What is Pick and Place File in PCBA?

March 8th, 2025

What is the Pick and Place File for PCB Assembly?

When assembling printed circuit boards, precise component placement matters a lot. That’s where the pick and place file in PCBA comes into play. This file lists each component’s location, orientation, and part number. It acts like a map that guides the machine responsible for placing components on the bare board. Without this data, machines have no clue where to position capacitors, resistors, or ICs.

The pick and place file, often called centroid file or XY data, acts as a bridge between the PCB design and the assembly process. It reduces human error, saves time, and boosts placement accuracy. Whether working on simple boards or complex multi-layer designs, this file makes the whole assembly process smoother and faster.

Why Does Pick & Place File Matter?

Every part on a PCB must land at the right spot. Even a minor offset can cause failures. The pick and place file ensures every component fits exactly where it belongs. It helps pick and place machines grab components and place them perfectly, following the designer’s plan.

Without this file, assembly teams would have to rely on manual placement or visual aids. That takes time and increases errors. Machines work faster, more consistently, and far more accurately than human hands. With a proper pick and place file, the machine knows the part number, package type, rotation angle, and X-Y coordinates for every single component.

This file also reduces the chances of missing parts or placing them upside down. When assembling hundreds or thousands of boards, even small mistakes add up. A clean, accurate file makes sure the entire batch meets quality standards, which is crucial for reliable products.

What is the Format of Pick and Place Machine File?

Most files use common formats, such as CSV (comma-separated values) or TXT (plain text). These work with nearly all pick and place machines, so manufacturers can share files easily across different platforms. The pick and place file in PCBA follows a simple structure that’s easy for machines and software to read. Though formats may vary slightly across design software, most include the following:

Reference Designator – Marks each component, like R1 or U3.
Part Number – Shows the specific part used.
Package Type – Explains the physical size and shape, like 0402 or QFP.
X Coordinate – Tells the machine the horizontal placement.
Y Coordinate – Sets the vertical placement.
Rotation Angle – Shows how the part should turn to match the footprint.
Layer Information – Identifies if the part sits on the top or bottom side.

Pick and Place File Example

Here’s a simple pick and place file example to help visualize what it looks like:

This is just a small sample, but real files often contain hundreds or thousands of lines depending on the design complexity. Each line defines one component, ensuring machines have clear placement instructions.

How to Make a Pick and Place File?

Creating a pick and place file in PCBA starts in the design software. When laying out components, the software records the exact position, angle, and orientation for each part. Once the layout’s complete, the file can be generated directly from the software.

Steps generally follow this flow:

Place all components and finalize the PCB layout.
Label every part with clear reference designators.
Assign correct part numbers and footprints.
Check for correct orientation and ensure no components overlap.
Export the pick and place file using the software’s built-in tools.

Good design habits, like keeping components aligned and properly spaced, also improve the file’s accuracy and make downstream processes smoother.

How to Generate Pick and Place File in Altium?

In Altium Designer, generating a pick and place file only takes a few steps. Altium makes the process intuitive, so designers don’t need extra plugins or manual tools. Here’s how it works:

Open the PCB layout in Altium.
Navigate to File > Assembly Outputs > Generate Pick and Place Files.
Choose the top and bottom layers if needed.
Select the output format (usually CSV or TXT).
Review the preview to check for missing or misaligned parts.
Save the file to the desired location.

Altium gives options to customize column order, units, and decimal precision. Double-checking these settings ensures the file works smoothly with the intended assembly equipment.

How to Export Pick and Place File?

The actual export process varies by software, but the core steps stay similar across most platforms. Here’s a general guide:

1. Open the completed PCB layout file.

2. Confirm all parts have correct designators, footprints, and placements.

3. Open the Output or Export menu (naming varies by software).

4. Choose Pick and Place File or Centroid File from the list and export.

5. Select output preferences — file type, units, layers, etc.

6. Review the file for missing data before saving.

Most tools let designers export top and bottom placements separately or combined. Always double-check orientation and rotation values since errors here cause misaligned parts during assembly.

How to Generate Pick and Place File from Gerber?

Gerber files mainly handle copper, solder mask, and silkscreen layers — they don’t directly hold placement data. However, some design tools can extract placement data if the Gerbers contain embedded component data, which isn’t common.

If placement data isn’t embedded, the best approach is to return to the original PCB design file. Most PCB CAD software (like Altium, KiCad, or Eagle) can regenerate a pick and place file directly. If the original design file is unavailable, creating a new placement file requires manual work — identifying parts from the silkscreen and manually recording coordinates.

What is the Pick and Place Process?

The pick and place process starts after the bare PCB arrives at the assembly line. Machines read the pick and place file to know exactly where each component should go. Here’s a simplified version of the steps:

1. Preparing the PCB

Prepare the bare PCB carefully before the assembly process starts. Full inspection is needed to check for defects, scratches, or contamination. For PCBs stored for a long time, baking is important to remove moisture, which helps avoid soldering issues later. After that, solder paste is applied to the pads where components will sit.

2. Feeding the Components

Next, components get loaded into the machine through feeders. These feeders hold reels, trays, or sticks of parts, all arranged in order. Each component type has its own feeder position, linked to the pick and place file.

3. Picking Up Components

The machine starts by picking up components from the feeders using vacuum nozzles. Each nozzle is designed to handle a specific part size, from tiny resistors to larger ICs. The machine uses gentle suction to grab each component without damaging it.

4. Vision Inspection and Alignment

After picking up each component, the machine checks its orientation using a vision system. High-resolution cameras take images to see if the part is facing the right way. If there’s any slight misalignment, the machine rotates the part to the correct angle before placement.

5. Placing Components on the Board

Once the part is aligned, the machine places it onto the PCB. Each component is placed at the exact coordinates provided in the pick and place file. The machine also adjusts the rotation angle to match the footprint on the board. Parts are placed carefully with the right amount of pressure to avoid damaging delicate parts or shifting the solder paste.

6. Speed and Precision Combined

Pick and place machines combine high speed with extreme precision. Modern machines can place thousands of parts per hour, even at microscopic sizes. While speed matters, accuracy is even more important. Each placed component must sit perfectly on its pad, since even the smallest shift could cause electrical issues after soldering.

7. Handling Different Part Sizes

Pick and place machines handle a wide range of components, from tiny 0201 resistors to large connectors. The machine automatically switches nozzles based on the part size.

8. Real-Time Monitoring

Throughout the process, the machine monitors everything in real time. Sensors track part pick-up, alignment checks, and placements. If a feeder runs empty or a part fails inspection, the machine pauses and alerts the operator.

9. Final Transfer for Soldering

Once all parts are placed, the PCB moves to the next step — reflow soldering. The solder paste melts during this stage, permanently bonding each component to the board. Accurate placement during the pick and place process helps ensure every connection forms correctly, which supports good electrical performance in the final product. Here is a full manufacturing process of PCB assembly:

In short, the pick and place process bridges the gap between PCB design and working hardware. It translates design data into real, physical assemblies — fast, accurately, and reliably. Without it, modern electronics manufacturing wouldn’t be able to meet today’s high standards for quality and volume.

At Best Technology, our pick and place process combines high-speed machines, careful file preparation, and experienced operators. Our team knows how important clear placement data is for delivering high-quality PCBs. If you’re looking for reliable PCB assembly services or want help preparing your files, feel free to reach out. We’ll make sure your designs turn into top-quality products, every time.

Tags: altium pick and place file, pick and place file in PCBA
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2.4 GHz Antenna PCB Design, 2.4 GHz Antenna PCB Manufacturer

March 7th, 2025

2.4 GHz antenna plays a key role in wireless communication today. From WiFi routers to smart home devices, they keep us connected without messy cables. Whether you need reliable coverage for short-range indoor use or long-range outdoor connections, the right 2.4 GHz antenna can improve your system’s performance. Best Technology handle both design and production for 2.4Ghz antenna PCB, we can optimize performance from the start. When you need reliable 2.4 GHz antenna PCB, Best Technology delivers top-quality solutions tailored to your project.

What is a 2.4 GHz Antenna?

A 2.4 GHz antenna is a specialized antenna that operates within the 2.4 GHz frequency band. This frequency is widely used for wireless technologies like WiFi, Bluetooth, and IoT devices.

Because 2.4 GHz antennas work within this popular band, they support many devices and systems. Whether for indoor use or longer outdoor coverage, they can send and receive signals efficiently. Their design focuses on matching frequency requirements while balancing gain, size, and range.

What Are the Different Types of 2.4 GHz Antennas?

There are several 2.4 GHz antenna types designed for different environments and needs. Each type offers distinct features to match specific wireless setups.

‌1. By Radiation Pattern

Omnidirectional Antennas

Omnidirectional antennas send signals in all directions. Radiate signals in all directions horizontally, like ripples on water. They are ideal for indoor WiFi routers or small IoT devices where full-area coverage matters most. (e.g., Wi-Fi routers, smart speakers).

Directional Antennas

Directional antennas focus energy in one direction to boost signal strength over longer distances. Focus energy like a flashlight beam. These are perfect for point-to-point outdoor links, long-distance links (e.g., outdoor cameras, wireless bridges).

‌ ‌2. By Integration Method‌

‌PCB Antennas‌

PCB Antennas‌ are designed as copper traces embedded directly into circuit boards. Ideal for mass-produced devices due to low cost and space-saving design. Common in Bluetooth earphones, smart thermostats, and IoT sensors. Their performance depends on board material (e.g., FR4 for basic needs, Rogers substrates for high-frequency stability). Requires precise impedance matching to avoid signal loss.

‌Flexible Antennas‌

Flexible Antennas‌ are made with thin, bendable materials like polyimide film or flexible printed circuits (FPC). Withstands repeated bending, making them perfect for wearables (e.g., fitness bands) or devices with curved surfaces (e.g., medical patches). Some models survive 100,000+ bend cycles. Water-resistant options available for outdoor gear.

‌ 3. By Installation Location

‌Internal Antennas‌

Integrated within the device housing, optimized for compact designs and aesthetic concealment. Common in consumer electronics (e.g., smartphones, smartwatches) where space and design are critical. Typically use PCB or flexible antennas for seamless integration ‌

‌External Antennas‌

Mounted outside the device via connectors (e.g., SMA) or cables, enabling flexible placement for optimal signal reception. Ideal for environments requiring tunable orientation or signal amplification (e.g., industrial routers, drones). High-gain directional variants (e.g., Yagi-Uda) are often external for long-range applications.

The reason 2.4GHz antennas widely adopt SMA connectors is threefold:

‌Superior high-frequency performance‌ – low loss (<0.1 dB @ 2.4GHz) and stable 50Ω impedance up to 18GHz;
Robust mechanical design‌ – compact threaded interface ensuring durability in space-constrained devices like drones;
Regulatory compliance‌ – standardized variants (e.g., RP-SMA) meet FCC/CE certifications for Wi-Fi routers and IoT equipment.

SMA Connector has gender identification. Most antennas use female SMA connectors (hole), while devices (e.g., routers) use male SMA ports (pin). SMA Connector Gender Identification‌:

SMA Male (Plug)‌: Features a center pin and inner threads.
SMA Female (Jack)‌: Has a center hole and outer threads.

‌Reverse-polarity SMA (RP-SMA) swaps genders, common in Wi-Fi gear. Pls always check device specs to avoid mismatches.

What Materials Are 2.4 GHz Antennas Made Of?

The materials used to build a 2.4 GHz antenna directly affect how well it performs, how long it lasts, and how easy it is to fit into different devices. Choosing the right materials helps balance conductivity, weight, cost, and durability. Let’s break down the most common material choices and where they fit best.

1. Conductive Metals for High Signal Efficiency

The main goal of any 2.4 GHz antenna is to efficiently radiate and receive signals, so the core material must conduct electricity well.

Copper is one of the top choices. Its excellent conductivity helps signals pass through with minimal loss, which directly improves antenna efficiency. Copper is widely used in both external and internal antennas, particularly in applications where high performance is critical.
Aluminum offers another option, especially for larger antennas where weight savings are important. Although aluminum’s conductivity is lower than copper’s, it’s still good enough for many 2.4 GHz antenna applications, especially directional designs like Yagi antennas or outdoor panels.

These metals form the main radiating elements in most antennas, whether they’re external, internal, or PCB-based.

2. Ceramic for Compact Embedded Designs

When devices shrink, so do their antennas. Many modern devices rely on ceramic antennas, especially for built-in 2.4 GHz antenna PCB layouts.

Ceramic materials allow antennas to stay small without losing too much performance.

They handle higher frequencies like 2.4 GHz well, making them perfect for compact gadgets such as IoT sensors, smart home devices, fitness trackers, and smartphones.

Ceramic antennas are often printed directly onto the PCB or mounted as small components. Their high dielectric constant helps keep the physical size small while still maintaining reasonable performance.

3. Protective Coatings and Weatherproof Materials

For outdoor applications, 2.4 GHz antennas face a different challenge—exposure to sun, rain, and extreme temperatures. Materials used in these antennas need to survive tough conditions without affecting performance.

Many outdoor antennas use weather-resistant plastics to cover the metal radiators. This plastic shielding blocks moisture and dirt but allows radio signals to pass through with minimal interference.

In harsher industrial or marine settings, UV-resistant coatings and corrosion-resistant metals add extra protection, keeping antennas working reliably for years.

These protective materials make sure outdoor antennas can handle long-term exposure while still providing stable connections, even in challenging environments.

2.4 GHz Antenna Design

How to design a 2.4 GHz antenna? Designing a 2.4 GHz antenna may look simple on the surface, but every step directly affects how well the antenna performs. Engineers focus on balancing frequency, size, gain, and impedance matching to get the best signal strength and stable connection. Below is a clear step-by-step breakdown of the key stages.

1. Selecting the Right Antenna Type and Length

The first step in the design process is deciding which 2.4 GHz antenna type works best for the device and its application. Common options include omnidirectional antennas, directional antennas, and PCB-integrated antennas.

Omnidirectional antennas radiate signals evenly in all directions, which suits routers, smart home devices, and wireless cameras.
Directional antennas focus the signal in one direction, which helps with long-range connections or point-to-point communication.
PCB antennas fit directly onto the circuit board, making them perfect for compact gadgets like wearables and IoT devices.

Once the type is clear, the 2.4 GHz antenna length becomes critical. For 2.4 GHz signals, a quarter-wavelength antenna is roughly 31 mm, while half-wavelength antennas are about 62 mm. These values shift slightly depending on the design and placement, especially in small or embedded products. Keeping the length correct ensures the antenna resonates properly at 2.4 GHz, which directly impacts performance.

2. Shaping the Antenna and Optimizing Radiation Pattern

The next important part is choosing the antenna shape since it directly affects how the antenna radiates signals. Different shapes suit different needs:

Helical antennas (coiled wire designs) work well when space is extremely limited. Despite the compact form, they still deliver usable performance.
Patch antennas, often seen in routers and access points, offer reliable coverage with a relatively small footprint.
Monopole or dipole antennas strike a balance between size and performance, making them versatile for indoor and outdoor devices.

Once the shape is selected, engineers use simulation software to model how the antenna radiates at 2.4 GHz. These simulations reveal weak points, dead zones, or unexpected reflections that could weaken signal strength. The design can be adjusted to boost coverage, reduce interference, and fine-tune the antenna’s radiation pattern.

3. Ensuring Proper Impedance Matching and Minimizing Interference

With the physical design in place, attention shifts to impedance matching—a critical factor for signal transfer efficiency. The 2.4 GHz antenna must match the output impedance of the connected device, typically 50 ohms. A mismatch causes signal reflections, which lower efficiency and reduce range.

The antenna materials, trace width, and even the 2.4 GHz antenna PCB layout all affect impedance. Engineers adjust these factors during prototyping to get the cleanest match possible.

Finally, interference checks are essential. The 2.4 GHz band is crowded, with Wi-Fi, Bluetooth, and countless smart devices all sharing the same space. Good antenna designs use filtering techniques, proper shielding, and smart placement to reduce noise from nearby electronics. By minimizing interference, the antenna delivers cleaner signals and better reliability, especially in busy environments like homes and offices.

Best Technology offers a full range of high-quality antenna PCBs, customized to match the unique requirements of each customer. With competitive ODM & OEM pricing, we deliver reliable 2.4 GHz antenna solutions to support your projects from initial design to final production.

What Are the Benefits of 2.4 GHz Antennas?

The 2.4 GHz antenna stands out in the wireless world thanks to its strong performance across various devices and environments. Its advantages explain why it plays such a key role in modern communication systems. Let’s break down some of the key benefits.

1. Compatibility Across Multiple Technologies

One of the biggest benefits of a 2.4 GHz antenna is its broad compatibility. It works smoothly with popular wireless standards like WiFi, Bluetooth, Zigbee, and proprietary RF systems.

This flexibility allows engineers to create devices that communicate across homes, offices, factories, and even outdoor spaces—all using the same frequency band. Because so many devices operate at 2.4 GHz, businesses and designers can standardize around this frequency, reducing complexity when building connected systems.

2. Longer Range Compared to Higher Frequencies

Another key advantage is range. Compared to higher bands like 5 GHz, the 2.4 GHz antenna supports better signal penetration and wider coverage.

Signals at 2.4 GHz travel farther, especially indoors where walls, furniture, and other obstacles can block higher frequencies. This longer range is valuable for applications like smart homes, industrial sensors, and outdoor IoT systems where stable connections matter more than speed.

This is why 2.4 GHz antennas remain so popular, even though faster frequencies exist.

3. Flexible Designs for Every Application

The 2.4 GHz antenna can be designed to match almost any requirement.

For compact devices like wearables or sensors, tiny PCB antennas fit directly onto circuit boards without adding bulk.
For outdoor or long-distance uses, larger high-gain directional antennas focus signals in a specific direction to improve coverage and signal strength.

This range of options—from small embedded antennas to large external ones—gives designers freedom to choose the perfect antenna for each product.

What Are the Applications of 2.4 GHz Antennas?

Because the 2.4 GHz antenna combines wide compatibility, reliable range, and flexible designs, it fits into countless industries and use cases. From home networks to industrial automation, this frequency keeps devices connected in every corner of life.

1. Smart Homes and Consumer Electronics

In residential settings, 2.4 GHz antennas power the everyday devices people rely on.

WiFi routers use 2.4 GHz to provide whole-home coverage, especially in multi-story homes where walls and floors block higher frequencies.
Smart TVs, security cameras, smart plugs, and speakers also connect using this band, ensuring devices stay linked to home networks without constant dropouts.
Even smaller gadgets like smart thermostats, light switches, and door sensors all benefit from the reliability of 2.4 GHz antennas.

2. Industrial and Agricultural Systems

Beyond homes, 2.4 GHz antennas support critical wireless links in factories, warehouses, and farms.

In industrial automation, machines rely on 2.4 GHz wireless connections to report performance data and receive remote commands.
In smart agriculture, wireless soil sensors, irrigation controllers, and livestock trackers all depend on 2.4 GHz antennas to transmit data across fields and greenhouses.

These industries value 2.4 GHz for its range, penetration, and low power requirements, making it ideal for sprawling facilities and remote locations.

3. Automotive and Healthcare Technologies

The automotive and medical sectors also take advantage of 2.4 GHz antennas in innovative ways.

Connected vehicles use them to communicate with roadside sensors, smart traffic lights, or other vehicles nearby.
In healthcare, patient monitors, wearable health trackers, and wireless diagnostic tools rely on 2.4 GHz to continuously transmit data to caregivers without using wired connections.

Because 2.4 GHz antennas balance reliable performance and compact size, they work perfectly in cars and medical devices where space and reliability matter most.

2.4 GHz Antenna PCB Manufacturer

Why choose Best Technology as your trusted 2.4 GHz antenna PCB manufacturer? When choosing a 2.4 GHz antenna PCB manufacturer, you want more than just a product — you need a partner who understands your industry, your project requirements, and your timeline. At Best Technology, we deliver all that and more. Here’s why companies worldwide trust us for their 2.4 GHz antenna needs:

1. Full Turn-key Antenna PCB Solutions

At Best Technology, we do more than supply antennas PCB — we work alongside you from initial design all the way to final delivery. Whether you need a standard design or something fully customized to match your device size, operating environment, and signal requirements, we’ve got you covered.

2. 18 Years PCB Manufacturing Experience

With over 18 years of hands-on experience in PCB manufacturing, our engineering team ensures your antenna’s performance is fine-tuned from the start. By handling both design and production under one roof, we make sure every detail — from material selection to layout optimization — works in harmony to maximize performance.

3. No MOQ Requirement

We also provide flexible order sizes, whether you need a small prototype batch for testing or high-volume production for mass deployment. With no MOQ restrictions, we ensure rapid turnaround times and dedicated support for projects of any scale.

4. 2-3 Weeks Fast Delivery Time

With delivery times as fast as 2-3 weeks, we help you hit your project milestones without compromising on quality. Our streamlined production process and dedicated team ensure timely delivery to keep your projects on track.

5. High Quality Ensured

Reliability matters, especially for wireless communication. Every PCB of 2.4 GHz antenna from Best Technology undergoes thorough performance checks to ensure it meets frequency accuracy, gain, and long-term durability requirements.

6. ISO13485, IATF16949 & AS9100D Compliant

Our production facilities operate under globally recognized quality systems, including ISO13485 for medical, IATF16949 for automotive, and AS9100D for aerospace applications.

7. Customer-Oriented Support

Whether you’re developing antennas for IoT devices, medical equipment, automotive systems, or industrial applications, our team deeply understands the unique wireless challenges across these industries and delivers tailored solutions. Our professional PCB engineers are here offering 24/7 consultation and rapid response. As an professional 2.4 GHz antenna PCB manufacturer, Best Technology feel pleasure to give customers the expert advice on 2.4GHz antenna PCB design. Just feel free to reach out to us at sales@bestpcbs.com with any questions or for additional information.

FAQ Of 2.4GHz Antenna

Will a 2.4 GHz antenna work for 5 GHz?

No, 2.4 GHz antennas are designed for 2.4 GHz signals. They cannot efficiently handle 5 GHz frequencies due to size and impedance differences.

What is the difference between 2.4G and 5G antennas?

2.4G antennas focus on longer range and better penetration, while 5G antennas prioritize faster speeds but with shorter range.

Do longer WiFi antennas work better?

Not always. Length should match signal wavelength. Longer antennas can add gain, but only if properly matched.

What is the best length for a 2.4 GHz antenna?

A quarter wavelength around 31 mm works well for most designs.

How far can a 2.4 GHz antenna reach?

It depends on gain and environment. Indoors, 30 meters is common. Outdoors, high-gain directional antennas can achieve over 5 kilometers in ideal line-of-sight environments.

How does a 2.4 GHz antenna work?

It converts electrical signals into 2.4 GHz electromagnetic waves for transmission and vice versa for reception, enabling wireless communication through resonant frequency matching.

Tags: 2.4 GHz Antenna, 2.4 GHz Antenna PCB Design, 2.4 GHz Antenna PCB Manufacturer, PCB, pcb design, printed circuit board
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Flex PCB-Flexible PCB Design, Production and Assembly

March 7th, 2025

Flex PCB has become a popular solution in modern electronic designs, especially for devices where flexibility, weight reduction, and compact layouts matter. These boards bring many benefits that traditional rigid boards simply cannot match. Whether you’re looking into flexible circuits for the first time or need a trusted partner for flex PCB manufacturing, understanding the full process helps you make better choices. In this blog, we’ll cover the design, production, and assembly processes, so you know exactly what’s involved.

What Is a Flex PCB?

A flex PCB is a printed circuit board made on a flexible substrate instead of the stiff materials used in regular PCBs. Unlike traditional boards, which stay flat, flex PCBs can bend and twist without damaging the copper traces or breaking the substrate. This flexibility gives product designers more freedom to create compact, lightweight, and innovative devices.

Many flexible PCBs use polyimide as the base, which handles heat well and stands up to constant movement. Because they bend without breaking, they are ideal for wearable devices, automotive controls, medical equipment, and any application where space is tight. Plus, flexible PCBs reduce connectors and wiring, lowering the chance of failure points.

Best Technology has over 18 years of experience in flex PCB design, manufacturing and assembly. Our one-stop service helps you simplify your supply chain while improving product reliability. Contact Best Technology at sales@bestpcbs.com today to learn how we support your projects with high-quality flex PCBs, low MOQ, fast delivery and competitive price.

What Are the Components of a Flex PCB?

‌Flex PCB mainly consists of the following parts‌:

‌Substrate layer‌

The substrate layer of FPC is usually made of polyimide (PI) or polyester (PET) materials. PI has excellent heat resistance, mechanical strength and electrical insulation, while PET substrate is cheaper, but its heat resistance and chemical resistance are slightly inferior to PI.

‌Conductive layer

The conductive layer is mainly composed of copper foil. There are two commonly used copper foils: electrolytic copper foil and rolled copper foil. Electrolytic copper foil has a lower cost and is suitable for applications with low flexibility requirements; while rolled copper foil has good ductility and is suitable for scenarios that require high flexibility and high-frequency bending‌.

‌Coating film layer

The covering film layer is used to protect the copper foil circuit and prevent the influence of the external environment, such as moisture, dust and mechanical damage. The cover film is usually made of the same material as the substrate, such as PI or PET, with a thickness between 0.0125mm and 0.05mm.

‌Adhesive layer

The adhesive layer is used to bond the materials of different layers together. Common adhesive materials are acrylic and epoxy resins, which perform well in heat resistance, chemical resistance and flexibility.

‌Solder mask

The solder mask is used to protect the soldering area of the circuit, prevent the flow of tin during soldering, and protect the circuit from being short-circuited by solder. The solder mask usually uses green, blue or transparent solder mask ink.

‌Surface treatment layer

The surface treatment layer is used to improve the welding performance and reliability of the FPC. Common surface treatments include tin plating and gold plating.

What Are the Components of a Flex PCB?

What Are the Advantages of Flexible PCB?

‌Bendability and flexibility‌

Flexible PCB can bend and fold without affecting the circuit operation, and can adapt to various complex shapes and spatial layouts, which makes it adaptable to various irregular installation requirements.‌

‌Light and thin features

Compared with rigid PCB, flexible PCB is thinner and lighter, which helps to reduce the size and weight of the device and make electronic equipment more portable.‌

‌High reliability

Flexible PCB is not easily affected by vibration and shock, can work stably in harsh environments, and has high reliability.‌

‌High temperature resistance‌

Flexible PCB can work in high temperature environments and is suitable for electronic equipment in high temperature working environments.‌

‌High production efficiency

The production process of flexible PCB can be completed by robots, which can realize the production of multiple boards at one time, improve production efficiency, and shorten product development cycle.

Diversified design

Flexible PCB can be customized according to strict physical dimension restrictions to meet the needs of various complex equipment structures.‌

‌High safety‌

The wires of flexible circuit boards are connected as a whole, which reduces the error problem when the wires are connected and reduces the occurrence of failures.

What Are the Advantages of Flexible PCB?

How Do You Make a Flexible PCB?

The design process of flexible PCB can be divided into the following core steps, combined with key links such as material selection, structural planning and manufacturing process:

1. Demand analysis and planning stage

‌Clear functional requirements

Determine the core parameters of the circuit such as functional modules, signal types (high frequency/low frequency), and current carrying capacity as constraints for subsequent design‌.

‌Three-dimensional structure planning‌

Define the bending area, folding angle and dynamic motion path according to the product space layout to avoid the concentration of lines in the mechanical stress concentration area‌.

‌Layer number and size definition‌

Select single-layer, double-layer or multi-layer structure according to the complexity of the circuit, and give priority to compact layout to save space‌.

2. Material selection and structural design

‌Substrate selection

Select polyimide (PI) or polyester (PET) substrate according to the application scenario. PI material with stronger temperature resistance is preferred in high temperature environment‌.

‌Conductive layer configuration‌

Use rolled copper foil to improve bending life. The copper thickness is selected in the range of 18μm-35μm according to the current demand. It is recommended to use ultra-thin copper layer in dynamic bending scenarios‌.

‌Protective layer design‌

Cover the non-welding area with polyimide cover film, and use reinforcement materials (such as stainless steel sheets) in the dynamic bending area to improve mechanical strength‌.

3. Circuit design and verification

‌Wiring rule setting‌

The line direction in the bending area is kept perpendicular to the bending direction, and arc corners are used to avoid right-angle routing‌. Equal-length routing is implemented for key signal lines, and staggered layout is used for adjacent.

Layer lines to reduce crosstalk

Grid copper plating is used to improve flexibility in the ground layer.

Impedance control and simulation

Impedance matching calculation is performed on high-speed signal lines, and electromagnetic simulation is performed using tools such as HFSS to verify signal integrity‌.

‌Thermal stress analysis

Use FEA software to simulate the fatigue characteristics of materials after multiple bending, and optimize the routing path and reinforcement scheme‌.

4. Production file output

‌Stack-up drawing

Clearly define the material thickness, adhesive type and cover film window position of each layer, and mark the special process requirements of the dynamic bending area‌.

‌Gerber file generation‌

Includes circuit layer, drilling diagram, shape cutting diagram, etc. The rigid-flexible board needs to mark the transition structure of the rigid area and the flexible area separately‌.

‌Process description document‌

Special areas are marked with electroplating requirements (such as selective gold treatment in dynamic bending areas), and the PI cover film window opening accuracy requirements (±0.05mm) are noted.

5. Manufacturability verification

‌DFM inspection‌

Verify key parameters such as minimum line width/line spacing (generally ≥75μm), distance from via to bending area (≥3 times the board thickness), and reinforcement material fitting accuracy.

‌Sample test‌

Perform reliability verification such as dynamic bending test (usually requiring more than 100,000 times without breakage), insulation resistance test under high temperature and high humidity environment, etc.

How to Manufacture Flex PCB Board?

The production process of flexible PCB (FPC) includes the following main steps:

1.‌ Design review

Before prototyping, the design of the flexible PCB needs to be reviewed first. This step mainly checks the rationality, feasibility and potential manufacturing problems of the design. Design review is usually completed by a professional team of engineers, who will carefully evaluate the design documents based on experience and technical specifications.

2. ‌Material preparation‌

Prepare the corresponding materials according to the requirements of the design documents. The main materials of flexible PCB include conductive materials, insulating materials and substrates. The choice of materials directly affects the performance and quality of flexible PCBs.

‌3. Production process‌:

‌Graphic production‌

Coat a layer of dry film photoresist on the copper foil, expose and develop the circuit pattern, and then use an etchant to remove the unnecessary copper, retain the designed circuit part, and form the basic conductive pattern.

‌Cover film bonding

Cover the protective film on the line through the lamination process to prevent the circuit from being oxidized or damaged. The cover film needs to be pressed under high temperature and high pressure to ensure good adhesion to the circuit.

Drilling and electroplating

Drill holes, through holes or mounting holes according to the design drawings. These holes are used for electrical connection between multi-layer FPCs or fixing of components. Hole metallization is to form metal channels through electroplating to ensure the conduction between the upper and lower layers of the circuit.

Surface treatment

Including gold plating, silver plating, tin plating, etc., select the appropriate treatment process according to the application requirements to improve the corrosion resistance and weldability of the FPC.

Forming and punching

Punch the FPC according to the specified size according to the designed shape to form the final board shape. This process requires high precision to ensure that the finished product size meets the design requirements.

Electrical testing

The FPC soft board after forming needs to be tested for electrical performance to ensure that the circuit is well conductive, the insulation meets the standard, and there is no short circuit and open circuit.

Quality inspection

After completing the production process, the flexible PCB needs to be quality inspected. Mainly check whether the appearance, size, electrical performance and other aspects of the product meet the design requirements. Quality inspection is usually completed by a professional quality inspection team, who will use a variety of advanced testing equipment and methods to conduct strict inspections on the products.

Packaging and shipment

Flexible PCBs that have passed quality inspection will be packaged and prepared for shipment. The selection of packaging materials and packaging methods need to take into account product protection and safety during transportation.

Flex PCB Manufacturer

Choosing the best flex PCB manufacturer means looking for experience, equipment quality, and customer support. Flex PCB production requires specialized machinery and careful handling at every step, so a factory with proven experience matters.

A good manufacturer offers design advice to help avoid costly errors. They also provide fast prototyping so design changes can be tested quickly before moving to full production. Beyond production, reliable after-sales support helps catch any issues during assembly at your facility.

Best Technology offer full-service capabilities, including flex PCB design, prototyping, production, and assembly. This simplifies communication and reduces the chance of errors caused by working with multiple suppliers. A trusted manufacturer also keeps materials in stock, shortening lead times and helping you stay on schedule.

What Is Rigid PCB vs Flex PCB?

‌The main differences between rigid PCB and flexible PCB are in terms of substrate, structure, application field, stress resistance, cost, design requirements and maintainability.

Substrate

‌Rigid PCB‌: FR-4 (glass fiber reinforced epoxy board) is usually used as the substrate, which has high mechanical strength and stable electrical performance. ‌

‌Flexible PCB‌: The substrate is mostly polymer materials such as polyimide (PI) or polyester (PET), which has good flexibility and lightness. ‌

Structure

‌Rigid PCB‌: It usually has a multi-layer structure, consisting of multiple layers of substrate and conductive layer, suitable for applications requiring high mechanical strength and stable electrical performance. ‌

‌Flexible PCB‌: It is usually a single-layer or double-layer structure with a thin thickness, which is more suitable for miniaturized and lightweight product design. ‌

Application

Rigid PCB‌: It is widely used in computers, communication equipment, household appliances and other fields that require high strength and stable performance. ‌

‌Flexible PCB: Mainly used in flexible displays, wearable devices, smartphones and other fields that require flexibility and compact design.

Stress resistance

Rigid PCB: With high stress resistance, suitable for bearing large mechanical pressure and thermal stress.

Flexible PCB: Although the stress resistance is relatively low, it has good adaptability to bending and folding stress.

Cost

Rigid PCB: The production cost is relatively low, and the raw materials and production process are relatively mature.

Flexible PCB: Due to the special substrate and production process, the production cost is relatively high.

Design requirements

Rigid PCB: The design is relatively simple, and the wiring space and installation method requirements are relatively low.

Flexible PCB: The design needs to consider factors such as wiring space, bending radius, and folding times, and the design is more difficult.

Where are flexible PCBs used?

‌Flexible PCB (Flexible Printed Circuit Board, FPC) has a wide range of applications, mainly including the following aspects‌:

‌Smartphones and smart watches

‌Flexible PCB is widely used in smartphones and smart watches with its light and flexible characteristics. It can adapt to complex internal structures and provide stable electrical performance‌.

‌Automotive electronics‌

In the field of automotive electronics, flexible PCB is used for in-vehicle entertainment systems, sensors and control systems, etc., providing lightweight and high-reliability solutions‌.

‌Medical devices

Flexible PCB also has important applications in medical devices, such as endoscopes and catheters, which can adapt to complex in vivo environments and provide high reliability and flexibility‌.

‌Aerospace‌

In the field of aerospace, flexible PCB is used in satellite communication systems, navigation and control systems, power and energy management systems, etc., to meet the high reliability, lightweight and high-density integration requirements in extreme environments.

‌Consumer electronics‌

Flexible PCB is also widely used in the field of consumer electronics, such as wearable devices, tablets and laptops, providing miniaturized and high-density installation design requirements.

Conclusion

Flex PCBs give product designers the freedom to create smaller, lighter, and more reliable products across many industries. Whether you need a simple flex PCB design for a wearable or a complex multi-layer flexible board for medical equipment, understanding the process helps you make better choices.

Tags: flex pcb design, flex pcb manufacturer
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What is PCB conformal coating? What is its use?

March 7th, 2025

PCB conformal coating is a thin layer of polymer applied to the surface of a PCB to protect the circuits and board components from environmental stresses. The coating ensures that the PCB maintains high performance and reliability in the face of moisture, condensation, dust, dirt, chemicals, corrosion and other adverse environmental conditions.

What is PCB conformal coating? What is its use?

What is Conformal Coating?

Conformal coating is a liquid polymer film applied to a printed circuit board (PCB) to protect it from environmental factors. It conforms to the board’s shape, covering components without affecting their function. This coating prevents damage from humidity, dust, salt spray, and chemical exposure, which can cause corrosion and electrical failures.

It is commonly used in aerospace, automotive, medical, and industrial electronics, where protection is crucial for long-term performance. The coating also helps prevent short circuits caused by contaminants and enhances the overall durability of the PCB.

What Are the 5 Types of Conformal Coating?

There are several types of conformal coatings, each offering unique benefits based on the application requirements. The five most commonly used coatings are:

Acrylic acid (AR): After liquid coating, it is heated and cured at room temperature, providing cost-effective moisture protection, easy to apply and reworkable, suitable for conventional environments such as consumer electronics, but its high temperature resistance is limited.

Silicone (SR): Ideal for extreme temperature environments, with excellent weather resistance and shock resistance, widely used in high reliability scenarios such as aerospace and automotive electronics.

Polyurethane (UR): It has strong chemical resistance and wear resistance, but it is difficult to remove after curing, suitable for industrial control panels that require long-term protection and low maintenance requirements.

Epoxy resin (ER): Thermosetting materials require high temperature curing, provide a rigid protective layer, and are extremely resistant to solvents, moisture and mechanical stress, but the high hardness makes rework difficult, and is mostly used in military or harsh environment equipment.

Parylene (XY): It is formed into a thin film through vacuum vapor deposition, has excellent moisture resistance and chemical resistance, and is suitable for precision scenarios such as medical implants and high-frequency circuits, but the process is complex and the cost is high.

Each type has its advantages depending on the operating environment, durability needs, and repairability of the PCB.

Do All PCBs Have Conformal Coating?

No, not all PCBs require conformal coating. It depends on the intended use of the board. Consumer electronics, such as smartphones and laptops, may not need it since they are protected within enclosures.

However, industrial, medical, and military PCBs often require this coating due to exposure to extreme conditions, moisture, or contaminants.

For products that must operate in outdoor, high-humidity, or chemical-rich environments, conformal coating is essential to maintain reliability.

What is the Point of Conformal Coating?

The primary purpose of conformal coating is to protect electronic circuits from environmental damage. It prevents issues like corrosion, oxidation, and short circuits caused by moisture or contaminants.

It also provides:

Enhanced Reliability: Reduces the risk of failure in harsh conditions.

Longer Lifespan: Protects components from physical and chemical wear.

Improved Performance: Prevents signal interference from conductive debris.

Cost Savings: Reduces maintenance and replacement costs over time.

With conformal coating, PCBs perform better, last longer, and withstand more challenging environments without degradation.

When to Apply Conformal Coating?

Conformal coating should be applied after the PCB assembly process but before final testing. This ensures that all components are correctly placed and functioning before adding the protective layer.

It is best applied when:

The PCB will be exposed to moisture, dust, or chemicals.

The circuit operates in high-temperature or high-humidity environments.

There is a risk of vibration or mechanical stress affecting performance.

Applying the coating at the right stage prevents contamination and defects while ensuring maximum protection.

How to Apply Conformal Coating?

The application method depends on the type of coating, production volume, and precision requirements. The most common methods include:

Brushing: Ideal for small-scale or repair applications. Simple and cost-effective but less precise.

Spraying: Provides an even coating over large surfaces. Used for medium-scale production and manual application.

Dipping: PCB is submerged in the coating liquid. Ensures full coverage but may lead to excess material buildup.

Selective Coating Machines: Uses robotic arms to apply coating only where needed. Precise and efficient for high-volume production.

After application, the coating must cure using air drying, heat, or UV light, depending on the material used. Proper curing ensures maximum adhesion and durability.

How to Remove Conformal Coating?

Although conformal coatings are designed to be permanent, they can be removed when necessary, such as during repairs or modifications. The removal method depends on the type of coating:

Solvent Removal: Works for acrylic and some urethane coatings. Chemical removers dissolve the coating without damaging the PCB.

Thermal Removal: Applying heat softens some coatings, making them easier to scrape off.

Mechanical Removal: Abrasive tools can scrape or sand away rigid coatings like epoxy.

Proper removal ensures that the PCB remains intact while allowing for necessary repairs or modifications.

What Are the Disadvantages of Conformal Coating?

Although conformal coating provides excellent protection, it has some limitations:

Difficult Repairs: Once coated, components can be harder to access for modifications.

Extended Drying Time: Some coatings take longer to cure, delaying production.

Application Complexity: Requires specialized equipment for precision coating.

Removal Challenges: Hard coatings like epoxy are difficult to remove without damaging the PCB.

Despite these challenges, the benefits of conformal coating far outweigh the drawbacks, making it a valuable solution for electronic protection.

Is Solder Mask the Same as Conformal Coating?

No, solder mask and conformal coating serve different purposes.

Solder Mask: A permanent protective layer applied during PCB manufacturing. It prevents solder bridges and protects copper traces from oxidation.

Conformal Coating: Applied after assembly to protect against moisture, dust, and chemicals. It is a transparent layer that shields the entire circuit.

While both offer protection, solder mask is built into the PCB, while conformal coating is an additional layer for enhanced durability.

Can We Apply Conformal Coating?

Yes, BEST Technology provides professional conformal coating services backed by 18+ years of PCB manufacturing expertise.

With advanced conformal coating equipment and a team of skilled professionals, BEST Technology ensures precise application, superior protection, and long-lasting performance for circuit boards. Whether you need acrylic, silicone, urethane, epoxy, or parylene coatings, BEST Technology can meet specific requirements with high-quality, industry-standard solutions.

Conclusion：

Conformal coating is an essential protective solution for PCBs operating in challenging environments. It ensures long-term reliability, prevents corrosion, and enhances performance in critical applications.

Though it adds complexity to the production process, the benefits of conformal coating far outweigh the disadvantages. It extends the lifespan of electronic devices. For professional PCB solutions, contact sales@bestpcbs.com

Tags: conformal coating, conformal coating machine, conformal coating pcb, pcb conformal coating
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What are double sided FR1 circuit boards? & FR1 vs FR4

March 7th, 2025

Double Sided FR1 Circuit Boards are a type of printed circuit board (PCB) made of FR1 material with two layers of conductive traces. FR1 is a flame retardant material made of paper base and phenolic resin, with good electrical properties and cost-effectiveness, suitable for a variety of electronic devices.

As a PCB manufacturer with more than 18 years of manufacturing experience, BEST Technology has accumulated rich experience and excellent technical strength in the production of double-sided FR1 circuit boards. BEST Technology’s production process uses advanced equipment and a strict quality control system to ensure that each circuit board meets high quality standards.

What are double sided FR1 circuit boards?

A double-sided FR1 PCB is made from Flame Retardant 1 (FR1) material, a paper-based phenolic laminate that serves as the board’s substrate. The defining characteristic of double-sided PCBs is their copper layers on both sides, allowing components to be soldered on both surfaces.

This feature enables denser circuit layouts, making double-sided FR1 PCBs ideal for applications where single-layer boards cannot provide enough space for circuit traces.

However, because FR1 is not as heat-resistant as FR4, it is mainly used in low-power electronic devices that do not generate excessive heat.

What is the difference between FR1 and FR4 PCB?

FR1 and FR4 are two different types of PCB materials, each suited for specific applications. Here’s how they compare:

Material Composition:

FR1: Made of phenolic resin and paper-based material.

FR4: Constructed from woven fiberglass and epoxy resin, making it more rigid and durable.

Thermal Resistance:

FR1: Has a lower heat tolerance, making it unsuitable for high-temperature applications.

FR4: Withstands higher temperatures, ideal for demanding environments.

Durability & Strength:

FR1: More brittle, making it prone to cracking under stress.

FR4: Has high mechanical strength, suitable for multilayer PCBs.

Cost:

FR1: Cheaper, making it ideal for cost-effective projects.

FR4: More expensive but offers better longevity.

Common Uses:

FR1: Found in household electronics, small gadgets, and simple power circuits.

FR4: Used in industrial, automotive, and high-performance electronic devices.

What is FR1 FR2 and FR3?

Many PCB materials exist, but FR1, FR2, and FR3 are closely related. All are paper-based but with different properties:

FR1: Phenolic resin impregnated kraft paper substrate, with the highest heat resistance (UL 94 V-0/V-1) among the three, used for single-layer boards and basic double-sided boards (lighting equipment, home appliance control boards), with the lowest cost but poor moisture resistance and low dimensional stability.

FR2: Phenolic resin paper-based material, with lower heat resistance than FR1 (UL 94 V-2), mainly used for low-cost single-layer PCBs (remote controls, toy circuits), with high flammability and requiring fireproof coating and not suitable for high temperature environments.

FR3: Epoxy resin impregnated paper-based material, with significantly improved moisture resistance, suitable for basic consumer electronics circuits (mobile phone chargers, small home appliances), as a compromise between FR2 and FR4, but with limited high temperature resistance.

What is the difference between single-sided and double-sided PCBs?

Single-sided PCB: Copper is only coated on one side (commonly used FR1/FR2 paper-based materials), made by simple etching process, with low manufacturing cost but limited design flexibility, and complex connections require jumper wires.

Double-sided PCB: Copper is coated on both sides and uses via interconnection technology (mostly using FR3/FR4 substrates), supports double-sided layout of components and multi-layer wiring. The manufacturing cost is higher but the reliability is significantly improved.

How to make double sided FR1 circuit boards?

Manufacturing double-sided FR1 PCBs involves several steps:

Material preparation: Double-sided copper-clad FR1 phenolic paper substrate is selected. Its heat resistance (UL 94 V-0/V-1) and cost balance characteristics are suitable for basic double-sided board requirements.

Circuit design: Use tools to complete the Gerber file, focus on optimizing the via distribution and copper foil thickness (usually 35μm), and ensure that the mechanical strength of the FR1 substrate is stable during the etching process.

Photoresist and etching: Double-sided negative photosensitive dry film is coated, and after exposure and development, a resist pattern is formed, and the circuit is etched out using a solution.

Drilling and metallization: CNC drilling machine processes through holes, chemical copper plating combined with electroplating copper achieves double-sided conduction, and the FR1 substrate needs to be pre-impregnated to enhance the bonding strength.

Solder mask and silk screen printing: Screen printing thermosetting solder mask ink forms a protective layer, and character logos are printed at the same time.

Assembly and testing: Wave soldering or manual soldering of components, ICT testing after flying probe test of conductivity, FR1 board needs to avoid long-term use in high temperature environment.

What are the advantages of double sided FR1 circuit boards?

Double-sided FR1 PCBs offer several benefits:

Cost-Effective: One of the most affordable PCB options, making it ideal for budget-sensitive projects.

Lightweight: FR1 is lighter than FR4, making it easier to handle.

Good Electrical Insulation: The phenolic resin provides stable electrical performance.

Efficient for Simple Electronics: Works well in basic circuit designs, power supplies, and consumer electronics.

What are the disadvantages of double sided FR1 circuit boards?

While FR1 PCBs are useful, they have some drawbacks:

Lower Heat Resistance: Can degrade in high-temperature environments.

Brittle: More fragile than FR4, leading to possible breakage under mechanical stress.

Limited Multilayer Capability: Unlike FR4, FR1 does not support complex multilayer stacking.

Moisture Absorption: Can absorb moisture over time, affecting durability.

What are the applications of double sided FR1 circuit boards?

Due to its affordability and reliability, double-sided FR1 PCBs are widely used in:

Consumer Electronics: Found in TV remote controls, LED drivers, and power strips.

Power Supplies: Used in low-power voltage regulators and adapters.

Automotive Electronics: Found in basic control modules for car accessories.

Industrial Control Systems: Used in low-complexity automation circuits.

Conclusion:

Double sided FR1 circuit boards offer an affordable and efficient solution for various electronic applications. Their dual-layer design allows for more compact circuit layouts. While FR1 PCBs may have some limitations, they remain a cost-effective choice for many projects.

At BEST Technology, Whether you need double-sided FR1 PCBs or other custom PCB solutions, we are here to help. Contact us today at sales@bestpcbs.com to discuss your project needs!

Tags: Copper Clad PCB, FR1 board, FR1 vs FR4
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How to Make Your Flex PCB LED Design into Reality?

March 6th, 2025

Flex PCB LED solutions keep expanding across industries as demand rises for products with creative shapes and compact structures. From automotive interiors to medical devices, these flexible boards blend functionality with space-saving benefits.

In this article, we’ll dive into what flex PCB LED means, explore its advantages, and share practical design and manufacturing processes. Whether you design products or source materials, this blog will help you understand why flex PCB LED continues to attract attention.

What is A Flex PCB LED?

A flex PCB LED is a thin, flexible circuit board designed to hold LED components while allowing the entire board to bend, twist, or fold during use. Unlike rigid PCBs, these boards are made from materials that stay reliable even after repeated bending.

Most flex PCB LED designs use polyimide or other flexible substrates that support surface-mount LEDs and small passive parts. These materials combine electrical performance with mechanical strength, helping the board withstand vibration and constant flexing without damage.

This flexibility helps designers install LED circuits into curved surfaces, folded product areas, or spaces too tight for traditional rigid boards. From flexible light strips to thin wearable screens, flex PCB LED technology supports creative designs while keeping circuits stable.

If your project need to be designed and produced, please feel free to contact Best Technology sales@bestpcbs.com. We devoted to provide you professional one stop flex pcb led solution and PCBA Service with competitive price and fast delivery, because we are equipped with advanced production and testing machines, and our engineer and production teams all have over 18 years of working experience in pcb industry. Looking forward to working with your project soon!

What Are the Advantages of a Flexible PCB?

Flexible adaptability

With a bend radius of less than 1mm, it adapts to curved and irregular spaces, supporting dynamic three-dimensional bending in space (such as foldable screens, wearable devices).

Lightweight design

Thickness less than 1mm, light weight, space saving and improved portability, suitable for mobile phone backlighting, car interior and other scenarios.

High reliability

High temperature resistance (the PI substrate can withstand temperatures above 260°C), strong vibration resistance, dynamic bending life exceeding one million times, suitable for harsh environments such as mechanical arms and automobiles.

Integration and Precision Supports

Multi-layer circuit stacking, capable of integrating drive modules or sensors; high precision copper wires ensure stable signal transmission, suitable for high-density wiring requirements (such as medical endoscopes). Thermal Dissipation and Safety Excellent thermal conductivity reduces component thermal damage; overall wire connections reduce assembly errors, enhancing system reliability.

All Details You Need to Know About Flex PCB LED

What Are the Disadvantages of a Flexible PCB?

Higher Cost

Due to the use of polyimide substrates and precision etching processes, the production cost is significantly higher than that of traditional rigid boards.

Difficult to Repair

If the lines are damaged after bending on a flexible substrate, it is difficult to repair locally and usually requires a complete replacement.

Complex Design

It is necessary to reserve stress relief areas to avoid line fractures at the bend; special processes are required for connecting the soft and hard parts, which increases the development cycle. Installation

Restrictions

Sharp bends or excessive stretching should be avoided to prevent delamination of the substrate or fracture of the copper foil.

Limited Application Scenarios

High costs and process limitations make them more suitable for high-value-added fields (such as aerospace and high-end consumer electronics), making it difficult to popularize in the low-end market.

What Are the Different Types of Flex LED PCB?

Single-Sided Flex LED PCB

Single-sided flex LED PCBs have just one conductive layer, perfect for simple circuits with basic LED arrays. These boards work well for backlighting, light strips, or decorative LED products.

Double-Sided Flex LED PCB

Double-sided versions add a second conductive layer, helping designers create more complex LED circuits in the same flexible space. These boards suit products where LEDs need more control, like tunable lighting or segmented displays.

Multi-Layer Flex LED PCB

Multi-layer designs stack several conductive layers, allowing advanced routing and high-density LED layouts. These boards support smart lighting, automotive displays, or complex wearables where space-saving matters.

What Is the Difference Between Flex and Non-Flex PCB?

Material

Flex PCBs use polyimide, PET, or other bendable substrates, while non-flex PCBs use fiberglass (FR4) or other rigid materials. Flexible materials let the board bend without cracking.

Thickness

Flexible boards run thinner than rigid boards, especially in wearable or lightweight designs. Rigid boards tend to be thicker for strength and easier handling.

Applications

Flex PCBs often serve in curved lighting strips, medical devices, or foldable gadgets. Non-flex PCBs dominate in flat devices like TVs, computers and so on.

Assembly

Rigid PCBs handle easier during assembly since they keep their shape. Flexible boards need extra care to avoid creases or trace damage. However, when correctly handled, flex PCB LED boards work just as well.

What Are the Manufacturing Processes of Flex PCB?

1. Material preparation and pretreatment

Substrate cutting

Cut the polyimide (PI) or polyester (PET) substrate into specific sizes according to design requirements. The thickness of the substrate is selected according to the application scenario (13μm for dynamic bending area and 25-50μm for static area.

Drilling and hole metallization

Mechanical or laser drilling forms through holes for subsequent electrical connections; metallize the inner wall of the hole through chemical copper plating (PTH process) or electroplating process to ensure conductivity.

2. Circuit pattern production

Dry film coating and exposure

On the surface of the substrate The surface is covered with a photosensitive dry film, and the circuit pattern is transferred to the dry film through ultraviolet exposure.

‌Development and etching‌

Development removes the unexposed part of the dry film to expose the copper layer. Acidic or alkaline etching solution etches away the excess copper layer to form the target circuit.

Demolding and surface cleaning‌

Peel off the remaining dry film, and clean and activate the etched circuit.

3.‌ Overlay and protective film processing

Cover film lamination

Align the PI or PET covering film with the substrate, and the thickness of the covering film needs to match the bending requirements (bending area ≤25μm).

High temperature pressing

In a clean room environment, the cover film and the substrate are pressed together as a whole through high temperature (150-200℃) and high pressure (10-15MPa).

4. Surface treatment and functional enhancement

ENIG

Deposit a nickel-gold layer (0.5-2μm nickel + 0.05μm gold) on the pad area to enhance solderability and corrosion resistance.

Character printing

Print identification text or symbols in non-functional areas to facilitate subsequent assembly identification.

5. Functional testing and finished product processing

Electrical testing

Test the circuit conductivity through a probe, Detect defects such as open circuit and short circuit.

‌Auxiliary material assembly

Add PI reinforcement sheet or steel sheet at the joint of connector or hard board to improve mechanical strength. Attach auxiliary materials such as adhesive tape and electromagnetic shielding film.

Appearance cutting

Use mold stamping or laser cutting to divide the whole board into the final finished product size.

6. ‌Final inspection and packaging

Full inspection (FQC)

‌Perform a comprehensive inspection of the appearance, size and electrical performance of the finished product to eliminate defective products.

Packaging and storage

Store at low temperature (<10℃) after vacuum anti-static packaging to prevent moisture absorption or oxidation of the material.

What Are the Material of a Flex LED PCB?

Substrate layer

Material type:

Polyimide (PI) film must be used in dynamic bending scenarios, which has a temperature resistance of more than 260°C and a bending life of more than 500,000 times, and is suitable for high-reliability scenarios such as folding screens and wearable devices.

Polyester (PET) film can be used for low-cost static scenarios, but it has poor temperature resistance (<100°C) and a bending life of less than 50,000 times.

Thickness selection:

The dynamic bending area requires a 13μm ultra-thin PI substrate to reduce stress concentration.

The static area can use a 50μm thick substrate to improve mechanical strength.

Conductive layer

Copper foil type:

The dynamic bending area must use rolled copper foil (RA copper), which has excellent ductility (long bending life) and avoids fatigue fracture.

Static scenes can use electrolytic copper foil (ED copper) to reduce costs.

Copper thickness parameters‌:

Conventional copper thickness is 18-35μm‌.

High-frequency or high-density lines require ‌9μm ultra-thin copper foil‌ to reduce signal loss‌.

Covering layer and protective film

‌Material matching‌:

The covering film must be consistent with the substrate (such as PI substrate with PI covering film) to avoid delamination caused by differences in thermal expansion coefficient‌.

Thickness control‌:

The thickness of the covering film in the bending area is ≤25μm, and the non-bending area can be increased to 50μm for enhanced protection‌.

The adhesive layer needs to use ‌high-temperature curing epoxy resin‌ to support welding processes (such as reflow soldering)‌.

Adhesives and Stiffener materials

‌Adhesion performance:‌

A low-flow epoxy adhesive is required to ensure the interlayer bonding strength and prevent bending delamination‌.

Stiffener strategy:‌

PI stiffener sheets or steel sheets need to be added to the soft and hard joints to enhance mechanical support‌.

Dynamic structures such as sliding covers are recommended to use ‌glue-free electrolytic copper‌ (better ductility)‌.

Adaptation to special scenarios

‌High-frequency applications:

Polytetrafluoroethylene (PTFE) substrate is required to reduce dielectric loss.

Medical/wearable devices:

The cover film must have sweat-proof and chemical corrosion-resistant properties (such as medical-grade PI materials)

Surface treatment:

The pads in the dynamic bending area need to be plated with a thin nickel-gold layer (0.5-2μm nickel + 0.05μm gold) to prevent bending and cracking.

How to Design a Flexible PCB for LED?

1. Material selection and basic design

Substrate selection

Polyimide (PI) substrate is preferred, as its high temperature resistance (above 260°C) and bending resistance can meet dynamic bending requirements‌. If cost is sensitive and the temperature resistance requirement is low (<100°C), PET film can be used‌.

Conductive layer design

Rolled annealed copper is used instead of electrolytic copper foil to improve the fatigue resistance of the bending area. The copper thickness is recommended to be 18-35μm‌.

‌Coating layer optimization

The covering film should be a polyimide protective film that matches the substrate. The thickness of the covering layer in the bending area is ≤25μm to avoid cracking caused by bending stress concentration‌.

2. Key points of layout planning

‌Component layout rules

All components such as LED lamp beads and driver ICs must be arranged in the hard board area or static bending area, and the distance from the soft-hard combination boundary is >1mm‌48. It is forbidden to place components in dynamic bending areas (such as the joints of wearable devices), and PI reinforcement sheets should be added to improve mechanical strength when the bending radius is ≤3mm. ‌

Power supply partition design

A star power supply topology is used, and the power line width is ≥0.3mm (1A current) to avoid voltage instability caused by impedance mutation due to bending.

3. Wiring process and structural optimization ‌Line direction control‌

The routing in the bending area must be perpendicular to the bending axis, and arc corners (radius ≥1.5 times the line width) are used instead of right-angle routing to reduce bending stress. ‌

Multi-layer board stacking strategy

Single-sided wiring is recommended for dynamic application scenarios, and double-sided wiring (with a 0.05mm PI adhesive layer in the middle) can be used for static scenarios, and the total thickness is controlled within 0.2mm.

‌Transition zone treatment

The soft and hard combination parts adopt a gradient line width design (line width change gradient ≤20%), and add anchor points (Via-in-Pad) to prevent delamination.

4. Production process and test verification

Etching precision control

The line tolerance needs to be ≤±10%, and the line spacing in the dynamic bending area must be ≥0.2mm to avoid short circuit caused by micro crack extension‌.

Welding process selection

Use low-temperature solder paste (melting point 138℃) or conductive silver glue welding to reduce the damage of thermal stress to the flexible substrate‌.

Reliability test

Dynamic bending test: After 100,000 bends (radius 1mm/frequency 1Hz), the resistance change rate is ≤5%‌.

Environmental test: Continuous operation for 500 hours under 85℃/85%RH conditions without performance degradation‌.

5. Design tools and engineering implementation

‌EDA tool settings

Use the Rigid-Flex module of Altium Designer to divide the soft and hard areas by defining the dividing line, and set the bending radius parameters (recommended ≥3 times the board thickness).

‌3D simulation verification‌

Simulate the bending state in software such as SolidWorks to check the component collision risk and line tensile deformation (allowable tensile rate ≤ 0.5%).

Conclusion

To sum up, Flex PCB LED technology offers powerful benefits for modern electronics, supporting thin, lightweight, and creative lighting designs. These boards help engineers build curved, wearable, or space-saving products where rigid boards simply cannot fit.

With the right materials, careful design, and proper handling, flex PCB LED circuits bring both reliability and creative freedom to industries from automotive to medical. Whether you need simple lighting strips or complex LED arrays, flexible boards open new design possibilities.

Tags: flex PCB, flex pcb led, flexible pcb design
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What is a breadboard and How does a breadboard work?

March 6th, 2025

How does a breadboard work? Breadboard allow users to quickly build and test circuits without soldering through their unique structural design. It usually consists of a plastic board with many small holes on it, and these small holes are connected to metal pieces inside. By inserting electronic components into these holes, electrical connections can be made between components, and circuits can be quickly built and tested.

What is a Breadboard?

A breadboard is a reusable platform for building temporary electronic circuits. It consists of a rectangular plastic board with a grid of small holes, into which components such as resistors, capacitors, transistors, and integrated circuits (ICs) can be inserted. These holes are connected internally by thin metal strips that create an electrical path without requiring soldering.

The biggest advantage of a breadboard is its flexibility. Unlike traditional PCBs, where components must be soldered, a breadboard allows for quick modifications. This makes it perfect for testing new circuit ideas, troubleshooting problems, and making iterative design changes without permanently fixing components in place.

What’s Inside a Breadboard?

Though a breadboard appears simple on the outside, its internal structure is what makes it work efficiently. Underneath the surface, it has rows of conductive metal strips that connect certain holes together.

A standard breadboard is divided into three main sections:

Power Rails: These are the long horizontal strips on both sides of the board, usually marked with red and blue lines. They are used to distribute power (positive and negative voltage) across the board, making circuit connections easier.

Terminal Strips: These are the main working area where most of the components are placed. Each row of five holes is electrically connected, allowing for easy placement and wiring of circuit elements.

Central Divider: The middle gap on a breadboard separates the two halves, which is especially useful for placing integrated circuits (ICs). This ensures that each pin of the IC remains isolated from the others unless explicitly connected with wires.

How Does Current Flow in a Breadboard?

When a component is inserted into a row, it automatically becomes connected to other components within the same row. However, the middle divider prevents direct connections across the board, requiring jumper wires for cross-board connections.

The power rails run vertically, meaning that any component connected to the power strip has access to the same voltage supply. By carefully arranging components and jumper wires, circuits can be created and modified without the need for soldering or permanent wiring.

How does a breadboard work?

The working principle of breadboard is based on the clever layout of internal metal strips. The core of the breadboard is that the circuit can be quickly built without soldering. The jacks on the board are connected by metal strips arranged in parallel at the bottom. Every five holes form a conductive path. When the component pins or wires are inserted into the same group of holes, they can be turned on.

The groove in the center divides the panel into two parts, which are used to insert dual in-line integrated circuits (DIP) to ensure that the pins will not short-circuit. The vertical power rails (marked with “+” and “-“) on both sides provide unified power supply for the entire circuit. The holes on the same side are connected by internal metal strips. When in use, the power rails need to be connected with wires to distribute power.

When building a circuit, it is necessary to plan the position of the components according to the circuit diagram, insert the pins into the corresponding jacks and pay attention to the polarity. Jumpers are used to connect different groups of holes. It is necessary to avoid jumping integrated circuits or overlapping wires. When experimenting, the power supply should be disconnected before operating the components to prevent short circuits.

Breadboards are divided into solderless, single-sided and combination types. The solderless type is portable and suitable for simple experiments, while the combination type supports complex projects but is larger in size. When using, please pay attention to the thickness of the component pins (no more than 0.8mm). It is recommended to connect the wires horizontally and vertically to facilitate testing.

How to Use a Breadboard?

To begin, you first need a power source, such as a battery or a power adapter. The positive and negative terminals should be connected to the power rails to ensure consistent voltage distribution.

Next, components such as resistors, LEDs, transistors, and capacitors can be placed in the terminal strips. Each component should be positioned in a way that allows proper current flow. To complete the connections, jumper wires are inserted to link different components together, forming a functional circuit.

Once the circuit is assembled, the power supply is activated, allowing the circuit to operate. This flexibility makes breadboards invaluable for rapid prototyping and troubleshooting.

What Are the Lines on a Breadboard?

The lines on the breadboard indicate its internal connections. These markings make it easier to plan the layout of the circuit.

Power Rail Lines (Red and Blue): The red line represents the positive voltage, while the blue line represents the negative or ground connection.

Horizontal Row Markings: These indicate that all the holes within a row are electrically connected.

Central Divider: This is a key feature that separates two halves of the breadboard, preventing direct electrical connections between them unless linked with wires.

How Much Current Can a Breadboard Handle?

Breadboards are not designed for high-current applications. Most standard breadboards can safely handle around 0.5A to 1A of current. Going beyond this limit can cause overheating, loose connections, or even damage the breadboard’s internal metal strips.

For high-power circuits, using a PCB or soldered perf board is recommended to ensure durability and efficiency.

What Are the Types of Breadboards?

Breadboards come in different types, each suited for specific applications. The most common types include:

Solderless Breadboards: These are the most widely used, featuring removable and reusable connections, making them ideal for prototyping.

Solderable Breadboards: These provide a more permanent solution by allowing components to be soldered onto them after prototyping is complete.

Stripboards (Veroboards): These contain continuous copper tracks that can be cut as needed to customize circuit layouts.

Mini Breadboards: These are compact and perfect for small-scale circuits or portable electronic projects.

What Are the Disadvantages of a Breadboard?

Despite their versatility, breadboards do have some limitations:

Limited Current Capacity: They are not suitable for high-power applications.

Unreliable for High Frequencies: The internal resistance and capacitance can affect signals above 10MHz, making them unsuitable for RF applications.

Loose Connections: Components and wires can become unstable, leading to intermittent circuit failures.

For more permanent and high-performance applications, PCBs are the best choice.

What is the Frequency Limit of a Breadboard?

Breadboards are best suited for low-frequency circuits. Due to their internal capacitance and resistance, they typically function reliably below 10MHz. Above this range, signal integrity issues arise, causing unwanted noise, interference, and potential malfunctions.

For high-frequency applications, custom PCBs or RF-specific boards are the recommended alternatives.

Conclusion:

A breadboard is a must-have for anyone working with electronics. It allows fast, flexible, and cost-effective circuit building.

Their reusability, affordability, and ease of use make them the perfect choice for prototyping. However, for high-current or high-frequency applications, PCBs are the better alternative. For custom PCB solutions, contact sales@bestpcbs.com

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RF Ceramic Substrate for Microwave, Ceramic PCB Prototype & Manufacturing

March 6th, 2025

What is RF Ceramic Substrate?

RF ceramic substrate is a key component for RF circuit and microwave circuit, it refers to a specialized ceramic material designed to support high-frequency circuits used in radio frequency systems. Unlike traditional materials, ceramic substrates used for RF circuits offer low signal loss, stable dielectric properties, and strong thermal resistance. It is usually made of alumina (Al₂O) ₃ ceramic material, with good insulation properties, high temperature stability and low dielectric loss characteristics, the dielectric constant is usually between 9-12, dielectric loss Angle is less than 0.0003.

RF Ceramic Substrate for Microwave, Ceramic PCB Prototype & Manufacturing

Types of RF Ceramic Substrate

1. Alumina-Based Substrate

Alumina (Al2O3) is widely used for RF ceramic substrates because it offers high thermal conductivity, good mechanical strength, and stable dielectric behavior at high frequencies. It can handle both RF and microwave signals, making it suitable for communication systems, radar, and aerospace devices.

2. Aluminum Nitride (AlN) Substrate

Aluminum nitride offers both high thermal conductivity and lower dielectric constant compared to alumina. This helps improve signal integrity in high-speed circuits. AlN substrates work well in applications needing both heat dissipation and frequency stability, like power amplifiers and phased array antennas.

3. Beryllium Oxide (BeO) Substrate

BeO substrates provide the highest thermal conductivity among ceramic options. Although used less frequently due to handling concerns, BeO still finds use in specialized high-power RF systems where heat removal is critical.

RF Ceramic Substrate vs. Normal Ceramic Substrate

Not all ceramic substrates perform equally, especially when handling RF signals. Regular ceramic substrates, like those used in standard circuits, mainly focus on mechanical strength and insulation. Electrical performance, especially at high frequencies, often comes second.

RF ceramic substrates, however, prioritize electrical performance. They offer low dielectric loss, controlled dielectric constant, and tight tolerances, all of which ensure signals move smoothly without distortion. In microwave circuits, even minor changes in material properties can cause signal loss or unwanted interference. In addition to this, they are differ from materials composition and applications:

1. Material Composition

RF Ceramic Substrates: Typically made from Class I ceramic materials, including alumina (Al₂O₃), aluminum nitride (AlN), and silicon nitride (Si₃N₄). These materials offer good thermal conductivity, high-frequency performance, and excellent high-temperature stability.
Normal Ceramic Substrates: Primarily made from inorganic materials like alumina (Al₂O₃) and aluminum nitride (AlN). While these materials perform well at high temperatures, they do not match RF ceramic substrates in terms of high-frequency performance.

2. Application Fields

RF Ceramic Substrates: Primarily used in RF and microwave circuits, such as mobile communication base stations, broadcast transmitters, MRI coils, semiconductor RF power supplies, laser equipment, military radios, radar systems, and complete RF microwave devices. They are also used in power amplifiers, LC filters, transceiver modules, and microwave components.
Normal Ceramic Substrates: Widely used in high-power LED lighting, high-frequency communication, and railway power systems. They are valued for their excellent heat dissipation and high-temperature stability.

Benefits of RF Ceramic Substrate for Microwave

1. Low Dielectric Loss

RF ceramic substrates minimize signal loss at high frequencies, which helps maintain signal strength even across longer transmission paths.

2. Stable Dielectric Properties

Ceramic substrates keep their dielectric constant stable across wide temperature and frequency ranges.

3. Excellent Thermal Management

Microwave circuits often generate heat, especially at higher power levels. Ceramic substrates, particularly AlN and BeO, offer strong heat dissipation, it helps prevent thermal damage while preserving electrical performance.

4. Environmental Durability

Microwave systems used in aerospace, defense, and satellite applications face harsh environments, including vibration, radiation, and extreme temperatures. Ceramic substrates handle these conditions without losing mechanical or electrical reliability.

5. Precision Manufacturing

Ceramic substrates for RF circuits support fine-line patterns, which allows designers to create high-density circuits without losing signal integrity.

Ceramic Substrate HS Code

The HS code for ceramic substrates used in electronic circuits generally falls under 8547.10.00. However, for substrates specifically designed for RF or microwave circuits, local customs authorities may apply slight variations depending on composition, thickness, or intended use.

Well-Known RF Ceramic Substrate Brands

When choosing RF ceramic substrates, selecting reliable materials from established brands helps ensure consistent performance. Several companies specialize in developing high-performance ceramic materials specifically for RF and microwave applications. Below are some well-known names trusted across industries like telecom, aerospace, automotive radar, and satellite systems.

Rogers Corporation
Kyocera Fine Ceramics
Coorstek
Murata Manufacturing
Maruwa
NGK Spark Plug Co., Ltd.
Heraeus Electronics

At Best Technology, we offer customized RF ceramic PCBs for our customers, we have stable supply chain and enough stock in our warehouse. Therefore, we can handle time-sensitive orders and provide expedited service if you are urgent.

RF Ceramic Substrate Uses

Wireless communication modules like 5G antennas, RF front-end modules, and satellite communication devices.

Radar and sensing systems, including automotive radar, weather radar, and defense radar systems.

Aerospace and space electronics, such as satellite payloads, deep-space communication, and onboard electronics.

Medical imaging and equipment, including MRI and wireless telemetry devices.

Industrial RF Systems, like RF heating systems, test instruments, and high-frequency sensors.

RF Ceramic PCB Design Considerations

Designing RF ceramic PCBs requires a deep understanding of both high-frequency circuit behavior and ceramic material properties. Compared to standard FR4 or other organic substrates, ceramic materials handle RF signals differently, especially at microwave and millimeter-wave frequencies. Below are the key considerations to achieve stable signal transmission, low loss, and reliable performance.

1. Dielectric Constant and Its Stability

The dielectric constant (Dk) directly affects signal propagation speed and impedance matching. Ceramic substrates, such as Al₂O₃ or AlN, typically have Dk values ranging from 9 to 10 for Al2O3 and 8 to 9 for AlN. It’s not just about Dk itself but also its stability over frequency and temperature changes. For RF circuits, materials with minimal Dk variation across frequencies (up to 40 GHz and beyond) help maintain consistent phase and impedance control, which directly impacts signal integrity.

2. Loss Tangent (Df) and Signal Attenuation

Loss tangent (Df) measures how much energy the substrate material absorbs during signal transmission. Lower Df leads to less signal attenuation, especially at high frequencies.

For comparison, FR4’s Df can exceed 0.015 at 10 GHz, While a reliable data from Murata’s ceramic materials shows Df values around 0.0005 to 0.0010 at 10 GHz, which outperforms many organic substrates.

3. Conductor Surface Roughness

For microwave circuits, copper foil roughness directly affects insertion loss. Rougher copper increases conductor loss, especially above 10 GHz. Ceramic PCBs often use low-profile copper, with surface roughness below 2 µm (Rz), to minimize skin effect losses at high frequencies.

4. Coefficient of Thermal Expansion (CTE) Matching

Alumina substrates typically have a CTE around 6.5 ppm/°C, which aligns reasonably well with copper’s 17 ppm/°C when using proper bonding techniques. For applications like satellite communications, where temperature swings can exceed ±100°C, this balance ensures mechanical reliability.

5. Transmission Line Structures and Impedance Control

To design RF circuits on ceramic substrates, engineers often use microstrip, coplanar waveguide (CPW), or stripline structures. Achieving tight impedance control (±5% or better) requires precise trace width calculation, gap spacing, and accurate Dk data across the operating frequency range. For example, a 50-ohm microstrip line on 99.6% alumina with a 0.635 mm (25 mil) thickness requires a trace width around 1.5 mm, but the exact value shifts slightly based on the operating frequency and whether the substrate uses thin-film or thick-film copper.

6. Thermal Management for High-Power RF Circuits

High-power RF circuits, such as power amplifiers (PAs) or radar transmitters, generate considerable heat. Aluminum nitride (AlN) substrates, with thermal conductivity reaching 170 W/m·K, outperform alumina (20-25 W/m·K) by almost seven times. This high thermal conductivity helps dissipate heat efficiently, reducing thermal gradients that could detune RF circuits.

7. Via and Plating Quality

Plated vias connect RF traces between layers or serve as ground vias to improve EMI shielding. In RF ceramic PCBs, via diameters as small as 100 µm are common, especially in LTCC packages.

For more information about RF ceramic PCB design guide, welcome to contact us at sales@bestpcbs.com. We offer free technical support for any PCB frequent asked questions.

Why Choose Best Technology as Your RF Ceramic PCB Supplier?

At Best Technology, we specialize in RF ceramic PCB manufacturing with over 18 years of experience serving global clients. We understand how critical dielectric stability, thermal management, and mechanical precision are for RF and microwave systems. Our in-house testing and quality checks ensure every board meets your performance standards, whether for 5G modules, radar systems, or aerospace electronics. At Best Technology, you can enjoy:

Products control under ISO13485, IATF16949, AS9100D system
Stable supply chain (cover various brands ceramic substrate)
Cutting edge technology for ceramic PCB manufacturing
Professional ceramic PCB engineer technical support
DDU & DDP quotation
2-3Weeks delivery
Highest quality
Customized RF ceramic PCB design
Turn-key service

With custom design support, quick turnaround, and flexible production options, we help clients bring RF innovations to market faster. Contact Best Technology today to see how our RF ceramic PCB solutions can support your next project.

Tags: rf ceramic substrate, rf ceramic substrate for microwave
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AlN PCB, Ceramic PCB Substrate

March 6th, 2025

AlN PCB stands out as a top choice when companies need strong heat management and reliable performance in advanced electronics. This ceramic PCB substrate uses aluminum nitride, known for its high thermal conductivity and excellent electrical insulation. With electronics getting smaller and more powerful, keeping heat under control is more important than ever. That’s why many industries rely on AlN ceramic PCB to improve both performance and reliability.

At the same time, customers often want to know how AlN PCB fabrication works, how it compares to other options, and what affects its final price. Understanding these details helps engineers and buyers make smarter choices for their projects. In this blog, we’ll explore everything from the properties of aluminum nitride to the benefits, pricing factors, and even common assembly challenges.

If you’re searching for a reliable ceramic PCB substrate or want to understand how AlN PCB fits into your next design, this guide will help. Whether you’re working on high-frequency devices, power modules, or advanced communication systems, knowing the strengths of AlN PCB can make a big difference.

What is aluminum nitride PCB material?

AlN PCB stands for aluminum nitride PCB, which uses aluminum nitride ceramic as the base material. It is known for excellent thermal conductivity, strong electrical insulation, and reliability in harsh environments. Compared to standard FR4 boards, AlN PCB supports much better heat dissipation. That’s why engineers choose this material for high-power circuits, laser systems, and advanced communication devices.

Aluminum nitride acts as both the base and heat spreader. This unique structure reduces thermal stress, helping sensitive components stay cooler. As technology grows, more industries lean toward AlN PCB to handle performance needs.

Is aluminum nitride a ceramic?

Yes, aluminum nitride is a ceramic. It belongs to the advanced ceramic family, valued for its high strength, electrical insulation, and outstanding heat transfer abilities. Unlike traditional ceramic materials, aluminum nitride supports fast heat removal, which helps extend component life.

Since AlN is ceramic, it also resists chemicals, high temperatures, and mechanical wear. These benefits make it suitable for AlN ceramic PCB manufacturing. Today, designers rely on it for high-frequency devices, power electronics, and communication modules.

Is Aluminium nitride brittle?

Like other ceramics, aluminum nitride is somewhat brittle, especially under sudden mechanical shock. However, it still performs better than some other ceramics used in electronics. Proper design, combined with experienced fabrication techniques, helps reduce risks related to brittleness.

The good news is that once AlN PCB fabrication completes and the board is installed correctly, its durability is impressive. This balance of strength, heat management, and electrical insulation keeps AlN ceramic PCBs in high demand across industries like automotive, aerospace, and telecom.

How does AlN PCB compare to alumina PCB in thermal performance?

Thermal performance directly affects the reliability of modern electronics. When comparing AlN PCB to alumina PCB, aluminum nitride performs much better in heat transfer. Its thermal conductivity reaches around 170-200 W/mK, which is far higher than alumina’s 20-30 W/mK.

This major difference matters when components generate heat in compact spaces. Devices that push high power levels or require stable performance over time benefit from this advantage. While alumina PCB offers good insulation and is more affordable, AlN remains the first choice for heat-sensitive applications.

What is the difference between aluminum nitride PCB and aluminum PCB?

This is a common question from customers comparing materials. AlN PCB uses a ceramic core made from aluminum nitride, while aluminum PCB uses a metal aluminum base with a dielectric layer on top. Both manage heat, but they work in different ways.

AlN ceramic PCB offers excellent electrical insulation, which allows designers to place components closer together. It also handles extreme heat better without expanding too much. On the other hand, aluminum PCB, though cheaper, has limited electrical insulation, making it less suitable for high-frequency and precision circuits.

In short, AlN PCB fits better where thermal management and signal performance both matter. Aluminum PCB works well in simpler applications where cost matters more than advanced performance.

What factors affect AlN PCB price?

Several factors affect AlN PCB price, and understanding them helps customers plan projects better. First, the raw material cost plays a key role. Aluminum nitride is more expensive than standard PCB materials, but the benefits often outweigh the cost.

Next, fabrication complexity impacts price. Multilayer designs, micro vias, and precision routing need advanced technology, adding to the total. Batch size also matters. Larger runs usually lower the cost per piece, while small or custom orders cost more.

Lastly, surface treatment choices, tolerances, and assembly needs contribute to the final cost. That’s why working with an experienced AlN PCB fabrication supplier helps balance price and performance.

What are common PCB assembly issues with AlN ceramic PCBs?

Even with advanced materials like AlN ceramic PCB, assembly issues can happen without careful handling. One common challenge is matching the thermal expansion of components with the ceramic base. Sudden thermal changes can stress solder joints if not managed well.

Another potential issue comes from the surface finish. Choosing the wrong finish for high-frequency circuits or high-temperature processes can lead to signal loss or poor solderability.

Lastly, poor handling during assembly can crack the ceramic substrate. This highlights the importance of choosing experienced assembly partners with expertise in AlN PCB fabrication and assembly. By working with a trusted supplier, these risks can be minimized, improving reliability and performance.

What is the use of Aluminium nitride?

Aluminium nitride offers broad uses across multiple industries. Its high thermal conductivity makes it perfect for high-power electronics, such as laser drivers, RF amplifiers, and power modules. These systems generate heat that needs to move away quickly to protect components.

Besides electronics, AlN ceramic plays a role in NFC communication systems, where thermal stability and electrical insulation enhance performance. Medical devices also benefit from aluminum nitride’s biocompatibility and thermal management properties.

In short, AlN PCB supports applications that demand precise performance, stability, and long-term reliability, especially under demanding conditions.

How to select the right manufacturer for AlN PCB fabrication?

Selecting the right AlN PCB fabrication partner directly affects project success. Start by checking the manufacturer’s experience with ceramic PCB substrates. Not all PCB companies have the technology or skills to handle aluminum nitride.

Next, ask about in-house capabilities for drilling, plating, and precision routing. AlN requires specialized equipment and processes, so a capable supplier handles every step under one roof. This ensures quality control and reduces lead times.

Also, consider the manufacturer’s knowledge in PCB assembly issues, especially for ceramics. Experienced suppliers know how to manage thermal stress, select the right surface treatments, and optimize designs for both performance and manufacturability.

Finally, check for customer support and willingness to provide design advice. A good partner not only builds your boards but also helps improve designs to balance performance, cost, and reliability.

In a nutshell, choosing AlN PCB means investing in better thermal performance, electrical insulation, and reliability. With growing demand for aln ceramic pcb in high-power and high-frequency applications, more engineers turn to this advanced material.

Working with a professional AlN PCB fabrication partner ensures your boards meet both performance and cost goals. If you’re looking for a ceramic PCB substrate that can handle the heat, aluminum nitride offers one of the best options available.

At Best Technology, we specialize in advanced ceramic PCBs, including AlN inlay PCB, alumina PCB, and more. Our experts understand the challenges of aln pcb fabrication and assembly issues, delivering high-quality boards for demanding projects. For more information or inquiries, feel free to contact us at sales@bestpcbs.com.

Tags: AlN PCB, ceramic PCB, Ceramic PCB substrate, PCB, pcb design, printed circuit board
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What is a perf board? How to use a perf board?

March 6th, 2025

Perf board is a board used in the field of electronics and PCB. It is a board with grid holes. These holes are used to insert and solder the pins of electronic components and are used to place and solder electronic components. It is similar to a breadboard, but is mainly used in situations where soldering is required, and is suitable for simple circuit design and prototyping.

What is a Perf Board?

A perf board, short for perforated board, is a flat board with a grid of holes. These holes are plated or non-plated, allowing electronic components to be mounted and soldered.

Unlike a PCB, which has pre-designed traces, a perf board gives complete freedom to create custom wiring connections.

Perf boards are ideal for prototyping and small-scale projects. They serve as an intermediate step between breadboarding and full PCB manufacturing. Many electronics enthusiasts rely on perf boards to refine their designs before moving to mass production.

What Does a Perf Board Do?

A perf board acts as a platform for circuit assembly. It allows components like resistors, capacitors, and integrated circuits (ICs) to be mounted securely. By connecting these components using solder and wires, a functional electronic circuit is created.

Unlike a breadboard, which is temporary, a perf board provides a permanent and durable solution. Once components are soldered, they remain firmly in place, ensuring a stable connection and reliable performance.

What is the Difference Between a Perf Board and a Breadboard?

Both perf boards and breadboards are used for building circuits, but they serve different purposes.

Breadboards are reusable, allowing circuits to be assembled without soldering. They are great for testing ideas but are not ideal for permanent designs.

Perf boards require soldering but create stronger and more reliable connections. They are used when a project needs to be more durable than a breadboard prototype.

Breadboards have internal metal connections, making wiring easy. Perf boards require manual wiring, offering complete customization.

How Do Perf Boards Work?

A perf board works by providing a physical base for electronic components. Each hole allows component leads to pass through. Solder is used to create permanent electrical connections.

There are different types of perf boards:

Single-sided perf boards have copper pads on one side for easy soldering.

Double-sided perf boards have pads on both sides, enabling more complex connections.

Stripboard perf boards have connected rows of copper, simplifying circuit routing.

Since there are no predefined traces, wiring must be done manually using solder bridges, jumper wires, or thin copper wires. Proper planning helps prevent messy connections and improves circuit performance.

How to use a perf board?

Using a perforated board (also known as a hole board or a universal board) to build a circuit requires welding to connect components. Its operation process is essentially different from that of a breadboard.

First, you need to plan the component layout according to the circuit diagram, insert the component pins into the corresponding holes, pay attention to polarity and spacing, and ensure that components such as integrated circuits, resistors, and capacitors are arranged neatly. When laying out, the wire length should be shortened as much as possible, and the component pins themselves can be used as connection points to simplify welding.

Next, you need to use solder to weld the component pins to the copper foil surface of the perforated board. Before welding, you need to clean the oxide on the surface of the copper foil, and use rosin flux to improve the welding quality.

For jumper wires, you can choose thin enameled wires or tinned copper wires, and weld them along the copper foil routing direction. If necessary, you can use wires to connect different areas on the back of the board. After welding, you need to cut off the excess pins of the component, and use a multimeter to check whether each solder joint is conductive to confirm that there is no short circuit or cold soldering.

To increase the success rate, you can draw a perforated board layout diagram on paper in advance, marking the component positions and routing paths. For complex circuits, modular welding can be used to test functions part by part. Beginners are advised to use a soldering station instead of a soldering iron to control the temperature and prevent damage to components.

In addition, the copper foil surface of the perforated board should be kept clean, and excessive solder accumulation should be avoided during soldering, which may cause short circuits in adjacent copper foils. The completed circuit can be fixed in the housing with screws, which is suitable for making electronic devices that need to be used for a long time.

What is a Perf Board Made Of?

Perf boards are made from different materials, depending on durability and cost requirements.

FR4 (Fiberglass): Strong and heat-resistant, commonly used for professional projects.

Phenolic Resin: Cheaper but more fragile, suitable for low-cost applications.

Epoxy Boards: Lightweight and flexible, but less durable than FR4.

The copper pads on perf boards can be tin-plated for better solder adhesion. Some high-quality boards have gold-plated pads, offering better conductivity and corrosion resistance.

How to Make a Perf Board?

Creating a perf board from scratch requires precision. The board must have evenly spaced holes and strong material for durability.

Manufacturers follow these steps:

Material Selection – FR4, phenolic, or epoxy sheets are chosen based on the application.

Hole Drilling – A grid of evenly spaced holes is drilled using CNC machines.

Copper Plating (Optional) – Some boards are coated with copper to improve conductivity.

Cutting and Finishing – The board is trimmed to standard sizes and inspected for defects.

For DIY projects, modifying an existing board is easier than making one from raw materials.

How to Cut a Perf Board?

Cutting a perf board requires precision to avoid damaging the holes or copper pads. The best methods include:

Score and Snap – Using a sharp knife, score the board along a straight line, then snap it carefully.

Hacksaw or Rotary Tool – A fine-tooth saw or Dremel cuts through thick boards easily.

Shears – Heavy-duty scissors work for thinner boards but may cause rough edges.

After cutting, sanding the edges ensures a smooth finish. It prevents sharp corners from damaging wires or components.

How to Assemble Electronic Components on a Perf Board?

Building a circuit on a perf board follows a structured process:

Plan the Layout – Arrange components logically to minimize wire clutter.

Insert Components – Place resistors, capacitors, ICs, and other parts into the holes.

Solder the Connections – Secure each component with solder, ensuring strong joints.

Add Wires or Solder Bridges – Use insulated wires or solder traces to connect components.

Test the Circuit – Check for short circuits or missing connections before finalizing.

Good soldering techniques prevent weak joints and ensure a long-lasting circuit. Proper planning and clean wiring improve circuit performance.

Conclusion：

A perf board is an essential tool for prototyping and DIY electronics. It bridges the gap between temporary breadboards and professional PCBs. For high-quality custom perf boards, contact sales@bestpcbs.com

Tags: pcb perf board, perf board, solderable perf board
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