DPC Ceramic PCB Photos DPC (Direct Plated Copper) technology denotes a special process in which the copper foil and the Al2O3 or AlN (one or both sides) are directly plated under appropriate high temperature. The super-thin DPC substrate has excellent electrical isolation, high thermal conductivity, fine solderability and high bonding strength. It can be etched like normal FR4 PCB, but has a high current loading capability. Therefore DPC ceramic PCB has become the base materials of construction and interconnection technology of high power semiconductor telectronic circuits and also have been the basis for the "Chip On Board" (COB) technology which represent the packaging trend in the future. You can visit the portal as below to see more product photos:
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