of PCBs, but it might not be suitable for very delicate circuits or when a perfectly smooth edge is required. In addition, V-cut and hollow connection strips also are the common depaneling ways for PCBs.

What are differences between Stamp Hole, V-cut and Hollow strip?

When preparing a panel for the manufacturing of multilayer PCBs, it’s essential to consider a method used to connect individual boards within the panel. As mentioned above, there are three connection methods for PCB technology, each serving different types of PCB designs and requirements. So, which one is the better or how to choose a suitable one for your project? Welcome to keep reading.

V-Cut (V-slot)

V-cut is the most common way to separate the PCBs during the circuit board manufacturing. It mainly utilizes for PCBs with straight edges or straight lines. This method involves cutting a V-shaped groove along the line where two PCBs are connected within the panel. When implemented, V-cuts leave a narrow gap (the width of the V-cut itself) between the boards. V-cut depth is an essential point during the process, make sure it has 1/3 depth on top and bottom side. The V-cut is especially suitable for standard, rectangular PCB designs, allowing for a clean and efficient separation of the boards once all other manufacturing processes have been completed.

Stamp Holes

For PCBs with unique or irregular shapes, stamp holes are often the preferred method of connection. Its process involves drilling multiple small holes in an array at the points where the individual PCBs connect within the panel. These holes create a perforated line that weakens the material enough to facilitate easy separation of the boards by applying minimal force, without compromising the integrity of the circuitry. But this way can only be used if you don’t have strict requirements for burrs on edges. And it is easy to damage the whole board if use improper approach.

Hollow Connecting Strips

Hollow connecting strips are used in scenarios where a very narrow strip of material is left to connect the boards within the panel. This method is particularly useful for PCBs utilizing half-hole (castellated holes) technology. The narrow strips maintain the alignment and integrity of the PCBs during the manufacturing process but can be easily removed or broken away to separate the individual boards. Hollow strip is less common but essential for specific designs and technologies.

Each of these connection methods has its specific applications, advantages, and considerations. The choice between V-cuts, stamp holes, and hollow connecting strips depends on the design of the PCB, the requirements of the manufacturing process, and the desired ease of separation post-manufacturing.

How to Add Stamp Holes on Your Circuit Board?

Designing stamp holes is a critical step in preparing your PCB for the depaneling process. This includes creating a series of small holes along the intended lines of separation between individual boards in a panel. Here’s a step-by-step guide to help you incorporate stamp holes into your PCB design effectively:

1. Understand the Purpose

Recognize that stamp holes are used to facilitate the manual separation of PCBs from a panel after the manufacturing process, minimizing the risk of damage to the board and its components.

2. Plan Your Layout

Placement: Decide where the stamp holes will be located on your PCB layout. They should be placed along the edges where the PCB will be separated from the panel.

Number and Spacing: The number of stamp holes and their spacing can significantly affect the ease of PCB separation. Typically, a distance of 0.5mm between holes and 1.0mm between centers of holes are used, but this may vary based on the PCB material and thickness.

3. Select the Hole Size and Quantity

The diameter of stamp holes usually ranges from 0.6 mm to 1 mm. The size may depend on your specific requirements and the capabilities of your PCB manufacturer. As for quantity, 5-8 holes in an array is good (always 2 arrays/rows), more also is available, it can be adapted based on your specific needs.

4. Arrangement of Stamp Holes

Two rows of stamp holes should be added at the edge of the PCB, extending slightly into the board. This design ensures that any burrs left on the board edge after separation will not affect the PCB’s overall dimensions. If there are traces or other critical components on the edge of the board, ensure that the stamp holes are placed to avoid damaging these elements during separation.

5. Design Using PCB Design Software

Use your PCB design software (such as Altium Designer, Eagle, or KiCad) to add the stamp holes to your design. This can usually be done by placing a series of via or pad holes along the separation lines.

Some software packages may offer tools to automate this process, allowing you to specify the number of holes, their spacing, and diameter, and then automatically place them along a line.

6. Consult with Your Manufacturer

Before finalizing your design, consult with your PCB manufacturer for any specific guidelines or requirements they have for stamp holes. This can include preferred sizes, spacing, and any additional considerations to ensure the depaneling process goes smoothly.

Provide detailed documentation of your stamp hole design to your manufacturer to avoid any confusion during the production process.

7. Review and Adjust

After adding the stamp holes to your design, review the layout to ensure that there is adequate clearance between the holes and any nearby components or traces. This is crucial to avoid damage during the separation process.

Adjust the size, spacing, and number of stamp holes as necessary to meet both your design requirements and the manufacturer’s capabilities.

In the design process, these considerations should be adjusted based on the specific PCB design and manufacturing requirements. Moreover, find a reliable PCB manufacturer to ensure these design details are accurately implemented is key to successfully fabrication.

Best Technology specializes in PCB manufacturing for more than 17 years, offering comprehensive PCB production and design services to over 200 countries worldwide. To ensure the best quality and fast delivery, we set up a strictly quality control system according to ISO9001 and equipped with advanced measured devices such as AOI, X-RAY, 2D, 3D measurement tools in our factory. We provide 24/7 hours service and commitment with a timely reply within 10 hours. We sincerely appreciate your any comments or consults, welcome to contact us at any time.

Tags: PCB technology, stamp hole
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How To Identify & Avoid Fake Electronic Components?

April 29th, 2024

Identifying and avoiding fake electronic components on PCB is crucial for ensuring the reliability and performance of your electronics. But with the development of electronics, the replacement cycle of various electronic components, including plastic integrated circuits, is getting shortage in resourcing, which brings the big difficulties to the component management supply chain.

For some components has been updated and may no longer to produced, especially for equipment manufacturers with small components consumption, many varieties and high reliability requirements. Due to small procurement volume, they often cannot be purchased directly from originally manufacturers and much be purchased through agents, thus proving the opportunities for fake components to enter the market. Herein, Best team would like to share some information about definition of fake components and methods to verify & identify fake parts, hope this is helpful for everyone that has demands on components.

What Are Fake Components and How Does It Affect Industry?

Fake components, also known as counterfeit electronic components, are parts that are misrepresented by sellers as genuine, but are actually inferior in quality and may not meet the specifications of the original manufacturer. The U.S. Department of Energy /SAE AS5553 defines counterfeit components as copies or substitutes produced without legal authorization, or components whose materials, properties, or specifications are falsely advertised. These components can be refurbished parts, parts with altered date codes or markings, or completely fabricated units that mimic real products. They are introduced into the supply chain through various illegal means, including unauthorized factories and distributors.

Counterfeiting is a violation of the legal rights of intellectual property owners. The economic cost of counterfeit components far exceeds the cost of replacement, including safety costs, lost performance, repair or replacement, and important is reputational impact. For example, a $2 component used on a printed circuit board (PCB) can cost up to $20 to replace once it is detected to be a counterfeit component. More importantly, counterfeit components have the potential to cause serious consequences. A case in point is the crash of a chartered Convair580 near the Danish coast on September 8^th, 1989. In addition, counterfeit goods may be used in some sabotages, which is likely to pose a serious challenge to national security. Therefore, identifying counterfeit components at the initial stage appear to be particularly important during the initial stage, especially before the PCBA assembly process.

How to Identifying Fake Electronics Components at Initial Stage?

At present, the fake integrated circuits on the market can be divided into refurbished integrated circuits and counterfeit integrated circuits. The mass entry of fake and inferior devices into the market or the supply chain of military products has seriously affected the quality and reliability of our country’s equipment products. Here are some methods to confirm whether you are using a counterfeit component.

Visual inspection

There will be polished marks or traces on the surface of fake electronic components, and some sellers will apply a thin film on the surface of fake electronic components, so that people cannot see the polishing marks. This kind of smearing fake electronic components look brighter than the genuine one. In addition, observing the edge of electronic components also is a good way, due to the polishing process, refurbished electronic components are easily changed to right angles from rounded corners. So, if you see that the edge of electronic components is a “Right Angle”, then you can think that it is refurbished goods!

Silkscreen or texts on surface

To ensure the high-quality of products, most of chips use laser printing or marking technology with a dedicated printer to print silkscreen or text. By this method, its silkscreen is clear, neither conspicuous, nor fuzzy and difficult to erase. But the refurbished chip either has a “jagged” feeling because the writing edge is corroded by the cleaning agent, or the printing is fuzzy, different in depth, wrong in position, easy to erase or too conspicuous. During the verifying process, acetone can be used to wipe the silkscreen as well to confirm whether it is remark part.

Pin-legs on the chips

The pins of genuine parts always in silver powder with darker and uniform color, and they are not easy to have oxidation traces. If it is a refurbished electronic component, then its pin is generally tinned and brighter like a new one. In addition, DIP parts and other plug-ins should not have scratched pins, even if there is scratch should be neat and the metal exposure is clean and no oxidation.

Documentation and traceability

Genuine parts will have proper documentation including batch numbers, date codes, and traceability. And the labels of the genuine parts including the labels on the bottom side of the chip, should be consistent and the date code should be consistent with the device product, while the labels of the refurbished pieces without Remark are confused and the production date is different. Verify these details with the manufacturer’s records if possible.

Thickness measurement

Because of the silkscreen on the electronic components, if you want to refurbish it is must to be polished, which will affect the thickness of electronic components. If you are a layman in electronic components industry, it is easy to ignore this.

Function test

Conduct electrical testing to verify that components meet the specifications claimed. This can include check if the electronic parameters align with what’s expected from the datasheet.

Above are the measurements about how to identify the fake components, however, last but not important is looking for a reliable reputable distributor or buy from original manufacturers directly. These sources are less likely to stock counterfeit parts. Best Technology not only provides PCB & PCBA assembly services, but also offers components sourcing and purchasing from original manufacturers. If you are looking for a reliable supplier, welcome to contact with us or send e-mail to us.

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