Posts Tagged ‘PCBA’

USB interface: From Type-A to Type-C, which interface do you use most?

Monday, September 2nd, 2024

What are USB Ports?

The USB end is a connection for connecting a consumer electronics device such as an accounting machine. USB’s general name is a universal skewer line. USB end support USB support for connection. If you have a USB connection, you can set up a number of numbers. In addition, a USB port is also available, as well as a power supply. This end is fully equipped with the power.

The USB calculation function has additional functions, and one small adjustment can be made alternately. Please contact us if you have any questions about USB. With the advancement of technology, the current functionality of the USB end is greatly enhanced. Because of this, this is a small change to the end of the road. USB is important for three major directions. In this regard, the dimensions are the external size, the number of speeds, the visual power of the power.

USB interface: From Type-A to Type-C, which interface do you use most?

Usb connector types

Types of USB connectors: different types of connectors with different shapes and directions, USB connectors can be separated into different types:

Type-A port: This is the most common type of USB port, the shape is long and rectangular, and the support is heat-resistant. Computer equipment such as printing machine, keypad, mouse button, driving device, etc. Type-A interface has USB 2.0 and USB 3.0 in different editions, among which USB 3.0 has faster speed, color is usually blue, and USB 2.0 has slow speed, color is black.

Type-B contact: Type-B contact shape is round shape, demand-specific connection. For general use, external equipment such as audio equipment, viewing equipment, etc., such as a 3.5 inch movable screen, stamping machine, display device, etc.Type-B verbal usage scene is relatively small, so this is an unusual sight in daily life.

Usb connector types:Type-A port:Type-B contact

Type-C port: Type-C port is a new type of USB port that has emerged in recent years. Built-in USB 3.1, Type-C interface configuration, mainstream interface type, intelligent handheld computer, flat panel battery, notebook battery, etc. The biggest feature of the Type-C interface is its support and double-sided insertion, making it convenient and convenient to use.

Type-C interface support further improves the speed and power of the power, and provides more advanced usage experience. Previously, when I came here, I was confused as to how to get around the main machine.

Mini USB port Micro USB port

Mini USB port Micro USB port: There are many types of ports for transfer equipment, digital reading machine, digital image machine, metering equipment, etc. Mini USB port ratio Micro USB port size is small, also known as a USB port, Micro USB port is smaller, thinner, supports OTG function, and provides a number of additional power functions. The Micro USB port is convenient and easy to use, and has various types of portability.

What functions does USB have?

Power Delivery of USB Ports
Some USB cables can deliver power as well as transfer data, but most USB cables can do both. Power delivery of USB ports is mainly divided into three categories: fast charging, quick charging, and power only.
USB Data Transfer Speed
USBs come in various sizes and shapes. Also, USB types have multiple speed standards. It is important to know that some USB cables are designed for data transfer only, while some can only deliver power. However, some USB cables can serve both purposes at the same time. Therefore, it is necessary to verify the performance of the cable before purchasing it.
USB Video Transfer
The ability of USB ports to power devices and transfer data between devices is already impressive enough. However, you can decide to integrate USB-C to connect a monitor in place of a VGA cable or HDMI. In addition, USB-C also supports 4K video transmission.

What are the advantages of USB interface?

Standard uniformity. The most common ones are hard disks with IDE interfaces, mouse and keyboards with serial ports, and printers and scanners with parallel ports. However, with USB, all these application peripherals can be connected to personal computers using the same standard. At this time, there are USB hard disks, USB mice, USB printers, etc.
Easy to carry. Most USB devices are known for being “small, light, and thin”, which is very convenient for users to carry large amounts of data with them.
Hot-swappable. That is, when users use external devices, they do not need to shut down and restart the computer, but directly plug in the USB when the computer is working.
Multiple devices can be connected. USB often has multiple interfaces on personal computers, and several devices can be connected at the same time. If a USB HUB with four ports is connected, four USB devices can be connected, and so on. You can connect all the devices to a personal computer at the same time without any problems (up to 127 devices can be connected).

How Do USB Ports Work?

USB is an external bus standard used to regulate the connection and communication between computers and external devices. The USB interface has plug-and-play and hot-swap functions. The USB interface can connect 127 peripherals, such as mice and keyboards. USB was jointly launched by Intel and other companies in 1994 and has successfully replaced serial and parallel ports since 1996. It has become a must-have interface for computers and a large number of smart devices today. For most engineers, the main obstacles to developing USB2.0 interface products are: facing the complex USB2.0 protocol, writing USB device drivers by themselves, and being familiar with microcontroller programming.

Why USB Ports Are Replacing Serial Ports

USB has three major advantages. It is superior to serial ports in several aspects.

Speed
USB ports are able to transfer data at a much faster speed. They work ten times faster than regular parallel ports. Also, they are much faster than serial ports. On average, serial ports offer a data transfer rate of 150kbps. On the other hand, USB ports offer about 12 Mbps. The data transfer rate depends on the type of USB port. For example, USB 2.0 has a maximum data transfer rate of 480 Mbps.

Compatibility
USB ports have replaced serial ports in the past few years. Various industrial devices are equipped with serial ports. This replacement has brought problems. USB ports are generally compatible with most USB devices.

Durability
USB ports are more durable than serial ports. The tiny pins on a serial port can break or bend easily. Whereas USB ports are very sturdy.

Frequently Asked Questions

The USB interface cannot be used. It may be due to a problem with the system. You need to check whether the system service is disabled or reinstall the operating system.

‌BIOS setting problem‌. If USB is disabled in BIOS or CMOS, you need to restore it to the factory default settings.

‌USB driver is not installed or the driver is deleted‌. You need to install the USB universal driver.

‌The front USB cable is not connected properly‌. Try to insert the USB flash drive into the USB interface on the back of the chassis.

‌The USB interface voltage is insufficient. When the mobile hard disk is connected to the front USB interface, it may not be recognized due to insufficient voltage. You should use a hard disk box with an external power supply or replace the power supply.

‌Compatibility issues between the motherboard and the system‌. For example, the compatibility issues between the NF2 motherboard and USB require the installation of the latest dedicated USB2.0 driver and patch.

‌System or BIOS problem‌. When USB is disabled in the BIOS or operating system, you need to enable options related to USB devices.

‌Be careful when plugging and unplugging. Do not unplug during reading and writing, otherwise the chip may be burned.

‌If the USB device is frequently disconnected‌, it may be that the USB cable connection is unstable or there is a problem with the USB port. Try changing the cable or connecting to another USB port.

‌If the USB device cannot be recognized or charged‌, make sure the device is compatible and the cable is intact. Try connecting to another computer or updating the driver.

What are the advantages of PCB?

‌Miniaturization and lightweight‌: As consumer electronics products increasingly pursue portability and compact design, thin PCBs have become a key factor in achieving device miniaturization, which can significantly reduce the thickness and weight of the device, making the product more in line with modern aesthetics and use. Habit.

‌Improved heat dissipation performance‌: Thin PCB has a smaller heat capacity, which helps to quickly dissipate the heat generated by electronic components, thus improving the overall heat dissipation efficiency of the device‌.

‌Reduced production costs‌: Thin PCBs require relatively less raw materials during the manufacturing process, and coupled with the possible reduction in the number of assembly layers, the material cost per unit area is reduced.

‌Adapt to high-speed signal transmission‌: Due to its low dielectric loss, thin PCB can effectively reduce signal transmission delay, improve signal integrity, and meet the needs of high-speed data transmission‌.

What are the advantages and disadvantages of PCB board?

‌High-density integration capability‌: PCB multi-layer boards allow for higher-density circuit layouts in a limited space. By arranging conductive paths and components between multiple layers, the size of the circuit board can be greatly reduced and electronic equipment can be improved. overall performance‌.

What are the disadvantages of PCB?

‌Mechanical strength problem‌: The mechanical properties of thin PCB are relatively weak, and it is easy to deform or break due to improper stress during assembly, transportation and even daily use‌.

‌Increased processing difficulty‌: Thin PCBs place higher requirements on the production process. Processes such as drilling, etching, and lamination need to be precisely controlled to prevent problems such as warping and breakage of thin plates‌.

‌Electromagnetic compatibility challenges‌: Thin PCB may increase parasitic capacitance and inductance, affecting the electromagnetic compatibility of the circuit‌.

‌Higher manufacturing costs‌: The manufacturing process of multi-layer boards involves complex processes such as multiple laminations, drilling, and electroplating, resulting in relatively high production costs.

Long production cycle: Due to the complex production process of multi-layer boards, the production cycle is usually longer than that of single-layer or double-layer boards, which may affect the product’s time to market and market competitiveness.

As an indispensable basic material in electronic manufacturing, PCB has the advantages of high reliability, high precision, and small size, but it also has disadvantages such as design and cost restrictions. When choosing to use PCB, you need to comprehensively consider its advantages and disadvantages as well as specific application scenarios.

What are the limitations of PCB?

The limitations of PCB (Printed Circuit Board) mainly include the difficulty of design and manufacturing, complex testing and troubleshooting, and environmental impact. ‌

‌Design and manufacturing are difficult‌: Designing multi-layer PCBs requires highly specialized knowledge and software tools to ensure signal integrity and optimization of power distribution.

‌Complex testing and troubleshooting‌: Due to the complexity of the multi-layer structure, once a failure occurs, it becomes more difficult and time-consuming to locate and repair the problem.

‌Environmental impact‌: Special chemicals and precious metals may be used in the production process of high-end multi-layer PCBs. If not handled properly, they may have a certain impact on the environment.

These limitations have put forward higher requirements for the design, manufacturing, testing and use environment of PCB, which require comprehensive consideration and optimization in terms of technology, cost, environmental protection and other aspects.

Why do PCB boards fail?

1. ‌Improper design‌

Including unreasonable PCB board design, improper part orientation design, automatic plug-in bent legs, etc. These problems may lead to short circuit faults, and the part orientation or design needs to be modified to avoid short circuits.

2. ‌Poor manufacturing‌

Problems during the manufacturing process, such as solder joint problems, damaged pads, improper installation of components, etc. These problems will affect the reliability of the welding and cause the circuit board to deform or crack.

3. Poor usage environment

PCB boards are affected by the environment, such as extreme temperature changes, excessive humidity, high-intensity vibration, etc., which may cause damage to the PCB board and affect its performance and reliability.

4. ‌Other reasons

It also includes circuit board aging, design defects, manufacturing process problems, etc., such as metal components on the circuit board reacting with oxygen, causing oxidation, or assembly deviations during the manufacturing process causing component position deviation, etc.

What can damage a PCB?

Factors that damage PCB (Printed Circuit Board) mainly include physical damage, chemical corrosion, electrochemical corrosion, electrostatic discharge, humidity and moisture, temperature changes, etc. ‌

1. ‌Physical damage‌: including vibration, falling, hitting, and stacking, which may cause PCB deformation and cracks, leading to circuit breakage or short circuit‌.

2. Chemical corrosion: The PCB surface may be exposed to chemicals, such as acids, alkalis or other corrosive solutions, causing corrosion.

3. ‌Electrochemical corrosion‌: When there is a potential difference between different metal components, a battery is formed in a humid environment, which accelerates the corrosion of one of the metals. This is called electrochemical corrosion‌.

4. ‌Electrostatic discharge‌: Electrostatic discharge is the invisible killer of PCB. It can generate thousands of volts in an instant, which is enough to damage the components on the PCB‌.

5. Humidity and moisture: Extreme temperatures or temperature changes, as well as moisture in the air, can cause PCB board damage, such as deformation, short circuit, corrosion and other problems.

6. ‌Temperature changes‌: Temperature changes can also cause solder joints, substrate materials and even casings to crack. If the circuit is going to be exposed to high temperatures, you may need to choose components that can withstand higher temperatures‌.

What is the lifespan of a PCB?

There is no fixed international standard for the service life of PCB, and its specific life span depends on many factors. ‌

‌Materials and manufacturing processes‌: The materials and manufacturing processes of the PCB board have a decisive impact on its service life. PCB boards made of different materials and processes have different service lives.

‌Normal use and maintenance‌: Under normal use and no damage, the life of the circuit board itself is quite long. Manufacturers usually give a lifespan indicator of about 5 years, but this does not mean that the circuit board cannot be used after 5 years. In fact, as long as a circuit board is properly maintained and maintained, it can last for decades‌.

‌Lifetime under specific conditions‌: For PCBs containing OSP parts, the vacuum seal is valid for up to 3 months. For non-OSP PCBs, if the storage period exceeds 6 months but is less than one year, the chip factory will bake them before producing them; if the storage period exceeds one year, they will be scrapped. Boards opened during production should be used within 24 hours.

The service life of PCB is not a fixed value, but depends on the specific situation. With proper design, manufacturing, use and maintenance, the life of a PCB can be significantly extended‌.

What are the dangers of PCB?

The wastewater generated during the PCB manufacturing process contains heavy metals (such as copper, nickel, lead, etc.) and organic matter. If these pollutants are discharged without proper treatment, they will cause serious pollution to the environment.

In electronic products, common defects in PCB boards include open circuits, short circuits, false soldering, solder beads, and substrate warping. These defects can cause electronic products to fail to work properly or even fail completely.

PCB circuit boards play a vital role in the manufacture of modern electronic devices. They are widely adopted for their high reliability, compactness, and high scalability. When choosing to use PCB circuit boards, you need to consider their advantages and disadvantages and make a wise decision based on the needs of the specific project.

BEST Technology has been deeply involved in the circuit board industry for many years and has many solutions for various PCB problems. You can find us for all your PCB problems.

What is the composition of solder paste?

Solder paste is a complex mixture of multiple components, and its main components include metal powder, flux and solvent.

What is solder paste? What is its function?

The metal powder in solder paste is usually composed of metal alloys such as tin, silver and copper. The particle size and distribution of metal powder have a direct impact on the welding effect. The smaller the particle size, the more uniform the distribution, and the better the welding effect.

At the same time, the composition of the metal alloy also determines the mechanical strength and electrical properties of the solder joint.

Flux is another important component in solder paste. Its main function is to remove oxides on the welding surface and improve the wettability and reliability of welding.

The type and formula of flux directly affect the melting state and solder joint quality during the welding process. Common fluxes include rosin-based flux, organic acid flux and halogen-free flux.

Solvents are used to adjust the viscosity and printing performance of solder paste. Appropriate viscosity can ensure that the solder paste is evenly distributed during the printing process without problems such as drawing and collapse. The evaporation rate of the solvent will also affect the drying time and welding performance of the solder paste.

What is the role of solder paste in SMT patches?

In the SMT (surface mount technology) patch processing process, solder paste plays a vital role. It is not only used to bond components, but also the key to ensure the quality of electrical connections and mechanical strength.

1. Bonding components

One of the main functions of solder paste is to bond components. After the solder paste is accurately printed on the pads of the PCB (printed circuit board), the pins or contact points of the electronic components will be placed on the solder paste. The solder paste melts during the reflow soldering process to form a strong bond, ensuring that the components are stably attached to the PCB.

2. Provide electrical connection

Solder paste melts during the reflow soldering process and forms metal solder joints, which not only bond components but also provide electrical connections. Good electrical connections ensure the effective transmission of electrical signals on the PCB, which is the basis for ensuring the normal operation of electronic equipment.

The solder joints formed by the metal components (such as tin, silver, and copper) in the solder paste after melting have excellent conductivity, ensuring the reliability and stability of electrical connections.

3. Ensure mechanical strength

The mechanical strength of the solder joints is the key to ensuring the stable operation of electronic components in various environments. The solder joints formed by the solder paste after reflow soldering have sufficient mechanical strength to resist external stresses such as vibration, impact, and thermal expansion and contraction. This not only protects the components and PCB, but also improves the reliability and service life of the entire electronic equipment.

Is solder paste the same as flux?

Solder paste and flux are not the same. ‌

Although both solder paste and flux are materials used in the welding process, their functions and uses are different.

Solder paste is a paste-like viscous body, the main components of which include metal powder, rosin, organic acid, thixotropic agent, and activator, and is used for welding in SMT automatic mounting process.

Flux is a liquid, a mixture with rosin as the main component, which is used to remove oxides on the surface of solder and the base material to be welded, so that the metal surface reaches the necessary cleanliness, prevents the surface from re-oxidation during welding, reduces the surface tension of the solder, and improves welding performance.

In general, although both solder paste and flux are indispensable materials in the welding process, they have obvious differences in form, function, and usage.‌

What is the storage method of solder paste?

The correct storage method can extend the service life of the solder paste and ensure its stable performance.

1. Temperature control

Solder paste should be stored in a low temperature environment, usually 0-10℃. Excessive temperature will cause the solvent in the solder paste to volatilize, affecting its viscosity and printing performance. Avoid direct sunlight and high temperature environment during storage to prevent the solder paste from deteriorating.

2. Humidity control

Humidity has a great impact on solder paste. Excessive humidity will cause the solder paste to absorb moisture, affecting its printing performance and welding quality. The relative humidity of the storage environment should be controlled below 50% to ensure the stability of the solder paste.

3. Sealed storage

The solder paste should be stored in a sealed container to prevent oxygen and moisture from entering the air. The solder paste after opening should be used up as soon as possible, and the unused solder paste should be resealed and stored in a low temperature environment.

How to use solder paste correctly?

1. Reheating treatment

The solder paste stored in a low temperature environment should be reheated before use. The reheating time is usually 4-8 hours. During the reheating process, it should be avoided to be directly exposed to a high temperature environment to prevent the solvent in the solder paste from volatilizing. The solder paste after reheating should be fully stirred to ensure that the metal powder and flux are evenly distributed.

2. Printing process

Solder paste printing is a key process in SMT patch processing. During the printing process, the scraper pressure, printing speed and template opening size should be controlled to ensure that the solder paste is evenly distributed on the pad. The printed solder paste should have a good shape and should not have problems such as drawing and collapse.

3. Solder paste reflow

The solder paste reflow process is the process of melting the solder paste and forming a firm solder joint with the pad and component pin. The temperature curve should be controlled during the reflow soldering process to ensure that the solder paste melts at an appropriate temperature and fully wets the pad and pin. Too high or too low reflow temperature will affect the welding quality.

4. Solder joint detection

The quality of the solder joint is an important indicator for evaluating the welding effect. After the welding is completed, the solder joint detection should be carried out to check the shape, size and wettability of the solder joint. Qualified solder joints should have a smooth and complete surface without defects such as solder balls and cold solder joints.

Conclusion:

Solder paste plays a vital role in SMT patch processing. Its composition, selection, storage and use methods directly affect the welding quality and the performance of the final product. By understanding and mastering the relevant knowledge of solder paste, the quality of SMT patch processing can be effectively improved, and defects and rework rates can be reduced.

BEST Technology has rich experience and strict control standards in the selection and use of solder paste, and can provide customers with high-quality SMT patch processing services. If you have any questions about our products or services, please feel free to contact us. Choose BEST Technology , choose quality assurance.

What is a resistor?

A resistor is a current-limiting element that is used to limit the magnitude of the current through the branch to which it is connected. ‌

Resistors are a basic electronic component whose function is to hinder the flow of current. The resistance value of a resistor is fixed and generally consists of two pins. It is used to divide voltage, adjust signals, stabilize and adjust current and voltage in circuits.

Depending on whether the resistance value is variable, resistors can be divided into fixed resistors and variable resistors (potentiometers). The resistance value of a fixed resistor cannot be changed, while the resistance value of a variable resistor can be changed by adjusting the contact position. An ideal resistor is linear, that is, the instantaneous current through the resistor is proportional to the applied instantaneous voltage.

Resistors play an important role in circuits, whether as voltage dividers, current limiters, or in regulating the voltage and current in circuits.

How to identify resistor polarity?

Resistors are generally non-polar. Resistors are mainly used in circuits to limit current, divide voltage, shunt, etc. Their physical properties are completely determined by the materials used inside. Their main functions are voltage division, current shunting, current limiting, voltage reduction, impedance matching, etc. They do not care about how they are placed, so any type of basic resistor is non-polar.

Although in electrical analysis, people may assume that resistors have polarity to more intuitively understand the flow of current, this does not mean that resistors themselves have polarity. In fact, resistors can be regarded as a kind of extremely powerful wire with a specific power rating and resistance, and its function is to hinder or reduce current in both directions.

When identifying resistors, it is usually not necessary to consider their polarity because resistors do not have a fixed positive or negative pole. If you need to determine the direction of the current, you can judge it by the circuit symbol or other identification, but this has nothing to do with the polarity of the resistor itself.

Do any resistors have polarity?

Not all resistors have polarity. ‌

A resistor is an electronic component whose main function is to block the flow of electric current. In most cases, resistors themselves have no polarity, which means that both ends of the resistor can be considered as positive or negative potential. There are many types of resistors, including fixed resistors, adjustable resistors, and various sensitive resistors, but they do not have positive and negative polarity.

However, there are some special types of resistors, such as type A in the resistor array, which are polarized. But this does not mean that all resistors have polarity, because most resistors are non-polar. For example, type B in the resistor array has no polarity, and other types of resistors (such as C, D, E, F, etc.) have different internal resistor arrangements, but because they are not often used, the resistors usually referred to are generally non-polarized. ‌

In summary, although there are some special types of resistors that may have polarity, in most cases, resistors are electronic components without polarity. ‌

Do resistors have a positive and negative side?

Resistors have no positive and negative poles. ‌Resistors are passive electronic components whose main function is to block the flow of electric current without caring about the direction of the current. In the circuit, the direction of the current is indicated by an arrow, and the resistor itself does not change its impedance characteristics due to the change of the current direction.

Whether it is a fixed resistor, an adjustable resistor or a sensitive resistor, there is no distinction between positive and negative polarity. In AC circuits, there is no need to distinguish between positive and negative poles. In DC circuits, although the variable resistor is composed of a carbon film and a metal contact, it is necessary to clarify the direction of the current, but this does not mean that the resistor itself has positive and negative poles, but it means that the direction of the current needs to be clarified in DC circuits.

The concept of positive and negative poles is usually used for power supplies, batteries and certain specific components, where the positive pole is usually connected to a high potential and the negative pole is connected to a low potential. Power supplies and batteries have a positive and negative pole because of the potential difference, while resistors, as a passive component, have no potential difference, so there is no distinction between positive and negative poles.

In a circuit, when the power supply is connected, the current flows out from the positive pole, passes through the resistor, and finally returns to the negative pole, forming a current cycle, but this does not change the nature of the resistor itself, but is only part of the current path.

Can a resistor be connected in any direction?

Resistors can be connected in any direction. ‌Resistors are passive devices that do not distinguish polarity, so they can be installed at will without affecting their normal operation.

This characteristic of resistors makes the connection direction of resistors in the circuit very flexible. In addition, the connection direction of resistors is not affected by the direction of current, and even if the current direction changes, the performance and resistance of resistors will not change. Therefore, in practical applications, the connection direction of resistors can be freely selected as needed to meet specific circuit requirements.

Is there a wrong way to install a resistor?

If the welding is not firm or there are problems such as cold welding and short circuit, the resistor will lose connection or become abnormal, which will cause the circuit to work abnormally.

When installing the ground wire, if the grounding resistor is not installed correctly, and the appropriate time and conditions are not selected when measuring the grounding resistance, or the connection wire with the equipment is not disconnected when measuring the protective grounding resistance of the electrical equipment, the measurement results may be inaccurate.

In order to avoid these errors, it is very important to install and test the resistor correctly. When installing the resistor, ensure the welding quality, correctly measure the grounding resistance, and follow the correct installation steps and testing methods to ensure that the resistor can work properly.

How to wire a resistor to an LED?

When connecting a resistor to an LED, the resistor can be connected to the positive or negative terminal of the LED, as long as the polarity of the power supply is connected correctly. ‌

When using a resistor with an LED, the main function of the resistor is to limit the current to protect the LED from excessive current damage. Whether the resistor is connected to the positive or negative terminal of the LED, the key is to ensure that the current limit of the entire circuit is within the range that both the LED and the resistor can safely withstand. Specifically:

‌Connected to the positive terminal of the LED‌: In this configuration, the resistor is connected to the positive terminal of the LED, and the voltage applied to the two terminals of the LED is limited by controlling the current flowing through the resistor, thereby protecting the LED. This configuration is suitable for a variety of power supply voltages and LED types. As long as the polarity of the power supply is connected correctly, the position of the resistor (positive or negative) has little effect on the normal operation of the LED.

‌Connected to the negative terminal of the LED‌: Connecting the resistor to the negative terminal of the LED can also achieve the purpose of current limiting. This configuration also requires that the polarity of the power supply is connected correctly to ensure the safety of the circuit and the normal operation of the LED.

In practical applications, if you encounter the problem of frequent LED damage, it may be due to the quality problem of the LED itself or the circuit design defect.

In short, when connecting a resistor to an LED, the key is to ensure the safety of the entire circuit and the normal operation of the LED. By correctly selecting the position and value of the resistor and ensuring that the polarity of the power supply is correctly connected, the LED can be effectively protected from damage.

Conclusion:

Resistors play a vital role in circuits. They can protect various components of the circuit by controlling the magnitude of the current. With the evolution of products, various types of resistors have been generated, which can change their resistance values according to changes in the environment. Therefore, resistors are still very important until now. Understanding the role and use of resistors will help us understand circuits.

What is a PCB test?

PCB test is a technique that uses electronic testing instruments to detect the performance and quality of PCB (Printed Circuit Board) circuit boards. It is widely used in the electronics manufacturing industry to help manufacturers improve product quality and production efficiency.

The main purpose of PCB test is to ensure that all parts on the circuit board are properly connected and can still work properly under high voltage environments, while verifying whether the function of the circuit board is normal. Test methods include connectivity testing, withstand voltage testing, and functional testing, while inspection standards involve appearance inspection, size inspection, and performance inspection. In addition, PCB test also involves a series of professional techniques and methods, such as flying probe test, ICT test, FCT test, AOI test, etc., to ensure the electrical performance and structural integrity of the circuit board.

How to Test PCB?

PCB contains different components that affect the overall performance of electronic circuits. Tests are performed to check and optimize the status of these components using computerized machine software, simple electronic test equipment and tools, and even basic manual inspections.

1. Electrical test

2. Hole wall quality

3. Mechanical resistance test

4. Soldering quality

5. Cleanliness inspection, considering weather resistance, humidity and corrosion

6. Lamination, testing the ability of laminates to resist or heat peeling

Environmental testing is particularly necessary for PCBs used in humid environments.

What are the benefits of PCB test?

Error identification: The main benefit of PCB test is that it helps identify problems in PCBs. Whether the problem lies in functionality, manufacturability or other aspects, PCB test can identify problems in PCB design and layout.

Save time: Performing PCB test early helps save time in the long run by allowing designers to identify major issues during the prototyping phase. Comprehensive testing allows designers to quickly and easily identify the root cause of each issue and make adjustments so that they can move to production at a faster pace and reduce product lead times.

Reduce costs: PCB test avoids the waste of producing defective products by testing products using prototypes and small-scale components. By completing comprehensive testing early in the design process, designers can avoid the waste of producing defective PCBs, ensuring that the design is as perfect as possible before going into production.

Reduced returns: When PCB test is performed, the likelihood of selling defective products or products that do not meet performance standards is reduced, reducing the costs associated with refunding customers and handling defective goods.

Improved safety: Defective PCBs can cause fires, which can endanger people nearby. Pre-manufacturing testing also ensures that machines and workers are not damaged or injured due to poor design during the production process.

What are the types of PCB test?

1. In-circuit testing

In-circuit testing (ICT) is the most reliable type of PCB test available today. The high price reflects this – tens of thousands of dollars, although the cost depends on factors such as board and fixture size.

Also known as bed of nails testing, ICT fires and activates individual circuits on a board. In most cases, the test is designed to achieve 100% coverage, but actual coverage will be closer to 85-90%.

The test involves the use of fixed probes, whose layout matches the PCB design. The probes check the integrity of the soldered connections. A bed of nails tester simply pushes the board onto the probe bed to begin testing. Access points are pre-designed on the board to allow the ICT test probes to establish a connection with the circuit.

2. Flying probe testing

Flying probe testing is a tried and tested method that is cheaper than in-circuit testing. It is a non-powered test that checks for shorts, capacitance, inductance, diodes, and other problems.

The flying probe tester works by using needles connected to probes on an xy grid obtained from basic CAD. The ECM program coordinates to match the board and then runs the program connected to these test points.

In some cases, ICT makes flying probe testing unnecessary, but the PCB must be designed to fit the test fixture – which means a higher initial cost. ICT is faster and less error-prone than flying probe testing, and while flying probe testing may be cheaper initially, it may not actually be cost-effective for large orders. Finally, it is important to note that PCB flying probe testing does not power the board.

3. Automated Optical Inspection (AOl)

AOI is a contact-free visual inspection of printed circuit boards. AOI uses a camera and microscope to take photos of the PCB. The software then looks for inconsistencies between these photos and the board schematic. Technicians can thoroughly check each board and find any problems through this procedure.

The board is not powered during AOI, and it may not cover all part types. Due to these deficiencies, it should be used in conjunction with another test technology such as functional testing, flying probe testing, or ICT.

4. X-ray Inspection

As the name suggests, this type of test is essentially an inspection tool. It is also known as AXI. During this testing, X-ray technicians can detect defects early in the production process by carefully inspecting solder connections, internal traces, and barrels. Using X-ray inspection, invisible components can be inspected.

Due to the high density of SMT technology and the difficulty in locating connections in BGA and CSP (chip scale packages), more precise inspection techniques, such as those based on X-ray technology, are needed. Solder joints can be clearly seen in radiographs because they are made of materials with a higher atomic weight than other components on the board.

The main benefit of AXI technology is that it can identify every connection and solder joint, including those hidden by the package. In addition, solder joints can be inspected, highlighting any potential bubbles.

What are the difficulties in PCB test?

Increasing complexity: PCB designs are becoming more complex, with higher component density and smaller size, which makes it more difficult to access test points and increases the risk of undetected defects.

Cost: High-end test equipment such as X-ray inspection systems can be expensive to purchase and maintain. Testing also increases production costs, especially when test failures require rework.

Accuracy: Although the test equipment is designed precisely, errors may still occur due to calibration problems, software errors or human errors.

Conclusion:

PCB test is very important to the quality of the product. It ensures that the PCB, which forms the backbone of all electronic devices, operates normally and meets the required quality standards, effectively avoiding the impact of poor products, improving the quality of the finished product, and preventing problems when the product is used.

BEST Technology has a complete set of PCB test equipment and has very complete testing standards to ensure that each PCB finished product has extremely high quality. Choosing us, you will not need to worry about any PCB quality issues.

What is flux?

Flux: A chemical substance that can help and promote the soldering process in the soldering process, and at the same time has a protective effect and prevents oxidation reactions. Flux can be divided into solid, liquid and gas.

There are mainly several aspects such as “assisting heat conduction”, “removing oxides”, “reducing the surface tension of the material to be soldered”, “removing oil stains on the surface of the material to be soldered, increasing the soldering area”, and “preventing re-oxidation”. Among these aspects, the two most critical functions are: “removing oxides” and “reducing the surface tension of the material to be soldered”.

Do you apply flux before or after soldering?

Use flux before soldering printed circuit boards. ‌

During the soldering process of printed circuit boards, the main purpose of using flux is to improve soldering performance and help the metal avoid the formation of an oxide film that hinders solder wetting when heated, thereby promoting the formation of solder-metal alloys and avoiding the occurrence of cold soldering and false soldering.

Flux can be applied to the printed circuit board before soldering, or it can be used as part of the solder during the soldering process, such as solder paste or solder oil. When tinning the pins of components, rosin should be used as the flux, and if the printed circuit board is already coated with rosin solution, then no additional flux is required during soldering.

After using flux, make sure to wipe off the residual flux at the soldering site after soldering to avoid potential damage to electronic components and circuit boards.

In addition, the preparation work before soldering includes thoroughly cleaning the copper foil surface and then applying rosin water to protect the copper foil and help soldering. This step is performed before soldering to ensure the smooth progress of the soldering process. Therefore, the correct approach is to use flux before soldering printed circuit boards to ensure the quality and reliability of soldering.

How much flux to use when soldering?

When soldering printed circuit boards, the amount of flux used needs to be determined according to the specific soldering method and the type of flux. For wave soldering flux, when using brushing and foaming methods, the specific gravity of the flux should be controlled between 0.82-0.84 (specific gravity of liquid rosin flux stock solution).

During the soldering process, the specific gravity of the flux needs to be measured regularly. If the specific gravity is found to increase, it should be adjusted to the normal range with diluent in time, but the diluent should not be added too much to avoid affecting the soldering quality.

For the quantitative spraying method, the key is that the nozzle can control the spray volume. The nozzle should be cleaned frequently to ensure that the spray hole is not blocked. The spray pressure should be controlled at 0.2-0.3Mpa, the flux pressure should be controlled at 0.4±0.05Mpa, and the spray flow rate should be controlled at 20-35ml/min.

In addition, different types of flux formulas are also different. For example, rosin liquid can be made by mixing rosin blocks and alcohol in a ratio of 1:3. For the flux of printed circuit boards, you can directly use rosin water, and apply the prepared rosin water directly on the surface of the printed circuit board or the solder joints.

When using flux, you should also pay attention to the following points:

Put the bottle cap on immediately after use to prevent the flux from being in contact with air for a long time and causing oxidation reaction or absorbing water vapor in the air to cause the concentration to decrease.

Regularly replace the flux that has been stored for too long, because long-term storage will cause the flux composition to change and the activation performance to deteriorate, affecting the welding quality.

Clean it after welding, because the insulation performance of the flux will drop sharply at high temperature, and the residue may affect the heating components, and in severe cases may cause short circuits.

In summary, the amount of flux used in printed circuit board welding needs to be determined according to the specific welding method and flux type, and pay attention to the use and storage conditions of the flux to ensure welding quality and safety.

What happens if you use too much flux when soldering?

First, the main functions of flux include assisting heat conduction, removing oxides, reducing the surface tension of the material being soldered, removing oil stains on the surface of the material being soldered, increasing the soldering area, and preventing reoxidation.

However, excessive use of flux can lead to corrosion and electromigration. This is because improper use of flux, such as excessive use, can create more favorable conditions for potential chemical corrosion reactions.

In addition, if the flux used is not well controlled, resulting in excessive use of flux, more flux residue will be left, which creates more favorable conditions for potential chemical corrosion reactions.

Therefore, it is very important to control the amount of flux used to avoid negative effects on soldering quality and reliability.

What happens if I don’t use flux?

If flux is not used on printed circuit boards, it may lead to reduced soldering quality, increased soldering difficulty, and affect the performance and reliability of the circuit.

1. Increased soldering difficulty: Without flux, the solder may be difficult to flow to the soldering point, resulting in loose soldering, prone to cold soldering or poor soldering.

2. Reduce welding quality: Without the help of flux, the soldering point may not be smooth enough, with burrs or unevenness, which may affect the normal operation of the circuit.

3. Affect circuit performance and reliability: Flux can reduce the resistance of the soldering point and improve the conductivity of the circuit. Without flux, the resistance of the soldering point may increase, affecting the performance and stability of the circuit.

In addition, the flux can also prevent oxidation to a certain extent, protect the soldering point from the influence of the external environment, thereby improving the life of the circuit. Therefore, in the soldering process of printed circuit boards, it is very important to use the soldering flux correctly.

What is an alternative to soldering flux?

Alternatives to printed circuit board soldering flux include no-clean soldering flux, special solder resist for printed circuit boards, water-based cleaning agents and dry ice cleaning technology. ‌

1. No-clean soldering flux is a new type of soldering flux that does not contain halide activators. It does not need to be cleaned after use, which can save investment in cleaning equipment and cleaning solvents, while reducing the emission of waste gas and wastewater, and the pollution to the environment is also reduced accordingly.

2. The main function of the ‌PCB solder mask‌ is to prevent “wiring” and short circuits during wave soldering and protect the PCB permanently. In addition, it can save solder, reduce the weight of the PCB, and reduce costs.

3. As a new type of cleaning medium, the ‌water-based cleaning agent‌ achieves cleaning through the wetting, dissolution, emulsification, saponification, chelation and other effects of the surfactants, emulsifiers, penetrants, etc.

4. The ‌dry ice cleaning technology‌ uses extremely low-temperature dry ice particles to spray onto the treated object under the action of compressed air, so that the dirt is rapidly frozen to brittleness and burst, and then vaporized to take away the dirt.

These substitutes have their own characteristics and are suitable for different application scenarios and technical requirements. When choosing, specific process requirements and cost-effectiveness must be considered.

What does rosin do when soldering?

In the process of printed circuit board soldering, rosin plays a vital role. It is mainly used as a flux to help the soldering process be smoother and more efficient. The role of rosin is reflected in the following aspects:

‌Removing oxide film‌: Rosin can remove the oxide film formed on the copper surface due to contact with air. These oxide films will prevent the tin from wetting the copper wire, thus affecting the quality of welding.

‌Preventing re-oxidation‌: Rosin can not only remove the oxide film, but also prevent the soldering surface from re-oxidizing during the welding process, which helps to maintain the stability and reliability of the welding point.

‌Isolating air‌: Under high temperature conditions of welding, rosin can isolate the air and prevent oxidation of the metal surface.

In summary, rosin plays an important role in the soldering process of printed circuit boards. Through its fluxing effect, it improves the quality and reliability of soldering and is one of the indispensable materials in electronic manufacturing‌.

Conclusion:

Flux is a key part of the soldering process. Without it, your solder will not flow smoothly through the joint and the solder will not adhere properly to the various components on the circuit board. High-quality flux is necessary to produce good solder joints.

BEST Technology is a professional PCB circuit board manufacturer with many years of experience in PCB circuit board welding. The circuit boards it produces are of extremely high quality. We have the most extensive experience to deal with all aspects of PCB welding issues.

What is the surface mount technology process?

The process of surface mount technology (SMT) mainly includes the following steps:

1. Printed circuit board preparation: Before surface mounting, the printed circuit board needs to be prepared first, including cleaning the circuit board, removing the surface oxide layer, and applying solder paste.

2. Component mounting: Use appropriate equipment to accurately mount various electronic components on the printed circuit board.

3. Soldering: After the components are mounted, the solder paste is heated to melt it to form a reliable welding connection.

4. Inspection: After welding, use AOI for automatic inspection to ensure the correct mounting and welding quality of components.

5. Testing and debugging: Test and debug the mounted circuit board, and verify whether the function and performance of the circuit board meet the requirements through specific test equipment and procedures.

Each step needs to be carried out carefully to ensure that the mounted circuit board has good quality and reliability. In addition, surface mount technology is suitable for circuit board assembly, with the characteristics of compact structure and small size, and is widely used in the manufacture of electronic products.

What are the roles of surface mount?

The role of surface mount technology (SMT) is mainly reflected in improving the performance, reliability and production efficiency of electronic products, while reducing the volume and weight of products.

Surface mount technology (SMT) has the following significant effects:

Increase assembly density and reduce product volume: By using surface mount technology, the volume of electronic products can be reduced by 40%~60% and the weight can be reduced by 60%~80%.

‌Improve reliability: SMT has high reliability, low solder joint defect rate and strong vibration resistance.

Optimize high-frequency characteristics: SMT reduces electromagnetic and radio frequency interference and optimizes the high-frequency characteristics of the circuit.

Automated production: SMT is easy to automate, thereby improving production efficiency.

Enhanced compactness: Using small surface-mounted components can save a lot of space on the printed circuit board, and circuit assembly is easier to automate.

Adapt to a wide range of fields: As a new generation of electronic assembly technology, SMT has penetrated into various fields, including but not limited to computers, communication equipment, consumer electronics, etc.

In summary, surface mounting technology has significantly improved the comprehensive performance and production efficiency of modern electronic products by increasing assembly density, optimizing circuit performance, enhancing product reliability, and realizing automated production.

What is the advantage of surface mount?

The advantages of surface mounting mainly include:

High assembly density: Surface mounting technology (SMT) allows more electronic components to be installed in a limited space.

Small size and light weight of electronic products: By using SMT, smaller and lighter electronic products can be manufactured.

‌High reliability‌: SMT has a low solder joint defect rate, which improves the reliability of the product‌.

‌Easy to automate‌: SMT technology is very suitable for automated production and can greatly improve production efficiency‌.

‌Design flexibility‌: SMT allows different components to be used on the same circuit board, providing design flexibility‌.

‌EMC compliance‌: SMT technology helps meet electromagnetic compatibility (EMC) requirements and ensure the safety and performance of the equipment‌.

‌Selective soldering‌: SMT supports selective soldering, which increases the customizability of the product‌.

In addition, SMT technology is cost-effective because the packaging size of components is generally standardized and can be quickly and accurately installed using automated equipment, thereby reducing production costs‌. At the same time, SMT reduces human errors and improves product quality because the placement of components is very consistent, reducing errors or the need for rework.

What are the disadvantages of surface mount?

‌The disadvantages of surface mount technology (SMT) mainly include incompatibility with certain components, the possibility of soldering defects, and high equipment costs. ‌

‌Incompatibility with certain components‌: SMT technology is not suitable for all types of components.

‌Possibility of soldering defects‌: Although SMT technology reduces the need for drilling and shortens setup time, it is not a zero-defect soldering process. In actual applications, SMT may encounter various soldering defects.

‌Higher equipment cost‌: Although SMT technology can improve production efficiency and circuit density, it requires expensive special equipment and professional technicians.

In summary, although SMT technology has many advantages, such as reducing drilling, shortening setup time, and improving production efficiency, it also has some disadvantages, especially in terms of incompatibility with certain components, possible soldering defects, and high equipment costs.

What does SMD stand for in surface mount?

SMD stands for Surface Mounted Devices. ‌

SMD is a type of component in surface mount technology (SMT), which is characterized by small size, high power, stable performance, and easy automated assembly.

SMD packaging technology can maximize the space utilization on the circuit board, especially for the design of dense circuit boards. SMD packaging usually adopts metal oxide semiconductor (MOS) technology, and its packaging methods are diverse, including COB, QFN, LCC, BGA, etc.

In practical applications, the appearance inspection of SMD devices includes visual inspection or use of a magnifying glass to check whether the solder end or pin surface is oxidized or has contaminants, and to ensure that the nominal value, specification, model, accuracy, and external dimensions of the components are consistent with the product process requirements. To ensure the performance and reliability of the device.

The wide application of SMD technology not only improves the performance of electronic products, but also promotes the automation and efficiency improvement of the electronics manufacturing industry. It is an indispensable part of the modern electronics manufacturing industry, especially in applications that require high integration and high reliability.

What is the application of surface mount?

The application of surface mount technology is mainly reflected in improving production efficiency, reducing product volume and weight, and meeting the market demand for miniaturized, lightweight, and high-performance electronic products. This technology is mainly used to mount electronic components on printed circuit boards (PCBs) to achieve circuit connection and system integration.

Surface mount technology can replace traditional through-hole insertion technology, thereby improving product reliability and performance and reducing costs. The technology has a wide range of applications, including but not limited to consumer electronics, military cutting-edge electronics, and fire detectors, manual alarms, and various electronic modules.

In the manufacture of electronic products, surface mount technology has become a revolutionary change, dominating the development of electronic equipment and bringing about major changes in electronic products.

Conclusion:

Usually, the electronic products we use are designed by PCB plus various capacitors, resistors and other electronic components according to the designed circuit diagram, so most electrical appliances require various SMT (patch) processing technologies to process.

BEST Technology focuses on the procurement and processing of various electronic products and processing services for incoming materials, including but not limited to SMT patches, DIP plug-ins, welding, functional testing and maintenance, and assembly proofing and batch production. We can provide proofing, small batch and batch SMT mounting, and can also purchase electronic components and make PCBs.

What is the standard for PCB assembly?

The standards for PCB assembly mainly include PCB panel specifications, ISO standards, IPC standards, JEDEC standards, and ROHS standards. ‌

‌PCB panel specifications‌ involve the width, shape, frame design, center distance between small boards, setting of positioning holes, arrangement of reference symbols, and positioning of large components of the panel. The panel frame should adopt a closed-loop design to ensure that the panel is fixed on the fixture without deformation.

‌ISO standards‌ emphasize key factors such as fit tolerance, surface roughness, contact area, and tightening force in PCB tight-fit installation to ensure the accuracy and stability of installation‌.

‌IPC standards‌ include IPC-7711 and IPC-A-600E, the former provides basic recommendations and guidelines for the design and manufacture of printed boards, and the latter provides acceptable conditions and practice guidelines for printed boards.

‌JEDEC standards‌ provide specifications for circuit board materials, dimensions, interfaces, etc., including material selection, dimension design, interface specifications, test methods and quality assurance.

‌ROHS standard‌ is a directive on the restriction of the use of hazardous substances, aimed at reducing the impact on the environment and human health. It stipulates the use restrictions of hazardous substances such as lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls and polybrominated diphenyl ethers.

Compliance with these standards ensures the quality, safety and environmental friendliness of PCB products, and also provides clear guidance and specifications for the design, manufacture and assembly of PCBs.

Why is PCB assembly so expensive?

The high cost of PCB assembly is mainly due to the combined influence of multiple factors. ‌

First, the production cost of PCB boards is affected by materials, design and manufacturing complexity, precision and quality, and supply chain and regional differences. PCB boards are mainly made of materials such as copper, fiberglass and epoxy resin, and the cost of these materials directly affects the price of PCB boards.

The complexity of the design and manufacturing process, including pre-processing, image transfer, electroplating, etching, inspection and trimming, and post-processing, requires precise tools and professional skills, which will also be reflected in the cost. High-precision PCB boards require higher manufacturing costs because they require more precise tools and more stringent manufacturing processes.

Details in the PCB assembly process, layer selection, and the application of HDI technology will all have an impact on the cost. Every small change may cause the cost to plummet, so if you want to save money without losing performance, you need to consider these factors comprehensively.

In addition, the welding process is also a costly link. Soldering is a key step in fixing electronic components to PCBs. This process requires heating each joint separately for welding, which is a slow and laborious process.

Finally, the price of PCBs is also affected by factors such as materials, surface processing, design standards, copper foil thickness, quality acceptance standards, and mold fees and test frames. For example, different materials, surface processing, and copper foil thickness will lead to price differences.

In summary, the high cost of PCB assembly is mainly due to the combined effect of multiple factors such as material cost, manufacturing complexity, precision and quality requirements, production needs, and specific design and quality requirements.

What does PCB stand for?

PCB stands for Printed Circuit Board. ‌

Printed circuit board (PCB), also known as printed circuit board, is an indispensable component in electronic engineering. It is the support of electronic components and also the carrier of electrical connection of electronic components.

Printed circuit boards are widely used in various electronic devices. Printed circuit boards can be divided into single-sided boards, double-sided boards, multi-layer boards, etc. according to the number of layers of circuit boards. Among them, multi-layer boards refer to printed boards with more than two layers. It consists of connecting wires on several layers of insulating substrates and pads for assembling and welding electronic components. It has the function of conducting each layer of circuits and insulating each other.

The wide application of printed circuit boards makes it possible to miniaturize and visualize the circuits of electronic devices, which plays an important role in the mass production of fixed circuits and optimizing the layout of electrical appliances. This type of circuit board uses polyimide or polyester film as the substrate, and has the characteristics of high wiring density, light weight, thin thickness and good bendability.

What is the difference between PCB and PCBA?

The main difference between PCB and PCBA lies in their definition, function, application and manufacturing process. ‌

Definition:

PCB (printed circuit board) is a basic electronic component made by electronic printing, mainly used as a support for electronic components, and does not contain any active or passive components.

PCBA (printed circuit board assembly) is a circuit board assembly with specific functions formed by soldering electronic components to PCB through processes such as SMT (surface mount technology) or THT (through-hole mounting technology). PCBA contains PCB and all necessary electronic components, which work together to realize the preset functions of the circuit board.

‌Function and application‌:

The main function of PCB is to support and connect electronic components, while PCBA integrates electronic components into a complete circuit system, which can be used in the manufacture of various electronic products.

PCBA is the core part of electronic products and directly determines the performance and function of the product.

‌Manufacturing process‌:

The manufacturing process of PCB includes circuit design, PCB board design, PCB template production, copper foil etching, drilling, tin spraying and board making.

The production of PCBA requires component mounting, welding, testing and other processes.

In summary, the main difference between PCB and PCBA lies in their definition, function, application and manufacturing process. PCB is a basic electronic component, mainly used to support and connect electronic components, while PCBA is a finished product formed by welding electronic components to PCB. It has specific circuit functions and is an indispensable part of electronic products.

What is the difference between PCB manufacturing and assembly?

The main difference between PCB manufacturing and assembly is that they involve different processes and focuses. ‌

‌PCB manufacturing‌ mainly involves the process of converting raw materials into printed circuit boards through a series of process flows, including design, layout, etching, lamination, drilling, welding and other steps, and finally forming a complete and usable printed circuit board.

‌PCB assembly‌ is the process of soldering electronic components to the printed circuit board according to the design requirements after the PCB is manufactured. The focus of assembly is to ensure that all components are in the correct position and direction, the pins of each component are fully soldered to the designated pads, and there is no excess solder or other excess materials to ensure the normal operation and reliability of the circuit board.

In short, ‌manufacturing‌ covers the entire production process from raw materials to finished products, including design, production and testing, while ‌assembly‌ is a link in the manufacturing process that focuses on accurately mounting electronic components on printed circuit boards to ensure the final function and performance of the product.

Conclusion:

PCB assembly is an important part of manufacturing and affects the quality of the final product. Therefore, choosing the right manufacturer becomes particularly important. BEST Technology is committed to becoming the world’s most trusted one-stop electronic circuit solution provider, while focusing on PCBA prototyping and small batch production. Choosing us will get the best quality products.

What is a heavy copper PCB?

Heavy copper PCB is a special printed circuit board (PCB) characterized by a very high concentration of copper, usually up to 200 ounces per square foot, and the copper content of the inner and outer layers of the circuit board is above 3 ounces (oz), which enables heavy copper PCBs to conduct extremely high currents, achieve good heat distribution, and realize complex circuit layouts in a limited space.

In the design and manufacturing process of heavy copper PCBs, thermal stress handling is an important consideration. Engineers need to eliminate thermal stress as much as possible to maintain the circuit while minimizing the power budget, while taking into account environmentally friendly design.

With the development of PCB manufacturing process, modern manufacturing technology such as the use of aluminum PCB can better handle thermal stress problems.

The heat dissipation capacity of Heavy copper PCB is better than the traditional solution of using external heat sink, because it prints the heat sink directly on the circuit board during the manufacturing process, and achieves rapid heat transfer through conductive through-holes, thereby improving heat dissipation performance.

In general, Heavy copper PCB is a high-performance electronic component carrier, which provides an ideal solution for applications requiring high power and high reliability through its high copper content and optimized thermal management characteristics.

What is the difference between PCB and Heavy copper PCB?

Copper board and Heavy copper board look similar in name, and people tend to think that they are the same PCB, but in fact they refer to different things.

1. PCB:

PCB refers to a copper-based PCB. The use of copper as a substrate is to better dissipate heat and extend the life of components on the PCB. The copper substrate is to allow heat to be quickly transferred from the PCB to the outside, such as a heat sink or a metal casing. Because the thermal conductivity of copper is several times that of aluminum or other metals, up to 401W/MK.

2. Heavy copper PCB:

Heavy copper PCB refers to PCB with copper thickness exceeding 3OZ. The substrate can be aluminum or FR4. Heavy copper is to enable PCB to carry large current. Please note that Heavy copper here does not refer to the thickness of PCB, but the thickness of copper foil on PCB. Both aluminum PCB and FR4 PCB can thicken the copper foil.

What is the maximum copper thickness on Heavy copper PCB?

‌The maximum thickness of copper on Heavy copper PCB can reach 20oz. ‌

In circuit board design and manufacturing, copper thickness is an important parameter, which directly affects the electrical performance, heat dissipation capacity and mechanical strength of the circuit board. For applications that need to carry large currents, it is necessary to choose a thicker copper layer.

The copper layer thickness of Heavy copper ultra-thick PCB is generally between 2oz and 20oz. This range of copper layer thickness can ensure the stability and reliability of the circuit board while providing good heat dissipation performance.

In practical applications, according to international standards, the copper thickness of PCB boards can be divided into standard copper thickness and non-standard copper thickness. Standard copper thickness includes 1oz (35um) and 2oz (70um), while non-standard copper thickness covers 0.5oz (17um), 3oz (105um) and 4oz (140um). For some special applications, such as high-power LED lights, electronic high-frequency circuits, etc., a higher copper thickness may be required. At this time, non-standard copper thickness will be selected, up to 20oz.

During the manufacturing process, a Heavy copper foil is first adhered to the substrate, and then the circuit pattern is transferred to the copper foil through a photolithography process. Then chemical etching is performed to remove excess copper, and finally the thickness of the copper layer is further increased through an electroplating process to ensure that the Heavy copper PCB can meet the requirements of high current and high power applications.

Finally, surface treatment is performed to protect the copper circuit from oxidation and corrosion. Common surface treatment methods include hot air leveling (HASL), lead-free tin spraying, nickel gold (ENIG), etc. During the entire manufacturing process, process parameters must also be strictly monitored to ensure the uniformity and thickness consistency of the copper layer.

What are the advantages of Heavy copper PCBs?

1. Heavy copper PCBs have better current conductivity and can withstand excessive current loads. Because thicker copper wires have higher current carrying capacity, their current carrying capacity can be increased by increasing the copper wire width.

2. Heavy copper inner layers are ideal power distribution layers in multi-layer PCBs, which minimize ground bounce and power supply noise

3. Improve thermal performance and increase heat dissipation. Can withstand repeated thermal cycles during manufacturing and assembly.

4. Provide high mechanical strength in connector locations and plated through holes.

5. Due to the presence of copper layers, the size of the circuit board is reduced.

What are the disadvantages of Heavy copper PCBs?

1. Heavy copper PCBs are more expensive to manufacture than standard PCBs because more specialized equipment and richer expertise are required.

2. Heavy copper PCBs are more difficult to process because the PCBs may be heavier and bulkier than other PCBs.

What are the properties of Heavy copper PCBs?

High mechanical strength: After Heavy copper is applied to the circuits and vias of the board, the printed circuit board has super high mechanical strength, and the weather resistance of the circuit board and electrical system is more stable and has a high melting point. Hot melt welding methods such as oxygen blowing can be used, and it is not easy to become brittle at low temperatures. Even in an extremely corrosive atmospheric environment, Heavy copper PCBs can form a strong, non-toxic passivation protective layer.

Excellent weather resistance: Because Heavy copper PCB boards support the selection of a variety of dielectric materials. It improves the overall weather resistance of the board and can ensure the stability of circuit transmission signals under certain high temperature or extreme special environments.

Thermal management: With the advancement of modern technology, PCBs are becoming more and more complex, and high-density currents increase the difficulty of thermal management. Excessive temperature will affect the normal operation of electronic equipment and even cause damage. Heavy copper PCB boards can provide stronger heat dissipation capabilities. With heat sinks and copper plating on through holes, the heat generation of the board can be greatly reduced.

Excellent current conductivity: In the operation of electronic equipment, Heavy copper printed circuit boards are excellent current conductors that can connect and transmit power between various boards.

Diversity: Plating of Heavy copper circuits allows Heavy copper PCB manufacturers to increase the copper weight of via sidewalls and plated holes, thereby reducing the number of layers and occupied space.

Ductility: Heavy copper PCBs have the best ductility and are not limited by processing temperature.

High performance: Heavy copper plating integrates high current and control circuits, allowing high density with a simple board structure.

Where are Heavy copper PCBs used?

1. Automotive electronics

2. Grid switching systems

3. Power line monitors

4. Security and signal systems

5. Radar monitoring systems

6. Industrial control

7. Aerospace

8. Telecommunications

9. Medical devices

Conclusion:

In PCB production, Heavy copper PCBs require special processes, are difficult to operate, and have certain technical barriers, so the production cost of Heavy copper PCBs is higher than other ordinary circuit boards. Although the price is not cheap, the quality and service are the best.

BEST Technology has more than 18 years of PCB manufacturing experience. Focusing not only on fast PCB prototyping and PCB assembly, but also on small and medium batch PCB manufacturing, customer satisfaction is our goal, we will do our best to manufacture your circuit boards in the highest quality to meet your needs, and are committed to complying with the most stringent standards in PCB manufacturing and assembly. ‌

Why fill PCB with copper?

The main purpose of using copper to fill PCB (Printed Circuit Board) is to improve the electrical conductivity of the circuit board, enhance mechanical strength and stability, protect the circuit board from oxidation or corrosion, and improve heat dissipation capabilities. ‌

The influence of copper thickness on PCB

As an excellent conductive material, copper plays a vital role in PCB design. By covering the surface of the PCB with copper foil, the conductive performance of the circuit board can be significantly improved and the connection between various components can be ensured to be more stable and reliable.

Copper foil itself has high mechanical strength and stability, which can effectively prevent PCB from being damaged or deformed due to the influence of the external environment. The corrosion resistance of copper foil can also protect the circuit board from oxidation or corrosion, thereby extending the service life of the circuit board and ensuring its stability and reliability during work.

Since metal has good electrical and thermal conductivity, copper coating can increase the heat dissipation surface area of the PCB, help distribute heat evenly, and prevent the generation of local high-temperature areas. This can not only reduce local heat concentration, but also reduce the temperature gradient of the heat source and improve heat dissipation efficiency.

To sum up, the role of copper-filled PCB is multi-faceted. It can not only improve the conductivity and mechanical stability of the circuit board, but also protect the circuit board from environmental influences, while enhancing the heat dissipation capacity and ensuring the stable operation of electronic equipment. and long-term use‌.

Is a thicker PCB copper better?

The copper thickness of PCB is not as thick as possible, but the appropriate copper thickness needs to be selected according to the design requirements and actual application of the circuit board. ‌

The importance of copper thickness in PCB manufacturing cannot be ignored because it directly affects the conductive performance, heat dissipation performance, mechanical strength and signal integrity of the circuit board. Proper copper thickness can provide good electrical and thermal conductivity while ensuring the reliability and stability of the circuit board.

Although an excessively thick copper layer can improve current carrying capacity and heat dissipation performance, it will also increase cost and weight, which may lead to serious glue flow and increased processing difficulty. Therefore, when selecting copper thickness, factors such as circuit board design requirements, application environment, and cost need to be comprehensively considered.

During the PCB design and manufacturing process, the optimal copper thickness should be selected based on specific application requirements and cost considerations to achieve optimal circuit performance, heat dissipation, and mechanical strength‌.

How thick is the copper on a 1 ounce copper PCB?

The thickness of 1 ounce of copper on a PCB is 35 microns. ‌

In the PCB industry, ounces (oz) are the unit used to express copper foil thickness, not weight. Specifically, the thickness of 1oz of copper refers to the thickness achieved by spreading 1oz of copper evenly over an area of 1 square foot.

According to different information, the thickness of 1oz copper can be obtained by different calculation methods, but the generally accepted value is that 1oz copper is equal to 1.4mil (milliinch), which is equivalent to 35 microns. Therefore, whether in international standards or practical applications, the thickness of 1oz copper on PCB is usually considered to be 35 microns.

In addition, the copper thickness of the PCB has a direct impact on the circuit board’s current carrying capacity, heat dissipation, reliability and other performance indicators. Commonly used PCB copper thickness specifications include 1oz, 2oz, 3oz, 4oz, 5oz, 6oz, etc., which correspond to different copper layer thicknesses. The copper layer thickness of 1oz is 35 microns, 2oz is 70 microns, and so on, 6oz is 210 microns. . These specifications provide the basis for selecting different copper thicknesses based on specific application needs to meet different electrical performance and physical requirements.

What is the conventional PCB copper thickness?Thick copper plate, FPC

‌Regular PCB copper thickness is 1oz (35μm). When the thickness of the copper foil reaches or exceeds 2oz, such a PCB board is defined as a thick copper board; for flexible circuit boards (FPC), the copper thickness also has different specifications, for example, 0.5oz copper thickness is used for flexible circuit boards is being manufactured. ‌

In PCB manufacturing, the choice of copper thickness is determined based on specific application requirements. Common copper thickness classifications include:

1. ‌1oz copper thickness: ‌

This is the most common and standard copper foil thickness and is widely used in everyday electronic devices and general applications. 1oz (ounce) means 1 ounce of copper foil weighs 1 square foot. In the PCB manufacturing process, 1 ounce corresponds to a copper foil thickness of approximately 35 microns, which has good electrical and thermal conductivity.

2. ‌2oz copper thickness: ‌

Copper foil of this thickness is usually used in circuits that require higher current carrying capabilities, such as power amplifiers, high-power LEDs, etc. 2oz copper thickness corresponds to a copper foil thickness of approximately 70 microns, which has better performance in electrical conductivity and heat dissipation than 1oz copper thickness.

3. ‌0.5oz copper thickness: ‌

This thinner copper foil thickness is suitable for some light and small electronic products, such as electronic watches, mobile phones, etc. 0.5oz (18μm) copper foil is suitable for equipment that has strict requirements on circuit board size and weight.

How to choose PCB copper thickness?

Choosing PCB copper thickness depends primarily on the board’s purpose, current requirements, signal integrity requirements, cost budget, and manufacturing process capabilities.

1. ‌Circuit board usage and current requirements‌: For circuit boards that need to handle large currents, such as power boards, it is recommended to use thicker copper foil, such as 2oz (about 70μm) or 3oz (about 105μm). For signal transmission, a copper thickness of 1oz (~35μm) is usually sufficient. Ordinary double-sided boards generally use 1oz copper thickness, while multi-layer boards generally use 1/2oz, 1/3oz copper thickness for the inner layer, and 1oz, 1/2oz, 1/3oz copper thickness for the outer layer.

2. Signal integrity requirements: For high-density interconnect (HDI) boards or high-frequency circuits, thinner copper foil may be required to reduce parasitic effects and ensure signal integrity.

3. ‌Cost considerations‌: The thicker the copper foil, the higher the cost is usually.

4. Environmental factors: For PCBs in extreme working environments (such as high temperature, high humidity or high vibration environments), the thickness of the copper foil may need to be adjusted to enhance the stability and durability of the circuit.

In summary, selecting PCB copper thickness is a process that comprehensively considers multiple factors and needs to be determined based on specific application scenarios and design requirements.

What is the difference between different copper thicknesses on PCB?

‌The main differences between different copper thicknesses on PCBs are their conductive properties, load-bearing capacity, anti-interference performance, cost and manufacturing difficulty. ‌

‌Outer copper thickness‌ is commonly used for circuit board routing and connections, and its selection depends on the application requirements and design needs of the circuit board. The outer copper thickness range is generally between 1-5oz, and the more common ones are 1oz, 2oz, 3oz and 4oz. The thicker the outer copper layer, the stronger the circuit board’s load-bearing capacity, and the better its anti-interference performance and electrical conductivity. But at the same time, the increase in the thickness of the outer copper layer will also lead to an increase in cost and manufacturing difficulty.

‌Inner layer copper thickness‌ is used for internal connections and signal transmission of the circuit board, and its selection also depends on the application requirements and design needs of the circuit board. The thickness of the inner copper layer generally ranges from 0.5-2oz, with the more common ones being 0.5oz, 1oz, and 2oz. If the circuit board needs to transmit high-speed signals, a larger inner copper thickness should be selected. The increase in the thickness of the inner copper layer will also lead to an increase in cost and manufacturing difficulty.

‌Copper Thickness Standard‌According to international standards, the copper thickness of PCB boards can be divided into standard copper thickness (such as 1oz and 2oz) and non-standard copper thickness (such as 0.5oz, 3oz and 4oz). In practical applications, some special PCB boards may require higher copper thickness, such as high-power LED lights, electronic high-frequency circuits, etc.

To sum up, the choice of different copper thicknesses is to meet specific circuit board design needs, including conductive performance, anti-interference performance and other requirements. At the same time, the choice of copper thickness also needs to consider aspects such as cost and manufacturing difficulty.

Conclusion:

By controlling the thickness of copper on the PCB to meet different usage requirements, applications that require large currents will naturally require PCBs with thicker copper foils. However, PCBs that require thicker copper foils are a great test of the capabilities of PCB manufacturers. BEST Technology has accumulated rich production experience in the PCB manufacturing industry and has many years of manufacturing experience for PCBs with different copper thicknesses. We can meet any PCB copper thickness requirements.

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