Just like FR4 PCB, we can also make boards with more than 2 layers of traces and we named it "Multi Layers MCPCB". The structure is similar with FR4 Multi Layers, but it much more complex to make.

You can populated more components on the boards, put signal and ground layer into seperated layers, to achieve better performance in electrical performance.

Compared with normal FR4, this sturcture need more technology and experience on laminating of more than two layers together with metal core and the cost is much higher than 2 layers MCPCB or double sided MCPCB.

• Base material: Aluminum/Copper/Iron Alloy
• Thermal Conductivity (dielectrial layer): 0.8, 1.5, 2.0, 3.0 W/m.K.
• Board Thickness: 0.8mm~3.0mm(0.02"~0.12")
• Copper thickness: 0.5 OZ, 1.0 OZ, 2.0 OZ, 3.0 OZ
• Outline: Routing, punching, V-Cut
• Soldermask: White/Black/Blue/Green/Red Oil
• Legend/Silkscreen Color: Black/White
• Surface finishing: Immersion Gold, HASL, OSP
• Max Panel size: 600*500mm(23.62"*19.68")
• Packing: Vacuum/Plastic bag
• Samples L/T: 15~18 Days
• MP L/T: 15~20 Days