ENEPIG PCB - Electroless Ni Electroless Pd Immersion Gold PCB
ENEPIG PCB is needed if your PCB design have more strict requirements and
specifications, when do you need do ENEPIG surface finishing for your PCBs? or you don't
know why we advise do ENEPIG for your boards, pls see the advantages as below to know ENEPIG
more.
Advantages of ENEPIG PCB
- To prevent " Black nickel" problem
- Electroless palladium will act as a barrier layer, there will not be
migrated to a gold copper layer of problems caused by soldering tin solder is poor
- Chemical palladium plating layer is completely dissolve in the solder, and
will not have a high phosphorus alloy interface layer. At the same time when the Learn
palladium plating dissolves to expose a new chemical nickel plating layer used to
generate a good nickel and tin alloy
- Able to withstand repeated lead-free reflow soldering cycle
- Excellent gold line (bonding) associativity
- Good for SSOP, TSOP, QFP, TQFP, PBGA Packaging components and so on
ENEPIG MCPCB
Belowing is a picture of metalist core PCB that we do ENEPIG surface finishing
for your information, so don't hesitate to contact us if you need energy PCB with any
material and we will provide our ideas for you. BTW,if the following picture cannot help you
you can click it for HD picture.
ENEPIG PCB VS ENIG PCB
ENEPIG is electroless nickel electroless palladium immersion gold, but ENIG is
Electroless Nickel Immersion Gold, so the main different is palladium. Palladium is hard
than gold, using palladium layer is because for Pure gold and Nickel have serious corrosion
and poor welding reliability. Meanwhile Palladium also is good for thermal diffusion.
List some others PCB surface finishing for your information.
If you would like to know more PCB surface finishing or suggest,don't hesitate
to contact us, and our PCB manufacturing engineers will help you more.