RadioFrequency (RF) DCB Ceramic PCB is fabricated by using bonding technology to make copper foils caldded to ceramic material (Al2O3 or ALN), and there's a smooth and sturdy conjuctive interface between copper foils and ceramic substrate. The RF DCB ceramic PCB has great isolationg performance and thermal conductivity. Just like the normal PCB, it can be processed into various find patterns with higher currrent loading capability and lower radiofrequency loss.

RadioFrequency (RF) DCB Ceramic circuit board is mainly applied to radiofrequency power amplification, lower noise amplifier, transmitter and packaging of multi-functional modules. Its application can also be extended to base station, wire television, radar antenna array and phase-controlled array, RFID label, card reader, and fiber communcation apparatus, etc.

• The thermal expansion coefficient of the DCB Ceramic PCB is close to that of the silicon chip, so no interface is required. For high frequency devices, it can support high integration and complicated I/O legs distribution.
• Applicable frequency range is from 100 MHz to 24GHZ. This board is espically suitable for low thermal resistance (1~2 C/W) application.
• The DC resistance of the Vias is less than 1mOhm. At 4GHz, the loss is less than 0.1 dB. For filled Vias, the thermal conductivity is bigger than 200W/m-K, and thermal resistance is less than 1C/W, and this will provide excellent power-controlled characteristics.
• It can meet long-time multiple soldering operation requirements of RoHS, and completeness and reliability of packaging can be guaranteed.
• Comparing to traditional microwave PCB technology, it has high repeatability and low inserting loss.