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We are continued to improve our
MCPCB,
FR4 PCB &
Ceramic PCB manufacturing level to get satisfactory result from customers and ourselves. Currently our monthy productivity is 260,000 square feet (28,900 square meter), more than 100 different boards will be completed. We calso provide fast service, and urgent boards can be shipped out within 24 hours! For more information , please
click here for lead time...
Follows are basic PCB production cabability, but we are not limited by that. If you would like some specail
material, tighter tolerance or other requirements, you can
Contact our stuff directly, we are going to answer any questions of
MCPCB,
FR4 PCB &
Ceramic PCB at anytime.
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Items
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FR4 PCB
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MCPCB
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Ceramic PCB
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| Max Layer Count |
32 Layer |
10 Layers |
Thick Film: 10L; DCB: 2L |
| Min Board Thickness |
5.5 mil (0.13mm) (2 L) |
12 mil (0.3mm) |
Thick Film: 10 mil (0.25mm)
DCB: 12mil (0.30mm) |
| 6.7 mil (0.17mm) (2 L) |
24 mil (0.6mm) |
Thick Film: 11mil (0.28mm)
DCB: 16mil (0.40mm) |
| 16 mil (0.4mm) (4 L) |
40 mil (1.0mm) |
13.5 mil (0.34mm) |
| 24 mil (0.6mm) (6 L) |
48 mil (1.2mm) |
28 mil (0.46mm) |
| 32 mil (0.8mm) (8 L) |
62 mil (1.6mm) |
32 mil (0.81mm) |
| 40 mil (1.2mm) (10 L) |
79 mil (2.0mm) |
60 mil (1.50mm) |
| Max Board Thickness |
2L: 236mil (6mm)
≥4L: 315mil (8mm) |
157 mil (4.0mm) |
Thick Film: 1.5mm
DCB: 1L: 1.3mm; 2L 1.6mm |
| Max Board Dimension |
24*24" (610*610mm) 4*51"(100*1,300mm) |
24*64"(610*1,625mm) |
Thick Film: 200*200mm
DCB: 138*178mm
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| Max Conductor Thickness |
20 OZ (27.56mm) |
10 OZ (14mil) |
Thick Film: 13um (0.51mil)
DCB: 8.6OZ (12mil) |
| Min Conductor Thickness |
1/2 OZ (0.7 mil) |
Thick Film: 10um (0.39mil)
DCB:3.9 OZ (4mil) |
| Min Trace Width/Space |
Normal: 4/4 mi
HDI: 2/2 mil |
6/6 mil (0.15/0.15mm) |
Thick Film: 6/8mil (0.15/0.2mm)
DCB: 12/12mil (0.3/0.30mm) |
| Min Hole Diameter |
Normal: 8 mil (0.2mm) ;
HDI: 4mil (0.1mm) |
12 mil (0.3mm) |
4mil (0.1mm) |
| Min Punch Hole Dia |
0.1" (2.5mm) |
0.12" (3.0mm) |
N/M |
| Min Hole Spacing |
12 mil (0.3mm) |
16 mil (0.4mm) |
NPTH: 16mil (0.30mm)
PTH: 20mil (0.5mm) |
| Max Aspect Ratio |
8:1 |
12:1 |
8:1 |
| Min Solder PAD Dia |
HDI: 10 mil (0.25mm)
Normal: 14mil (0.35mm)
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14mil (0.35mm) |
10mil (0.25mm) |
| Min PAD Ring(Single) |
3mil (0.075mm)
6mil (0.15mm)
8mil (0.2mm) |
| PTH Wall Thickness |
0.48mil (12 um) for HDI;
0.59mil (15um) for normal |
Thick Film: 10um
DCB: Not Available |
| PTH Dia Tolerance |
± 3 mil (0.075mm) |
± 4 mil (0.1mm) |
| NPTH Dia Tolerance |
±2 mil (0.05mm) |
± 2 mil (0.05mm) |
± 2 mil (0.05mm) |
| Hole Position |
±2 mil (0.05mm) |
±3 mil (0.075mm) |
±4 mil (0.1mm) |
| Outline Tolerance |
CNC: ± 6 mil (0.15mm) |
CNC: ± 6 mil (015mm) |
Laser: +0.2/0.05mm |
| Die Punch: ± 4 mil (0.1mm) |
Die Punch: ± 6 mil (0.15mm) |
Die Punch: +0.25/0.20mm |
| Min Soldermask Bridge |
HDI: 6 mil (0.15mm);
Normal: 8mil (0.2mm) |
8 mil (0.20mm) |
2 mil (0.3mm) |
| Min BAG PAD Margin |
5 mil (0.125mm) |
12 mil (0.3mm)
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| Impedance Controlled |
Value>50 ohm: ± 10%
Value≤50 Ohm: ± 5 Ohm |
N/M
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Thermal Conductivity
(W/m.K, or W/m.C)
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0.30-0.45 |
Normal: 0.8~1.0, 1.5
High: 2.0, 3.0 |
Al2O3: >= 24 W/C-K
AIN: >=170 W/C-K |
| Dielectric Strength |
> 1.3 KV /mm |
>1.5 Kv (L/S >1.5mm);
>3.0 Kv (L/S >3.0mm) |
>15 KV/mm |
| Wrap & Twist |
≤ 0.75% |
≤ 3% |
| Flammability |
94V-0 |
| Thermal Stress |
3 x 10 Sec @ 280 ℃ |
| Surface Treatment |
ENIG, Flash Gold, Hard Gold Finger, Gold Plating(50mil), Gold finger, Selected Gold plating,ENEPIG, ENIPIG;
HAL, HASL(LF), OSP, Silver Imm., Tin Imm |
Thick Film: AgPd, AuPd, Mn/Ni
DCB: Ni plating, ENIG |
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