Posts Tagged ‘PCB’

Single layer PCB manufacturer | Single sided PCB Design&Prototype

Friday, September 27th, 2024

What is a single-sided PCB circuit board

Single-sided PCB circuit board is a type of printed circuit board. Only one side of the PCB board has circuits (it can have holes or not), and the other side is a substrate or directly covered with insulating ink. There is no circuit and the whole board is transparent under strong light (except for individual boards and special process requirements). The cross section only contains copper foil on the side with circuits.
Single-sided PCB circuit board is obtained by etching copper-clad board. Copper-clad board consists of board base and copper foil. The board base is usually made of insulating materials such as glass fiber, and is covered with a layer of copper foil (usually oxygen-free copper).

Single layer PCB manufacturer

Single layer PCB manufacturer Best Technology has offered high-quality PCBs and the best PCB assembly & box building service all over the world since 2006. We are professional fabricator on PCB prototype, IPC Class III standard are available. You can get high-quality PCB board and PCBA at a very reasonable price.

Single layer PCB design
Best Technology excels in PCB design, perform PI analysis, SI analysis, EMC test and DFM tests to ensure one-time successed PCB design. Over 20 professional engineers, all of them has more than 15+ years experience in PCB, we make sure every design is optimized for performance and manufacturability.

Single layer PCB prototype
As an industry-leading PCB prototype manufacturer, Best Technology offers 24 hours quick turn PCB prototype, PCB assembly and reliable small-batch PCB production. Free technical support and VIP one-to-one service.

Single layer PCB production
With over 18 years PCB manufacture experience, we dedicated to provide highest quality PCB for customers. We offer turnkey service from PCB design, PCB layout, PCB prototype, mass production and PCB assembly. Contact us to get an instant quote.

Single layer PCB assembly
Professional PCB assembly service, includes DFM/DFA checks, function/ICT testing, X-RAY, Online dual AOI, nitrogen reflow oven. 10+ SMT lines, free passive parts and Thorough Inspections! SMT, Thru-hole, BGA, QFN Assembly at Low Prices! No MOQ, complex and difficulty designs welcome!

Single-sided PCB production process

Cutting
Drilling or punching
Screen printing circuit anti-etching pattern or using dry film
Curing inspection and board repair
Screen printing solder mask pattern (commonly used green oil)
Screen printing character mark pattern, UV curing
Preheating, punching and appearance
Electrical open and short circuit test
Pre-coating flux anti-oxidant (drying) or tin spraying hot air leveling
Packaging and delivery

Single-sided PCB production capacity

Item	Content
Material type :	XPC FR-1 FR-4 CEM-1
Surface finish :	ENIG gold, HASL Immersion Tin, Chemical Silver OSP
Layer No :	Single side, Multilayer PCB
Max PCB size:	1500mm*600mm
Min PCB size:	5mm*5mm
Min space/width:	0.1mm
Warp and Twist:	≤0.5%(board thickness：1.6mm，PCB size ： 300mm*300mm)
Board thickness:	0.3-5.0mm
Copper thickness:	35um-240um
Outline Tolerance:	±0.15mm
V-CUT Precision:	±0.1mm
Capacity:	80000㎡/Month
PTH Dia tolerance:	±0.076mm
Outline tolerance:	CNC ：±0.1mm punch：±0.15mm

What are the single-sided PCB materials?

What are the single-sided PCB materials

Phenolic paper substrate
Phenolic paper substrate (commonly known as cardboard, plastic board, V0 board, flame retardant board, red-letter copper clad board, 94V0). The most commonly used product models of phenolic paper-based copper clad boards are FR-1 (flame retardant) and XPC (non-flame retardant). Single-sided copper clad boards can be easily judged from the color of the characters on the back of the board. Generally, red characters are FR-1 (flame retardant) and blue characters are XPC (non-flame retardant). This type of board is the cheapest compared to other types of boards.

Epoxy fiberglass cloth substrate
Epoxy fiberglass cloth substrate (commonly known as: epoxy board, fiberglass board, fiberboard, FR4), epoxy fiberglass cloth substrate is a type of substrate with epoxy resin as adhesive and electronic grade glass fiber cloth as reinforcing material. Its bonding sheet and inner core thin copper clad board are important substrates for making multi-layer printed circuit boards. The working temperature is high and its own performance is less affected by the environment. In terms of processing technology, it has great advantages over other resin fiberglass cloth substrates. This type of product is mainly used for double-sided PCBs. It is also about twice as expensive as phenolic paper substrates, and the commonly used thickness is 1.5MM.

Composite substrates
Composite substrates (commonly known as powder boards, etc., cem-1 boards are also called 22F in some places in China) mainly refer to CEM-1 and CEM-3 composite-based copper-clad boards. Copper-clad boards made of wood pulp fiber paper or cotton pulp fiber paper as core reinforcement materials and glass fiber cloth as surface reinforcement materials, both of which are impregnated with flame-retardant epoxy resin, are called CEM-1. Copper-clad boards made of glass fiber paper as core reinforcement materials and glass fiber cloth as surface reinforcement materials, both of which are impregnated with flame-retardant epoxy resin, are called CEM-3. These two types of copper-clad boards are the most common composite-based copper-clad boards. This type of board is cheaper than FR4 type boards.

Single-sided PCB circuit board price

Since the cost of single-sided PCB circuit boards is affected by many factors, including the cost of raw materials, production cost, production process, special requirements, etc., its exact pricing needs to be negotiated with its single-sided PCB circuit board supplier. The general unit price calculation formula is: (length MM) × (width MM) × 0.01 × unit price (yuan/square meter) ÷ 10000 (rounded to 3 decimal places)
For specific single-sided PCB quotes, please consult bestpcbs．

Single-sided PCB circuit board price

Single-sided PCB applications and features

Single-sided PCBs are increasingly widely used due to their many unique advantages;
High density: For decades, high-density printed boards have developed with the improvement of integrated circuit integration and the advancement of installation technology.
High reliability: Through a series of inspections, tests and aging tests, PCBs can work reliably for a long time (usually 20 years).
Designability: According to the requirements of various performances (electrical, physical, chemical, mechanical, etc.) of single-sided boards, printed boards can be designed in a short time and efficiently through design standardization.
Manufacturability: Through modern production management, standardization, scale (quantification), automation, etc. can be achieved to ensure the consistency of product quality.
Testability: Complete test methods, standards and various test equipment and instruments have been established to detect and evaluate the qualification and service life of a single PCB.
Assembly: Circuit boards facilitate standardized assembly of various components to achieve automated, large-scale mass production. At the same time, circuit boards and various component assemblies can be assembled into larger components and systems, and even complete machines.

Maintainability: Circuit boards and various component parts are manufactured with standardized designs and scales. If a system fails, components can be replaced quickly and conveniently. The system can recover quickly due to this flexibility. More examples include system miniaturization, lightweight, high-speed signal transmission, etc.

FAQ About single sided pcb

FAQ About single sided pcb

Q: When laying out the board, if the lines are dense, there may be more vias, which will of course affect the electrical performance of the board. How can I improve the electrical performance of the board?
A: For low-frequency signals, vias are not a big deal, but for high-frequency signals, try to reduce vias. If there are many lines, you can consider multi-layer boards;

Q: Is it better to add more decoupling capacitors on the board?
A: Decoupling capacitors need to be added with appropriate values at appropriate locations. For example, add them to the power supply port of your analog device, and use different capacitance values to filter out stray signals of different frequencies;

Q: What are the standards for a good board?
A: Reasonable layout, sufficient power redundancy of power lines, high-frequency impedance, and simple low-frequency routing.

Q: How much difference do through holes and blind holes have on signals? What are the application principles?
A: Using blind or buried holes is an effective way to increase the density of multi-layer boards, reduce the number of layers and board size, and greatly reduce the number of plated through holes. But in comparison, through holes are easy to implement in terms of process and have lower costs, so through holes are generally used in designs.

Q: What kind of layout can achieve the best heat dissipation effect?
A: There are three main sources of heat in PCB: (1) heat generated by electronic components; (2) heat generated by the PCB itself; (3) heat transmitted from other parts. Among these three heat sources, the heat generated by components is the largest and is the main heat source, followed by the heat generated by the PCB board. The heat transmitted from the outside depends on the overall thermal design of the system and is not considered for the time being. The purpose of thermal design is to take appropriate measures and methods to reduce the temperature of components and PCB boards so that the system can work normally at a suitable temperature. This is mainly achieved by reducing heat generation and accelerating heat dissipation.

Q: Can you explain the proportional relationship between the line width and the size of the matching via?
A: This is a good question. It is difficult to say that there is a simple proportional relationship because the two simulations are different. One is surface transmission and the other is ring transmission. You can find a via impedance calculation software on the Internet, and then keep the impedance of the via consistent with the impedance of the transmission line.

Q: In an ordinary PCB circuit board with an MCU control, but without high current and high-speed signal requirements, is it better to lay a layer of ground wire around the outermost edge of the PCB to wrap the entire circuit board?
A: Generally speaking, just lay a complete ground.

Q: How to deal with the avoidance of vias during the wiring process of high-speed PCB, what good suggestions are there?
A: For high-speed PCB, it is best to make fewer vias and solve the need to increase vias by adding signal layers.

Q: How to select the thickness of the power trace in PCB board design? Are there any rules?
A: You can refer to: 0.15×line width (mm)=A, and copper thickness also needs to be considered.

Q: When digital circuits and analog circuits are on the same multi-layer board, should analog ground and digital ground be arranged on different layers?
A: This is not necessary, but analog circuits and digital circuits should be placed separately.

Q: How many vias are generally suitable for digital signal transmission? (Signals below 120Mhz)
A: It is best not to exceed two vias.

What is Alternating Current?

Alternating current (AC) refers to the current whose direction and magnitude change periodically over time. Unlike direct current (DC), the direction of direct current in the circuit remains unchanged, while alternating current will experience the process of flowing from the positive electrode to the negative electrode and then from the negative electrode back to the positive electrode during its cycle, forming a closed loop.

The main characteristics of alternating current include:

‌Periodic change‌: The current magnitude and direction of alternating current change periodically over time. The speed of this change is expressed by frequency, and the unit is Hertz (Hz). Common household AC frequencies are 50Hz or 60Hz, which means that the current changes direction 50 or 60 times per second.

‌RMS‌: Since the current size and direction of AC are constantly changing, the Root Mean Square (RMS) is often used to describe its size.

‌Easy to transmit and transform‌: AC can be easily increased or decreased in voltage through a transformer, which is of great significance for the long-distance transmission and distribution of electric energy.

‌Widely used‌: Due to the above advantages, AC has been widely used in power systems, household appliances, industrial equipment and other fields.

In short, AC is a form of current whose direction and size change periodically over time, and it has the characteristics of convenient transmission and transformation and wide application.

Do PCBs use AC or DC?

PCBs mainly use direct current. ‌

In electronic circuits, direct current (DC) is a more common and used form of power supply. The purpose of power supply design is not only to convert AC to DC, but also to provide power to circuit components with the correct voltage and current.

Common voltage ranges include 1.8V to 12V, of which 1.2V, 1.8V, 3.3V, 5V, and 12V are the most commonly used voltages. Important parameters of the power supply include voltage, maximum current, voltage ripple, and heat loss at maximum current.

In PCB design, DC power is widely used to provide a stable power supply for the circuit, while AC power can be used for input, but before reaching the inside of the electronic device, it is usually converted into DC to meet the power needs of the electronic device.

In summary, PCB mainly uses DC because DC can provide stable and suitable power for electronic devices.

Can AC be used in PCB?

From an electrical principle, the conductive pattern on the PCB can transmit AC. As long as the design is reasonable and the parameters such as the width, thickness, and spacing of the conductive pattern can meet the transmission requirements of AC, AC can be used on the PCB.

In some electronic devices such as audio amplifiers and power adapters, AC is used on the PCB for signal transmission and power conversion.

What should be paid attention to when using AC in PCB?

1. Electromagnetic interference

When AC is transmitted on PCB, electromagnetic radiation will be generated, which may interfere with surrounding electronic components and circuits.

In order to reduce electromagnetic interference, reasonable layout, shielding measures, and filter capacitors can be adopted.

2. Insulation requirements

The voltage of AC is usually higher than that of DC, and the insulation requirements are also higher. If the insulation is poor, it may cause safety problems such as leakage and short circuit.

When designing PCB, it is necessary to select suitable insulating materials and ensure that there is sufficient insulation distance between the conductive line and the surrounding components and ground layer.

3. Heating problem

AC generates heat due to the presence of resistance during transmission. If the heat cannot be dissipated in time, it may cause the PCB temperature to rise, affecting the performance and life of electronic components.

The heating problem can be solved by optimizing the layout of PCB, adding heat sinks, and selecting low-resistance conductive materials.

What are the applications of using AC in PCB?

Audio amplifier: Audio amplifiers usually need to process audio signals, which are essentially an AC. On the PCB of the audio amplifier, there will be special circuits for amplifying and processing audio signals, and these circuits will involve the transmission and processing of AC power.

Power adapter: The power adapter usually needs to convert AC power to DC power to meet the power supply needs of electronic equipment. On the PCB of the power adapter, there will be components such as transformers and rectifier circuits to realize the conversion of AC power to DC power. These components will involve the transmission and processing of AC power.

Communication circuit: In the field of communication, a modem is a device that converts digital signals into analog signals (modulation) for transmission on analog communication lines, and converts received analog signals into digital signals (demodulation). In the modulation process, AC signals are needed to carry digital information, and the circuits on the PCB are responsible for realizing the modulation and demodulation functions of these signals.

Lighting circuit: Although LEDs are driven by DC power, in some large lighting systems, in order to facilitate power access and management, AC power is first converted to DC power and then drives the LED. In this process, the circuit on the PCB plays the role of power conversion and control, ensuring the stability and reliability of LED lighting.

What happens if you connect DC to AC?

Connecting DC to AC in a PCB can cause the device to not work properly or even be damaged. ‌

DC power and AC power are handled differently in circuits. DC power provides a constant current direction, while AC power provides a current direction that changes periodically.

In PCB design, it is critical to connect the power supply correctly, as incorrect connections can cause device failure or damage.

‌Device damage‌: If a DC device is designed to work only with DC power, connecting it to AC power may cause the electronic components inside the device to overheat, burn out, or otherwise be damaged.

‌Functional abnormality‌: Even if the device is able to operate briefly, the performance of the device will be affected due to the mismatch in design and may not achieve the expected working state.

‌Safety issues‌: Improper power connection may also cause safety risks such as fire or electric shock, as the voltage and current changes of the AC power supply may cause circuit overload or power supply damage.

AC can be used safely and effectively in PCBs by properly designing circuits, taking effective electromagnetic shielding measures, ensuring good insulation performance, and solving heating problems. In practical applications, it is necessary to comprehensively consider various factors and select a suitable solution to realize the transmission and processing of AC on PCB according to the specific requirements of electronic equipment and working environment.

What are the 7 types of PCB testing methods?

The common detection methods of PCB (Printed Circuit Board) boards are mainly used to detect the quality and accuracy of PCB boards, which is an indispensable part of the PCB production process. The following are 7 commonly used PCB board detection methods:

1. Visual inspection: Visual inspection is the simplest detection method. It observes the surface of the PCB board with human eyes to find possible defects, such as welding problems, component position offset, etc.

2. X-ray detection: X-ray detection is mainly used to detect problems hidden inside the PCB board, such as welding quality, BGA ball welding quality, inner layer line routing problems, etc.

3. Non-destructive testing: Non-destructive testing is a non-destructive detection method. Commonly used technologies include infrared testing, ultrasonic testing and electromagnetic wave testing.

4. AOl (Automated Optical Inspection): AOl is a method of automated inspection using optical equipment, which detects problems on the surface of PCB boards through high-resolution camera systems and pattern recognition software.

5. ATE (Automatic Test Equipment): ATE is an automatic test equipment used to test the electrical performance and functions of PCB boards.

6. Vibration test: Vibration test is used to detect the reliability and durability of PCB boards in vibration environments. By applying vibrations of different frequencies and amplitudes, the problems that may occur in actual use of PCB boards can be evaluated.

7. Thermal shock test: Thermal shock test is used to detect the performance of PCB boards in temperature change environments. By rapidly changing the temperature, the thermal expansion, thermal stability and welding quality of PCB boards can be evaluated.

These methods can comprehensively evaluate the quality and performance of PCB boards and detect potential problems in a timely manner to ensure the reliability and stability of PCB boards.

What is ate testing in semiconductor?

ATE testing is an important link in the semiconductor industry for testing the functional integrity and reliability of integrated circuits (ICs). It is the abbreviation of Automatic Test Equipment, which is a device that tests devices, circuit boards, and subsystems through computer control.

ATE testing plays a vital role in the semiconductor manufacturing process. It is a key step to ensure the quality of IC products. The test content includes DC parameter testing, AC parameter testing, functional testing, etc. These tests are designed to evaluate the performance, function, and reliability of the chip.

The basic principle of the test is to apply stimulus to the chip through the test vector, measure the response output of the chip, and compare it with the expected result to determine whether the chip meets the specification requirements.

ATE testing not only involves testing various parameters of the chip, but also includes structural testing of the chip, that is, detecting manufacturing defects to ensure the quality and reliability of the chip.

In addition, ATE testing also includes testing of voltage, current, frequency, pulse, temperature and other aspects of the chip to achieve comprehensive testing of the static parameters and dynamic performance of semiconductor chips.

In general, ATE testing is an important means of quality control of integrated circuits in the semiconductor industry. It improves the efficiency and accuracy of testing through automation, ensures the quality and reliability of semiconductor chips, and is an indispensable and important link in the semiconductor manufacturing process.

What is an ATE PSU?

ATE PSU refers to the power supply unit (Power Supply Unit) of Automatic Test Equipment. In the field of electronic testing, ATE (automatic test equipment) is mainly used for integrated systems of power supply electrical performance testing. The system consists of test equipment hardware and test system software, and is designed to provide efficient and accurate automatic testing functions.

The key to ATE test system integration is to combine test software, test hardware (such as oscilloscopes, digital multimeters, vector networks, etc.) with communication technology to meet the testing needs of products. With the increasing complexity of electronic products, the role of ATE test system integration has become indispensable.

As part of the ATE system, the power supply unit (PSU) is responsible for providing a stable power supply for the entire test system to ensure the accuracy and reliability of the test.

Therefore, ATE PSU is one of the very important components in the ATE system, and its performance directly affects the overall efficiency and accuracy of the ATE test system.

What are the advantages of ATE?

ATE test system has the following significant advantages:

‌High efficiency and time saving‌: ATE test system can automatically complete the test without manual intervention, which greatly saves test time and improves production efficiency‌.

‌Easy to operate‌: The operation is simple and easy to understand, easy to get started, which reduces the skill requirements for operators and reduces training costs‌.

‌Safe and reliable‌: The danger of manual operation can be avoided during the test process to ensure the life safety of employees‌.

‌Improve test efficiency‌: Automatically execute the test program, greatly shorten the test cycle, reduce manual intervention, and thus significantly improve test efficiency‌.

‌Flexibility and scalability‌: It can be flexibly configured and adjusted according to different test requirements, and supports customized configuration of various test modules and sensors‌.

‌Reduced labor costs‌: Reduced dependence on labor, reduced labor costs, and improved labor efficiency‌.

‌Strong anti-interference ability‌: The internal mechanical properties are good, and various external interferences can be eliminated to ensure the stability and accuracy of the test results‌.

In summary, the ATE test system is of great significance in improving production efficiency, reducing costs, ensuring employee safety, and optimizing quality management. It is widely used in product testing in semiconductors, electronics, automobiles and other fields‌.

What is ate in PCB?

ATE in PCB refers to automatic test equipment (Automatic Test Equipment). ATE is a computer-controlled device used to test devices, circuit boards, and subsystems.

It replaces manual labor through computer programming and automatically completes the test sequence. In the semiconductor industry, ATE specifically refers to an automatic tester for integrated circuits (ICs), whose functions include detecting the integrity of integrated circuit functions and ensuring the quality of integrated circuit manufacturing.

In a broader context, ATE equipment can perform chip parameter testing, functional testing, performance testing, fault detection, reliability testing, etc., and plays a vital role in the semiconductor manufacturing process.

What is the difference between automatic and manual testing?

In PCB testing, there are the following differences between automatic testing and manual testing:

1. Automatic testing relies on equipment and software, and is programmed; manual testing is manually operated and more flexible.

2. Automatic testing is high-speed and efficient, and can run continuously; manual testing is slow, easy to fatigue and low efficiency.

3. Automatic testing has high accuracy and good consistency; manual testing is easily affected by human factors and has poor consistency.

4. Automatic testing equipment has high investment but low operating cost; manual testing equipment has low cost but high labor cost.

5. Automated testing is suitable for large-scale production and complex circuit boards; manual testing is suitable for small-batch production and fault diagnosis.

What is the purpose of automated testing?

The purpose of automated testing in PCB is to ensure that each circuit board can meet the high performance required in complex electrical applications, and to improve product quality and performance by detecting and repairing defects. ‌

Automated testing, especially in the PCB (printed circuit board) production process, plays a vital role. This test uses machine scanners with light imaging to visually inspect the finished circuit board and evaluate the process quality by using technologies such as automated optical inspection (AOI).

The importance of automated testing lies in its ability to detect and repair defects at multiple stages of production, including bare board inspection, solder paste inspection, pre-reflow and post-reflow. Improve production speed and productivity to ensure that tasks are completed on time.

Conclusion:

Automated test equipment (ATE) plays a key role in PCBA testing. It can improve test efficiency, accuracy and product quality, reduce test costs, and provide strong support for electronic manufacturing companies. With the continuous development of electronic technology, ATE will also continue to upgrade and improve to adapt to the increasingly complex PCBA testing needs.

What is aluminum base material PCB?

Aluminum base material PCB (Printed Circuit Board) refers to a special type of PCB that uses aluminum as the substrate material. This PCB usually includes three main parts:

What is aluminum base pcb board? How to choose?

1. Circuit layer: This is the part where the circuit pattern is installed, usually a layer of copper foil, which is etched to form a circuit path.

2. Insulating thermal conductive layer: Located between the circuit layer and the metal base layer, this layer of material not only needs to provide electrical insulation between circuits, but also has good thermal conductivity to transfer the heat generated when the circuit is working to the metal base layer.

3. Metal base layer: Usually a layer of aluminum plate, its function is to quickly dissipate the heat from the circuit layer.

Due to its good thermal conductivity, aluminum base PCB is very popular in application scenarios that require efficient heat dissipation, in LED lighting, power management, automotive electronics, communication equipment, and other electronic devices that require high power output and good thermal management.

Compared with traditional FR-4 fiberglass PCBs, aluminum base pcb boards can manage heat more effectively, thereby improving the reliability and life of electronic components. ‌

Why Aluminum is used in PCB?

There are several main reasons for using aluminum in PCBs (printed circuit boards):

1. Good heat dissipation performance

High thermal conductivity: Aluminum is an excellent thermal conductive material with a relatively high thermal conductivity. During the operation of the PCB, electronic components will generate heat, and the aluminum substrate can quickly conduct this heat away to avoid damage to electronic components caused by excessive local temperatures, thereby improving the stability and reliability of electronic equipment and extending the service life of components.

Uniform heat dissipation: The aluminum substrate can evenly distribute heat across the entire PCB, prevent hot spots from concentrating, and reduce the risk of failures caused by local overheating.

2. Higher mechanical strength

Vibration resistance: Aluminum has a certain rigidity and toughness, and can withstand the vibration and impact that electronic equipment may be subjected to during use, which can ensure that the PCB will not be easily damaged by external forces.

Dimensional stability: The dimensional changes of aluminum substrates are relatively small under different temperature and humidity conditions, which can maintain the structural stability of PCBs and ensure the welding reliability of electronic components.

3. Good insulation performance

The surface of the specially treated aluminum substrate has a good insulation layer, which can effectively prevent circuit short circuits and leakage. At the same time, the insulation layer can also withstand a certain voltage to meet the electrical insulation requirements of different electronic equipment.

Good compatibility with other insulating materials: It can be well combined with the packaging materials and welding materials of various electronic components to ensure the overall performance of electronic equipment.

4. Good processing performance

Strong processability: Aluminum substrates can be made using traditional PCB processing techniques, such as etching, drilling, cutting, etc., which is convenient and fast and can meet different design requirements.

Surface processability: The surface of the aluminum substrate can be processed in a variety of ways, such as copper plating, gold plating, tin spraying, etc., to improve welding performance and corrosion resistance.

5. Cost-effectiveness

Relatively low material cost: Aluminum is a common metal material with abundant resources and relatively stable prices. Compared with some high-performance heat dissipation materials, the cost of aluminum substrates is low, which can reduce the manufacturing cost of electronic equipment while ensuring performance.

High production efficiency: Due to the good processing performance of aluminum substrates, large-scale automated production can be achieved, which can improve production efficiency and further reduce costs.

How to choose aluminum base pcb board?

Choosing the right aluminum base pcb board is crucial to the performance and reliability of electronic equipment. In the selection process, multiple factors need to be considered, including glass transition temperature, heat resistance, flatness, thermal expansion coefficient and electrical performance.

(I) Glass transition temperature

Glass transition temperature (Tg) is one of the important parameters for measuring the heat resistance of PCB substrates. Generally speaking, substrates with higher Tg are more stable in high temperature environments and are not prone to deformation or damage.

For application scenarios with higher operating temperatures, aluminum base pcb boards with Tg higher than the circuit operating temperature should be selected. The Tg of the current mainstream FR-4 board is about 130-140 degrees. If the circuit operating temperature is close to or exceeds this value, it is necessary to consider choosing an aluminum substrate material with a higher Tg.

(II) Heat resistance

Aluminum-based PCB boards should have high heat resistance to ensure that they can still work normally in high temperature environments.

Generally, a heat resistance of 250℃/50S is required. This means that the board will not undergo significant performance changes under short-term high temperature exposure.

(III) Flatness

In SMT (surface mount technology), it is required to use boards with a small degree of curvature as much as possible. Aluminum base PCB boards with good flatness can ensure accurate installation of components and good welding quality. If the flatness of the board is poor, it may cause the components to be installed loosely, and even cause problems such as cold soldering and short circuits during the welding process.

(IV) Thermal expansion coefficient

The thermal expansion coefficient (CTE) is one of the key factors to consider when selecting aluminum base pcb boards. Due to the inconsistent thermal expansion coefficient in the thickness direction, it is easy to cause PCB deformation, and in severe cases, it will cause the metallized holes to break, resulting in damage to components.

The thermal expansion coefficient of the aluminum substrate is 50×10⁻⁶cm/cm℃, which is smaller than that of the general FR-4 board and closer to the thermal expansion coefficient of copper foil. When selecting, try to choose a board with a low thermal expansion coefficient and matching other components to reduce the thermal stress caused by the difference in thermal expansion coefficient.

(V) Electrical performance

For high-frequency circuits, materials with high dielectric constant and low dielectric loss are required. Insulation resistance, withstand voltage strength, and arc resistance must meet product requirements.

In communication electronic equipment, high-frequency amplifiers, filters and other circuits have high requirements for electrical performance, and aluminum base pcb boards with good electrical performance need to be selected to ensure accurate signal transmission and stability.

In summary, according to application requirements, factors such as glass transition temperature, heat resistance, flatness, thermal expansion coefficient and electrical performance can be comprehensively considered to select a suitable aluminum base pcb board to ensure the performance and reliability of electronic equipment.

Which is a major disadvantage of aluminum?

Although aluminum has many advantages, it also has some inherent disadvantages as a material that may limit its use in certain applications.

1. Lower conductivity than copper: Although aluminum has a relatively high conductivity, it is still lower than copper.

2. Easy to deform: Aluminum has a relatively low hardness, so it is more likely to undergo plastic deformation when subjected to external forces.

3. Cold flow phenomenon: Aluminum becomes more brittle at low temperatures, and may exhibit cold flow (creep) phenomenon in high temperature environments, that is, slow deformation under constant load.

4. Difficult welding: The surface of aluminum is prone to form an oxide film, which affects the quality of welding and makes aluminum welding more difficult than other metals.

5. Corrosion resistance condition restrictions: Although aluminum itself has a certain degree of corrosion resistance, aluminum may accelerate corrosion in certain specific environments, such as salt water, alkaline solutions or halogens.

6. Connection reliability: When aluminum is in direct contact with other metals such as copper, corrosion problems may occur in some cases due to electrochemical reactions, especially in humid environments, which may affect the long-term reliability of the connector.

7. Large thermal expansion coefficient: Aluminum has a relatively high thermal expansion coefficient, which means that in an environment with large temperature changes, aluminum products may change in size due to thermal expansion and contraction, which may cause problems for applications that require precise matching.

What is the dielectric layer of aluminum PCB?

The dielectric layer of aluminum PCB is an insulating layer, which is located between the circuit layer and the metal layer and plays a role of isolation and insulation.

This insulating layer uses a thermally conductive insulating material that can quickly transfer the heat generated by the LED to the aluminum substrate. At the same time, the thermal resistance of this thermally conductive insulating material is a key factor that affects the efficiency of heat transfer.

In the design of aluminum substrates, the insulating layer is an indispensable part, which ensures the normal operation of the circuit while allowing heat to be effectively transferred to the aluminum base layer, thereby improving the thermal and mechanical properties of the entire structure.

Why don’t we use aluminum instead of copper?

The main reasons for not using aluminum instead of copper in PCBs (printed circuit boards) include the following:

‌Conductivity difference‌: Copper has significantly better conductivity than aluminum. This means that in circuits that require good conductivity, using copper can provide more stable current transmission‌.

‌Thermal conductivity difference‌: Copper substrates have higher thermal conductivity than aluminum substrates, which means that copper performs better in transmission efficiency, heat dissipation, and service life.

‌Resistance difference‌: Since copper has a higher density than aluminum, copper generally has lower resistance than aluminum. Using copper can reduce power loss and improve power transmission efficiency‌.

‌Weight difference‌: Copper has a higher density per unit area, resulting in copper PCBs weighing much more than aluminum PCBs under the same design. But if weight is not the main consideration, copper is widely used for its excellent electrical properties‌.

‌Production process‌: The production process of aluminum substrate PCBs is relatively simple, but this does not mean that aluminum is a better choice. In some cases, although aluminum substrates may be produced faster, copper substrates are preferred in many applications due to their superior electrical properties‌.

In summary, although aluminum as a lightweight, low-cost material may have advantages in some cases, copper is still the preferred material in PCB manufacturing due to its better electrical conductivity, thermal conductivity, low resistance and applicability in most applications.

In short, as a new type of PCB material, aluminum base pcb board has the advantages of excellent heat dissipation, high mechanical strength, good electrical properties and environmental protection and recyclability. With the continuous development and progress of electronic technology, market demand will continue to increase. BEST Technoloby, as a professional aluminum substrate manufacturer, has rich manufacturing experience. The aluminum substrates produced have been tested by the market for a long time, and the service quality is in the first echelon. Choose us and you will get the best experience.

What is an aluminum substrate?

Aluminum substrate, the full name of which is aluminum-based copper clad laminate, has good heat dissipation, electrical insulation and mechanical processing performance. It is widely used in LED lighting, power modules, automotive electronics, communication equipment and other fields.

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In these fields, aluminum substrates can effectively dissipate the heat generated by electronic components quickly, thereby ensuring the normal working temperature of electronic components and extending their service life. At the same time, the high insulation performance of aluminum substrates can prevent the occurrence of safety problems such as electrical short circuits and leakage.

In addition, the mechanical processing performance of aluminum substrates also enables it to adapt to various complex electronic equipment structure design requirements.

How to choose an aluminum pcb suppliers?

1. Conduct market research

Before choosing an aluminum pcb supplier, you need to conduct sufficient market research. Understand the product quality, technical strength, production capacity, service quality and price of different suppliers, and make comparisons and analyses.

You can get more information about suppliers through online searches, industry exhibitions, and consulting industry insiders. At the same time, you can also refer to the evaluations and recommendations of other customers to understand the reputation and credibility of the supplier.

2. On-site inspection of suppliers

After determining some potential suppliers, you can conduct on-site inspections. On-site inspections can give you a more intuitive understanding of the supplier’s production equipment, production processes, quality control systems, and management levels.

During the on-site inspection, you can communicate with the supplier’s technical personnel and management personnel to understand their technical strength and service level. At the same time, you can also view the supplier’s product samples to understand the quality and performance of the products.

3. Conduct sample testing

Before selecting an aluminum pcb supplier, you can ask the supplier to provide samples for testing. Sample testing can give you a more intuitive understanding of the supplier’s product quality and performance, and whether it meets your needs.

When conducting sample testing, you need to test according to your actual use requirements, such as heat dissipation performance, electrical insulation performance, mechanical processing performance, etc. At the same time, you also need to check the appearance quality of the sample to ensure that there are no obvious scratches, stains, and defects.

How strong is BEST Technology?

BEST Technology has a strict quality control system. From raw material procurement to production and processing to product testing, every link is strictly controlled. And BEST Technology’s products have passed many international certifications, such as ISO9001 quality management system certification, UL certification, etc.

BEST Technology also has a strong technical R&D team, which can continuously launch new products and technologies to meet the needs of the market and customers. For example, the high thermal conductivity aluminum substrate they developed has a heat dissipation performance that is more than 30% higher than that of traditional aluminum substrates, and has been widely praised by customers.

BEST Technology also has advanced production equipment and process technology, using automated production lines and advanced surface treatment technology to ensure product production efficiency and quality. Their production capacity is in a leading position in the industry and can ensure on-time delivery of orders.

What are the classifications of aluminum-based PCBs?

‌Aluminum-based PCB‌ (aluminum-based copper-clad laminate) is mainly divided into the following categories:

‌General-purpose aluminum-based copper-clad laminate‌: The insulation layer of this type of aluminum-based copper-clad laminate is composed of epoxy glass cloth bonding sheets, which is suitable for the manufacture of general electronic products, providing basic electrical insulation and certain heat dissipation performance.

‌High heat dissipation aluminum-based copper-clad laminate‌: Its insulating layer is composed of highly thermally conductive epoxy resin or other resins, which is designed to provide better heat dissipation and is suitable for high-power electronic devices.

‌Aluminum-based copper-clad laminate for high-frequency circuits‌: The insulating layer of this type of copper-clad laminate is composed of polyolefin resin or polyimide resin glass cloth bonding sheet, which is particularly suitable for electronic devices that require high-speed signal transmission and high integration.

What are the characteristics of aluminum-based PCBs?

The characteristics of aluminum-based PCBs mainly include excellent heat dissipation, dimensional stability, insulation, durability, lightness and environmental protection. ‌

‌Excellent heat dissipation‌: Aluminum-based PCBs have excellent thermal conductivity because they use aluminum as the base material, which can effectively transfer heat from heating devices or important devices, thereby improving the overall performance of the product‌.

‌Dimensional stability‌: The dimensional stability of aluminum substrates is higher. Compared with printed boards made of insulating materials, the dimensional changes of aluminum substrates are smaller, which helps to improve the reliability and durability of products‌.

‌Insulation‌: Aluminum substrates have good insulation properties and can provide the electrical isolation required by electronic devices. At the same time, they are hard and can replace easily broken ceramic plates, effectively reducing the actual area required for printed circuit boards, so that products do not need to install radiators, etc., thereby improving the heat dissipation of products and improving product efficiency and reducing costs.‌

‌Durability‌: Due to its high hardness, aluminum substrates can reduce the risk of accidental damage during production, handling and daily use, and provide strength, toughness and durability that glass fiber substrates cannot provide.‌

‌Lightweight‌: Aluminum substrates enhance the strength and elasticity of products without adding extra weight, which helps to reduce the overall weight of products.‌

‌Environmental protection‌: Aluminum is non-toxic and recyclable, which helps to reduce the impact of electronic waste on the environment.‌

In summary, aluminum-based PCBs provide electronic products with multiple advantages such as efficient heat dissipation, dimensional stability, excellent electrical performance, durability, lightness and environmental protection through their unique physical and chemical properties, making aluminum-based PCBs widely used in high-end electronic devices.‌

What are the application scenarios of aluminum-based PCBs?

The application scenarios of aluminum-based PCBs are very wide, mainly including the following aspects:

‌High-power LED lighting‌: Aluminum-based PCBs can quickly and effectively transfer the heat generated by LEDs to the external environment, reduce the impact of high temperature on the life of LED chips, and improve the life and reliability of lamps.

‌Power supply equipment‌: Such as switching power supplies, DC/AC converters, voltage regulators and other high-power density power modules, aluminum-based PCBs can quickly dissipate heat to ensure stable operation of the circuit.

‌Audio equipment‌: The heating elements in audio devices such as audio amplifiers, power amplifiers, and preamplifiers can be well managed by aluminum-based PCBs.

‌Communication electronic equipment‌: Components in communication systems such as high-frequency devices, filters, signal transmission and reception circuits, etc., use aluminum-based PCBs to improve system reliability.

‌Computers and peripherals‌: Some areas on the motherboard, power supply modules, and hardware such as graphics cards may use aluminum-based PCBs to improve the heat dissipation effect.

‌Office automation equipment‌: Motor drivers and other components that require effective heat dissipation.

‌Automotive electronics‌: Including electronic speed regulators, ignition devices, power controllers and other vehicle-mounted applications.

‌Industrial control field‌: High heat density circuit boards inside industrial control equipment such as frequency converters and inverters.

Aluminum-based PCBs are widely used in many fields due to their excellent heat dissipation and electrical insulation properties, especially in situations where efficient heat dissipation and stable operation are required.

Choosing a high-quality aluminum pcb supplier is crucial for electronics manufacturers. When choosing a supplier, it is necessary to consider the key points comprehensively. Choose a suitable aluminum pcb suppliers through market research, field visits and sample testing.

What is aluminum PCB?

Aluminum PCB board is a metal-based copper-clad board with good heat dissipation function. This board is mainly used for high-end applications. When designed as a double-sided board, the structure is a circuit layer, an insulating layer, an aluminum pcb board, and then an insulating layer and a circuit layer.

In rare cases, aluminum pcb board can also be designed as multi-layer boards, which are formed by laminating ordinary multi-layer boards with insulating layers and aluminum pcb board.

The unique advantage of aluminum pcb board lies in their excellent heat dissipation performance. The power device is mounted on the circuit layer on the surface. The heat generated by the device during operation is quickly transferred to the metal base layer through the insulating layer, and then the metal base layer transfers the heat away to achieve effective heat dissipation of the device.

This design enables the aluminum pcb board to minimize thermal resistance and has excellent thermal conductivity. At the same time, compared with traditional materials, aluminum pcb board can reduce volume, extend life, and improve power density and reliability while carrying higher currents.

In addition, aluminum pcb board also meet RoHS requirements, are more suitable for SMT processes, and effectively handle heat diffusion in circuit design schemes, reduce the assembly of heat sinks and other hardware, reduce costs, improve the optimal combination of power circuits and control circuits, replace fragile ceramic substrates, and obtain better mechanical durability.

How do you make aluminum PCB?

The production process of aluminum pcb board mainly includes the following steps:

Cutting: First, cut the aluminum pcb board material according to the design requirements.

Drilling: Drill holes on the aluminum pcb board according to the circuit design requirements to prepare for subsequent circuit production.

Dry film photo imaging: Cover the dry film on the aluminum pcb board and transfer the circuit pattern to the aluminum pcb board through photo imaging technology.

Board inspection: Check whether the circuit pattern on the aluminum pcb board meets the design requirements.

Etching: Use chemical etching to remove the part not covered by the dry film to form a circuit pattern.

Etching inspection: Check the etched aluminum pcb board again to ensure the accuracy of the circuit pattern.

‌Green paint‌: Apply protective paint to prevent the circuit from being oxidized and corroded.

‌Character‌: Print necessary logos and information on the aluminum pcb board.

‌Green inspection‌: Check the aluminum substrate after applying protective paint to ensure quality.

‌Hinning‌: Spray tin on the aluminum substrate to improve welding performance.

Surface treatment‌: Treat the surface of the aluminum substrate, such as applying thermal conductive slurry to optimize heat dissipation performance.

‌Punching‌: Cut the aluminum substrate as needed to form the final product shape.

‌Final inspection‌: Perform final quality inspection on the finished aluminum substrate.

‌Packaging and shipment‌: Pack qualified aluminum substrates and prepare for shipment.

This series of steps ensures that the production quality and performance of the aluminum substrate meet the design and use requirements. Aluminum substrates are widely used in high-end electronic devices due to their excellent heat dissipation and machining performance.

How much does aluminum PCB cost?

The cost of aluminum substrate PCB is about 230 yuan to 400 yuan per square meter. ‌

The cost of aluminum substrate PCB is affected by many factors, including board type, production process, testing cost and other additional expenses.

Aluminum substrate PCB is a metal-based copper-clad board with good heat dissipation function. This board is highly praised in certain specific application scenarios due to its efficient heat dissipation performance, but correspondingly, its cost is usually much higher than other types of PCB.

‌Board cost‌ is one of the main costs of aluminum substrate PCB. The board cost used in aluminum substrate is higher because of its special materials and manufacturing process.

‌Processing cost‌ also occupies a certain proportion. The processing process of aluminum substrate includes cutting, drilling, electroplating, lamination and other links. The equipment and process requirements of each link will affect the final cost.

‌Quality inspection cost‌ is also not to be ignored. Strict quality inspection is required during the production process, including environmental adaptability testing, electrical performance testing, etc. The number and strictness of these inspection items will also affect the production cost.

In summary, the cost of aluminum substrate PCB is affected by many factors, roughly between 230 yuan and 400 yuan per square meter, and the specific price will vary according to specific needs and production conditions.

What are the layers of aluminum PCB?

The number of layers of aluminum-based PCB can be single-sided, double-sided or multi-layer. ‌

‌Single-sided aluminum substrate‌: On this type of PCB, the parts are concentrated on one side and the wires are concentrated on the other side. Since the wires only appear on one side, this PCB is called a single-sided aluminum substrate.

‌Double-sided aluminum substrate‌: There are wiring on both sides of the circuit board, but to use the wires on both sides, there must be appropriate circuit connections between the two sides.

‌Multilayer board‌: In order to increase the area that can be wired, multilayer boards use more single-sided or double-sided wiring boards. The printed circuit board that is alternately connected by the positioning system and insulating adhesive materials and the conductive patterns are interconnected according to the design requirements becomes a four-layer or six-layer printed circuit board, also known as a multilayer printed circuit board.

How thick is aluminum clad PCB?

The thickness of aluminum clad PCB usually ranges from 0.12mm to 0.18mm, with an error of ±0.01mm.

The thermal conductivity of aluminum substrate is one of the important indicators for evaluating its quality, and the thermal conductivity of aluminum substrate is generally 2.0-0.1, which means that the thermal conductivity of aluminum substrate is excellent and can effectively improve the heat dissipation efficiency of circuit boards.

In addition, the thickness of the insulation layer of aluminum substrate is usually 0.003 to 0.006 inches, which is composed of UL-certified aluminum plate cladding and insulating materials, while the base layer is a metal substrate, usually aluminum or copper.

What are the disadvantages of aluminum PCB?

The disadvantages of aluminum PCB mainly include high cost, high process difficulty, non-uniform board material, and easy problems in pressure resistance and electrical strength. ‌

‌High cost‌: The cost of aluminum PCB is relatively high, usually more expensive than other types of PCBs, and the price accounts for more than 30% of the total cost of the product.

‌High process difficulty‌: When making aluminum PCB, due to its special material and structure, the process of making double-sided boards is difficult, and during the manufacturing process, problems in pressure resistance and electrical strength are also easy to occur.

‌Inconsistent board materials‌: There is no unified international standard for the material specifications of aluminum PCBs. There are multiple specifications such as CPCA industry standards, national standards and international standards, which increases the complexity of selection and use‌.

‌Problems with withstand voltage and electrical strength‌: Aluminum substrates are prone to fail to meet the withstand voltage index, which may lead to safety problems during use‌.

Why is aluminum no longer used in integrated circuits?

The main reason why aluminum is no longer used in integrated circuits is that its high resistivity and easy electromigration are gradually exposed with the increase of chip integration and the reduction of feature size, which limits its application in high-performance chips. ‌

Aluminum is one of the earliest widely used metals in semiconductor chips. Due to its good conductivity and relatively low cost, it has been widely used as an interconnect metal in early integrated circuits.

However, with the increase of chip integration and the reduction of feature size, the shortcomings of aluminum gradually emerge. In addition, aluminum wires may experience electromigration under the action of long-term current, which will cause the failure of integrated circuits.

As an alternative material, copper has lower resistivity and higher electromigration resistance than aluminum, can carry larger current in thinner metal wires, and is more reliable under high-speed current conditions.

With the continuous development of electronic technology, aluminum substrates are also constantly innovating and developing. In the future, aluminum substrates will pay more attention to product quality, performance and environmental protection, and provide more reliable support for the development of electronic equipment. BEST Technology focuses on circuit board design and production, and has many years of experience in aluminum substrate manufacturing. Choosing BEST Technology will provide you with the best service.

Reasons for the development of aluminum substrate

The continuous updating and improvement of aluminum substrate technology has provided a strong driving force for the development of manufacturers. In terms of thermal conductivity, in order to meet the application needs of different fields, the thermal conductivity of aluminum substrates has been continuously improved, and has now reached more than 180W/mK.

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In terms of molding and processing technology, commonly used molding processes include cutting, punching and bending, and the continuously optimized molding and processing technology has improved the production efficiency and product quality of aluminum substrates.

In addition, technological innovation has also promoted the diversified development of aluminum substrate products, such as ultra-thin aluminum substrates, high-frequency and high-speed aluminum substrates, flexible aluminum substrates, composite functional aluminum substrates, environmentally friendly aluminum substrates and other new products have emerged continuously, meeting the needs of different industries and application fields.

What are the types of aluminum substrates?

(I) Flexible aluminum substrate

The material system of flexible aluminum substrate is usually a polyimide resin system with ceramic fillers, which can provide excellent electrical insulation, flexibility and thermal conductivity.

For example, in some portable electronic devices that require special shapes, flexible aluminum substrates can better adapt to the internal space of the device, eliminating expensive fixtures, cables and connectors, and reducing overall costs.

At the same time, due to its good flexibility, it can also play an important role in some bendable electronic products, such as foldable displays.

(II) Multilayer aluminum substrate

In the high-performance power supply market, multilayer aluminum substrates are made of multiple layers of thermally conductive dielectrics. These structures have one or more layers of circuits buried in the dielectric, and blind holes are used as thermal vias or signal paths.

Although it is more expensive and less efficient to transfer heat with a single-layer design, they provide a simple and effective heat dissipation solution for more complex designs. For example, in some high-end server power supplies, industrial power supplies and other fields, the heat dissipation requirements are extremely high. Multilayer aluminum substrates can meet the heat dissipation needs of these complex electronic devices and ensure the stable operation of the equipment.

(III) Through-hole aluminum substrate

In the most complex structures, a layer of aluminum can form the “core” of a multi-layer thermal structure.

Before lamination, the aluminum is pre-plated and filled with dielectrics. Thermal materials or sub-assemblies can be laminated to both sides of the aluminum using thermal bonding materials. Once laminated, the completed assembly is similar to a traditional multi-layer aluminum substrate through drilling.

The plated through-holes pass through the gaps in the aluminum to maintain electrical insulation. Alternatively, the copper core can allow direct electrical connection as well as insulating through-holes. This complex structure makes it play an important role in some high-end electronic devices with extremely high requirements for electrical insulation.

What is the dielectric material of aluminum PCB?

The dielectric material selection of aluminum PCB is diverse, designed to meet different performance requirements. Epoxy resin is widely used for its toughness and heat resistance, while polyimide is known for its high temperature stability and chemical stability.

Polystyrene is favored for its low dielectric constant and dielectric loss tangent, while acrylic ester is selected for its excellent light transmittance. In addition, ceramic materials such as alumina, silicon nitride, zirconium oxide, etc. are also commonly used dielectric materials for aluminum PCBs due to their excellent insulation, thermal conductivity, oxidation resistance, and high-temperature stability.

Different dielectric materials have different dielectric constants and thermal properties, which are particularly important for applications in high-frequency and high-temperature environments. Polytetrafluoroethylene (PTFE) and ceramic substrates are particularly suitable for high-frequency and high-temperature environments due to their high temperature resistance and low dielectric constant.

In summary, there are a wide variety of dielectric materials for aluminum PCBs, including epoxy resin, polyimide, polystyrene, acrylic ester, alumina, silicon nitride, zirconium oxide, etc. These materials are selected based on their respective advantages to meet the performance requirements of aluminum PCBs in specific applications.

What is the thermal resistance of aluminum PCB?

The thermal resistance of aluminum PCBs ranges from 1℃/W to 2℃/W. ‌This data is in sharp contrast to the thermal resistance of FR4 PCBs, which ranges from 20℃/W to 22℃/W.

This shows that aluminum PCB is significantly better than FR4 PCB in heat dissipation performance. Aluminum material has good heat dissipation effect, which can effectively reduce the heat generated by electronic equipment during operation and keep components running at a suitable working temperature, thereby improving the stability and service life of the equipment.

What are the production processes of aluminum substrates?

First, the material is cut, and the incoming material inspection is strengthened to ensure that the sheet with a protective film on the aluminum surface is used. After cutting, there is no need to bake the sheet, and it should be handled with care, paying attention to protecting the protective film on the aluminum base surface.

Next is drilling. The drilling parameters are the same as those of FR-4 sheet materials. At the same time, the aperture tolerance must be strictly controlled, especially for 4OZ-based Cu. Pay attention to controlling the generation of flash, and drill with the copper skin facing up.

Then enter the dry film optical imaging link, including incoming material inspection, grinding, filming, board clapping, exposure and development.

When inspecting the board, the circuit surface must be inspected according to MI requirements for various contents, and the dry film on the aluminum base surface must not have film falling or damage.

In the etching process, since the copper base is generally 4OZ, etching is difficult. After the aluminum surface without protective film is taken out of the film stripping liquid, it should be washed with water in time to prevent the alkali solution from biting the aluminum surface.

The production process of the green oil process is grinding the plate (only brushing the copper surface) → silk screen printing green oil (first time) → pre-baking → silk screen printing green oil (second time) → pre-baking → exposure → development → grinding machine pickling soft brush → post-curing → next process.

Before spraying tin, tear off the protective film of the aluminum substrate with protective film, hold the edge of the plate with both hands, and it is strictly forbidden to touch the inside of the plate directly with your hands. Pay attention to the operation to prevent scratches.

What are the characteristics of aluminum substrate manufacturers?

(I) Good processing and production effect

Aluminum substrate manufacturers can make full use of the material properties of the aluminum substrate itself according to the actual processing size to bring better processing and production effects for building material design.

(II) Stable and reliable quality

Aluminum substrate manufacturers focus on product quality and stability, and use high-quality raw materials and strict production standards. They have a complete production system and quality control system to ensure the quality and stability of products.

(III) Advanced production technology

Aluminum substrate manufacturers use advanced production technology and equipment to ensure product accuracy and stability. They have professional sales and technical teams that can provide high-quality products and technical support.

(IV) Energy saving and environmental protection

Aluminum substrate manufacturers focus on the energy saving and environmental protection of their products, and use energy-saving and environmentally friendly materials and production processes. They have strong R&D and technical strength, and continue to launch new energy-saving and environmentally friendly products and technological innovations.

What is the market prospect of aluminum substrate manufacturers?

The continuous emergence of new generation electronic products, such as smart phones, tablets, wearable devices, etc., has higher and higher requirements for heat dissipation performance and thinness. Aluminum substrates, as a metal-based copper-clad laminate with good heat dissipation function, just meet these needs.

The development of emerging technologies such as 5G has also brought new opportunities to the aluminum substrate market. Aluminum substrates, as a metal-based copper-clad laminate with good heat dissipation and electrical properties, just meet the needs of 5G communication technology.

The trend of lightweight vehicles and the expansion of the new energy vehicle market have also brought new opportunities to the aluminum substrate market. Aluminum substrates, as a metal-based copper-clad laminate with the characteristics of lightweight, high strength and corrosion resistance, just meet the needs of lightweight vehicles.

In short, aluminum substrate manufacturers play an important role in the electronics field. They provide high-quality aluminum substrate products to the electronics industry with advanced technology, strict quality control, continuous innovation and research and development, and good customer service.

How do you make Aluminum PCB?

What is an aluminum pcb? How is it made?

1. Cutting: Cut large-sized incoming materials into the size required for production. The process is picking materials-cutting.

2. Drilling: Positioning and drilling holes in the plate to assist the subsequent production process and customer assembly. The drilling process is pinning-drilling-board inspection.

3. Dry/wet film imaging: The part required for making the circuit is presented on the plate. The dry/wet film imaging process is grinding the plate-filming-exposure-development.

4. Acid/alkaline etching: After dry/wet film imaging, the required circuit part is retained and the excess part outside the circuit is removed. The acid/alkaline etching process is etching-film stripping-drying-board inspection.

5. Silkscreen solder mask and characters: solder mask is to protect the circuit that does not need soldering, preventing tin from entering and causing short circuit. Characters are used for marking. The silkscreen solder mask and character process is silkscreen – pre-baking – exposure – development – characters.

6. V-CUT, gong board: V-CUT is to cut the single PCS circuit and the whole PNL board to leave a small part connected for easy packaging and removal. The gong board is to remove the excess part of the circuit board. The process of V-CUT and gong board is V-CUT – gong board – tearing the protective film – removing the flash.

7. Test, OSP: Circuit test is to detect whether the completed circuit is working normally. Voltage resistance test is to detect whether the completed circuit can withstand the specified voltage environment. OSP allows the circuit to be better soldered. The test, OSP process is circuit test – voltage resistance test – OSP.

8. FQC, FQA, packaging, shipment: FQC conducts full inspection and confirmation of the product, FQA conducts random inspection and verification, and packages and ships to customers as required. The process is FQC-FQA-packaging-shipping.

What are the layers of aluminum PCB?

Aluminum-based circuit boards (PCBs) mainly consist of three layers, namely the circuit layer (copper foil), the insulation layer, and the metal base layer. This structure gives aluminum-based PCBs excellent heat dissipation performance and mechanical strength, making them particularly suitable for applications that require efficient heat dissipation and good mechanical properties.

The circuit layer is usually made of copper foil, which is etched to form a printed circuit for assembly and connection of devices. The thickness of the copper foil can be between 1oz and 10oz to ensure the conductivity and load-bearing capacity of the circuit.

The insulation layer is the core technology of aluminum-based PCBs. It uses low thermal resistance thermal insulation materials with a thickness of 0.003″ to 0.006″ inches and has good bonding, insulation and thermal conductivity.

The metal base layer is generally aluminum or copper, which has good thermal conductivity and certain mechanical strength. It can quickly conduct the heat generated during device operation, effectively reduce the operating temperature of the device, and improve the power load and reliability of the module.

In addition, according to the specific application requirements, aluminum clad PCB can be designed as single-sided board, double-sided board or very few multi-layer boards. Single-sided board consists of three-layer structure, while double-sided board adds a circuit layer on this basis, forming a structure of circuit layer, insulation layer, aluminum base, insulation layer, circuit layer.

How thick is aluminum clad PCB?

The thickness of aluminum clad board usually ranges from 0.2mm to 10mm, and the specific choice depends on the number of layers and purpose of the circuit board.

0.2mm to 0.5mm aluminum clad board is suitable for making single-sided circuit boards, 0.5mm to 1.2mm is suitable for double-sided circuit boards, and 1.2mm to 2.0mm is suitable for multi-layer circuit boards.

In addition, common standard thicknesses also include 0.5mm, 1.0mm, 1.5mm, etc. For the PCB board itself, common thicknesses are 0.6mm, 1.0mm, 1.6mm, 2.0mm, 2.4mm, etc.

The standard PCB thickness ranges from 0.031 inches (0.78 mm), 0.062 inches (1.57 mm), and 0.093 inches (2.36 mm), with the most commonly used thickness being 0.063 inches (1.57 mm or 157 mm).

The thickness of conventional PCB finished products is generally between 0.8 mm and 1.6 mm, with 1.6 mm being the most common specification‌.

What are aluminum PCBs used for?

Aluminum substrate PCB (aluminum PCB) is a metal-based copper-clad board with good heat dissipation function. It consists of a circuit layer (copper foil), an insulating layer and a metal base layer. Sometimes it is also designed as a double-sided board or a multi-layer board structure.

The application of aluminum substrates is very wide, covering multiple fields and equipment, mainly including:

1. Audio equipment: used for input and output amplifiers, balanced amplifiers, audio amplifiers, preamplifiers, power amplifiers, etc.

2. Power supply equipment: including switching regulators, DC/AC converters, SW regulators, etc.

3. Communication electronic equipment: suitable for high-frequency amplifiers, filtering appliances, signal transmission circuits, etc.

4. Office automation equipment: such as motor drives, etc.

5. Automotive electronics: used in electronic regulators, igniters, power controllers, etc.

6. Computers: including CPU boards, floppy disk drives, power supply equipment, etc.

7. Power modules: such as inverters, solid-state relays, rectifier bridges, etc.

8. Lamps and lighting: As an advocate of energy-saving lamps, aluminum substrates are increasingly used in various color energy-saving LED lamps.

Aluminum substrate PCBs are particularly favored in high-end electronic devices due to their excellent heat dissipation performance and reliability, and are widely used in various occasions that require efficient heat dissipation.

What are the disadvantages of aluminum PCB?

The main disadvantages of aluminum PCBs include high cost, usually only single-sided panels can be made, electrical strength and withstand voltage are more prone to problems, thermal conductivity test methods and test results are not matched, aluminum substrate material specifications are not unified, copper foil thickness does not meet the standard, and there are more defective products and shoddy work. ‌

1. High cost: The price of aluminum substrates usually accounts for more than 30% of the product price, which is significantly higher than other types of PCBs.

2. Production limitations: Aluminum substrates can usually only produce single-sided boards, and the process of producing double-sided boards is more difficult, which limits their use in some applications.

3. Electrical strength and withstand voltage issues: Aluminum substrates are more prone to problems in electrical strength and withstand voltage, which may affect the safety and reliability of the product.

4. Thermal conductivity test and material specification issues: The mismatch between the test methods and test results of thermal conductivity, as well as the lack of unified material specifications for aluminum substrates (there are CPCA industry standards, national standards, and international standards, etc.), all increase the complexity of production and quality control.

5. Copper foil thickness and defective products: Failure to meet the copper foil thickness standards may lead to problems such as burning circuits. At the same time, due to cutting corners and increasing defective products, the quality control of aluminum substrates has become more difficult.

These shortcomings limit the application scope of aluminum substrates to a certain extent and increase the risks of production and use. Therefore, when choosing to use aluminum substrates, it is necessary to comprehensively consider their advantages and disadvantages, as well as specific application requirements and environmental conditions.

What temp can aluminum PCB withstand?‌

The high temperature resistance of aluminum substrates is related to the materials used, manufacturing process and working environment. Under normal circumstances, aluminum substrates can withstand a wide range of temperatures, but the specific temperature resistance is also affected by factors such as solder paste and lamp quality.

The temperature that aluminum substrates can withstand during welding can reach about 400 degrees Celsius, and the welding time is about 30 seconds to 50 seconds, of which the actual melting time is only 10 seconds, which shows that aluminum substrates can withstand higher temperatures in a short period of time without damaging the components.‌

In addition, aluminum substrates, like other types of PCB boards (such as FR4 boards, copper substrates, etc.), can withstand an ambient temperature range of -40℃ to +150℃.

However, in long-term use, the highest temperature that these boards can withstand is between 120℃ and 130℃‌. This shows that although aluminum substrates and other types of PCB boards can work in a wide temperature range, their performance and life will be affected to a certain extent when working in a high temperature environment for a long time.

In short, as an important component in the field of electronics, aluminum substrates have excellent performance and broad application prospects. I believe that in the future, with the continuous advancement of technology, aluminum substrates will play a more important role in the field of electronics.

What is high frequency PCB?

high frequency PCB communication circuits refer to printed circuit board circuits that operate in a higher frequency range, usually between hundreds of MHz and tens of GHz. Compared with traditional low-frequency PCB circuits, high frequency PCB communication circuits have the following significant characteristics:

What is a high frequency pcb communication circuits?

1. High-speed signal transmission: high frequency PCB communication circuits can support high-speed data transmission and meet the needs of modern communication systems for large data volumes and high bandwidth.

2. Low signal loss: At high frequencies, signal transmission loss will increase significantly. Therefore, high frequency PCB communication circuits require special materials and design techniques to reduce signal loss and improve signal transmission quality.

3. Good electromagnetic compatibility: high frequency signals are prone to electromagnetic interference and affect surrounding electronic equipment. high frequency PCB communication circuits need to have good electromagnetic compatibility to ensure their stable operation in complex electromagnetic environments.

4. Miniaturization and lightweight: As electronic equipment continues to be miniaturized and lightweight, high frequency PCB communication circuits also need to develop in the direction of miniaturization and lightweight. This requires the use of high-density integration technology and advanced manufacturing processes to reduce the size and weight of circuit boards.

How do you make high frequency PCB?

Making a high frequency PCB (printed circuit board) involves several key steps to ensure the stability and reliability of signal transmission, taking into account the characteristics of high frequency signals.

1. ‌Material selection and preparation‌:

Choose a substrate material with low dielectric constant and low dielectric loss to ensure the stability and reliability of signal transmission.

The substrate material requires a conductive layer with good electrical conductivity and corrosion resistance.

Auxiliary materials such as membrane materials, filling materials, etc. also need to be carefully selected and prepared.

2. ‌Design, drawing production, etching, and laminating‌:

Carry out circuit design and layout planning based on design requirements and signal transmission characteristics.

Make PCB drawings and convert circuit layout and connection lines into circuit diagrams on the drawings.

The circuit diagram on the drawing is transferred to the substrate through photolithography technology and etched to form a conductive layer.

The film sticking process attaches the protective layer and copper clad layer to the conductive layer to protect the circuit and improve the mechanical strength.

3. ‌Welding and assembly process‌:

Surface mount technology is widely used in high frequency PCB welding, and SMT components are accurately welded to PCBs through methods such as hot air or reflow soldering.

Manual soldering technology also plays an important role in the assembly of high frequency PCBs. Plug-in components and connecting lines are connected by manual soldering.

4. ‌Special considerations for high frequency PCBs‌:

high frequency circuit design requires the adoption of special design principles and strategies, such as transmission line theory and matching, short and straight wiring strategies, impedance control and matching, decoupling and bypass, etc., to ensure signal quality and system reliability.

Adopt strategies such as multi-layer board design, straight wiring, shortening signal leads, reducing inter-layer alternation, being wary of crosstalk, increasing decoupling capacitors, isolating digital and analog ground wires, avoiding loops, ensuring impedance matching, and preventing ground bounce to improve Performance and reliability of high frequency circuits.

Through the above steps, a high-quality PCB that meets high frequency signal transmission requirements can be produced to ensure stable signal transmission and reliable operation of the system.

What are some important considerations when designing a PCB layout for high frequency circuits?

Designing high frequency PCB communication circuits faces many challenges and requires comprehensive consideration of circuit performance, electromagnetic compatibility, reliability and other aspects. Here are some of the major design challenges:

1. Signal integrity: At high frequencies, signal transmission will be affected by reflection, crosstalk, attenuation and other factors, leading to signal integrity problems.

2. Electromagnetic compatibility: As mentioned before, high frequency signals are prone to electromagnetic interference, so high frequency PCB communication circuits need to have good electromagnetic compatibility.

3. Thermal management: high frequency PCB communication circuits will generate a large amount of heat when working. If the heat cannot be dissipated in a timely and effective manner, the performance of the circuit will be reduced or even damaged.

4. Reliability: high frequency PCB communication circuits usually work in harsh environments, such as high temperature, high humidity, vibration, etc.

What is the highest frequency used for communication?

The highest frequency used for communication is 450GHz. ‌

This frequency range was finally approved at the 2019 World Radiocommunication Conference (WRC-19) and involves the 275 GHz-296 GHz, 306 GHz-313 GHz, 318 GHz-333 GHz and 356 GHz-450 GHz frequency bands, for a total of 137 GHz Bandwidth resources.

These frequency bands are used without restrictions for fixed and land mobile service applications. This is the first time that ITU has clarified the spectrum resources available for terrestrial active radio service applications in the terahertz frequency band above 275 GHz, and raised the upper limit of available spectrum resources for active services to 450 GHz, providing basic resource guarantee for the development and application of the global terahertz communication industry. .

Which frequency is best for communication?

For WiFi communication, choosing which frequency band is best depends on the user’s specific needs and network environment.

The 2.4GHz frequency band is suitable for use in home and office environments because of its strong signal penetration and low interference, especially when wide coverage and signal stability are required.

Because of its high-speed transmission capabilities, the 5GHz band is suitable for scenarios that require large traffic transmission, such as high-definition videos and online games, because it provides faster network speeds and more stable transmission rates.

In satellite communications, different frequency bands have their own advantages and applicable scenarios.

Although the C-band has low frequency and low gain, its rain attenuation is much smaller than that of the Ku-band and even smaller than the Ka-band. It is suitable for businesses that have strict requirements on communication quality, such as television and radio.

The Ku band has high frequency, high gain, small antenna size, and is easy to install. It is especially suitable for mobile emergency communication services such as communication in motion and communication in silence, and satellite news collection SNG and DTH services.

When selecting the wireless communication frequency band bandwidth.

The 20MHz frequency band bandwidth is suitable for small to medium-sized wireless networks due to its stable signal and wide coverage.

Although the data transmission rate of the 40MHz band bandwidth is relatively high, the signal penetration capability is weak and is suitable for dense environments or application scenarios that require higher transmission rates.

What are examples of high frequency equipment?

high frequency PCB communication circuits are widely used in various fields. The following are some of the main application fields:

1. Wireless communication: high frequency PCB communication circuits are the core components of wireless communication systems, such as mobile phones, base stations, satellite communications, etc.

2. Radar system: high frequency PCB communication circuits are also widely used in radar systems, such as radar antennas, signal processing, transmitters and receivers, etc.

3. Satellite communications: Satellite communications require the use of high frequency PCB communication circuits to transmit and receive signals.

4. High-speed data transmission: In the field of high-speed data transmission, high frequency PCB communication circuits can achieve data transmission rates of tens of Gbps per second to meet the needs of large data volume and high bandwidth.

In short, high frequency PCB communication circuits are an important part of modern communication technology and have broad application prospects and development potential. With the continuous advancement of technology.

What is HASL in PCB?

HASL is hot air solder leveling, which is a commonly used surface finish in the printed circuit board (PCB) industry.

HASL forms a coating that resists copper oxidation and provides good solderability by coating molten tin-lead solder on the surface of the PCB and using heated compressed air for leveling. This coating not only helps protect the copper from oxidation, but also ensures good soldering performance.

There are two types of HASL: leaded and lead-free, making it one of the lower-cost PCB surface finishes. The leaded version was more common in the electronics manufacturing industry in the past, but with the improvement of environmental protection requirements, the lead-free version of HASL has also been widely used.

What is the difference between HASL and ENIG finish?

The main differences between HASL and ENIG surface finishes are their process flow, cost, corrosion resistance, applicable scenarios, and environmental protection. ‌

‌Process flow‌:

HASL (hot air leveling) is a traditional surface treatment process that provides good soldering performance by coating a layer of lead-tin alloy on the surface of the PCB.

ENIG (electro-nickel-gold) improves soldering performance and corrosion resistance by electroplating a thin layer of nickel and gold on the copper surface.

‌Cost‌:

HASL has a relatively low cost because it is a mature and widely used process.

In contrast, ENIG has a higher cost because it has stricter control requirements for the manufacturing process and uses higher material costs.

‌Corrosion resistance‌:

ENIG provides better corrosion resistance due to the presence of nickel and gold layers, especially for applications that require long-term reliability and stability.

Although HASL can also provide certain corrosion resistance, it is not as good as ENIG in terms of corrosion resistance.

‌Applicable scenarios‌:

HASL is suitable for most general applications due to its low cost and good soldering performance.

ENIG is more suitable for application scenarios with higher requirements for soldering performance and corrosion resistance.

‌Environmental protection‌:

HASL used to mainly use lead-containing materials, but with the restrictions of environmental regulations, lead-free HASL has gradually become the standard, but there are still potential environmental problems.

ENIG has no obvious environmental problems in this regard because it does not contain any hazardous substances.

In short, choosing HASL or ENIG depends on the specific application requirements, cost budget and environmental impact considerations. Each process has its unique advantages and applicable occasions. The right choice can significantly improve the performance and market competitiveness of multi-layer PCBs.

What is the difference between lead-free HASL and HASL?

The main difference between lead-free HASL and traditional HASL is the different materials used. ‌

Traditional HASL (hot air leveling) uses lead-containing solder, which was once one of the most commonly used surface treatment technologies in electronic assembly.

However, due to restrictions on environmental regulations, lead-containing HASL has been gradually eliminated and replaced by lead-free HASL. Lead-free HASL uses non-lead metals or lead-free solder alloys to replace traditional lead-containing solder to meet environmental protection requirements.

The advantages of lead-free HASL include lower cost and good soldering performance. Compared with traditional HASL, lead-free HASL is more environmentally friendly and can pass environmental assessments such as RoHS certification.

However, the mechanical strength and glossiness of lead-free HASL may not be as good as traditional lead-containing HASL, and there may be some challenges in soldering fine components, especially in the case of poor surface flatness, which is easy to produce tin beads and short circuits for fine-pitch pin components. ‌

In general, lead-free HASL is an improvement on traditional HASL, with the main purpose of improving environmental performance. Although there may be some limitations in some aspects, it is currently a necessary choice to meet environmental regulations.

Is HASL with lead bad?

Lead-containing HASL is not an ideal choice because it has multiple disadvantages and limitations. ‌

First, the main disadvantages of lead-containing HASL include uneven surfaces, which are not suitable for fine-pitch applications.

In addition, it faces problems of thermal shock and solder bridging, which may cause the plated through hole (PTH) to be blocked or reduced, as well as thickness/topography differences between large and small pads.

These problems make leaded HASL unsuitable for SMD and BGA with a pitch less than 20 mil, and unsuitable for HDI products and wire binding. Therefore, leaded HASL is gradually regarded as a suboptimal choice in modern electronic manufacturing.

Secondly, environmental protection is also an important consideration for leaded HASL. Due to environmental regulations, leaded versions of HASL have been gradually phased out in some areas, and lead-free HASL has become an alternative, but its soldering performance is slightly inferior to that of the leaded version.

Does HASL oxidize?

HASL (hot air leveling) does oxidize. ‌HASL protects the connection wires by coating a layer of tin-lead alloy, including anti-sulfurization treatment.

However, the surface flatness of HASL is relatively low, which may not be suitable for high-density, fine-pitch circuit design. In addition, due to the lead issue, the surface oxidation resistance of lead-free HASL is weak, and the long-term reliability is not as good as other advanced processes.

Therefore, although HASL provides some protection, it is not a complete solution to prevent oxidation, especially in long-term use or under certain environmental conditions, its protection effect may be affected.

Is HASL RoHS?

HASL is not RoHS compliant. ‌

HASL (hot air solder leveling) is a traditional PCB surface treatment process that contains lead (SnPb) solder. However, the RoHS (Restriction of Hazardous Substances) directive aims to restrict the use of certain hazardous substances in electrical and electronic equipment, specifically lead (Pb), mercury (Hg), cadmium (Cd), hexavalent chromium (Cr6+), polybrominated biphenyls (PBB) and polybrominated diphenyl ethers (PBDE).

Because the leaded solder used in the HASL process does not meet the RoHS standard for the restriction of hazardous substances, the traditional HASL process is not considered RoHS compliant. ‌

To meet RoHS standards, lead-free HASL (Lead-Free HASL) has become an alternative, which uses lead-free solder alloys such as tin-copper, tin-nickel or tin-copper-nickel alloy to replace traditional lead-containing solder.

Although lead-free HASL meets environmental requirements, it is not suitable for all situations, especially when dealing with fine-pitch components and dense wiring.

For projects that need to comply with RoHS standards, lead-free processing processes such as lead-free tin spraying or other RoHS-compliant surface treatment technologies should be given priority.

What is the best surface finish for PCB?

There are many surface treatment processes for PCBs, each with its specific advantages and applicable scenarios. The following are some common surface treatment processes and their characteristics:

‌Hot Air Leveling (HASL): This is a traditional surface treatment method that is cost-effective and suitable for most general electronic products.

‌Electroless Nickel Gold (ENIG): Especially suitable for PCBs with fine line spacing and high density, a layer of nickel is first deposited on the copper surface, and then a thin layer of gold is plated. The gold layer acts as a protective layer to prevent the nickel layer from oxidizing and provides long-term soldering reliability and good solderability.

‌Organic solderability preservative (OSP)‌: An environmentally friendly and cost-effective surface treatment technology, especially suitable for low to medium complexity PCBs.

‌Electroplating silver (immersion silver)‌: A layer of silver is deposited on the copper surface through a chemical reaction, providing excellent conductivity and solderability, and also has good corrosion resistance.

In summary, choosing the best surface treatment process requires comprehensive consideration of the specific needs, cost, and environmental factors of the product.

HASL, as a traditional PCB surface treatment process, has the advantages of good solderability, low cost, and wide applicability. In practical applications, it is necessary to select a suitable surface treatment process based on factors such as the type of PCB, the use environment, and environmental requirements.

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