BPM20112 - 6L HDI PCB, 6L FR4 PCB, Tg150

• Construction: 6 layers
• Base material: FR4 Tg170
• Board Thickness: 0.64mm+/-0.10mm
• 1oz copper in each layer
• matt black
• white silk screen
• ENIG (Au 1u")
• with blind&burid vias 1-2,2-5,5-6
• tented solder mask in the vias
• platting shut
• 32pcs in one panel