Organic Solderability Preservative PCB surface finishing
OSP (Organic Solderability Preservative) or anti-tarnish preserves the copper surface from oxidation by applying a very thin protective layer of material over the exposed copper usually using a conveyorized process.
OSP is printed circuit board (PCB) copper foil surface treatment of a kind of technology to meet the requirements of RoHS directive. Short for OSP is Organic Solderability Preservatives, translated into Organic shielded welding membrane, also called copper agent, English also called Preflux.In a nutshell, OSP is on clean bare copper surface, a layer of organic chemical method to skin membrane. Impact the membrane oxidation resistant, heat resistant, moisture resistant, to protect the copper surface in normal environment does not continue to rust (oxide or sulfide, etc.);But in the subsequent welding heat, the protective film and must be quickly removed by flux easily, so just can make clean copper surface of the show is in a very short period of time with molten solder immediately become a solid solder joints.
OSP PCB Structure
Here is the OSP PCB structure which can help you know more about OSP surface finishing.
Advantages of OSP surface finishing
- Flat Surface
- No Pb
- Simple Process
- Re-workable
- Cost Effective
Don't hesitate to contact us if any questions about OSP surface finishing PCB.
