In fact, the process of laser drilling/scribing and stencil making can be done at the same time, as they’re belonging to different production workshop.
(1)Stencil: Hard aluminum or aluminum alloy is commonly be used in the stencil of the thick film circuit. The size of the stencil is generally 100 mm×150 mm or 150 mm×200 mm, and rectangular is the normal outline.
(2) Foil: The foil of the thick film circuit is generally used stainless steel or nylon.  
（3）Photosensitive glue: As the trace of the thick film circuit requires a thick ink film, it is necessary to use Photosensitive glue which can coating the optical film from 20～30μm and have no edge defects after development.

The picture below is the front side of the stencil (It has been already installed on the manual printing table)

The stencil is installed on the printer working table and is ready for printing.

The size and the outline of the stencil will be different if it is used on the automatic or semi-automatic printing machine,.

The rectangular stencil is used to print the cylindrical substrate.

Now let’s move to the next step Conductive ink preparation . If you have any questions about the last step, please back to the Blackening spot removing after laser drilling