"S/S PCB" ful name is "Single Sided PCB", or you can named it as Single Layer PCB, or 1L PCB. There's no only one copper trace ont the board, SMD components on one side (through hole components at the other side), but also no PTH (plated through hole) or Via, only has NPTH(no-plated throgh hole), or location hole.

It is the most cheap type of board, and used in very simple board. In order to get a cheaper price, sometimes people will use CEM-1, CEM-3 instead of FR4, to make the circuit board. Sometimes, factory will etch away one copper trace from a 2L CCL (copper clad laminate) if no 1L FR4 raw materail available.

There's another conventional board "2L PCB" which has 2 copper trace, and also named as "Double Sided PCB" (D/S PCB), and PTH (Via) is a must, but it still doesn't has Buried or Blind hole. Components can be assembled on both top and bottom side, so you don't need to worry about where to put components on the board, and not need to use through hole components which is always expensive than SMD one.

Currently this is one of the most popular type of PCB on the Earth, and we can provide 24 hours quick-turn service for them. Click here to see the Lead time for both types of circuit boards.

Here is the basic layer up for a single side (S/S) FR4 PCB (from top to bottom):

• Top silkscreen/Legend: to identify name of each PAD, board part number, data, etc;
• Top Surface finishing: to protect exposed copper from oxidation ;
• Top Soldermask (overlay): to protect copper from oxidation, to be not soldered during SMT process;
• Top Trace: copper etched according to design to carry on different function
• Substrate/Core material: Non-conductive such as FR4, FR3, CEM-1, CEM-3.

• Top silkscreen/Legend: to identify name of each PAD, board part number, data, etc;
• Top Surface finishing: to protect exposed copper from oxidation ;
• Top Soldermask (overlay): to protect copper from oxidation, to be not soldered during SMT process;
• Top Trace: copper etched according to design to carry on different function
• Substrate/Core material: Non-conductive such as FR4, FR5
• Bottom trace (if any): (same as above mentioned)
• Bottom soldermask (overlay):(same as above mentioned)
• Bottom surface finishing: (same as above mentioned)
• Bottom silkscreen/legend: (same as above mentioned)