THe DCB ceramic PCB for high power LED is mainly used for package of LED chip or COB module package with lower power multichip integrated technology. DCB (Direct Copper Bonded) ceramic heating sinking substrate used for high power LED (Light Emittering Diode) is compound material, and the copper foil are directly bonded onto ceramic base (aluminum-oxide (Al2O3) or aluminium nitride (ALN) under high temperature. Because the bond between copper foil and ceramic substrate is formed by bonding technology, by using this DCB ceramic substrate as the heat-sinking, it will have stronger adhesive strength than commmon PCB material or thick-film ciccuit circuit material. The ceramic dielectric strength endows with excellent thermal conductive performance and long-time material stability of LED package products. In other words, the isolating performance of LED products will not change with the increase of operation temperature and the number of thermal cycle. Further more, the DCB ceramic PCB has higher current loading and much better solderability than that of thick-film circuit. |
Advantage of DCB PCB in High Power LED |
In a word, DCB ceramic PCB will give excellent product performance and cost control of industrial processing of high power LED products. Please contact us for more information about DCB ceramic PCB for high pwer LED. |
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