It also has same two layers of copper conductor like Double layers MCPCB, but the metal core is in the middle of two conductor, so there're conductors (trace) on both sides of metal core, and were connected to each other by Vias. So we named it "Double sided MCPCB", and you can populated SMD on both top and bottom.

Different with Single layer MCPCB, double sided MCPCB also requires an additional pressing step to laminate the imaged thermal conductive laminate and metal core (also known as metal base) together. But sometimes, some raw Metal Clad material vendor will supply board material which already laminated.

Compared with normal FR4, this sturcture need more technology and experience on laminating of two layers together with metal core.

• Base material: Aluminum/Copper/Iron Alloy
• Thermal Conductivity (dielectrial layer): 0.8, 1.5, 2.0, 3.0 W/m.K.
• Board Thickness: 0.5mm~3.0mm(0.02"~0.12")
• Copper thickness: 0.5 OZ, 1.0 OZ, 2.0 OZ, 3.0 OZ, 4.0 OZ, 5.0 OZ
• Outline: Routing, punching, V-Cut
• Soldermask: White/Black/Blue/Green/Red Oil
• Legend/Silkscreen Color: Black/White
• Surface finishing: Immersion Gold, HASL, OSP
• Max Panel size: 600*500mm(23.62"*19.68")
• Packing: Vacuum/Plastic bag
• Samples L/T: 10~15 Days
• MP L/T: 12~15 Days