Attention should also be paid to other components like resistors, diodes or capacitors that need to be assembled next to the module. It is recommended to leave at least 4 mm between the edge of these components and the middle of the PTH. This ensures enough space for the pressing tool to back the PCB.

Press-in process Figure 7 shows the press-in force versus press in path for a Press-fit module. A classic curve shows three typical phases. During the first phase the force is increasing nearly linearly, due to the resistance of the collapsing compliant section of the pin. In the second phase, the force is relatively stable, and - depending on the PCB’s metallization- can be somewhat horizontal or decreasing slightly. At this point the compliant section has totally collapsed, and the force is simply that of overcoming friction as the pin slides through the hole. In the third phase, the force increases sharply, because the module body contacts the PCB’s surface. It is not recommended to reach this third phase because it can cause unwanted stresses in PCB and module. In case of flow 0 modules that are equipped with clips there is an additional segment visible on the curve. It can be found before the first phase of the classic curve. In this period the clips are bended and begin to slide through the openings of the PCB.

The exact process parameters and quality acceptance limits are given in the handling instructions of the Press-fit Modules

Press-fit pin offers the perfect solution for solder-less assembly. Today, as cost saving very often leads to compromises in quality, BEST TECHNOLOGY’s new Press-fit technology goes against the trend: highly reliable and electrically equal to the solder pin, this new interconnect technology reduces assembly time and cost whilst increasing reliability. Added benefits are design flexibility, free choice of PCB thickness, and easy PCB repair and re-use.