Two (Double) layers MCPCB is consisting of two layers of copper conductor, put them on same side of metal core (usually aluminum, copper or iron alloy). The metal base is on the bottom of whole MCPCB, which is different from double sided MCPCB (the two copper layers were put on the each side of metal core respectively), and you can only populate SMD on top side.

Different with Single layer MCPCB, 2 layers MCPCB requires an additional pressing step to laminate the imaged thermal conductive laminate and metal core (also known as metal base) together.

Compared with normal FR4, this sturcture need more technology and experience on laminating of two layers together with metal core.

The processing steps of the MCPCB with the metal base embedded in the PCB are comparatively complex as hole plugging is required after primary drilling on the metal base in order to isolate it from the circuitry.

• Base material: Aluminum/Copper/Iron Alloy
• Thermal Conductivity (dielectrial layer): 0.8, 1.5, 2.0, 3.0 W/m.K.
• Board Thickness: 0.5mm~3.0mm(0.02"~0.12")
• Copper thickness: 0.5 OZ, 1.0 OZ, 2.0 OZ, 3.0 OZ
• Outline: Routing, punching, V-Cut
• Soldermask: White/Black/Blue/Green/Red Oil
• Legend/Silkscreen Color: Black/White
• Surface finishing: Immersion Gold, HASL, OSP
• Max Panel size: 600*500mm(23.62"*19.68")
• Packing: Vacuum/Plastic bag
• Samples L/T: 5~7 Days
• MP L/T: 6~8 Days