As the raw material of SinkPAD board is copper in most of cases, so outline making is also the same like other type of Metal Core PCB, dividing into three basic types:
- V-Cutting
- CNC routing/milling
- Die-punching
V-cutting will be used if the board is shipped via panel (several pieces into the same panel), and that process will be done before CNC routing/milling or Die-punching, as V-cutting process will not affect the location of each board, no alignment issue. If CNC routing firstly, the location of board will be shift and then V-cutting will be a big problem as it machine can’t V-cut the board outline correctly.
After V-cutting, the depth of V-cut will be measured, to make sure the balance on the SinkaPAD board (SinkPAD PCB) meets customers’ requirements, to support the weight of board itself and at the same time, not difficult to be de-panel.
(V-Cutting & Measuring)
Several layers of SinkPAD PCB will be routed together, in order to save time. But for punching, there’re only one layer of SinkPAD PCB each time. And Die-punching will be used only while there’re big volume order as the cost of die-punching tooling is higher comparing with other ways.
(CNC Routing For SinkPAD Board (SinkPAD PCB)
If there’re a lot of through holes, normal dimension tolerance, volume production order, or complex outline which is difficult for routing, Die-punching will be used to make SinkaPAD board (SinkPAD PCB) too. There’re pictures showing Die-punching of an aluminum core PCB, which is the same as SinkPAD board (PCB) punching. Each time, there’ll be only one layer of board will be punched and will be punched through bottom to top, to avoid potential trace or soldermask peeling off.
(Die-punching of aluminum core PCB)
Of course, these three processes can be used alone, or will be used together, upon how complicated the board is. So make simple outline/shape of SinkPAD board (PCB), or any type of MCPCB will be make manufacturing cost cheaper.
During these outline making processes, the burs of outline will be removed by human handle, to make the edge of circuit board outline is smooth enough.
After outline making, electronic testing will be happened, most of them are opening and shorting testing, and sometimes, high voltage, breakdown testing, to make sure each piece of SinkPAd board is in good condition.
(Electronic Testing)
Return to main manufacturing process
Or go to next step of Finished the SinkPAD board making.