Posts Tagged ‘laser direct imaging’

What is laser direct imaging(LDI) in PCB manufacturing?

星期四, 13 2 月, 2025

Laser direct imaging (LDI) is an advanced PCB manufacturing technology that uses a computer-controlled laser beam to directly expose circuit patterns on a PCB substrate coated with photosensitive material. This technology can achieve high-precision imaging effects and significantly improve production efficiency and imaging quality.

What is laser direct imaging?

Laser Direct Imaging (LDI) is an advanced PCB manufacturing technique that directly transfers circuit patterns onto a photoresist-coated board using laser technology.

Unlike traditional photolithography, which relies on photomasks, LDI uses computer-controlled lasers to etch intricate designs with extreme precision.

This method significantly enhances accuracy, speed, and flexibility, making it a preferred choice for modern PCB production, especially for high-density interconnect (HDI) boards.

How does LDI differ from traditional imaging?

Traditional PCB imaging depends on photomasks to transfer circuit designs onto the PCB. This process involves multiple steps, including photomask fabrication, manual alignment, and exposure to UV light.

Since photomasks are physical templates, they can degrade over time, leading to inconsistencies in production.

LDI eliminates these challenges by using digital laser beams to expose the photoresist layer directly, ensuring greater precision and efficiency. Here’s how LDI stands out:

No photomasks required – Eliminates costs and maintenance associated with masks.

Higher precision – Laser beams can achieve much finer line widths than traditional methods.

Fast design modifications – Digital files allow for easy and quick adjustments.

Less material waste – Reduces the need for physical stencils, making the process eco-friendly.

Why is LDI important for PCB manufacturing?

The demand for compact, high-performance electronics continues to grow. LDI technology plays a crucial role in meeting these demands by allowing manufacturers to create complex circuit layouts with extreme accuracy.

Key Benefits of LDI in PCB Production:

Fine-line circuit imaging – Supports line widths as small as 50 microns or less.

Better alignment precision – Perfect for multilayer PCBs where layers must align perfectly.

Faster turnaround time – Since no photomasks are required, production cycles are shorter.

Cost-effective for prototypes – Ideal for low to medium-volume production runs.

Reduces defects – Eliminates common photolithography issues like misalignment and dust contamination.

What is LDI used for in PCB manufacturing?

LDI is especially valuable for:

HDI PCBs – Enables the creation of extremely fine pitch traces.

Flexible & Rigid-Flex PCBs – Ensures precise patterning for flexible circuits.

RF and Microwave PCBs – Delivers superior signal integrity in high-frequency applications.

Prototyping & Small Batch Production – Reduces the need for costly photomask production.

What are the steps in the laser imaging process?

The LDI process follows a precise workflow to ensure accurate circuit patterning on the PCB. Here’s how it works:

Pre-Processing & Design Preparation – The PCB layout is converted into a digital file for LDI processing.

Photoresist Application – The PCB is coated with a light-sensitive photoresist layer.

Laser Exposure – High-precision UV lasers expose the design directly onto the photoresist.

Development Process – Unexposed photoresist is removed, revealing the circuit pattern.

Etching & Stripping – Unwanted copper is etched away, leaving the final circuit traces.

Quality Inspection – The board undergoes optical and electrical testing to ensure precision.

How does laser direct imaging work?

LDI uses a high-intensity laser beam to directly expose the photoresist layer on the PCB without needing a photomask. The system moves the laser precisely across the board, creating circuit traces based on a digitally stored layout.

Since the laser operates with pinpoint accuracy, it ensures perfect pattern alignment, making it especially useful for HDI and multilayer PCB manufacturing.

What are the advantages of laser direct imaging?

LDI has transformed the PCB manufacturing industry with its unmatched speed, accuracy, and efficiency.

1. Enhanced Precision

Allows for narrow trace widths and tight spacing.
Reduces alignment errors in multilayer PCBs.
Supports the production of high-density circuit boards.

2. Eliminates Photomasks

No need to create, store, or maintain expensive photomasks.
Digital files can be easily modified for design updates.

3. Faster Production Cycles

Reduces imaging time compared to traditional methods.
Supports rapid prototyping and quick design changes.

4. Cost-Efficiency for Prototyping & Low-Volume Runs

Ideal for custom PCB designs and small-batch production.
Avoids high costs associated with mask creation.

5. Consistent & Reliable Results

No photomask degradation means every board is identical.
Reduces defects like overexposure, misalignment, and contamination.

What are the disadvantages of laser direct imaging?

Despite its benefits, LDI is not without challenges. Here are some considerations:

1. High Initial Investment: LDI equipment is more expensive than traditional imaging tools.

2. Higher Power Consumption: Laser systems require significant energy to operate efficiently.

3. Not Always Ideal for High-Volume Production: For very large-scale manufacturing, traditional photolithography may still be more cost-effective.

Conclusion：

Laser Direct Imaging has revolutionized PCB manufacturing, offering higher accuracy, efficiency, and flexibility compared to traditional imaging techniques.

If you need precision-engineered PCBs with LDI technology, Best Technology is your trusted partner. Contact us at: sales@bestpcbs.com

‌What is Laser Direct Imaging?

Laser Direct Imaging (LDI) is a technology that uses a laser beam emitted by an ultraviolet laser to image directly on a PCB (printed circuit board). Compared to traditional exposure techniques, LDI has higher image quality, precision traces and real-time adjustment.

The LDI technology achieves pattern transfer by projecting the line image directly onto the PCB coated with photoresist through the laser beam emitted by the laser diode. This method eliminates the use of negatives in the traditional exposure process, reduces the time and cost of loading and unloading negatives, and avoids deviations caused by negative growing. The image resolution of LDI technology is high, and the fine wire can reach about 20um, which is suitable for the production of fine wire and improves the yield of PCB production.

What is Laser Direct Imaging in PCB Manufacturing?

Working Principle of LDI Technology

The principle of laser imaging is to acquire and present images based on the characteristics of laser beam. As we know, a laser is a highly focused, high-brightness, monochromatic beam that can therefore produce high-quality images. The laser imaging system mainly consists of laser, lens, scanning device and receiver. The laser is used to generate the laser beam, the lens is used to focus the beam, the scanning device is used to change the path of the beam on the object, and the receiver is used to receive the light signal and convert it into an image.

In the imaging process, the laser beam is focused from the laser through the lens, and then the path of the beam on the object is controlled by the scanning device. When the laser beam hits the surface of an object, it interacts with the surface. This interaction causes light to scatter and reflect, with scattered light diffusing in different directions and reflected light remaining in its original direction of propagation. The receiver receives the light scattered and reflected by the object and converts it into an electrical signal. The receiver converts the signal into a digital image signal, which is then processed and displayed on the screen to form an image. In the processing process, the received signal can be filtered, amplified and other operations to improve the quality and clarity of the image.

As PCB manufacturing processes continue to advance, LDI technology is also evolving. At present, the mainstream light source in the industry is the 405nm laser diode produced by Nichiya, Panasonic, and it is expected that the optical power requirements for exposure will be further improved in the future, and the optical power of a single device may develop to 100W. Nowadays, LDI technology is not only used in PCB manufacturing process, but also in high-end applications like medical imaging, industrial detection, remote sensing.

Advantages of Laser Direct Imaging Over Photo Exposure

The advantages of laser direct imaging (LDI) compared with traditional exposure machines mainly include the following aspects:

1. Eliminating the negative process in the exposure process

The LDI technology eliminates the step of making the negative in the traditional exposure process, thereby saving the time and cost of loading and unloading the negative, and reducing the deviation caused by the negative growth and contraction.

2. High resolution

The image resolution of LDI technology is very high, which is suitable for some very fine line production, especially for multi-layer PCB, which greatly improves the yield of PCB production.

3. High quality and precision

LDI is contactless operation, reducing the chance of miscontact, the closed operating environment reduces the influence of temperature and humidity, the image quality is high and fine, eliminating many defects in the traditional process.

4. Reduce errors and improve alignment

LDI technology improves alignment by eliminating alignment problems that often exist in photographic plates, especially the anisotropic movement of photographic plates caused by changes in temperature and humidity. High-precision alignment is achieved by using a charge-coupled device (CCD) camera system and a reference target to line up printed images and panels.

5. Shorten the production process and reduce costs

Because there is no need to have a negative production process, LDI technology shortens the production process, reduces the call of personnel, and reduces the production cost. In addition, the LDI system can lay more devices in the same environment, enabling two-way scanning and further savings.

6. Adapt to a variety of production needs

LDI technology has a flexible manufacturing route, which can meet various production needs without affecting the output. Once the data is delivered to the engineering department, production can begin, reducing product delivery time.

The image quality of LDI technology is clearer than that of traditional exposure technology, and it has obvious advantages in mid-to-high-end PCB manufacturing. With the transfer of global PCB production capacity to China and the high-end development of the electronics industry, the demand for LDI equipment continues to grow, and it is expected that the future will gradually replace traditional exposure equipment in the field of low-end PCB.

What is the Process of Direct Imaging?

Direct imaging with LDI involves several steps that ensure precise layer creation:

Design Preparation: The digital circuit design is prepped for imaging, with adjustments made to accommodate laser processing specifics.

Photoresist Coating: The PCB is coated with a light-sensitive photoresist material, which reacts chemically when exposed to the laser.

Laser Imaging: The laser projects the circuit pattern directly onto the photoresist. Adjustments can be made mid-process, allowing for precise alignment.

Developing: After exposure, the board is treated with a developer to reveal the circuit paths. Unexposed areas are removed, leaving only the intended design.

Etching or Plating: Depending on the PCB type, the board undergoes etching or plating to define the copper traces, completing the imaging process.

Difference Between Positive and Negative Images in PCB

In PCB photo exposure, the terms “positive” and “negative” refer to how the photoresist reacts to the laser exposure:

Positive Image: Here, the laser exposes areas intended to be removed. During development, the exposed regions dissolve, leaving behind the unexposed areas as the design.

Negative Image: In a negative image process, the laser exposes the regions meant to remain on the board. These exposed parts resist the developer, protecting the underlying material, while unexposed regions dissolve away.

The choice between positive and negative imaging depends on the photoresist type and the specific design requirements. Both methods offer high accuracy, but each has unique benefits based on the intended application.

Why LDI Process Less Cost-effective than Phototool?

While LDI offers many advantages, it often requires a higher initial investment than phototools:

1. Equipment Costs: LDI machines are sophisticated and costly, requiring a significant investment in laser technology and imaging systems.

2. Maintenance: High-precision lasers and optics demand regular maintenance and calibration to ensure consistent performance, which adds to operational costs.

3. Speed on Larger Runs: For high-volume production, phototools may still be more cost-effective. Phototools offer rapid replication without the need for repeated laser exposure, lowering costs for large-scale production.

These cost factors make LDI more suitable for specialized, lower-volume, or high-precision applications rather than large-batch productions.

How is Layer Registration in LDI?

Layer registration is crucial in PCB manufacturing, especially for multilayer boards where each layer must align precisely. LDI excels in this aspect:

1. Automated Alignment: LDI systems come with advanced alignment software that adjusts each laser exposure to match the existing layer positions.

2. Reduced Human Error: Since the process is largely automated, human handling is minimal, reducing the risk of alignment issues.

3. Dynamic Adjustment: With real-time feedback systems, LDI machines adjust alignment during the process, maintaining tight registration tolerances.

If you’re seeking high-quality PCB manufacturing, consider choosing a provider skilled in LDI processes like Best Technology. Our company combines expertise with cutting-edge technology to ensure your boards are produced to exact specifications, delivering the durability and performance you need in today’s advanced electronics.

What is laser direct imaging?

Laser direct imaging (LDI) is an advanced photolithography technology. It directly uses a laser beam to expose images on photoresists, eliminating the intermediate step of making photolithography masks in traditional photolithography technology.

In this process, the laser beam is precisely controlled according to the pre-set circuit pattern data. The laser emitted by the laser light source is processed by a series of optical components, such as beam expansion and focusing, and then the laser beam is guided by the scanning system to scan and expose the surface of the printed circuit board (PCB) coated with photoresist.

The photoresist responds to the laser energy, and according to the type of photoresist (positive or negative), the corresponding chemical changes occur in the laser irradiation area. This change will lay the foundation for subsequent development and other processes, thereby forming an accurate circuit pattern.

What is the principle of laser direct imaging?

The principle of laser direct imaging (LDI) is to expose the pattern directly on the substrate coated with photosensitive material through a computer-controlled laser beam.

Specifically, the workflow of LDI includes the following steps: First, the designed circuit pattern is converted into the image generation program of the spatial light modulator through computer-aided manufacturing (CAM) software. Then, the laser beam passes through the spatial light modulator, and the generated image is projected onto the substrate coated with photosensitive material through the optical imaging system to complete the pattern exposure. Compared with the traditional mask exposure process, LDI saves the film process in the exposure process and greatly improves the production efficiency.

The main advantages of LDI technology are its efficiency and precision. It directly uses a highly focused laser beam controlled by a computer to define the circuit pattern on the PCB copper layer covered with laser photoresist without the need for photographic tools, thus avoiding the film and printing defects in the traditional process.

In addition, LDI also optimizes the production environment, eliminates the influence of temperature and humidity on the product, and further improves the production quality and efficiency.

How does laser direct imaging (LDI) work?

Laser direct imaging (LDI) technology is a process that uses laser to directly expose and image on photoresist, and is mainly used in the exposure process in the PCB manufacturing process. Its working principle is as follows:

1. Design graphics: Design the circuit graphics to be produced through computer-aided design (CAD) software.

2. Generate images: Convert the designed circuit graphics into digital images and transmit them to the control system of the LDI equipment.

3. Laser scanning: The laser beam in the LDI equipment scans and exposes the photoresist according to the information of the digital image under the precise control of the control system.

4. Photochemical reaction: The photoresist undergoes a photochemical reaction under the irradiation of the laser, changing its solubility.

5. Development: The exposed photoresist is developed in the developer to remove the unexposed part of the photoresist, thereby forming a circuit pattern on the photoresist that is consistent with the design graphics.

6. Etching or electroplating: According to needs, the developed circuit board is etched or electroplated and other subsequent processes are performed to produce the actual circuit.

Compared with traditional exposure technology, LDI technology has higher resolution and precision, can produce finer circuit wiring and smaller line spacing, and also has higher production efficiency and flexibility.

What are the advantages of using laser direct imaging?

The main advantages of LDI (Laser Direct Image) technology include: eliminating the film process in the exposure process, saving time and cost for loading and unloading films, and reducing deviations caused by film expansion and contraction; directly imaging CAM data on PCB, eliminating CAM production process; high image resolution, fine wires can reach about 20um, suitable for fine wire production; improve PCB production yield.

The main problems of LDI technology include: high-precision lasers and optical systems are required, which increases the cost and complexity of the equipment; high environmental requirements, temperature and humidity need to be controlled to ensure imaging quality; high technical requirements for operators, and professional training is required to operate the equipment proficiently.

The advantages of LDI technology in the flexible board industry include: improving production efficiency, no need to make and replace physical masks, shortening production cycles and waiting time; high-precision imaging, capable of processing finer and more complex graphics, improving product yield and reliability; efficient use of materials, reducing material waste; environmental advantages, reducing the use of chemicals, and reducing environmental pollution.

What are the disadvantages of laser direct imaging?

The disadvantages of laser direct imaging (LDI) technology mainly include:

1. High equipment cost: LDI equipment is usually expensive and requires a large initial investment, which may be a burden for some small enterprises or projects.

2. High environmental requirements: LDI equipment needs to work in a specific environment, such as a dark room or a low-illuminance red light environment, which increases the requirements for the working environment.

3. Technical complexity: LDI technology involves multiple steps and complex process flows, with high technical requirements for operators, and long training costs and time.

4. High material cost: LDI requires the use of specific photoresists and laser diodes, which are expensive and increase production costs.

5. Speckle problem: After the laser beam is reflected or transmitted through a rough surface, it will form countless independent scattered sub-waves. These sub-waves are coherently superimposed during the spatial propagation process, forming random and irregularly distributed bright and dark spots in space, that is, speckle phenomenon, which may affect the imaging quality.

In summary, although LDI technology has the advantages of high precision and high efficiency, its disadvantages such as high equipment cost, complex technical requirements and speckle problem also need to be considered when using it.

When is laser direct imaging used?

Laser direct imaging LDI is mainly used in the exposure process in PCB manufacturing, especially when high precision and efficient production are required. This technology is particularly suitable for the production of fine-line and ultra-fine-line circuit boards, and can achieve the best imaging effect.

In addition, LDI technology is also widely used in the field of FPC soft boards, which can improve production efficiency and product quality, and support complex circuit structures and high-density layouts.

The advantages of laser direct imaging LDI technology include:

1. High precision: It can achieve high-resolution pattern exposure and improve product performance and reliability.

2. Efficient production: shorten the exposure process, speed up production and reduce costs.

3. Complex circuit structure: support the exposure of multi-layer FPC and meet the needs of high-density layout.

Laser direct imaging technology is a highly promising technology in the field of PCB manufacturing. It has many advantages in terms of precision, flexibility, production efficiency and cost-effectiveness, and plays an important role in PCB manufacturing in many fields such as high-end electronic products, automotive electronics, industrial control and communication equipment.