DPC Ceramic PCB

DPC (Direct Plated Copper) technology denotes a special process in which the copper foil and the Al2O3 or AlN (one or both sides) are directly plated under appropriate high temperature.

The super-thin DPC substrate has excellent electrical isolation, high thermal conductivity, fine solderability and high bonding strength. It can be etched like normal FR4 PCB, but has a high current loading capability. Therefore DPC ceramic PCB has become the base materials of construction and interconnection technology of high power semiconductor telectronic circuits and also have been the basis for the "Chip On Board" (COB) technology which represent the packaging trend in the future.

You can visit the portal as below to see more product photos:

• BCD18309:2 Layers，1.5mm Ceramic PCB
• BCD18372:2 Layers，0.5mm AlN Ceramic PCB
• BCD19449-B:2 Layers，1.0mm，2OZ Ceramic PCB
• BCD20092: 2 Layers，0.635mm Ceramic PCB
• BCD20093:2 Layers，0.635mm Ceramic PCB
• BCD20108:2 Layers，1.0mm AlN Ceramic PCB
• BCD20109:2 Layers，1.0mm Al2O3 Ceramic PCB
• BCD20140:2 Layers，1.0mm AlN Ceramic PCB
• BCD20162:2 Layers，0.635mm AlN Ceramic PCB
• BCD20271:2 Layers，0.635mm，4OZ AlN Ceramic PCB
• BCS20051:1 Layers，0.635mm,1OZ Al2O3 Ceramic PCB
• BCS20091:1 Layers，1.0mm,1OZ Al2O3 Ceramic PCB
• BCS20228:1 Layers，0.635mm,2OZ Al2O3 Ceramic PCB
• BCS20297:1 Layers，0.5mm,5-7um Al2O3 Ceramic PCB

Please contact us today for more information about Ceramic circuit board (Ceramic PCB).